APC3216MBC

3.2x1.6mm SMD CHIP LED LAMP APC3216MBC BLUE Features !3.2mmx1.6mm SMT LED, 1.1mm THICKNESS. !LOW POWER CONSUMPTION. !WIDE VIEWING ANGLE. !IDEAL FOR BACKLIGHT AND INDICATOR. ! VARIOUS !PACKAGE Description The Blue source color devices are made with GaN on SiC Light Emitting Diode. Static electricity and surge damage the LEDS. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. All devices, equipment and machinery must be electrically grounded. COLORS AND LENS TYPES AVAILABLE. : 2000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ± 0.2(0.0079") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO: DSAD1006 APPROVED: J. Lu REV NO: V.1 CHECKED: Allen Liu DATE:MAR/20/2003 DRAWN:D.L.HUANG PAGE: 1 OF 4 Selection Guide Par t No . APC3216MBC Blue (GaN) Dic e L en s Ty p e WATER CLEAR 4 Iv (m c d ) @ 20 m A Min . Ty p . 10 V i ew i n g An g l e 2θ1/2 120° Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25°C Sy m b o l λpeak λD ∆λ1/2 C VF IR Par am et er Peak Wavelength Dominate Wavelength Blue Blue D ev i c e Ty p . 430 466 60 100 3.8 4.5 10 Max . Un it s nm nm nm pF V uA Tes t Co n d it io n s I F =20mA I F =20mA I F =20mA VF=0V;f=1MHz I F =20mA V R = 5V Spectral Line Half-width Blue Capacitance Forward Voltage Reverse Current Blue Blue Blue Absolute Maximum Ratings at T)=25°C P ar am e t e r Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating /Storage Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. B lu e 105 30 150 5 -40°C To +85°C Un it s mW mA mA V SPEC NO: DSAD1006 APPROVED: J. Lu REV NO: V.1 CHECKED: Allen Liu DATE:MAR/20/2003 DRAWN:D.L.HUANG PAGE: 2 OF 4 Blue APC3216MBC SPEC NO: DSAD1006 APPROVED: J. Lu REV NO: V.1 CHECKED: Allen Liu DATE:MAR/20/2003 DRAWN:D.L.HUANG PAGE: 3 OF 4 APC3216MBC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAD1006 APPROVED: J. Lu REV NO: V.1 CHECKED: Allen Liu DATE:MAR/20/2003 DRAWN:D.L.HUANG PAGE: 4 OF 4