AAAF5050-MC-K12

AAAF5050-MC-K12 5.0 x 5.0 mm Surface Mount LED Lamp DESCRIPTIONS




An intelligent control LED light source that integrates the control circuit and RGB chips in a 5050 package for a complete control of pixel point Data protocol uses unipolar NRZ communication mode The control chip integrated in the LED enables a simple circuit, small size, and convenient installation Electrostatic discharge and power surge could damage the LEDs It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs All devices, equipments and machineries must be electrically grounded tia l
PACKAGE DIMENSIONS







The control circuit and the LED share the same power source Intelligent protection against reverse connection Built-in electric reset and power lost reset circuit 256-level grayscale adjustable circuit Built-in signal reshaping circuit Cascade port transmission signal by single line Moisture sensitivity level: 3 Halogen-free RoHS compliant APPLICATIONS


RECOMMENDED SOLDERING PATTERN (units : mm; tolerance : ± 0.1) Decorative and entertainment lighting Full color soft light strip Commercial and residential architectural lighting Signage applications ATTENTION C
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en FEATURES Observe precautions for handling electrostatic discharge sensitive devices Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.2(0.008") unless otherwise noted. 3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications. PIN FUNCTION PIN CONFIGURATION © 2021 Kingbright. All Rights Reserved. Spec No: DSAP7044 / 1201009406 Rev No: V.3B Date: 01/04/2021 No. Symbol Function Description 1 VSS Ground 2 NC / 3 DI Control data signal input 4 VDD Power supply LED 5 VDD Power supply LED 6 DO Control data signal output Page 1 / 5 AAAF5050-MC-K12 SELECTION GUIDE Emitting Color (Material) Part Number Peak Dominant Wavelength Wavelength (nm) (nm) Lens Type ■ Hyper Red (AlGaInP) ■ Green (InGaN) AAAF5050-MC-K12 Water Clear ■ Blue (InGaN) ABSOLUTE MAXIMUM RATINGS at TA=25°C Power Supply Voltage Symbol EST Pressure 640 625 200 360 515 525 400 600 460 465 80 150 2θ1/2 120° +3.5~+5.5 V -0.5~VDD+0.5 V Top -40 to +85 °C Tstg -40 to +115 °C VESD 4000 V on fid Storage Temperature Typ. Unit VI Operating Temperature Min. Ratings VDD Input Voltage Typ. en Parameter Typ. Viewing Angle [1] tia l Notes: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. 2. Luminous intensity / luminous flux: +/-15%. 3. Luminous intensity value is traceable to the CIE 27-2007 compliant national standards. Iv (mcd) @ VDD = 5V, Gray Scale Level = 255 [2] C ELECTRICAL CHARACTERISTICS (TA=-20~+70°C,VDD=+4.5~+5.5V,VSS=0V,unless otherwise specified) Parameter Symbol Conditions Min. Typ. Max. Unit Supply Voltage VDD - - 5 - V R / G / B Port Pressure VDS - - - 26 V IOUT_R/G/B VDS_R/G/B - 12 - mA - 3.4 - V - 1.6 - V R / G / B Port Drive Current VIH The Signal Input Flip Threshold VDD=5V VIL The Frequency of PWM Static Power Consumption FPWM - - 1.2 - KHZ IDD - - 1 - mA © 2021 Kingbright. All Rights Reserved. Spec No: DSAP7044 / 1201009406 Rev No: V.3B Date: 01/04/2021 Page 2 / 5 AAAF5050-MC-K12 DYNAMIC CHARACTERISTICS at TA=25°C Parameter Operation Frequency Symbol Conditions Min. Typ. Max. Unit FDIN The Duty Ratio of 67%(Data 1) - 800 - KHZ - - 500 ns - - 500 ns - 70 - ns - 100 - ns TPLH Transmission Delay Time DIN → DOUT TPHL TR VDS=1.5V IOUT=12mA IOUT Time on fid en tia l TF DATA TRANSFER TIME(TH+TL=1.25µs±600ns) T0H T1H T0L 0.3µs ±150ns 1 code, high voltage time 0.6µs ±150ns 0 code, low voltage time 0.9µs ±150ns 1 code, low voltage time 0.6µs ±150ns low voltage time 80µs - C T1L 0 code, high voltage time RES SEQUENCE CHART © 2021 Kingbright. All Rights Reserved. Spec No: DSAP7044 / 1201009406 Rev No: V.3B Date: 01/04/2021 CASCADE METHOD Page 3 / 5 AAAF5050-MC-K12 TYPICAL APPLICATION CIRCUIT tia l DATA TRANSMISSION METHOD en Note: The data of D1 is sent by MCU, and D2,D3,D4 through pixel internal reshaping amplification to transmit. G7 G6 G5 G4 on fid COMPOSITION OF 24BIT DATA G3 G2 G1 G0 R7 R6 R5 R4 R3 R2 R1 R0 B7 B6 B5 B4 B3 B2 B1 B0 Note: Follow the order of GRB to send data and the high bit is sent first. TECHNICAL DATA TAPE SPECIFICATIONS (units : mm) C REFLOW SOLDERING PROFILE for LEAD-FREE SMD PROCESS REEL DIMENSION (units : mm) Notes: 1. Don't cause stress to the LEDs while it is exposed to high temperature. 2. The maximum number of reflow soldering passes is 2 times. 3. Reflow soldering is recommended. Other soldering methods are not recommended as they might cause damage to the product. © 2021 Kingbright. All Rights Reserved. Spec No: DSAP7044 / 1201009406 Rev No: V.3B Date: 01/04/2021 Page 4 / 5 AAAF5050-MC-K12 en HANDLING PRECAUTIONS tia l PACKING & LABEL SPECIFICATIONS Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. on fid 1. Handle the component along the side surfaces by using forceps or appropriate tools. 3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. C 4-1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. 4-2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 4-3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances. 6. LED shall be air sealed when used in environments where abundant moisture or corrosive substances such as sulfur are present. PRECAUTIONARY NOTES 1. The information included in this document reflects representative usage scenarios and is intended for technical reference only. 2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to the latest datasheet for the updated specifications. 3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues. 4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance. 5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright. 6. All design applications should refer to Kingbright application notes available at https://www.KingbrightUSA.com/ApplicationNotes © 2021 Kingbright. All Rights Reserved. Spec No: DSAP7044 / 1201009406 Rev No: V.3B Date: 01/04/2021 Page 5 / 5