Surface Mount Varistors
VE High Temperature 150°C
Overview
Applications
KEMET's VE series of high temperature, low voltage
varistors are designed to protect sensitive electronic
devices against high voltage surges in the low voltage
region. In addition to superior operating performance at
rated 150°C (AEC–Q200 compliance) they offer excellent
transient energy absorption due to improved energy volume
distribution and power dissipation.
Typical applications include transient over-voltage
protection in automotive assembly motors and controllers
as well as surge protection of non-automotive electronic
products exposed to over-heating, i.e., consumer,
telecommunication or industrial.
Load dump and jump start protection of 12 to 24 V
supply systems. Protection of integrated circuits and
other components at the circuit board level including the
suppression of inductive switching or other transient events
such as surge voltage. ESD protection for components
sensitive to IEC 1000–4–2, MILSTD 883C Method 3015.7
and other industry spec. Replacement of larger surface
mount TVS Zeners in many applications. Designed to
achieve electromagnetic compliance of end products and
provide on-board transient voltage protection of ICs and
transistors.
Benefits
• AEC-Q200 qualified Grade 1
• Surface mount form factor
• Operating ambient temperature of −55°C to +150°C
• Superior operating performance rated at 150°C
(AEC-Q200 compliance)
• Operating voltage range of 11 – 170 V
• AC voltage range (Vrms) of 8 – 130 V
• High resistance to cyclic temperature stress
• Low leakage currents after 1,000 hours rated at 150°C
• High energy absorption capability
• Available case sizes: 0603, 0805, 1206, 1210, 1812, 2220
• Short response time
• Broad range of current and energy handling capabilities
• Low clamping voltage – Uc
• Non-sensitive to mildly activated fluxes
• Barrier type end terminations solderable with Pb-free
solders according to JEDEC J–STD–020C and
IEC 60068–2–58
• RoHS 2 2011/65/EC, REACH compliant
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SMD Varistors
VE High Temperature 150°C
Ordering Information
VE
0603
M
300
R
002
Series
Chip
Size Code
Tolerances
Rated Peak Single Pulse
Transient Current (A)
Packaging/
Termination
Maximum Continuous
Working Voltage
(Vrms AC)
Varistor
SMD High
Temperature 150°C
Low Voltage
Multilayer Chip
0603 = 0603
0805 = 0805
1206 = 1206
1210 = 1210
1812 = 1812
2220 = 2220
K = ±10%
L = ±15%
M = ±20%
300 = 30
101 = 100
121 = 120
151 = 150
201 = 200
251 = 250
301 = 300
401 = 400
501 = 500
601 = 600
801 = 800
102 = 1,000
122 = 1,200
(First two digits represent
significant figures. Third digit
specifies number of zeros.)
R = Reel 180 mm/Ni Sn
Barrier Terminations
008 = 8
011 = 11
014 = 14
017 = 17
020 = 20
025 = 25
030 = 30
035 = 35
040 = 40
050 = 50
060 = 60
075 = 75
095 = 95
115 = 115
130 = 130
Dimensions – Millimeters
0.5±0.25
W
t
L
Size Code
L
W
tmax
0603
1.6±0.20
0.80±0.10
0.95
0805
1206
1210
1812
2220
2.0±0.25
3.2±0.30
3.2±0.30
4.7±0.40
5.7±0.50
1.25±0.20
1.60±0.20
2.50±0.25
3.20±0.30
5.00±0.40
0.80
0.85
0.85
1.25
1.25
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SMD Varistors
VE High Temperature 150°C
Environmental Compliance
RoHS 2 2011/65/EC, REACH
Performance Characteristics
Continuous
Units
Value
DC Voltage Range (Vdc)
V
11 – 170
AC Voltage Range (Vrms)
V
8 – 130
Peak Single Pulse Surge Current, 8/20 µs Waveform (Imax)
A
30 – 1,200
Single Pulse Surge Energy, 10/1,000 µs Waveform (Wmax)
J
0.1 – 12.2
Operating Ambient Temperature
°C
−55 to +150
Storage Temperature Range (mounted components)
°C
−55 to +150
%/°C
< +0.05
ns
0.2 wt. % are NOT RECOMMENDED. The use of such fluxes
could create high leakage current paths along the body of the varistor components.
When a flux is applied prior to wave soldering, it is important to completely dry any residual flux solvents prior to the soldering process.
Thermal Shock – to avoid the possibility of generating stresses in the varistor chip due to thermal shock, a preheat stage to within
100°C of the peak soldering process temperature is recommended. Additionally, SMD varistors should not be subjected to a temperature
gradient greater than 4°C/second, with an ideal gradient being 2°C/second. Peak temperatures should be controlled. Wave and Reflow
soldering conditions for SMD varistors with Pb-containing solders are shown in Fig. 1 and 2 respectively, while Wave and Reflow soldering
conditions for SMD varistors with Pb-free solders are shown in Figures 1 and 3
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SMD Varistors
VE High Temperature 150°C
Soldering cont'd
Whenever several different types of SMD components are being soldered, each having a specific soldering profile, the soldering profile
with the least heat and the minimum amount of heating time is recommended. Once soldering has been completed, it is necessary to
minimize the possibility of thermal shock by allowing the hot PCB to cool to less than 50°C before cleaning.
Inspection Criteria – the inspection criteria to determine acceptable solder joints, when Wave or Infrared Reflow processes are used, will
depend on several key variables, principally termination material process profiles.
Pb-contining Wave and IR Reflow Soldering – typical “before” and “after” soldering results for Barrier Type End Terminations can be seen
in Fig. 4. Barrier type terminated varistors form a reliable electrical contact and metallurgical bond between the end terminations and the
solder pads. The bond between these two metallic surfaces is exceptionally strong and has been tested by both vertical pull and lateral
(horizontal) push tests. The results exceed established industry standards for adhesion.
The solder joint appearance of a barrier type terminated varistor shows that solder forms a metallurgical junction with the thin tin-alloy
(over the barrier layer), and due to its small volume “climbs” the outer surface of the terminations, the meniscus will be slightly lower.
This optical appearance should be taken into consideration when programming visual inspection of the PCB after soldering.
Ni Sn Barrier Type End Terminations
Figure 4: Soldering Criterion in case of Wave and IR Reflow Pb-containing Soldering
Pb-free Wave and IR Reflow Soldering – typical “before” and “after” soldering results for Barrier Type End Terminations are given
in a phenomenon knows as “mirror” or “negative” meniscus. Solder forms a metallurgical junction with the entire volume of the end
termination, i.e. it diffuses from pad to end termination across the inner side, forming a “mirror” or “negative” meniscus. The height of the
solder penetration can be clearly seen on the end termination and is always 30% higher than the chip height.
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SMD Varistors
VE High Temperature 150°C
Soldering cont'd
Solder Test and Retained Samples – reflow soldering test based on J-STD-020D.1 and soldering test by dipping based on IEC 600682 for Pb-free solders are preformed on each production lot as shown in the following chart. Test results and accompanying samples
are retained for a minimum of two (2) years. The solderability of a specific lot can be checked at any time within this period should a
customer require this information.
Resistance to Flux
Solderability
Static leaching
(Simulation of Reflow
Soldering)
Dynamic Leaching
(Simulation of Wave
Soldering)
Soldering method
Dipping
Dipping
Dipping
Dipping with agitation
Flux
L3CN, ORL0
L3CN, ORL0, R
L3CN, ORL0, R
L3CN, ORL0, R
Pb Solder
62 Sn/36 Pb/2 Ag
Pb Soldering temperature (°C)
235±5
235±5
260±5
235±5
Test
Parameter
Pb-FREE Solder
Sn96/Cu0,4–0,8/3–4Ag
Pb-FREE Soldering
Temperature (°C)
250±5
250±5
280±5
250±5
Soldering Time (s)
2
210
10
> 15
Burn-in Conditions
VDCmax, 48 h
Acceptance Criterion
dVn < 5%, idc must stay
unchanged
> 95% of end termination
must be covered by solder
> 95% of end termination
must be intact and covered
by solder
> 95% of end termination
must be intact and covered
by solder
Rework Criteria Soldering Iron – unless absolutely necessary, the use of soldering irons is NOT recommended for reworking varistor
chips. If no other means of rework is available, the following criteria must be strictly followed:
• Do not allow the tip of the iron to directly contact the top of the chip
• Do not exceed the following soldering iron specifications:
Output Power:
30 Watts maximum
Temperature of Soldering Iron Tip:
280°C maximum
Soldering Time:
10 Seconds maximum
Storage Conditions – SMD varistors should be used within 1 year of shipment from factory to avoid possible soldering problems caused
by oxidized terminals. The storage environment should be controlled, with humidity less than 40% and temperature between -25 and 45
°C. Varistor chips should always be stored in their original packaged unit.
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SMD Varistors
VE High Temperature 150°C
Soldering Pad Configuration
M
B
W
C
A
t
B
A
L
D
Size
L (mm)
W (mm)
h (mm)
tmax (mm)
A (mm)
B (mm)
C (mm)
D (mm)
0603
1.6±0.20
0.80±0.10
0.5±0.25
1.0
1.0
1.0
0.6
2.6
0805
2.0±0.25
1.25±0.20
0.5±0.25
1.1
1.4
1.2
1.0
3.4
1206
3.2±0.30
1.60±0.20
0.5±0.25
1.6
1.8
1.2
2.1
4.5
1210
3.2±0.30
2.50±0.25
0.5±0.25
1.8
2.8
1.2
2.1
4.5
1812
4.7±0.40
3.20±0.30
0.5±0.25
1.9
3.6
1.5
3.2
6.2
2220
5.7±0.50
5.00±0.40
0.5±0.25
1.9
5.5
1.5
4.2
7.2
1210
1812
2220
180
4,000
2,500
2,500
2,000
180
1,500
1,500
1,000
1,000
180
1,500
1,500
1,000
1,000
Packaging
Voltage
Range (V)
2 – 14
17
20 – 40
50 – 130
Chip Size
0603
0805
1206
180
4,000
3,500
3,500
180
4,000
3,500
3,500
180
4,000
2,500
2,500
2,000
Reel Size
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SMD Varistors
VE High Temperature 150°C
Construction
Detailed Cross Section
Glass Passivation
Termination
(Ag/Pd, Ni/Sn)
Glass Passivation
ZnO Layer
Inner Electrodes
(Ag)
Termination
(Ag/Pd, Ni/Sn)
Terminate
Edge
Inner Electrodes
(Ag)
Terminate
Edge
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SMD Varistors
VE High Temperature 150°C
Taping & Reel Specifications
Tape Size (mm)
A0
B0
K0 Maximum
B1 Maximum
D1 Minimum
E2 Minimum
P1
F
W
T2 Maximum
W1
W2 Maximum
W3
A
8 mm
12 mm
0603
0805
1206
1210
1812
2220
1.2
1.9
1.1
4.35
0.3
6.25
4.0
3.5
8.0
3.5
8.4+1.5
14.4
7.9 – 10.9
180
1.6
2.4
1.1
4.35
0.3
6.25
4.0
3.5
8.0
3.5
8.4+1.5
14.4
7.9 – 10.9
180
1.9
3.75
1.8
4.35
0.3
6.25
4.0
3.5
8.0
3.5
8.4+1.5
14.4
7.9 – 10.9
180
2.9
3.7
2.0
4.35
0.3
6.25
4.0
3.5
8.0
3.5
8.4+1.5
14.4
7.9 – 10.9
180
3.75
5.0
2.0
8.2
1.5
10.25
8.0
5.5
12.0
6.5
12.4+2
18.4
11.9 – 15.4
180
5.6
6.25
2.0
8.2
1.5
10.25
8.0
5.5
12.0
6.5
12.4+2
18.4
11.9 – 15.4
180
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SMD Varistors
VE High Temperature 150°C
Terms and Definitions
Term
Rated AC
Voltage
Rated DC
Voltage
Supply
Voltage
Symbol
Vrms
Vdc
V
Leakage Current
Idc
Varistor Voltage
Reference Current
Clamping Voltage
Protection Level
Vn
In
Class Current
Ic
Voltage
Clamping
Ratio
Vc/Vapp
Jump
Start
Transient
Vjump
Rated Single Pulse
Transient Energy
Wmax
Load
Dump
Transient
WLD
Rated Peak Single
Pulse Transient
Current
Rated Transient
Average Power
Dissipation
Capacitance
Response Time
Varistor Voltage
Temperature
Coefficient
Insulation Resistance
Isolation
Voltage
Operating
Temperature
Climatic Category
Storage Temperature
Vc
Definition
Maximum continuous sinusoidal AC voltage (< 5% total harmonic distortion) which may be
applied to the component under continuous operation conditions at 25°C
Maximum continuous DC voltage (< 5% ripple) which may be applied to the component under
continuous operating conditions at 25°C
The voltage by which the system is designated and to which certain operating characteristics of
the system are referred; Vrms = 1, 1 x V
The current passing through the varistor at Vdc and at 25°C or at any other specified
temperature
Voltage across the varistor measured at a given reference current In
Reference current = 1 mA DC
The peak voltage developed across the varistor under standard atmospheric conditions, when
passing an 8/20 μs class current pulse
A peak value of current which is 1/10 of the maximum peak current for 100 pulses at two per
minute for the 8/20 μs pulse
A figure of merit measure of the varistor clamping effectiveness as defined by the symbols
Vc/Vapp, where (Vapp = Vrms or Vdc)
The jump start transient resulting from the temporary application of an overvoltage in excess
of the rated battery voltage. The circuit power supply may be subjected to a temporary
overvoltage condition due to the voltage regulation failing or it may be deliberately generated
when it becomes necessary to boost start the car
Energy which may be dissipated for a single 10/1,000 μs pulse of a maximum rated current,
with rated AC voltage or rated DC voltage also applied, without causing device failure
Load Dump is a transient which occurs in an automotive environment. It is an exponentially
decaying positive voltage which occurs in the event of a battery disconect while the alternator
is still generating charging current with other loads remaining on the alternator circuit at the
time of battery disconect
Imax
Maximum peak current which may be applied for a single 8/20 μs pulse, with, rated line
voltage also applies, without causing device failure
P
Maximum average power which may be dissipated due to a group of pulses occurring within a
specified isolated time period, without causing device failure at 25°C
C
tr
Capacitance between two terminals of the varistor measured at 1 kHz
The time lag between application of a surge and varistor's "turn-on" conduction action
TC
(Vn at 85°C – Vn at 25°C)/(Vn at 25°C) x 60°C) x 100
IR
Minimum resistance between shorted terminals and varistor surface
The maximum peak voltage which may be applied under continuous operating conditions
between the varistor terminations and any conducting mounting surface
The range of ambient temperature for which the varistor is designed to operate continuously as
defined by the temperature limits of its climatic category
UCT = Upper Category Temperature – the maximum ambient temperature for which a varistor
has been designed to operate continuously, LCT = Lower Category Temperature – the minimum
ambient temperature at which a varistor has been designed to operate continuously
DHD = Dump Heat Test Duration
Storage temperature range without voltage applied
LCT/UCT/DHD
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SMD Varistors
VE High Temperature 150°C
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Disclaimer
All product specifi cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for
checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given
herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such
applications, but are not intended to constitute – and KEMET specifi cally disclaims – any warranty concerning suitability for a specifi c customer application or use.
The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any
technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes
no obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component
failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards
(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury
or property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other
measures may not be required.
KEMET is a registered trademark of KEMET Electronics Corporation.
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