AP32156SF4C

INFRA-RED EMITTING DIODES AP3216F3C AP3216SF4C Features ! WATER Description F3 Made with Gallium Arsenide Infrared Emitting diodes. SF4 Made with Gallium Aluminum Arsenide Infrared Emitting diodes. CLEAR LENS AVAILABLE. ! 3.2mmx1.6mm SMT LED, 1.1mm THICKNESS. ! HIGH POWER OUTPUT. ! PACKAGE: 2000PCS/REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.2(0.0079") unless otherwise noted. 3. Lead spacing is measured where the lead emerge package. 4. Specifications are subject to change without notice. D i g i t a l l y s i g n e d b y Y A N G S H O U F E N c n = Y A N G S H O U F E N , o u = K I N G B R I H G T , o = 4 2 , c = U S D a t e : 2 0 0 1 . 1 1 . 1 2 1 3 : 5 7 : 5 4 + 0 8 '0 0 'R e a s o n : D o c u m e n t i s c e r t i f i e d S PEC NO: CDA0510 APPROVED: J.LU REV NO: V.1 CHECKED: DATE: NOV/12/2001 DRAWN: M.F.CAI PAGE: 1 OF 5 Selection Guide Par t No . Dic e L en s Ty p e Po = (mW/s r ) @20mA Mi n . AP3216F3C AP3216SF4C GaAs GaAlAs WATER CLEAR WATER CLEAR 0.5 0.5 Ty p . 1.2 1 Viewin g An g le 2θ1/2 120° 120° Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25°C It em Forward Voltage Reverse Current Junction Capacitance Peak Spectral Wavelength Spectral Bandwidth P/N F3 S F4 F3 S F4 F3 S F4 F3 S F4 F3 S F4 Sy m b o l VF IR C λP ∆λ Ty p . 1.2 1.3 90 90 940 880 50 50 Max . 1.5 1.7 10 10 Un it V uA pF nm nm Co n d it io n IF=20mA VR=5V V=0 f=1MHz IF=20mA IF=20mA Absolute Maximum Ratings at T)=25°C It em Power Dissipation Forward Current Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature Note: 1.1/100 Duty Cycle, 10us Pluse Width. Sy m b o l PT IF i FS Max im u m Rat in g 100 50 1.2 5 -40~ +85 -40~ +85 Un it s mW mA A V °C °C VR TA TSTG S PEC NO: CDA0510 APPROVED: J.LU REV NO: V.1 CHECKED: DATE: NOV/12/2001 DRAWN: M.F.CAI PAGE: 2 OF 5 AP3216F3C S PEC NO: CDA0510 APPROVED: J.LU REV NO: V.1 CHECKED: DATE: NOV/12/2001 DRAWN: M.F.CAI PAGE: 3 OF 5 AP3216SF4C AP3216F3C,AP3216SF4C SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. S PEC NO: CDA0510 APPROVED: J.LU REV NO: V.1 CHECKED: DATE: NOV/12/2001 DRAWN: M.F.CAI PAGE: 4 OF 5 Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) .! 5." S PEC NO: CDA0510 APPROVED: J.LU REV NO: V.1 CHECKED: DATE: NOV/12/2001 DRAWN: M.F.CAI PAGE: 5 OF 5