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2018/6/21
Technical Data Sheet
TOKIN Corporation
RoHS-2 compliant
Parts name
TPI078060L047N
TPI078060L056N
TPI078060L068N
TPI078060L082N
Halogen Free
Inductance [nH]
47±10%
56±10%
68±10%
82±10%
DCR [mΩ]
0.31±10%
0.31±10%
0.31±10%
0.31±10%
ISAT1 [A]
ISAT2 [A]
ISAT3 [A]
90
81
69
54
83
74
63
51
73
64
55
43
General Specifications
ISAT1 : Peak current for approximately 20% rolloff at +25℃
ISAT2 :
ISAT3 :
IRMS :
IRMS [A]
53
53
53
53
Electrical Requirement Note
OCL : at 100kHz, 0.1Vrms, 0A, at 25℃
Peak current for approximately 20% rolloff at +60℃
Peak current for approximately 20% rolloff at +100℃
DC current for an approximate temperature rise of 40℃ without core loss.
DCR :
at 20℃
DCR inspection position
Environmental data
Operating temperature range : -40℃ to +125℃ (ambient plus self-temperature rise)
Model: TPI078060L047N
60
40
20
Reference data
100℃
80
60
40
20
0
0
0
20
40
60
DC_Current [A]
80
100
Model: TPI078060L082N
25℃
100
25℃
100
60℃
Reference data
100℃
80
60
40
20
0
0
20
40
60
DC_Current [A]
80
100
0
20
40
60
DC_Current [A]
80
100
60℃
Reference data
100℃
Reference data
Model: TPI078060 Series
60
50
80
60
⊿T [℃]
Inductance [nH]
60℃
Inductance [nH]
80
Model: TPI078060L068N
25℃
100
Inductance [nH]
Inductance [nH]
Reference data
60℃
100℃
25℃
100
Model: TPI078060L056N
40
20
40
30
20
10
0
0
0
20
40
60
DC_Current [A]
80
100
0
10
20
30
40
DC_Current [A]
50
60
Land Pattern
unit: mm
2/3
Appendix 1
Temperature
→
Recommended Reflow Soldering Profile
Time →
Table 1 Pb-Free Process classification temperature (TC)
Package
Thickness
2000
Temperature min. (TS min)
150°C
2.5mm
250°C
245°C
245°C
Ramp up rate (TS max to TP)
3°C/ second max.
Liquidous temperature (TL)
217°C
Time (tL) maintained above TL
60-150 seconds
Peak package body temperature (TP max)
Table 1
Time (tP max) within 5 °C of the specified
30 seconds
classification temperature (TC)
Ramp-down rate (TP to TS max)
Time 25°C to Peak Temperature
6°C/ second max.
8 minutes max.
*1 The TPI078060-Series shape becomes 「package thickness >2.5mm」 「volume
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