2.0x1.25mm SMD CHIP LED LAMP
APTC2012MBC BLUE
Features
!2.0mmx1.25mm SMT LED,0.75mm THICKNESS. !LOW
Description
The Blue source color devices are made with GaN on SiC Light Emitting Diode. Static electricity and surge damage the LEDS. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. All devices, equipment and machinery must be electrically grounded.
POWER CONSUMPTION. VIEWING ANGLE. COLORS AND LENS TYPES AVAILABLE. : 2000PCS / REEL.
! WIDE
!IDEAL FOR BACKLIGHT AND INDICATOR. ! VARIOUS !PACKAGE
Package Dimensions
Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.1(0.004") unless otherwise noted. 3. Specifications are subject to change without notice.
S PEC NO: DSAD0961 APPROVED : J. Lu
REV NO: V.1 CHECKED :Allen Liu
DATE:MAR/22/2003 DRAWN: S.J.HOU
PAGE: 1 OF 4
Selection Guide
Par t No . Dic e L en s Ty p e Iv (m c d ) @ 20 m A Min . APTC2012MBC BLUE (GaN) WATER CLEAR 4 Ty p . 10 V i ew i n g An g l e 2θ1/2 120°
Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Electrical / Optical Characteristics at T)=25°C
Sy m b o l λpeak λD ∆λ1/2 C VF IR Par am et er Peak Wavelength Dominate Wavelength Spectral Line Half-width Capacitance Forward Voltage Reverse Current Blue Blue Blue Blue Blue Blue D ev i c e Ty p . 430 466 60 100 3.8 4.5 10 Max . Un it s nm nm nm pF V uA Tes t Co n d it io n s IF = 2 0 m A IF = 2 0 m A IF = 2 0 m A V F = 0 V; f = 1 M Hz IF = 2 0 m A VR = 5V
Absolute Maximum Ratings at T)=25°C
P ar am e t e r Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating / Storage Temperature
Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width.
B lu e 105 30 150 5 -40°C To +85°C
Un it s mW mA mA V
S PEC NO: DSAD0961 APPROVED : J. Lu
REV NO: V.1 CHECKED :Allen Liu
DATE:MAR/22/2003 DRAWN: S.J.HOU
PAGE: 2 OF 4
Blue
APTC2012MBC
S PEC NO: DSAD0961 APPROVED : J. Lu
REV NO: V.1 CHECKED :Allen Liu
DATE:MAR/22/2003 DRAWN: S.J.HOU
PAGE: 3 OF 4
APTC2012MBC SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process.
Recommended Soldering Pattern (Units : mm)
Tape Specifications (Units : mm)
S PEC NO: DSAD0961 APPROVED : J. Lu
REV NO: V.1 CHECKED :Allen Liu
DATE:MAR/22/2003 DRAWN: S.J.HOU
PAGE: 4 OF 4
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