APC3216EC

3.2x1.6mm SMD CHIP LED LAMP APC3216EC HIGH EFFICIENCY RED Features !3.2mmx1.6mm SMT LED, 1.1mm THICKNESS. !LOW POWER CONSUMPTION. !WIDE VIEWING ANGLE. !IDEAL FOR BACKLIGHT AND INDICATOR. ! VARIOUS !PACKAGE Description The High Efficiency Red source color devices are made with Gallium Arsenide Phosphide on Gallium Phosphide Orange Light Emitting Diode. COLORS AND LENS TYPES AVAILABLE. : 2000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ± 0.2(0.0079") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO: DSAD0995 APPROVED : J. Lu REV NO: V.1 CHECKED :Allen Liu DATE:MAR/20/2003 DRAWN:D.L.HUANG PAGE: 1 OF 4 Selection Guide Par t No . Dic e L en s Ty p e Iv (m c d ) @ 20 m A Min . APC3216EC HIGH EFFICIENCY RED(GaAsP/GaP) WATER CLEAR 4 Ty p . 12 V i ew i n g An g l e 2θ1/2 12 0 ° Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25°C Sy m b o l λpeak λD ∆λ1/2 C VF IR Par am et er Peak Wavelength Dominate Wavelength D ev i c e High Efficiency Red High Efficiency Red Ty p . 6 27 6 25 45 15 2.0 2.5 10 Max . Un it s nm nm nm pF V uA Tes t Co n d it io n s I F =20mA I F =20mA I F =20mA V F=0V;f =1MHz I F =20mA V R = 5V Spectral Line Half-width High Efficiency Red Capacitance Forward Voltage Reverse Current High Efficiency Red High Efficiency Red High Efficiency Red Absolute Maximum Ratings at T)=25°C P ar am e t e r Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating/Storage Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. H i g h E f f i c i e n c y R ed 105 30 160 5 -40°C To +85°C Un it s mW mA mA V SPEC NO: DSAD0995 APPROVED : J. Lu REV NO: V.1 CHECKED :Allen Liu DATE:MAR/20/2003 DRAWN:D.L.HUANG PAGE: 2 OF 4 High Efficiency Red APC3216EC SPEC NO: DSAD0995 APPROVED : J. Lu REV NO: V.1 CHECKED :Allen Liu DATE:MAR/20/2003 DRAWN:D.L.HUANG PAGE: 3 OF 4 APC3216EC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAD0995 APPROVED : J. Lu REV NO: V.1 CHECKED :Allen Liu DATE:MAR/20/2003 DRAWN:D.L.HUANG PAGE: 4 OF 4