APA3010F3C-GX

APA3010F3C-GX 3.0 mm x 1.0 mm Right Angle Infrared Emitting Diode DESCRIPTION
PACKAGE DIMENSIONS F3 Made with Gallium Arsenide Infrared Emitting diodes FEATURES






3.0 x 2.0 x 1.0 mm right angle SMD LED, 1.0 mm thickness Mechanically and spectrally matched to the phototransistor Package: 2000 pcs / reel Moisture sensitivity level: 3 Tinned pads for improved solderability Halogen-free RoHS compliant APPLICATIONS





Infrared Illumination for cameras Machine vision systems Surveillance systems Industrial electronics IR data transmission Remote control RECOMMENDED SOLDERING PATTERN (units : mm; tolerance : ± 0.1) Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.15(0.006") unless otherwise noted. 3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications. SELECTION GUIDE Part Number APA3010F3C-GX Po (mW/sr) @ 20mA [2] Emitting Color (Material) Lens Type Infrared (GaAs) Water Clear Min. Typ. 1.2 3 *0.8 *2 Viewing Angle [1] 2θ1/2 160° Notes: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. 2. Radiant Intensity / luminous flux: +/-15%. * Radiant intensity value is traceable to CIE127-2007 standards. © 2021 Kingbright. All Rights Reserved. Spec No: DSAL3678 / 1203000562 Rev No: V.9A Date: 01/21/2021 Page 1 / 4 APA3010F3C-GX ELECTRICAL / OPTICAL CHARACTERISTICS at TA=25°C Value Parameter Symbol Emitting Color Unit Typ. Max. Wavelength at Peak Emission IF = 20mA λpeak Infrared 940 - nm Spectral Bandwidth at 50% Φ REL MAX IF = 20mA ∆λ Infrared 50 - nm Capacitance C Infrared 90 - pF Forward Voltage IF = 20mA VF [1] Infrared 1.2 1.6 V Reverse Current (VR = 5V) IR Infrared - 10 µA Temperature Coefficient of Wavelength IF = 20mA, -10°C ≤ T ≤ 85°C TCλ Infrared 0.3 - nm/°C Temperature Coefficient of VF IF = 20mA, -10°C ≤ T ≤ 85°C TCV Infrared -1.2 - mV/°C Notes: 1. Forward voltage: ±0.1V. 2. Wavelength value is traceable to CIE127-2007 standards. 3. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure. ABSOLUTE MAXIMUM RATINGS at TA=25°C Parameter Symbol Value Unit Power Dissipation PD 90 mW Reverse Voltage VR 5 V Junction Temperature Tj 115 °C Operating Temperature Top -40 to +85 °C Storage Temperature Tstg -40 to +85 °C DC Forward Current IF 50 mA IFM [1] 1.2 A Electrostatic Discharge Threshold (HBM) - 8000 V Thermal Resistance (Junction / Ambient) Rth JA [2] 470 °C/W Thermal Resistance (Junction / Solder point) Rth JS [2] 330 °C/W Peak Forward Current Notes: 1. 1/100 Duty Cycle, 10µs Pulse Width. 2. Rt h JA ,Rt h JS Results from mounting on PC board FR4 (pad size ≥ 16 mm 2 per pad). 3. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033. © 2021 Kingbright. All Rights Reserved. Spec No: DSAL3678 / 1203000562 Rev No: V.9A Date: 01/21/2021 Page 2 / 4 APA3010F3C-GX TECHNICAL DATA SPATIAL DISTRIBUTION RELATIVE INTENSITY vs. WAVELENGTH F3 Relative Intensity (a. u.) 100% -15° Ta = 25 °C Ta = 25 °C 0° -30° 15° 30° 80% -45° 45° 60% 60° -60° 40% 20% 75° -75° 0% 550 600 650 700 750 800 850 Wavelength (nm) 900 950 1000 1050 -90° 1.0 0.5 0.0 90° 1.0 0.5 INFRARED Forward current (mA) Ta = 25 °C 40 30 20 10 0 0.8 Permissible forward current (mA) 2.5 Radiant intensity normalised at 20mA 50 Ta = 25 °C 2.0 1.5 1.0 0.5 0.0 1.0 1.2 1.4 1.6 Forward voltage (V) 1.8 0 Radiant Intensity vs. Ambient Temperature Forward Current Derating Curve Radiant Intensity vs. Forward Current 10 20 30 40 Forward current (mA) 50 REFLOW SOLDERING PROFILE for LEAD-FREE SMD PROCESS 70 2.5 Radiant intensity normalised at Ta = 25 °C Forward Current vs. Forward Voltage 60 50 40 30 20 10 0 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 Ambient temperature (°C) -40 -20 0 20 40 60 80 100 Ambient temperature (°C) TAPE SPECIFICATIONS (units : mm) REEL DIMENSION (units : mm) Notes: 1. Don't cause stress to the LEDs while it is exposed to high temperature. 2. The maximum number of reflow soldering passes is 2 times. 3. Reflow soldering is recommended. Other soldering methods are not recommended as they might cause damage to the product. © 2021 Kingbright. All Rights Reserved. Spec No: DSAL3678 / 1203000562 Rev No: V.9A Date: 01/21/2021 Page 3 / 4 APA3010F3C-GX PACKING & LABEL SPECIFICATIONS PRECAUTIONARY NOTES 1. The information included in this document reflects representative usage scenarios and is intended for technical reference only. 2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to the latest datasheet for the updated specifications. 3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues. 4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance. 5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright. 6. All design applications should refer to Kingbright application notes available at https://www.KingbrightUSA.com/ApplicationNotes © 2021 Kingbright. All Rights Reserved. Spec No: DSAL3678 / 1203000562 Rev No: V.9A Date: 01/21/2021 Page 4 / 4