ATS2012UV385

ATS2012UV385 2.0 x 1.25 mm UV LED With Ceramic Substrate FEATURES






PACKAGE DIMENSIONS 2.0 mm x 1.25 mm SMD LED, 0.75 mm thickness Low power consumption Wide viewing angle Package: 2000 pcs / reel Moisture sensitivity level: 1 Halogen-free RoHS compliant APPLICATIONS



Photocatalytic Purification Blood and Counterfeit money detection UV curing in nail salon, dental, and poster printing applications UV Sensor Light PACKAGE MATERIALS
Material as follows: Package: Ceramics Encapsulating resin: Silicone resin Electrodes: Au plating RECOMMENDED SOLDERING PATTERN ATTENTION (units : mm; tolerance : ± 0.1) Observe precautions for handling electrostatic discharge sensitive devices Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.25(0.01") unless otherwise noted. 3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications. SELECTION GUIDE Part Number ATS2012UV385 Emitting Color (Material) Lens Type Ultraviolet (InGaN) Water Clear Φe(mW) [2] @ 20mA Viewing [1] Angle Min. Typ. 2θ1/2 10 16 150° Notes: 1. θ1/2 is the angle from optical centerline where the radiant intensity is 1/2 of the optical peak value. 2. Radiant flux: +/-15%. 3. Radiant flux value is traceable to CIE127-2007 standards. © 2021 Kingbright. All Rights Reserved. Spec No: DSAP4443 / 1212000493 Rev No: V.2B Date: 03/26/2021 Page 1 / 4 ATS2012UV385 ELECTRICAL / OPTICAL CHARACTERISTICS at TA=25°C Parameter Symbol Value Wavelength at Peak Emission IF = 20mA [Min.] Unit 380 Wavelength at Peak Emission IF = 20mA [Typ.] 385 λpeak Wavelength at Peak Emission IF = 20mA [Max.] nm 390 Spectral Bandwidth at 50% Φ REL MAX IF = 20mA [Typ.] ∆λ 12 Forward Voltage IF = 20mA [Typ.] nm 3.3 VF [1] V Forward Voltage IF = 20mA [Max.] 3.8 Reverse Current (VR = 5V) [Max.] Temperature Coefficient of VF IF = 20mA, -10°C ≤ T ≤ 85°C IR 50 µA TCV -3.0 mV/°C Notes: 1. Forward voltage: ±0.1V. 2. Wavelength value is traceable to CIE127-2007 standards. 3. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure. ABSOLUTE MAXIMUM RATINGS at TA=25°C Parameter Symbol Value Unit Power Dissipation PD 120 mW Reverse Voltage VR 5 V Junction Temperature Tj 115 °C Operating Temperature Top -40 to +85 °C Storage Temperature Tstg -40 to +85 °C DC Forward Current IF 30 mA IFM [1] 100 mA Thermal Resistance (Junction / Ambient) Rth JA [2] 100 °C/W Thermal Resistance (Junction / Solder point) Rth JS [2] 50 °C/W Peak Forward Current Notes: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. 2. Rt h JA ,Rt h JS Results from mounting on PC board FR4 (pad size ≥ 16 mm 2 per pad). 3. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033. © 2021 Kingbright. All Rights Reserved. Spec No: DSAP4443 / 1212000493 Rev No: V.2B Date: 03/26/2021 Page 2 / 4 ATS2012UV385 TECHNICAL DATA SPATIAL DISTRIBUTION Relative radiant Intensity (a. u.) RELATIVE INTENSITY vs. WAVELENGTH 100% 0° -15° Ta = 25 °C Ta = 25 °C -30° 80% 15° 30° -45° 45° 60% 60° -60° 40% 20% 75° -75° 0% 300 315 330 345 360 375 390 Wavelength (nm) 405 420 435 450 -90° 1.0 0.5 0.0 90° 1.0 0.5 ULTRAVIOLET 2.5 Radiant flux normalised at 20 mA Forward current (mA) Ta = 25 °C 40 30 20 10 Ta = 25 °C 2 1.5 1 0.5 0 2.9 3.1 3.3 3.5 Forward voltage (V) 3.7 Radiant Flux vs. Ambient Temperature 50 Permissible forward current (mA) 50 0 2.7 Forward Current Derating Curve Radiant Flux vs. Forward Current 0 10 20 30 40 Forward current (mA) 50 REFLOW SOLDERING PROFILE for LEAD-FREE SMD PROCESS 2.5 Radiant flux normalised at T a = 25 °C Forward Current vs. Forward Voltage 40 30 20 10 0 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 Ambient temperature (°C) -40 -20 0 20 40 60 80 100 Ambient temperature (°C) TAPE SPECIFICATIONS (units : mm) REEL DIMENSION (units : mm) Notes: 1. Don't cause stress to the LEDs while it is exposed to high temperature. 2. The maximum number of reflow soldering passes is 2 times. 3. Reflow soldering is recommended. Other soldering methods are not recommended as they might cause damage to the product. © 2021 Kingbright. All Rights Reserved. Spec No: DSAP4443 / 1212000493 Rev No: V.2B Date: 03/26/2021 Page 3 / 4 ATS2012UV385 PACKING & LABEL SPECIFICATIONS HANDLING PRECAUTIONS Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 4. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of lead frame. Special care should be taken if an LED with silicone encapsulation is to be used near such substances. PRECAUTIONARY NOTES 1. The information included in this document reflects representative usage scenarios and is intended for technical reference only. 2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to the latest datasheet for the updated specifications. 3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues. 4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance. 5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright. 6. All design applications should refer to Kingbright application notes available at https://www.KingbrightUSA.com/ApplicationNotes © 2021 Kingbright. All Rights Reserved. Spec No: DSAP4443 / 1212000493 Rev No: V.2B Date: 03/26/2021 Page 4 / 4