APC3216SYC

3.2x1.6mm SMD CHIP LED LAMP APC3216SYC SUPER BRIGHT YELLOW Features !3.2mmx1.6mm SMT LED, 1.1mm THICKNESS. !LOW POWER CONSUMPTION. !WIDE VIEWING ANGLE. !IDEAL FOR BACKLIGHT AND INDICATOR. ! VARIOUS ! PACKAGE Description The Super Bright Yellow source color devices are made with DH InGaAIP on GaAs substrate Light Emitting Diode. COLORS AND LENS TYPES AVAILABLE. : 2000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.2(0.0079") unless otherwise noted. 3. Specifications are subject to change without notice. S PEC NO: DSAD1002 APPROVED : J. Lu REV NO: V.1 CHECKED : Allen Liu DATE:MAR/20/2003 DRAWN:D.L.HUANG PAGE: 1 OF 4 Selection Guide Par t No . Dic e L en s Ty p e Iv (m c d ) @ 20 m A Min . APC3216SYC SUPER BRIGHT YELLOW (InGaAIP) WATER CLEAR 36 Ty p . 10 0 V i ew i n g An g l e 2θ1/2 120° Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25°C Sy m b o l λpeak λD ∆λ1/2 C VF IR Par am et er Peak Wavelength Dominate Wavelength Spectral Line Half-width Capacitance Forward Voltage Reverse Current D ev i c e Super Bright Yellow Super Bright Yellow Super Bright Yellow Super Bright Yellow Super Bright Yellow Super Bright Yellow Ty p . 590 588 28 25 2.0 2.5 10 Max . Un it s nm nm nm pF V uA Tes t Co n d it io n s I F =20mA I F =20mA I F =20mA VF=0V;f=1MHz I F =20mA V R = 5V Absolute Maximum Ratings at T)=25°C Par am et er Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating/Storage Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. Su p er B r ig h t Yello w 12 5 30 150 5 -40°C To +85°C Un it s mW mA mA V S PEC NO: DSAD1002 APPROVED : J. Lu REV NO: V.1 CHECKED : Allen Liu DATE:MAR/20/2003 DRAWN:D.L.HUANG PAGE: 2 OF 4 Super Bright Yellow APC3216SYC S PEC NO: DSAD1002 APPROVED : J. Lu REV NO: V.1 CHECKED : Allen Liu DATE:MAR/20/2003 DRAWN:D.L.HUANG PAGE: 3 OF 4 APC3216SYC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) S PEC NO: DSAD1002 APPROVED : J. Lu REV NO: V.1 CHECKED : Allen Liu DATE:MAR/20/2003 DRAWN:D.L.HUANG PAGE: 4 OF 4