WP154A4SEJ3VBDZGC/CA

WP154A4SEJ3VBDZGC/CA T-1 3/4 (5mm) Full Color LED Lamp DESCRIPTIONS z z z z z z PACKAGE DIMENSIONS The Hyper Red device is based on light emitting diode chip made from AlGaInP The Blue source color devices are made with InGaN Light Emitting Diode The Green source color devices are made with InGaN on Sapphire Light Emitting Diode Electrostatic discharge and power surge could damage the LEDs It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs All devices, equipments and machineries must be electrically grounded FEATURES z z z z Uniform light output Low power consumption Long life-solid state reliability RoHS compliant APPLICATIONS z z z z z Status indicator Illuminator Signage applications Decorative and entertainment lighting Commercial and residential architectural lighting Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.25(0.01") unless otherwise noted. 3. Lead spacing is measured where the leads emerge from the package. 4. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. ATTENTION Observe precautions for handling electrostatic discharge sensitive devices SELECTION GUIDE Part Number Emitting Color (Material) Iv (mcd) @ 20mA [2] Lens Type ■ Hyper Red (AlGaInP) WP154A4SEJ3VBDZGC/CA ■ Blue (InGaN) Water Clear ■ Green (InGaN) Min. Typ. 1900 2600 *1000 *1500 1000 1800 *1000 *1800 1200 2000 *1200 *2000 Viewing Angle [1] 2θ1/2 50° Notes: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. 2. Luminous intensity / luminous flux: +/-15%. * Luminous intensity value is traceable to CIE127-2007 standards. © 2019 Kingbright. All Rights Reserved. Spec No: DSAO0224 / 1101032014 Rev No: V.3A Date: 11/15/2019 Page 1 / 5 WP154A4SEJ3VBDZGC/CA ELECTRICAL / OPTICAL CHARACTERISTICS at TA=25°C Parameter Symbol Emitting Color λpeak Value Unit Typ. Max. Hyper Red Blue Green 640 465 515 - nm λdom [1] Hyper Red Blue Green 625 470 525 - nm Spectral Bandwidth at 50% Φ REL MAX IF = 20mA Δλ Hyper Red Blue Green 25 22 30 - nm Capacitance C Hyper Red Blue Green 27 100 45 - pF Forward Voltage IF = 20mA VF [2] Hyper Red Blue Green 2.2 3.3 3.3 2.8 4.0 4.1 V Reverse Current (VR = 5V) IR Hyper Red Blue Green - 10 50 50 µA Temperature Coefficient of λpeak IF = 20mA, -10°C ≤ T ≤ 85°C TCλpeak Hyper Red Blue Green 0.13 0.04 0.05 - nm/°C Temperature Coefficient of λdom IF = 20mA, -10°C ≤ T ≤ 85°C TCλdom Hyper Red Blue Green 0.06 0.03 0.03 - nm/°C Temperature Coefficient of VF IF = 20mA, -10°C ≤ T ≤ 85°C TCV Hyper Red Blue Green -2 -3 -3 - mV/°C Wavelength at Peak Emission IF = 20mA Dominant Wavelength IF = 20mA Notes: 1. The dominant wavelength (λd) above is the setup value of the sorting machine. (Tolerance λd : ±1nm. ) 2. Forward voltage: ±0.1V. 3. Wavelength value is traceable to CIE127-2007 standards. 4. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure. ABSOLUTE MAXIMUM RATINGS at TA=25°C Value Parameter Symbol Hyper Red Blue Green Unit Power Dissipation PD 84 120 102.5 mW Reverse Voltage VR 5 5 5 V Junction Temperature Tj 115 115 115 °C Operating Temperature Top -40 to +85 °C Storage Temperature Tstg -40 to +85 °C DC Forward Current IF Peak Forward Current IFM Electrostatic Discharge Threshold (HBM) Thermal Resistance (Junction / Ambient) Thermal Resistance (Junction / Solder point) [1] - 30 30 25 mA 150 100 150 mA 3000 250 450 V Rth JA [2] 170 230 310 °C/W Rth JS [2] 120 170 270 °C/W Lead Solder Temperature [3] 260°C For 3 Seconds Lead Solder Temperature [4] 260°C For 5 Seconds Notes: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. 2. Rt h JA ,Rt h JS Results from mounting on PC board FR4 (pad size ≥ 16 mm 2 per pad). 3. 2mm below package base. 4. 5mm below package base. 5. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033. © 2019 Kingbright. All Rights Reserved. Spec No: DSAO0224 / 1101032014 Rev No: V.3A Date: 11/15/2019 Page 2 / 5 WP154A4SEJ3VBDZGC/CA TECHNICAL DATA SPATIAL DISTRIBUTION RELATIVE INTENSITY vs. WAVELENGTH Blue Green Red Relative Intensity (a. u.) 100% Ta = 25 °C Ta = 25 °C 80% 0° -15° 15° 30° -30° 45° -45° 60% 60° -60° 40% 20% 75° -75° 0% 350 400 450 500 550 600 Wavelength (nm) 650 700 750 800 -90° 1.0 0.5 0.0 90° 1.0 0.5 HYPER RED Forward Current vs. Forward Voltage 40 30 20 10 1.7 1.9 2.1 2.3 Forward voltage (V) 2.5 Ta = 25 °C 2.0 1.5 1.0 0.5 0.0 2.5 0 10 20 30 40 Forward current (mA) 50 50 Luminous Intensity vs. Ambient Temperature Luminous intensity normalised at Ta = 25 °C Forward current (mA) Ta = 25 °C Permissible forward current (mA) Luminous intensity normalised at 20 mA 50 0 1.5 Forward Current Derating Curve Luminous Intensity vs. Forward Current 40 30 20 10 0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 Ambient temperature (°C) -40 -20 0 20 40 60 80 100 Ambient temperature (°C) BLUE 50 Ta = 25 °C 40 30 20 10 0 2.0 2.4 2.8 3.2 3.6 Forward voltage (V) Permissible forward current (mA) 2.5 Luminous intensity normalised at 20 mA Forward current (mA) Forward Current Derating Curve Luminous Intensity vs. Forward Current Ta = 25 °C 2.0 1.5 1.0 0.5 0.0 4.0 0 10 20 30 40 Forward current (mA) Luminous Intensity vs. Ambient Temperature 50 2.5 Luminous intensity normalised at T a = 25 °C Forward Current vs. Forward Voltage 40 30 20 10 0 50 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 Ambient temperature (°C) -40 -20 0 20 40 60 80 100 Ambient temperature (°C) GREEN Forward current (mA) Ta = 25 °C 40 30 20 10 2.5 3.0 3.5 4.0 Forward voltage (V) 4.5 2.5 Permissible forward current (mA) Luminous intensity normalised at 20 mA 50 0 2.0 Forward Current Derating Curve Luminous Intensity vs. Forward Current Ta = 25 °C 2.0 1.5 1.0 0.5 0.0 0 10 20 30 40 Forward current (mA) 50 © 2019 Kingbright. All Rights Reserved. Spec No: DSAO0224 / 1101032014 Rev No: V.3A Date: 11/15/2019 50 Luminous Intensity vs. Ambient Temperature Luminous intensity normalised at Ta = 25 °C Forward Current vs. Forward Voltage 40 30 20 10 0 -40 -20 0 20 40 60 80 100 Ambient temperature (°C) 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 Ambient temperature (°C) Page 3 / 5 WP154A4SEJ3VBDZGC/CA RECOMMENDED WAVE SOLDERING PROFILE Notes: 1. Recommend pre-heat temperature of 105°C or less (as measured with a thermocouple attached to the LED pins) prior to immersion in the solder wave with a maximum solder bath temperature of 260°C 2. Peak wave soldering temperature between 245°C ~ 255°C for 3 sec (5 sec max). 3. Do not apply stress to the epoxy resin while the temperature is above 85°C. 4. Fixtures should not incur stress on the component when mounting and during soldering process. 5. SAC 305 solder alloy is recommended. 6. No more than one wave soldering pass. PRECAUTIONS Storage conditions 1. Avoid continued exposure to the condensing moisture environment and keep the product away from rapid transitions in ambient temperature. 2. LEDs should be stored with temperature ≤ 30°C and relative humidity < 60%. 3. Product in the original sealed package is recommended to be assembled within 72 hours of opening. Product in opened package for more than a week should be baked for 30 (+10/-0) hours at 85 ~ 100°C. LED Mounting Method 1. The lead pitch of the LED must match the pitch of the mounting holes on the PCB during component placement. Lead-forming may be required to insure the lead pitch matches the hole pitch. Refer to the figure below for proper lead forming procedures. Note 1-3: Do not route PCB trace in the contact area between the leadframe and the PCB to prevent short-circuits. " ○" Correct mounting method "x " Incorrect mounting method 2. When soldering wires to the LED, each wire joint should be separately insulated with heat-shrink tube to prevent short-circuit contact. Do not bundle both wires in one heat shrink tube to avoid pinching the LED leads. Pinching stress on the LED leads may damage the internal structures and cause failure. 3. Use stand-offs (Fig.1) or spacers (Fig.2) to securely position the LED above the PCB. 4. Maintain a minimum of 3mm clearance between the base of the LED lens and the first lead bend (Fig. 3 ,Fig. 4). 5. During lead forming, use tools or jigs to hold the leads securely so that the bending force will not be transmitted to the LED lens and its internal structures. Do not perform lead forming once the component has been mounted onto the PCB. (Fig. 5 ) © 2019 Kingbright. All Rights Reserved. Spec No: DSAO0224 / 1101032014 Rev No: V.3A Date: 11/15/2019 Page 4 / 5 WP154A4SEJ3VBDZGC/CA Lead Forming Procedures 1. Do not bend the leads more than twice. (Fig. 6 ) 2. During soldering, component covers and holders should leave clearance to avoid placing damaging stress on the LED during soldering. (Fig. 7) 3. The tip of the soldering iron should never touch the lens epoxy. 4. Through-hole LEDs are incompatible with reflow soldering. 5. If the LED will undergo multiple soldering passes or face other processes where the part may be subjected to intense heat, please check with Kingbright for compatibility. PACKING & LABEL SPECIFICATIONS PRECAUTIONARY NOTES 1. The information included in this document reflects representative usage scenarios and is intended for technical reference only. 2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to the latest datasheet for the updated specifications. 3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues. 4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance. 5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright. 6. All design applications should refer to Kingbright application notes available at https://www.KingbrightUSA.com/ApplicationNotes © 2019 Kingbright. All Rights Reserved. Spec No: DSAO0224 / 1101032014 Rev No: V.3A Date: 11/15/2019 Page 5 / 5