AAAF3529SEKJ3ZGKQBKS 数据手册
AAAF3529SEKJ3ZGKQBKS
3.5 x 2.8 mm Surface Mount SMD Chip LED
PACKAGE DIMENSIONS
DESCRIPTIONS
The Hyper Red device is based on light emitting diode
chip made from AlGaInP
The Green source color devices are made with InGaN
On Sapphire Light Emitting Diode
The Blue source color devices are made with InGaN
Light Emitting Diode
Electrostatic discharge and power surge could
damage the LEDs
It is recommended to use a wrist band or
anti-electrostatic glove when handling the LEDs
All devices, equipments and machineries must be
electrically grounded
FEATURES
Suitable for all SMD assembly and solder process
Available on tape and reel
Package: 2000pcs / reel
Moisture sensitivity level: 3
RoHS compliant
RECOMMENDED SOLDERING PATTERN
APPLICATIONS
(units : mm; tolerance : ± 0.1)
Backlight
Status indicator
Home and smart appliances
Wearable and portable devices
Healthcare applications
ATTENTION
Observe precautions for handling
electrostatic discharge sensitive devices
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.2(0.008") unless otherwise noted.
3. The specifications, characteristics and technical data described in the datasheet are subject to
change without prior notice.
4. The device has a single mounting surface. The device must be mounted according to the specifications.
SELECTION GUIDE
Part Number
Emitting Color
(Material)
Iv (mcd) @ 20mA [2]
Lens Type
■ Hyper Red
(AlGaInP)
AAAF3529SEKJ3ZGKQBKS
■ Green (InGaN)
Water Clear
■ Blue (InGaN)
Min.
Typ.
400
500
400
580
80
130
Viewing Angle [1]
2θ1/2
130°
Notes:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.
2. Luminous intensity / luminous flux: +/-15%.
3. Luminous intensity value is traceable to CIE127-2007 standards.
© 2019 Kingbright. All Rights Reserved. Spec No: DSAO2424 / 1201009036 Rev No: V.4B Date: 10/11/2019
Page 1 / 5
AAAF3529SEKJ3ZGKQBKS
ELECTRICAL / OPTICAL CHARACTERISTICS at TA=25°C
Parameter
Symbol
Emitting Color
λpeak
Value
Unit
Typ.
Max.
Hyper Red
Green
Blue
640
515
460
-
nm
λdom [1]
Hyper Red
Green
Blue
625
525
465
-
nm
Spectral Bandwidth at 50% Φ REL MAX
IF = 20mA
Δλ
Hyper Red
Green
Blue
20
35
25
-
nm
Capacitance
C
Hyper Red
Green
Blue
27
45
100
-
pF
Forward Voltage IF = 20mA
VF [2]
Hyper Red
Green
Blue
2.2
3.3
3.3
2.8
4.1
4.0
V
Reverse Current (VR = 5V)
IR
Hyper Red
Green
Blue
-
10
50
50
µA
Temperature Coefficient of λpeak
IF = 20mA, -10°C ≤ T ≤ 85°C
TCλpeak
Hyper Red
Green
Blue
0.13
0.05
0.04
-
nm/°C
Temperature Coefficient of λdom
IF = 20mA, -10°C ≤ T ≤ 85°C
TCλdom
Hyper Red
Green
Blue
0.06
0.03
0.03
-
nm/°C
Temperature Coefficient of VF
IF = 20mA, -10°C ≤ T ≤ 85°C
TCV
Hyper Red
Green
Blue
-2.0
-2.9
-2.9
-
mV/°C
Wavelength at Peak Emission IF = 20mA
Dominant Wavelength IF = 20mA
Notes:
1. The dominant wavelength (λd) above is the setup value of the sorting machine. (Tolerance λd: ±1nm. )
2. Forward voltage: ±0.1V.
3. Wavelength value is traceable to CIE127-2007 standards.
4. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure.
ABSOLUTE MAXIMUM RATINGS at TA=25°C
Parameter
Symbol
Value
Hyper Red
Green
Blue
Unit
Power Dissipation
PD
140
123
120
mW
Reverse Voltage
VR
5
5
5
V
Junction Temperature
Tj
115
115
115
°C
Operating Temperature
Top
-40 to +85
°C
Storage Temperature
Tstg
-40 to +85
°C
DC Forward Current
IF
Peak Forward Current
Electrostatic Discharge Threshold (HBM)
Thermal Resistance (Junction / Ambient)
Thermal Resistance (Junction / Solder point)
IFM
[1]
-
50
30
30
mA
150
150
150
mA
3000
450
250
V
Rth JA
[2]
250
390
420
°C/W
Rth JS
[2]
120
290
290
°C/W
Notes:
1. 1/10 Duty Cycle , 0.1ms Pulse Width .
2. Rt h JA, Rt h JS Results from mounting on PC board FR4 (pad size≥16 mm 2 per pad).
3. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033.
© 2019 Kingbright. All Rights Reserved. Spec No: DSAO2424 / 1201009036 Rev No: V.4B Date: 10/11/2019
Page 2 / 5
AAAF3529SEKJ3ZGKQBKS
TECHNICAL DATA
SPATIAL DISTRIBUTION
RELATIVE INTENSITY vs. WAVELENGTH
Blue
Relative Intensity (a. u.)
100%
Green
Red
Ta = 25 °C
Ta = 25 °C
80%
0°
-15°
15°
30°
-30°
45°
-45°
60%
60°
-60°
40%
20%
75°
-75°
0%
350
400
450
500
550
600
Wavelength (nm)
650
700
750
800
-90°
1.0
0.5
0.0
90°
1.0
0.5
HYPER RED
Luminous intensity normalised
at 20 mA
Ta = 25 °C
40
30
20
10
0
1.5
1.7
1.9
2.1
2.3
Forward voltage (V)
Ta = 25 °C
2.0
1.5
1.0
0.5
0.0
0
2.5
10
20
30
40
Forward current (mA)
Luminous Intensity vs.
Ambient Temperature
2.5
60
Permissible forward current (mA)
2.5
50
Forward current (mA)
Forward Current Derating Curve
Luminous Intensity vs.
Forward Current
Luminous intensity normalised
at T a = 25 °C
Forward Current vs.
Forward Voltage
50
40
30
20
10
0
50
2.0
1.5
1.0
0.5
0.0
-40 -20 0 20 40 60 80 100
Ambient temperature (°C)
-40 -20 0 20 40 60 80 100
Ambient temperature (°C)
GREEN
Forward Current vs.
Forward Voltage
40
30
20
10
0
2.0
2.4
2.8
3.2
3.6
Forward voltage (V)
Ta = 25 °C
2.0
1.5
1.0
0.5
0.0
4.0
0
10
20
30
40
Forward current (mA)
50
Luminous Intensity vs.
Ambient Temperature
50
2.5
Luminous intensity normalised
at T a = 25 °C
Luminous intensity normalised
at 20 mA
Ta = 25 °C
Permissible forward current (mA)
2.5
50
Forward current (mA)
Forward Current Derating Curve
Luminous Intensity vs.
Forward Current
40
30
20
10
0
2.0
1.5
1.0
0.5
0.0
-40 -20 0 20 40 60 80 100
Ambient temperature (°C)
-40 -20 0 20 40 60 80 100
Ambient temperature (°C)
BLUE
Ta = 25 °C
30
20
10
0
2.0
2.4
2.8
3.2
3.6
Forward voltage (V)
4.0
Permissible forward current (mA)
2.5
Luminous intensity normalised
at 20 mA
Forward current (mA)
50
40
Forward Current Derating Curve
Luminous Intensity vs.
Forward Current
Ta = 25 °C
2.0
1.5
1.0
0.5
0.0
0
10
20
30
40
Forward current (mA)
50
© 2019 Kingbright. All Rights Reserved. Spec No: DSAO2424 / 1201009036 Rev No: V.4B Date: 10/11/2019
Luminous Intensity vs.
Ambient Temperature
50
2.5
Luminous intensity normalised
at T a = 25 °C
Forward Current vs.
Forward Voltage
40
30
20
10
0
-40 -20 0 20 40 60 80 100
Ambient temperature (°C)
2.0
1.5
1.0
0.5
0.0
-40 -20 0 20 40 60 80 100
Ambient temperature (°C)
Page 3 / 5
AAAF3529SEKJ3ZGKQBKS
REFLOW SOLDERING PROFILE for LEAD-FREE SMD PROCESS
TAPE SPECIFICATIONS (units : mm)
REEL DIMENSION (units : mm)
Notes:
1. Don't cause stress to the LEDs while it is exposed to high temperature.
2. The maximum number of reflow soldering passes is 2 times.
3. Reflow soldering is recommended. Other soldering methods are not recommended as they might
cause damage to the product.
PACKING & LABEL SPECIFICATIONS
© 2019 Kingbright. All Rights Reserved. Spec No: DSAO2424 / 1201009036 Rev No: V.4B Date: 10/11/2019
Page 4 / 5
AAAF3529SEKJ3ZGKQBKS
HANDLING PRECAUTIONS
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is
more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone
encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED.
1. Handle the component along the
side surfaces by using forceps or
2. Do not directly touch or handle the silicone lens
3. Do not stack together assembled
surface. It may damage the internal circuitry.
appropriate tools.
PCBs containing exposed LEDs.
Impact may scratch the silicone lens
or damage the internal circuitry.
4-1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks.
4-2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.
4-3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure
precise pickup and avoid damage during production.
5.
As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver
plating of leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such
substances.
PRECAUTIONARY NOTES
1. The information included in this document reflects representative usage scenarios and is intended for technical reference only.
2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to
the latest datasheet for the updated specifications.
3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If
customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues.
4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening
liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance.
5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright.
6. All design applications should refer to Kingbright application notes available at https://www.KingbrightUSA.com/ApplicationNotes
© 2019 Kingbright. All Rights Reserved. Spec No: DSAO2424 / 1201009036 Rev No: V.4B Date: 10/11/2019
Page 5 / 5
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