0805Y1000223KNT

X8R High Temperature Capacitors Electrical Details Width (W) Max Thickness (T) 1.6 ± 0.2 0.8 ± 0.2 0.8 0.10 - 0.04 2.0 ± 0.3 1.25 ± 0.2 1.3 0.13 – 0.75 1206 3.2 ± 0.3 1.6 ± 0.2 1.6 0.25 – 0.75 1210 3.2 ± 0.3 2.5 ± 0.3 2.0 0.25 – 0.75 1808 4.5 ± 0.35 2.0 ± 0.3 2.0 0.25 – 1.0 1812 4.5 ± 0.35 3.2 ± 0.3 2.5 0.25 – 1.0 2220 5.7 ± 0.4 5.0 ± 0.4 4.2 0.25 – 1.0 2225 5.7 ± 0.4 6.3 ± 0.4 4.2 0.25 – 1.0 Size Length (L1) 0603 0805 Band (L2) Capacitance Range 270pF to 1.8µF Temperature Coefficient of Capacitance (TCC) ±15% from -55˚C to +150˚C Dissipation Factor ≤ 0.025 Insulation Resistance (IR) 100G or 1000secs (whichever is the less) Dielectric Withstand Voltage (DWV) Voltage applied for 5 ±1 seconds, 50mA charging current maximum Ageing Rate 1% per decade (typical) The X8R dielectric will operate from -55 to +150˚C, with a maximum capacitance change ±15% (without applied voltage). The devices are available in sizes 0805 to 2225, with voltage ranges from 25V to 3kV and capacitance values from 270pf to 1.8µF. The capacitors have been developed by Syfer to meet demand from various applications in the automotive and industrial markets and in other electronic equipment exposed to high temperatures. The increased use of electronics in automotive “under the hood” applications has created demand for this product range. The X8R range incorporates a specially formulated termination with a nickel barrier finish that has been designed to enhance the mechanical performance of these SMD chip capacitors in harsh environments typically present in automotive applications. Note: All dimensions in mm For information, X8R dielectric contains lead within the ceramic and parts rated less than 250Vdc are not compliant with the EU 2011/65/EU RoHS directive. X8R High Temperature capacitors – minimum/maximum capacitance values according to the rated d.c. voltage Minimum Capacitance Value 25V 50V 100V 200/250V 500V Maximum capacitance value 630V according to the 1kV rated voltage 1.2kV 1.5kV 2kV 2.5kV 3kV 0805 680pF 56nF 33nF 15nF 10nF 3.9nF 1.8nF 1.0nF - 1206 270pF 180nF 120nF 56nF 33nF 18nF 3.9nF 2.2nF 1.8nF 1.2nF 470pF - 1210 680pF 330nF 220nF 120nF 68nF 39nF 10nF 4.7nF 3.9nF 2.2nF 1.2nF - 1808 390pF 470nF 270nF 150nF 82nF 47nF 12nF 5.6nF 4.7nF 2.7nF 1.8nF 1.0nF 680pF 1812 1.0nF 680nF 470nF 220nF 120nF 100nF 33nF 18nF 12nF 8.2nF 4.7nF 2.7nF 2.2nF 2220 2.7nF 1.5µF 680nF 470nF 220nF 180nF 150nF 39nF 33nF 22nF 12nF 6.8nF 4.7nF 2225 3.9nF 1.8µF 1.0µF 560nF 330nF 270nF 180nF 56nF 39nF 27nF 18nF 10nF 5.6nF Ordering Information – X8R High Temperature Range 1206 Y 100 0473 K N T Dielectric Codes Packaging N = X8R T = 178mm (7”) reel Chip Size Termination Voltage d.c. Capacitance in picofarads (pF) Capacitance Tolerance 0805 Y = FlexiCapTM termination base with nickel barrier (100% matte tin plating). 025 = 25V First digit is 0. J = ± 5% 050 = 50V Second and third digits are significant figures of capacitance code. K = ± 10% R = 330mm (13”) reel M = ± 20% B = Bulk pack – tubs or trays 1206 1210 1808 1812 2220 2225 RoHS Compliant 100 = 100V 200 = 200V 250 = 250V 500 = 500V 630 = 630V The fourth digit is the number of zeros following. Examples: 0473 = 47000 pF = 47nF 1K0 = 1kV 1K2 =1.2kV 1K5 =1.5kV 2K5 =2.5kV 3K0 =3kV X8RDatasheet Issue 1 (P107372) Release Date 05/03/13 Page 1 of 6 Soldering Information Rework of Chip Capacitors Syfer MLCCs are compatible with all recognised soldering/mounting methods for chip capacitors. A detailed application note is available at syfer.com Syfer recommend hot air/gas as the preferred method of applying heat for rework. Apply even heat surrounding the component to minimise internal thermal gradients. Soldering irons or other techniques that apply direct heat to the chip or surrounding area should not be used as these can result in micro cracks being generated. Reflow Soldering Syfer recommend reflow soldering as the preferred method for mounting MLCCs. Syfer MLCCs can be reflow soldered using a reflow profile generally defined in IPC/FEDEC J-STD-020. Sn plated termination chip capacitors are compatible with both conventional and lead free soldering with peak temperatures of 260 to 270˚C acceptable. The heating ramp rate should be such that components see a temperature rise of 1.5 to 4˚C per second to maintain temperature uniformity through the MLCC. The time for which the solder is molten should be maintained at a minimum, so as to prevent solder leaching. Extended times above 230˚C can cause problems with oxidation of Sn plating. Use of an inert atmosphere can help if this problem is encountered. Palladium/Silver (Pd/Ag) terminations can be particularly susceptible to leaching with free lead, tin rich solders and trials are recommended for this combination. Cooling to ambient temperature should be allowed to occur naturally, particularly if larger chip sizes are being soldered. Natural cooling allows a gradual relaxation of thermal mismatch stresses in the solder joints. Forced cooling should be avoided as this can induce thermal breakage. Wave Soldering Wave soldering is generally acceptable, but the thermal stresses caused by the wave have been shown to lead to potential problems with larger or thicker chips. Particular care should be taken when soldering SM chips larger than size 1210 and with a thickness greater than 1.0mm for this reason. Maximum permissible wave temperature is 270˚C for SM chips. The total immersion time in solder should be kept to a minimum. It is strongly recommended that Sn/Ni plated terminations are specified for wave soldering applications. Solder Leaching Leaching is the term for the dissolution of silver into the solder causing a failure of the termination system which causes increased ESR, tan δ and open circuit faults, including ultimately the possibility of the chip becoming detached. Leaching occurs more readily with higher temperature solders and solders with a high tin content. Pb free solders can be very prone to leaching certain termination systems. Ro prevent leaching, exercise care when choosing solder allows and minimize both maximum temperature and dwell time with the molten solder. Plated terminations with nickel or copper anti-leaching barrier layers are available in a range of top coat finishes to prevent leaching occurring. These finishes also include Syfer FlexiCapTM for improved stress resistance post soldering. Multilayer ceramic chip with nickel or copper barrier termination Minimise the rework heat duration and allow components to cool naturally after soldering. Use of Silver Loaded Epoxy Adhesives Chip capacitors can be mounted to circuit boards using silver loaded adhesive provided the termination material of the capacitor is selected to be compatible with the adhesive. This is normally PdAg. Standard tin finishes are often not recommended for use with silver loaded epoxies as there can be electrical and mechanical issues with the joint integrity due to material mismatch. Handling & Storage Components should never be handled with fingers; perspiration and skin oils can inhibit solderability and will aggravate cleaning. Chip capacitors should never be handled with metallic instruments. Metal tweezers should never be used as theses can chip the product and leave abraded metal tracks on the product surface. Plastic or plastic coated metal types are readily available and recommended – these should be used with an absolute minimum of applied pressure. Incorrect storage can lead to problems for the user. Rapid tarnishing of the terminations, with an associated degradation of solderability, will occur if the product comes into contact with industrial gases such as sulphur dioxide and chlorine. Storage in free air, particularly moist or polluted air, can result in termination oxidation. Packaging should not be opened until the MLCs are required for use. If opened, the pack should be re-sealed as soon as practicable. Alternatively, the contents could be kept in a sealed container with an environmental control agent. Long term storage conditions, ideally, should be temperature controlled between -5 and +40˚C and humidity controlled between 40% and 60% R.H. Taped product should be stored out of direct sunlight, which might promote deterioration in tape or adhesive performance. Product, stored under the conditions recommended above, in its “as received” packaging, has a minimum shelf life of 2 years. SM Pad Design Syfer conventional 2-terminal chip capacitors can generally be mounted using pad designs in accordance with IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standards, but there are some other factors that have been shown to reduce mechanical stress, such as reducing the pad width to less than the chip width. In addition, the position of the chip on the board should also be considered. 3-terminal components are not specifically covered by IPC7351, but recommended pad dimensions are included in the Syfer catalogue/website for these components. X8RDatasheet Issue 1 (P107372) Release Date 05/03/13 Page 2 of 6 FlexiCapTM Termination FlexiCapTM has been developed as a result of listening to customer’s experiences of stress damage to MLCCs from many manufacturers, often caused by variations in production processes. Our answer is a proprietary flexible epoxy polymer termination material that is applied to the device under the usual nickel barrier finish. FlexiCapTM will accommodate a greater degree of board bending than conventional capacitors. All ranges are available with FlexiCapTM termination material offering increased reliability and superior mechanical performance (board flex and temperature cycling) when compared with standard termination materials. Refer to Syfer application note reference AN0001. FlexiCapTM capacitors enable the board to be bent almost twice as much as before mechanical cracking occurs. Refer to application note AN0002. FlexiCapTM is also suitable for space applications having passed thermal vacuum outgassing tests. Refer to Syfer application note reference AN0026. REACH (Registration, Evaluation, Authorisation and restriction of Chemicals) Statement The main purpose of REACH is to improve the protection of human health and the environment from the risks arising from the use of chemicals. Syfer Technology Ltd maintains both ISO 14001, Environmental Management System and OHSAS 18001 Health & Safety Management System approvals that require and ensure compliance with corresponding legislation such as REACH. For further information, please contact the sales office at sales@syfer.co.uk RoHS Compliance Syfer routinely monitors world wide material restrictions (e.g., EU/China and Korea RoHS mandates) and is actively involved in shaping future legislation. All standard C0G/NPO, X7R, X5R and High Q Syfer MLCC products are compliant with the EU RoHS directive (see below for special exemptions) and those with plated terminations are suitable for soldering common lead free solder alloys (refer to ‘Soldering Information’ for more details on soldering limitations). Compliance with EU RoHS directive automatically signifies compliance with some other legislation (e.g., Korea RoHS). Please refer to the Sales Office for details of compliance with other materials legislation. Breakdown of material content, SGS analysis reports and tin whisker test results are available on request. Most Syfer MLCC components are available with non-RoHS compliant tin/lead (SnPb) Solderable termination finish for exempt applications and where pure tin is not acceptable. Other tin free termination finishes may also be available – please refer to the Sales Office for further details. X8R ranges 750V and a capacitance value >250nF and a series inductance