AAAF5060QBFSURZGS

5.0mm x 6.0mm SURFACE MOUNT LED LAMP Part Number: AAAF5060QBFSURZGS ATTENTION Blue Hyper Red Green OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Features Description z Chips can be controlled separately. The Blue source color devices are made with InGaN Light z Suitable for all SMT assembly and solder process. Emitting Diode. z Available on tape and reel. The Hyper Red source color devices are made with Al- z Package: 500pcs / reel. GaInP on GaAs substrate Light Emitting Diode. z Moisture sensitivity level : level 3. The Green source color devices are made with InGaN z RoHS compliant. on Sapphire Light Emitting Diode. Static electricity and surge damage the LEDS. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. All devices, equipment and machinery must be electrically grounded. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.25(0.01") unless otherwise noted. 3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications. SPEC NO: DSAL0957 APPROVED: WYNEC REV NO: V.1 CHECKED: Allen Liu DATE: OCT/06/2010 DRAWN: F.F.Zhou PAGE: 1 OF 8 ERP: 1201007061 Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. 4. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diameter of the nozzle should be as large as possible. 5. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 6. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. SPEC NO: DSAL0957 APPROVED: WYNEC REV NO: V.1 CHECKED: Allen Liu DATE: OCT/06/2010 DRAWN: F.F.Zhou PAGE: 2 OF 8 ERP: 1201007061 Selection Guide Part No. Dice Lens Type Blue (InGaN) AAAF5060QBFSURZGS Water Clear Hyper Red (AlGaInP) Green (InGaN) Iv (mcd) [2] @ 30mA *50mA Min. Typ. 280 400 *500 *800 500 1000 Viewing Angle [1] 2θ1/2 100° Notes: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. 2. *Luminous intensity with asterisk is measured at 50mA; Luminous intensity/ luminous Flux: +/-15%. Electrical / Optical Characteristics at TA=25°C Symbol Parameter Device Typ. λpeak Peak Wavelength Blue Hyper Red Green λD [1] Dominant Wavelength Δλ1/2 Max. Units Test Conditions 461 650 515 nm IF=20mA Blue Hyper Red Green 465 630 525 nm IF=20mA Spectral Line Half-width Blue Hyper Red Green 25 27 30 nm IF=20mA C Capacitance Blue Hyper Red Green 100 45 45 pF VF=0V;f=1MHz VF [2] Forward Voltage Blue Hyper Red Green 3.3 1.9 3.3 4 2.5 4.1 V IF=20mA IR Reverse Current Blue Hyper Red Green 50 10 50 uA VR=5V Notes: 1.Wavelength: +/-1nm. 2. Forward Voltage: +/-0.1V. Absolute Maximum Ratings at TA=25°C Parameter Blue Power dissipation[2] Hyper Red Green 350 Units mW DC Forward Current 30 50 30 mA Peak Forward Current [1] 150 185 150 mA Reverse Voltage 5 Operating Temperature -40°C To +85°C Storage Temperature -40°C To +85°C V Notes: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. 2. Within 350mW at all chips are lightened. SPEC NO: DSAL0957 APPROVED: WYNEC REV NO: V.1 CHECKED: Allen Liu DATE: OCT/06/2010 DRAWN: F.F.Zhou PAGE: 3 OF 8 ERP: 1201007061 AAAF5060QBFSURZGS Blue SPEC NO: DSAL0957 APPROVED: WYNEC REV NO: V.1 CHECKED: Allen Liu DATE: OCT/06/2010 DRAWN: F.F.Zhou PAGE: 4 OF 8 ERP: 1201007061 Hyper Red SPEC NO: DSAL0957 APPROVED: WYNEC REV NO: V.1 CHECKED: Allen Liu DATE: OCT/06/2010 DRAWN: F.F.Zhou PAGE: 5 OF 8 ERP: 1201007061 Green SPEC NO: DSAL0957 APPROVED: WYNEC REV NO: V.1 CHECKED: Allen Liu DATE: OCT/06/2010 DRAWN: F.F.Zhou PAGE: 6 OF 8 ERP: 1201007061 AAAF5060QBFSURZGS Reflow soldering is recommended and the soldering profile is shown below. Other soldering methods are not recommended as they might cause damage to the product. Recommended Soldering Pattern (Units : mm; Tolerance: ± 0.1) Reel Dimension Tape Dimensions (Units : mm) SPEC NO: DSAL0957 APPROVED: WYNEC REV NO: V.1 CHECKED: Allen Liu DATE: OCT/06/2010 DRAWN: F.F.Zhou PAGE: 7 OF 8 ERP: 1201007061 PACKING & LABEL SPECIFICATIONS SPEC NO: DSAL0957 APPROVED: WYNEC REV NO: V.1 CHECKED: Allen Liu AAAF5060QBFSURZGS DATE: OCT/06/2010 DRAWN: F.F.Zhou PAGE: 8 OF 8 ERP: 1201007061