AAAF5060QBDZGSEES

5.0mm x 6.0mm SURFACE MOUNT LED LAMP Part Number: AAAF5060QBDZGSEES ATTENTION Blue Hyper Red Green OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Features Description z Chips can be controlled separately. The Blue source color devices are made with InGaN on z Suitable for all SMT assembly and solder process. Sapphire Light Emitting Diode. z Available on tape and reel. The Hyper Red source color devices are made with Al- z Package: 500pcs / reel. GaInP on GaAs substrate Light Emitting Diode. z Moisture sensitivity level : level 3. The Green source color devices are made with InGaN z RoHS compliant. on Sapphire Light Emitting Diode. Static electricity and surge damage the LEDS. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. All devices, equipment and machinery must be electrically grounded. Package Dimensions GREEN RED BLUE Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.25(0.01") unless otherwise noted. 3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications. SPEC NO: DSAL0955 REV NO: V.2B DATE: JUL/11/2012 PAGE: 1 OF 8 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: D.M.Su ERP: 1201008311 Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. 4.1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. 4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances. All design applications should refer to Kingbright application notes available at http://www.KingbrightUSA.com/ApplicationNotes SPEC NO: DSAL0955 REV NO: V.2B DATE: JUL/11/2012 PAGE: 2 OF 8 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: D.M.Su ERP: 1201008311 Selection Guide Part No. Dice Iv (mcd) [2] @ 30mA Lens Type Min. Typ. 120 180 200 300 500 650 Blue (InGaN) AAAF5060QBDZGSEES Water Clear Hyper Red (AlGaInP) Green (InGaN) Viewing Angle [1] 2θ1/2 100° Notes: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. 2. Luminous intensity/ luminous Flux: +/-15%. 3. Luminous intensity value is traceable to the CIE127-2007 compliant national standards. Electrical / Optical Characteristics at TA=25°C Symbol Parameter Device Typ. λpeak Peak Wavelength Blue Hyper Red Green λD [1] Dominant Wavelength Δλ1/2 Max. Units Test Conditions 468 630 515 nm IF=20mA Blue Hyper Red Green 470 621 525 nm IF=20mA Spectral Line Half-width Blue Hyper Red Green 25 20 30 nm IF=20mA C Capacitance Blue Hyper Red Green 100 25 45 pF VF=0V;f=1MHz VF [2] Forward Voltage Blue Hyper Red Green 3.3 2 3.3 4 2.5 4.1 V IF=20mA IR Reverse Current Blue Hyper Red Green 50 10 50 uA VR=5V Notes: 1.Wavelength: +/-1nm. 2. Forward Voltage: +/-0.1V. 3. Wavelength value is traceable to the CIE127-2007 compliant national standards. Absolute Maximum Ratings at TA=25°C Parameter Blue Power dissipation[2] Hyper Red Green 350 Units mW DC Forward Current 30 30 30 mA Peak Forward Current [1] 150 195 150 mA Reverse Voltage 5 Operating Temperature -40°C To +85°C Storage Temperature -40°C To +85°C V Notes: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. 2. Within 350mW at all chips are lightened. SPEC NO: DSAL0955 REV NO: V.2B DATE: JUL/11/2012 PAGE: 3 OF 8 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: D.M.Su ERP: 1201008311 BLUE GREEN RED AAAF5060QBDZGSEES Blue SPEC NO: DSAL0955 REV NO: V.2B DATE: JUL/11/2012 PAGE: 4 OF 8 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: D.M.Su ERP: 1201008311 Hyper Red SPEC NO: DSAL0955 REV NO: V.2B DATE: JUL/11/2012 PAGE: 5 OF 8 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: D.M.Su ERP: 1201008311 Green SPEC NO: DSAL0955 REV NO: V.2B DATE: JUL/11/2012 PAGE: 6 OF 8 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: D.M.Su ERP: 1201008311 AAAF5060QBDZGSEES Reflow soldering is recommended and the soldering profile is shown below. Other soldering methods are not recommended as they might cause damage to the product. Recommended Soldering Pattern (Units : mm; Tolerance: ± 0.1) Reel Dimension Tape Dimensions (Units : mm) SPEC NO: DSAL0955 REV NO: V.2B DATE: JUL/11/2012 PAGE: 7 OF 8 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: D.M.Su ERP: 1201008311 PACKING & LABEL SPECIFICATIONS AAAF5060QBDZGSEES SPEC NO: DSAL0955 REV NO: V.2B DATE: JUL/11/2012 PAGE: 8 OF 8 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: D.M.Su ERP: 1201008311