3.2x1.6mm SMD CHIP LED LAMP
APC3216SEC SUPER BRIGHT ORANGE
Features
!3.2mmx1.6mm SMT LED, 1.1mm THICKNESS. !LOW POWER CONSUMPTION. !WIDE VIEWING ANGLE. !IDEAL FOR BACKLIGHT AND INDICATOR. ! VARIOUS !PACKAGE
Description
The Super Bright Orange source color devices are made with DH InGaAlP on GaAs substrate Light Emitting Diode.
COLORS AND LENS TYPES AVAILABLE. : 2000PCS / REEL.
Package Dimensions
Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ± 0.2(0.0079") unless otherwise noted. 3. Specifications are subject to change without notice.
SPEC NO: DSAD0999 APPROVED: J. Lu
REV NO: V.1 CHECKED: Allen Liu
DATE:MAR/20/2003 DRAWN:D.L.HUANG
PAGE: 1 OF 4
Selection Guide
P ar t N o . Dic e L en s Ty p e Iv (m c d ) @ 20 m A Min . APC3216SEC SUPER BRIGHT ORANGE ( InGaAlP) WATER CLEAR 70 Ty p . 20 0 V i ew i n g An g l e 2θ1/2 120°
Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Electrical / Optical Characteristics at T)=25°C
Sy m b o l λpeak λD ∆λ1/2 C VF IR Par am et er Peak Wavelength Dominate Wavelength Spectral Line Half-width Capacitance Forward Voltage Reverse Current D ev i c e Super Bright Orange Super Bright Orange Super Bright Orange Super Bright Orange Super Bright Orange Super Bright Orange Ty p . 6 10 601 29 30 2.0 2.5 10 Max . Un it s nm nm nm pF V uA Tes t Co n d it io n s IF = 2 0 m A IF = 2 0 m A IF = 2 0 m A V F = 0 V; f = 1 M Hz IF = 2 0 m A VR = 5V
Absolute Maximum Ratings at T)=25°C
P ar am e t e r Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating/Storage Temperature
Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Su p er B r ig h t Or an g e 75 30 195 5 -40°C To +85°C
Un it s mW mA mA V
SPEC NO: DSAD0999 APPROVED: J. Lu
REV NO: V.1 CHECKED: Allen Liu
DATE:MAR/20/2003 DRAWN:D.L.HUANG
PAGE: 2 OF 4
Super Bright Orange
APC3216SEC
SPEC NO: DSAD0999 APPROVED: J. Lu
REV NO: V.1 CHECKED: Allen Liu
DATE:MAR/20/2003 DRAWN:D.L.HUANG
PAGE: 3 OF 4
APC3216SEC SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process.
Recommended Soldering Pattern (Units : mm)
Tape Specifications (Units : mm)
SPEC NO: DSAD0999 APPROVED: J. Lu
REV NO: V.1 CHECKED: Allen Liu
DATE:MAR/20/2003 DRAWN:D.L.HUANG
PAGE: 4 OF 4
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