SMD S MD Type
MOS Field Effect Transistors 2SK2481
TO-263
+ .1 1 .2 7 -00.1
Transistors IC
Unit: mm
+0.1 1.27-0.1 +0.2 4.57-0.2
Features
Low On-state Resistance:RDS(on)=4 max.(VGS=10V,ID=2.0A) Low Ciss Ciss=900pF TYP
+ .2 8 .7 -00.2
+0.1 1.27-0.1
0.1max
+0.1 0.81-0.1
+ .2 5 .2 8 -00.2
2.54
+0.2 -0.2 +0.1 5.08-0.1
+ .2 2 .5 4 -00.2
+ .2 1 5 .2 5 -00.2
2.54
+0.2 0.4-0.2
Absolute Maximum Ratings Ta = 25
Parameter Drain to Source Voltage Gate to Source Voltage Drain Current(DC) Drain Current(pulse) *1 Total Power Dissipation Ta = 25 Total Power Dissipation TC = 25 Channel Temperature Storage temperature Single Avalanche Current *2 Single Avalanche Energy *2 *1. PW 10ìs,Dduty cycle 1%. 0 Tch Tstg IAS EAS Symbol VDSS VGSS ID(DS) ID(pulse) PT Rating 900 30 4 12 1.5 70 150 -55 to +150 4 65.9 A mJ Unit V V A A W
*2.Starting Tch=25 ,RG=25Ù,VGS=20V
5 .6 0
1 Gate 2 Drain 3 Source
High Avalanche Capability Ratings
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1
SMD Type
2SK2481
Electrical Characteristics Ta = 25
Parameter Drain to Source On-state Resistance Gate Cut-off Voltage Forward Transfer Admittance Drain Cut-off Current Gate Leakage Current Input Capacitance Output Capacitance Feedback Capacitance Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Symbol Testconditons
Transistors IC
Min
Typ 3.2
Max 4.0 3.5
Unit Ù V S
RDS(on) VGS = 10 V, ID = 2.0 A VGS(off) VDS = 10 V, ID = 1 mA Yfs IDSS IGSS Ciss Coss Crss td(on) tr td(off) tf Qg Qgs Qgd VF(S-D) trr Qrr VDS = 20 V, ID = 2.0 A VDS = VDSS, VGS = 0 VGS = 30 V, VDS = 0 2.5 1.0
100 100 900 130 25 17 7 63 8 30 5 13 1.0 710 3.5
ìA nA pF pF pF ns ns ns ns
VDS = 10 V VGS = 0 f = 1 MHz ID = 2.0 A VGS = 10 V VDD = 150 V RG = 10 Ù ID = 4.0 A VDD = 450 V VGS = 10 V IF = 4.0 A, VGS = 0 IF = 4.0 A, VGS = 0 di/dt = 50 A/ ìs
nC
V ns ìC
2
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