AAAF3529VBDSEJ3ZGS

AAAF3529VBDSEJ3ZGS 3.5 x 2.8 mm Surface Mount SMD Chip LED PACKAGE DIMENSIONS DESCRIPTIONS The Blue source color devices are made with InGaN Light Emitting Diode The Hyper Red device is based on light emitting diode chip made from AlGaInP The Green source color devices are made with InGaN on Sapphire Light Emitting Diode Electrostatic discharge and power surge could damage the LEDs It is recommended to use a wrist band or antielectrostatic glove when handling the LEDs All devices, equipments and machineries must be electrically grounded Green Red Blue FEATURES Outstanding material efficiency Low power consumption Can produce any color in visible spectrum, including white light Suitable for all SMD assembly and solder process Available on tape and reel Package: 2000pcs / reel Moisture sensitivity level: 3 RoHS compliant RECOMMENDED SOLDERING PATTERN (units : mm; tolerance : ± 0.1) APPLICATIONS Backlight Status indicator Home and smart appliances Wearable and portable devices Healthcare applications ATTENTION Observe precautions for handling electrostatic discharge sensitive devices Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.2(0.008") unless otherwise noted. 3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications. SELECTION GUIDE Part Number AAAF3529VBDSEJ3ZGS Emitting Color (Material) ■ Blue (InGaN) ■ Hyper Red (AlGaInP) Iv (mcd) @ 20mA [2] Lens Type Water Clear ■ Green (InGaN) Min. Typ. 200 300 400 560 400 580 Viewing Angle [1] 2θ1/2 130° Notes: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. 2. Luminous intensity / luminous flux: +/-15%. 3. Luminous intensity value is traceable to CIE127-2007 standards. © 2019 Kingbright. All Rights Reserved. Spec No: DSAM7148 / 1201008462 Rev No: V.6B Date: 10/11/2019 Page 1 / 5 AAAF3529VBDSEJ3ZGS ELECTRICAL / OPTICAL CHARACTERISTICS at TA=25°C Parameter Symbol Emitting Color λpeak Value Unit Typ. Max. Blue Hyper Red Green 465 640 515 - nm λdom [1] Blue Hyper Red Green 470 625 525 - nm Spectral Bandwidth at 50% Φ REL MAX IF = 20mA Δλ Blue Hyper Red Green 22 25 35 - nm Capacitance C Blue Hyper Red Green 100 27 45 - pF Forward Voltage IF = 20mA VF [2] Blue Hyper Red Green 3.3 2.2 3.3 4.0 2.8 4.1 V Reverse Current (VR = 5V) IR Blue Hyper Red Green - 50 10 50 µA Temperature Coefficient of λpeak IF = 20mA, -10°C ≤ T ≤ 85°C TCλpeak Blue Hyper Red Green 0.04 0.13 0.05 - nm/°C Temperature Coefficient of λdom IF = 20mA, -10°C ≤ T ≤ 85°C TCλdom Blue Hyper Red Green 0.03 0.06 0.03 - nm/°C Temperature Coefficient of VF IF = 20mA, -10°C ≤ T ≤ 85°C TCV Blue Hyper Red Green -2.9 -2.0 -2.9 - mV/°C Wavelength at Peak Emission IF = 20mA Dominant Wavelength IF = 20mA Notes: 1. The dominant wavelength (λd) above is the setup value of the sorting machine. (Tolerance λd: ±1nm. ) 2. Forward voltage: ±0.1V. 3. Wavelength value is traceable to CIE127-2007 standards. 4. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure. ABSOLUTE MAXIMUM RATINGS at TA=25°C Parameter Symbol Value Blue Hyper Red Green Unit Power Dissipation PD 120 140 123 mW Reverse Voltage VR 5 5 5 V Junction Temperature Tj 115 115 115 °C Operating Temperature Top -40 to +85 °C Storage Temperature Tstg -40 to +85 °C DC Forward Current IF Peak Forward Current Electrostatic Discharge Threshold (HBM) Thermal Resistance (Junction / Ambient) Thermal Resistance (Junction / Solder point) IFM [1] - 30 50 30 mA 100 150 150 mA 250 3000 450 V Rth JA [2] 290 210 380 °C/W Rth JS [2] 180 120 250 °C/W Notes: 1. 1/10 Duty Cycle , 0.1ms Pulse Width . 2. Rt h JA, Rt h JS Results from mounting on PC board FR4 (pad size≥16 mm 2 per pad). 3. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033. © 2019 Kingbright. All Rights Reserved. Spec No: DSAM7148 / 1201008462 Rev No: V.6B Date: 10/11/2019 Page 2 / 5 AAAF3529VBDSEJ3ZGS TECHNICAL DATA SPATIAL DISTRIBUTION RELATIVE INTENSITY vs. WAVELENGTH Blue Green Red Relative Intensity (a. u.) 100% Ta = 25 °C Ta = 25 °C 80% 0° -15° 15° 30° -30° 45° -45° 60% 60° -60° 40% 20% 75° -75° 0% 350 400 450 500 550 600 Wavelength (nm) 650 700 750 800 -90° 1.0 0.5 0.0 90° 1.0 0.5 BLUE Forward Current vs. Forward Voltage 40 30 20 10 0 2.0 2.4 2.8 3.2 3.6 Forward voltage (V) Ta = 25 °C 2.0 1.5 1.0 0.5 0.0 4.0 0 10 20 30 40 Forward current (mA) 50 Permissible forward current (mA) Luminous intensity normalised at 20 mA 2.5 Ta = 25 °C Luminous Intensity vs. Ambient Temperature 2.5 Luminous intensity normalised at T a = 25 °C 50 Forward current (mA) Forward Current Derating Curve Luminous Intensity vs. Forward Current 40 30 20 10 0 50 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 Ambient temperature (°C) -40 -20 0 20 40 60 80 100 Ambient temperature (°C) HYPER RED Forward Current vs. Forward Voltage 40 30 20 10 0 1.5 1.7 1.9 2.1 2.3 Forward voltage (V) Ta = 25 °C 2.0 1.5 1.0 0.5 0.0 2.5 0 10 20 30 40 Forward current (mA) Luminous Intensity vs. Ambient Temperature 2.5 60 Luminous intensity normalised at T a = 25 °C Luminous intensity normalised at 20 mA Ta = 25 °C Permissible forward current (mA) 2.5 50 Forward current (mA) Forward Current Derating Curve Luminous Intensity vs. Forward Current 50 40 30 20 10 0 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 Ambient temperature (°C) 50 -40 -20 0 20 40 60 80 100 Ambient temperature (°C) GREEN 50 Forward current (mA) 40 30 20 10 2.4 2.8 3.2 3.6 Forward voltage (V) 4.0 Permissible forward current (mA) Luminous intensity normalised at 20 mA 2.5 Ta = 25 °C 0 2.0 Forward Current Derating Curve Luminous Intensity vs. Forward Current Ta = 25 °C 2.0 1.5 1.0 0.5 0.0 0 10 20 30 40 Forward current (mA) 50 © 2019 Kingbright. All Rights Reserved. Spec No: DSAM7148 / 1201008462 Rev No: V.6B Date: 10/11/2019 Luminous Intensity vs. Ambient Temperature 50 2.5 Luminous intensity normalised at T a = 25 °C Forward Current vs. Forward Voltage 40 30 20 10 0 -40 -20 0 20 40 60 80 100 Ambient temperature (°C) 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 Ambient temperature (°C) Page 3 / 5 AAAF3529VBDSEJ3ZGS REFLOW SOLDERING PROFILE for LEAD-FREE SMD PROCESS TAPE SPECIFICATIONS (units : mm) REEL DIMENSION (units : mm) Notes: 1. Don't cause stress to the LEDs while it is exposed to high temperature. 2. The maximum number of reflow soldering passes is 2 times. 3. Reflow soldering is recommended. Other soldering methods are not recommended as they might cause damage to the product. PACKING & LABEL SPECIFICATIONS © 2019 Kingbright. All Rights Reserved. Spec No: DSAM7148 / 1201008462 Rev No: V.6B Date: 10/11/2019 Page 4 / 5 AAAF3529VBDSEJ3ZGS HANDLING PRECAUTIONS Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. 4-1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. 4-2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 4-3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances. PRECAUTIONARY NOTES 1. The information included in this document reflects representative usage scenarios and is intended for technical reference only. 2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to the latest datasheet for the updated specifications. 3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues. 4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance. 5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright. 6. All design applications should refer to Kingbright application notes available at https://www.KingbrightUSA.com/ApplicationNotes © 2019 Kingbright. All Rights Reserved. Spec No: DSAM7148 / 1201008462 Rev No: V.6B Date: 10/11/2019 Page 5 / 5