X8R
High Temperature Capacitors
Electrical Details
Width
(W)
Max
Thickness
(T)
1.6 ± 0.2
0.8 ± 0.2
0.8
0.10 - 0.04
2.0 ± 0.3
1.25 ± 0.2
1.3
0.13 – 0.75
1206
3.2 ± 0.3
1.6 ± 0.2
1.6
0.25 – 0.75
1210
3.2 ± 0.3
2.5 ± 0.3
2.0
0.25 – 0.75
1808
4.5 ± 0.35
2.0 ± 0.3
2.0
0.25 – 1.0
1812
4.5 ± 0.35
3.2 ± 0.3
2.5
0.25 – 1.0
2220
5.7 ± 0.4
5.0 ± 0.4
4.2
0.25 – 1.0
2225
5.7 ± 0.4
6.3 ± 0.4
4.2
0.25 – 1.0
Size
Length
(L1)
0603
0805
Band
(L2)
Capacitance Range
270pF to 1.8µF
Temperature Coefficient of Capacitance (TCC)
±15% from -55˚C to +150˚C
Dissipation Factor
≤ 0.025
Insulation Resistance (IR)
100G or 1000secs (whichever is the less)
Dielectric Withstand Voltage (DWV)
Voltage applied for 5 ±1 seconds, 50mA charging
current maximum
Ageing Rate
1% per decade (typical)
The X8R dielectric will operate from -55 to +150˚C, with a maximum capacitance change ±15%
(without applied voltage).
The devices are available in sizes 0805 to 2225, with voltage ranges from 25V to 3kV and
capacitance values from 270pf to 1.8µF.
The capacitors have been developed by Syfer to meet demand from various applications in the
automotive and industrial markets and in other electronic equipment exposed to high temperatures.
The increased use of electronics in automotive “under the hood” applications has created demand for
this product range.
The X8R range incorporates a specially formulated termination with a nickel barrier finish that has
been designed to enhance the mechanical performance of these SMD chip capacitors in harsh
environments typically present in automotive applications.
Note: All dimensions in mm
For information, X8R dielectric contains lead within the ceramic and parts rated less than 250Vdc are not compliant
with the EU 2011/65/EU RoHS directive.
X8R High Temperature capacitors – minimum/maximum capacitance values according to the rated d.c. voltage
Minimum Capacitance Value
25V
50V
100V
200/250V
500V
Maximum
capacitance value
630V
according to the
1kV
rated voltage
1.2kV
1.5kV
2kV
2.5kV
3kV
0805
680pF
56nF
33nF
15nF
10nF
3.9nF
1.8nF
1.0nF
-
1206
270pF
180nF
120nF
56nF
33nF
18nF
3.9nF
2.2nF
1.8nF
1.2nF
470pF
-
1210
680pF
330nF
220nF
120nF
68nF
39nF
10nF
4.7nF
3.9nF
2.2nF
1.2nF
-
1808
390pF
470nF
270nF
150nF
82nF
47nF
12nF
5.6nF
4.7nF
2.7nF
1.8nF
1.0nF
680pF
1812
1.0nF
680nF
470nF
220nF
120nF
100nF
33nF
18nF
12nF
8.2nF
4.7nF
2.7nF
2.2nF
2220
2.7nF
1.5µF
680nF
470nF
220nF
180nF
150nF
39nF
33nF
22nF
12nF
6.8nF
4.7nF
2225
3.9nF
1.8µF
1.0µF
560nF
330nF
270nF
180nF
56nF
39nF
27nF
18nF
10nF
5.6nF
Ordering Information – X8R High Temperature Range
1206
Y
100
0473
K
N
T
Dielectric Codes
Packaging
N = X8R
T = 178mm (7”) reel
Chip Size
Termination
Voltage d.c.
Capacitance in picofarads (pF)
Capacitance
Tolerance
0805
Y = FlexiCapTM
termination base
with nickel
barrier (100%
matte tin
plating).
025 = 25V
First digit is 0.
J = ± 5%
050 = 50V
Second and third digits are significant
figures of capacitance code.
K = ± 10%
R = 330mm (13”) reel
M = ± 20%
B = Bulk pack – tubs or trays
1206
1210
1808
1812
2220
2225
RoHS Compliant
100 = 100V
200 = 200V
250 = 250V
500 = 500V
630 = 630V
The fourth digit is the number of zeros
following.
Examples:
0473 = 47000 pF = 47nF
1K0 = 1kV
1K2 =1.2kV
1K5 =1.5kV
2K5 =2.5kV
3K0 =3kV
X8RDatasheet Issue 1 (P107372) Release Date 05/03/13
Page 1 of 6
Soldering Information
Rework of Chip Capacitors
Syfer MLCCs are compatible with all recognised
soldering/mounting methods for chip capacitors. A detailed
application note is available at syfer.com
Syfer recommend hot air/gas as the preferred method of
applying heat for rework. Apply even heat surrounding the
component to minimise internal thermal gradients. Soldering
irons or other techniques that apply direct heat to the chip or
surrounding area should not be used as these can result in
micro cracks being generated.
Reflow Soldering
Syfer recommend reflow soldering as the preferred method for
mounting MLCCs. Syfer MLCCs can be reflow soldered using a
reflow profile generally defined in IPC/FEDEC J-STD-020. Sn
plated termination chip capacitors are compatible with both
conventional and lead free soldering with peak temperatures of
260 to 270˚C acceptable.
The heating ramp rate should be such that components see a
temperature rise of 1.5 to 4˚C per second to maintain
temperature uniformity through the MLCC.
The time for which the solder is molten should be maintained
at a minimum, so as to prevent solder leaching. Extended
times above 230˚C can cause problems with oxidation of Sn
plating. Use of an inert atmosphere can help if this problem is
encountered. Palladium/Silver (Pd/Ag) terminations can be
particularly susceptible to leaching with free lead, tin rich
solders and trials are recommended for this combination.
Cooling to ambient temperature should be allowed to occur
naturally, particularly if larger chip sizes are being soldered.
Natural cooling allows a gradual relaxation of thermal
mismatch stresses in the solder joints. Forced cooling should
be avoided as this can induce thermal breakage.
Wave Soldering
Wave soldering is generally acceptable, but the thermal
stresses caused by the wave have been shown to lead to
potential problems with larger or thicker chips. Particular care
should be taken when soldering SM chips larger than size 1210
and with a thickness greater than 1.0mm for this reason.
Maximum permissible wave temperature is 270˚C for SM
chips.
The total immersion time in solder should be kept to a
minimum. It is strongly recommended that Sn/Ni plated
terminations are specified for wave soldering applications.
Solder Leaching
Leaching is the term for the dissolution of silver into the solder
causing a failure of the termination system which causes
increased ESR, tan δ and open circuit faults, including
ultimately the possibility of the chip becoming detached.
Leaching occurs more readily with higher temperature solders
and solders with a high tin content. Pb free solders can be very
prone to leaching certain termination systems. Ro prevent
leaching, exercise care when choosing solder allows and
minimize both maximum temperature and dwell time with the
molten solder.
Plated terminations with nickel or copper anti-leaching barrier
layers are available in a range of top coat finishes to prevent
leaching occurring. These finishes also include Syfer FlexiCapTM
for improved stress resistance post soldering.
Multilayer ceramic chip with nickel or copper barrier
termination
Minimise the rework heat duration and allow components to
cool naturally after soldering.
Use of Silver Loaded Epoxy Adhesives
Chip capacitors can be mounted to circuit boards using silver
loaded adhesive provided the termination material of the
capacitor is selected to be compatible with the adhesive. This
is normally PdAg. Standard tin finishes are often not
recommended for use with silver loaded epoxies as there can
be electrical and mechanical issues with the joint integrity due
to material mismatch.
Handling & Storage
Components should never be handled with fingers;
perspiration and skin oils can inhibit solderability and will
aggravate cleaning.
Chip capacitors should never be handled with metallic
instruments. Metal tweezers should never be used as theses
can chip the product and leave abraded metal tracks on the
product surface. Plastic or plastic coated metal types are
readily available and recommended – these should be used
with an absolute minimum of applied pressure.
Incorrect storage can lead to problems for the user. Rapid
tarnishing of the terminations, with an associated degradation
of solderability, will occur if the product comes into contact
with industrial gases such as sulphur dioxide and chlorine.
Storage in free air, particularly moist or polluted air, can result
in termination oxidation.
Packaging should not be opened until the MLCs are required
for use. If opened, the pack should be re-sealed as soon as
practicable. Alternatively, the contents could be kept in a
sealed container with an environmental control agent.
Long term storage conditions, ideally, should be temperature
controlled between -5 and +40˚C and humidity controlled
between 40% and 60% R.H.
Taped product should be stored out of direct sunlight, which
might promote deterioration in tape or adhesive performance.
Product, stored under the conditions recommended above, in
its “as received” packaging, has a minimum shelf life of 2
years.
SM Pad Design
Syfer conventional 2-terminal chip capacitors can generally be
mounted using pad designs in accordance with IPC-7351,
Generic Requirements for Surface Mount Design and Land
Pattern Standards, but there are some other factors that have
been shown to reduce mechanical stress, such as reducing the
pad width to less than the chip width. In addition, the position
of the chip on the board should also be considered.
3-terminal components are not specifically covered by IPC7351, but recommended pad dimensions are included in the
Syfer catalogue/website for these components.
X8RDatasheet Issue 1 (P107372) Release Date 05/03/13
Page 2 of 6
FlexiCapTM Termination
FlexiCapTM has been developed as a result of listening to
customer’s experiences of stress damage to MLCCs from many
manufacturers, often caused by variations in production
processes.
Our answer is a proprietary flexible epoxy polymer termination
material that is applied to the device under the usual nickel
barrier finish. FlexiCapTM will accommodate a greater degree of
board bending than conventional capacitors.
All ranges are available with FlexiCapTM termination material
offering increased reliability and superior mechanical
performance (board flex and temperature cycling) when
compared with standard termination materials. Refer to Syfer
application note reference AN0001. FlexiCapTM capacitors
enable the board to be bent almost twice as much as before
mechanical cracking occurs. Refer to application note AN0002.
FlexiCapTM is also suitable for space applications having passed
thermal vacuum outgassing tests. Refer to Syfer application
note reference AN0026.
REACH (Registration, Evaluation, Authorisation and
restriction of Chemicals) Statement
The main purpose of REACH is to improve the protection of
human health and the environment from the risks arising from
the use of chemicals.
Syfer Technology Ltd maintains both ISO 14001,
Environmental Management System and OHSAS 18001 Health
& Safety Management System approvals that require and
ensure compliance with corresponding legislation such as
REACH.
For further information, please contact the sales office at
sales@syfer.co.uk
RoHS Compliance
Syfer routinely monitors world wide material restrictions (e.g.,
EU/China and Korea RoHS mandates) and is actively involved
in shaping future legislation.
All standard C0G/NPO, X7R, X5R and High Q Syfer MLCC
products are compliant with the EU RoHS directive (see below
for special exemptions) and those with plated terminations are
suitable for soldering common lead free solder alloys (refer to
‘Soldering Information’ for more details on soldering
limitations). Compliance with EU RoHS directive automatically
signifies compliance with some other legislation (e.g., Korea
RoHS). Please refer to the Sales Office for details of
compliance with other materials legislation.
Breakdown of material content, SGS analysis reports and tin
whisker test results are available on request.
Most Syfer MLCC components are available with non-RoHS
compliant tin/lead (SnPb) Solderable termination finish for
exempt applications and where pure tin is not acceptable.
Other tin free termination finishes may also be available –
please refer to the Sales Office for further details.
X8R ranges 750V and a
capacitance value >250nF and a series inductance
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