060322003P30BQTLSM

MLCC Non-magnetic Surface Mount & Ribbon Leaded MLC Capacitors Electrical Details Non-magnetic MLCC Ranges Capacitance Range The use of a copper barrier instead of a nickel barrier, with a tin finish on top, is the solution Knowles has developed for non-magnetic applications. This non-magnetic termination is offered with selected non-magnetic High Q (C0G/NP0), X5R and X7R dielectrics, providing a fully non-magnetic component (μr=1.0000). To meet high temperature 260°C soldering reflow profiles as detailed in J-STD-020, High Q dielectrics are supplied with sintered solder terminations, while X5R and X7R dielectrics use Knowles’ award-winning FlexiCap™ solder termination. Temperature Coefficient of Capacitance (TCC) Dissipation Factor Palladium silver termination for conductive epoxy mounting is also available for parts in the High Q Standard range and X5R/X7R ranges. Ribbon lead terminations for optimum mechanical performance are available on High Q High Power RF parts. 0.2pF to 6.8µF High Q (C0G/NP0) 0 ± 30ppm/˚C X5R ±15% from -55oC to +85oC X7R ±15% from -55oC to +125oC High Q (C0G/NP0) Surface mount ≤ 0.0014 for capacitance values 25V ≤ 0.035 for rated voltages ≤25V Minimum Insulation Resistance (IR) 100GΩ or (1000s/cap in F), whichever is less Dielectric Withstand Voltage (DWV) Voltage applied for 5 seconds maximum, at 50mA maximum charging current Ageing Rate High Q (C0G/NP0) Zero X5R and X7R