Surface mount capacitors
1.1 - Production process flowchart
Ceramic powder
preparation
1.1 to 1.3
1.2 - Syfer reliability grades
Electrode ink
material
Space
Grade
ESCC 3009(1)
(wet process)
MIL Grade(2)
IECQ-CECC(3)
AEC-Q200(4)
Fire
Standard components
Multilayer build
Rumble
High reliability
(space quality)
Standard
reliability
Notes:
(1) Space grade tested in accordance with ESCC 3009. Refer to Syfer
specification S02A 0100.
Internal inspection
(2) MIL Grade. Released in accordance with US standards available on
request.
Termination
Plating
(3)
IECQ-CECC. The International Electrotechnical Commission (IEC)
Quality Assessment System for Electronic Components. This is an
internationally recognised product quality certification which
provides customers with assurance that the product supplied
meets high quality standards.
View Syfer’s IECQ-CECC approvals at http://www.iecq.org or at
www.syfer.com
(4) AEC-Q200. Automotive Electronics Council Stress Test Qualification
For Passive Components. Refer to Syfer application note reference
AN0009.
(if specified)
Printing
(if specified)
1.3 - Syfer reliability surface mount product
groups
High reliability
Electrical test
Tandem
FlexiCapTM
capacitors(1)
Test verification
Open Mode
FlexiCapTM capacitors(2)
Standard FlexiCapTM
capacitors(3)
Additional sample
Rel tests
Standard MLC capacitor(4)
(if specified)
Standard
reliability
Notes:
QC inspection
Additional Hi Rel
activities
(2)
(S02A & S05
100% burn-in, QC insp)
Packaging
4
(1)
“Tandem” construction capacitors, ie internally having the
equivalent of 2 series capacitors. If one of these should fail
short-circuit, there is still capacitance end to end and the chip will
still function as a capacitor, although capacitance maybe affected.
Refer to application note AN0021. Also available qualified to
AEC-Q200.
“Open Mode” capacitors with FlexiCapTM termination also reduce
the possibility of a short circuit by utilising inset electrode margins.
Refer to application note AN0022. Also available qualified to
AEC-Q200.
(3) Multilayer capacitors with Syfer FlexiCapTM termination. By using
FlexiCapTM termination, there is a reduced possibility of the
mechanical cracking occurring.
(4) “Standard” capacitors includes MLCCs with tin finish over nickel,
but no FlexiCapTM.
Finished goods store
1.4
Surface mount capacitors
1.4 - FlexiCap™ termination
MLCCs are widely used in electronic circuit design for a
multitude of applications. Their small package size, technical
performance and suitability for automated assembly makes
them the component of choice for the specifier.
However, despite the technical benefits, ceramic components
are brittle and need careful handling on the production floor.
In some circumstances they may be prone to mechanical
stress damage if not used in an appropriate manner. Board
flexing, depanelisation, mounting through hole components,
poor storage and automatic testing may all result in cracking.
Syfer has delivered millions of FlexiCapTM components and
during that time has collected substantial test and reliability
data, working in partnership with customers world wide, to
eliminate mechanical cracking.
An additional benefit of FlexiCap™ is that MLCCs can
withstand temperature cycling -55ºC to 125ºC in excess of
1,000 times without cracking.
● Picture taken at
1,000x magnification
using a SEM
to demonstrate the
fibrous nature of the
FlexiCapTM termination
that absorbs increased
levels of mechanical
stress.
Careful process control is important at all stages of circuit
board assembly and transportation - from component
placement to test and packaging. Any significant board flexing
may result in stress fractures in ceramic devices that may
not always be evident during the board assembly process.
Sometimes it may be the end customer who finds out - when
equipment fails!
Syfer has the solution - FlexiCap™
FlexiCapTM has been developed as a result of listening to
customers’ experiences of stress damage to MLCCs from
many manufacturers, often caused by variations in production
processes.
Our answer is a proprietary flexible epoxy polymer termination
material, that is applied to the device under the usual nickel
barrier finish. FlexiCapTM will accommodate a greater degree
of board bending than conventional capacitors.
Syfer FlexiCap™ termination
All ranges are available with FlexiCap™ termination material
offering increased reliability and superior mechanical
performance (board flex and temperature cycling) when
compared with standard termination materials. Refer to Syfer
application note reference AN0001. FlexiCap™ capacitors
enable the board to be bent almost twice as much before
mechanical cracking occurs. Refer to application note AN0002.
FlexiCap™ is also suitable for Space applications having
passed thermal vacuum outgassing tests. Refer to Syfer
application note reference AN0026.
Available on the following ranges:
● All High Reliability ranges
● Standard and High Voltage chips
● Surge Protection and Safety capacitor chips
● 3 terminal EMI chips
● X2Y Integrated Passive Components
● X8R High Temperature capacitors
Summary of PCB bend test results
The bend tests conducted on X7R have proven that
the FlexiCapTM termination withstands a greater level of
mechanical stress before mechanical cracking occurs.
The AEC-Q200 test for X7R requires a bend level of 2mm
minimum and a cap change of less than 10%.
Product
X7R
Standard termination
FlexiCap™
Fired ceramic
dielectric
Typical bend performance under
AEC-Q200 test conditions
2mm to 3mm
Typically 8mm to 10mm
Application notes
FlexiCapTM may be handled, stored and transported in
the same manner as standard terminated capacitors. The
requirements for mounting and soldering FlexiCapTM are the
same as for standard SMD capacitors.
Tin outer
layer
Intermediate
nickel layer
FlexiCapTM
termination
base
Metal
electrodes
FlexiCap MLCC cross section
TM
FlexiCap™ benefits
With traditional termination materials and assembly, the chain
of materials from bare PCB to soldered termination, provides
no flexibility. In circumstances where excessive stress is
applied - the weakest link fails. This means the ceramic itself,
which may fail short circuit.
The benefit to the user is to facilitate a wider process window
- giving a greater safety margin and substantially reducing the
typical root causes of mechanical stress cracking.
FlexiCapTM may be soldered using your traditional wave
or reflow solder techniques and needs no adjustment to
equipment or current processes.
For customers currently using standard terminated capacitors
there should be no requirement to change the assembly
process when converting to FlexiCapTM.
Based upon board bend tests in accordance with IEC 60384-1
the amount of board bending required to mechanically crack
a FlexiCapTM terminated capacitor is significantly increased
compared with standard terminated capacitors.
It must be stressed however, that capacitor users must not
assume that the use of FlexiCapTM terminated capacitors will
totally eliminate mechanical cracking. Good process controls
are still required for this objective to be achieved.
5
Surface mount capacitors
1.5 - Tests conducted during
batch manufacture
1.5 to 1.7
Syfer reliability SM product group
Standard
SM
capacitors
IECQ-CECC
AEC-Q200
MIL - PRF
55681(1)
Solderability
l
l
l
l
l
l
Resistance to soldering heat
l
l
l
l
l
l
Plating thickness verification (if plated)
l
l
l
l
l
l
Destructive Physical Analysis (DPA)
l
l
l
l
l
l
Voltage proof test (DWV / Flash)
l
l
l
l
l
l
Insulation Resistance
l
l
l
l
l
l
Capacitance test
l
l
l
l
l
l
S (space grade) High Rel
S05
S02A
(3)
Dissipation Factor test
l
l
l
l
l
l
100% visual inspection
m
m
l
m
l
l
100% burn-in(2). (2xRV @125ºC for 100 hours)
m
m
m
l
-
-
100% burn-in . (2xRV @125ºC for 168 hours)
m
m
m
-
l
l
m
LAT1 & LAT2
(1000 hours)
(2)
Load sample test @ 125ºC. (Life at elevated
temperature test).
m
m
m
m
Humidity sample test. 85ºC/85%RH
m
m
m
m
m
240 hours
Hot IR sample test
m
m
m
l
m
m
Axial pull sample test (MIL-STD-123)
m
m
m
m
m
m
Breakdown voltage sample test
m
m
m
m
m
m
Deflection (bend) sample test
m
m
m
m
m
m
SAM (Scanning Acoustic Microscopy)
m
m
m
m
m
m
LAT1 (4 x adhesion, 8 x rapid temp change + LAT2 and
LAT3)
-
-
-
-
-
m
LAT2 (20 x 1000 hour life test + LAT3)
-
-
-
-
-
m
LAT3 (6 x TC and 4 x solderability)
-
-
-
-
-
m
l Test conducted as standard.
m Optional test. Please discuss with Syfer Sales.
Notes:
1) In accordance with MIL-PRF-55681 group A. Additional optional tests available.
2) Burn-in also referred to as Voltage conditioning.
3) In accordance with ESCC 3009.
Multilayer ceramic capacitors typically require sintering temperatures
in excess of 1000ºC, which presents no problems to capacitors that
employ a Precious Metal Electrode (PME) system. However, for Base
Metal Electrode (BME) systems additional processes are required,
including the use of a reducing atmosphere to prevent oxidation of the
electrodes.
Despite the manufacturing problems, BME multilayer ceramic
capacitors have proven to be a good choice for commercial products as
they have reasonable electrical properties and life expectancy and can
be used for some high reliability applications when properly qualified
and screened.
At Syfer Technology we have been developing PME systems for over
thirty years and use them exclusively for all our product lines. It
produces capacitors to the highest reliability that can be used in all
applications including the very demanding space requirements.
A recent Highly Accelerated Life Test (HALT) programme was
undertaken to compare Syfer PME with equivalent BME capacitors.
Capacitors rated at 50 volts were tested at 400 volts and at a
temperature of 180ºC. The programme used three capacitor types
from Syfer and two BME manufacturers.
6
1.7 - RoHS compliance
All Syfer surface mount capacitors (excluding Sn/Pb plated)
are compliant with the EU RoHS directive. Breakdown of
materials content is available on request.
25
Median Time to Failure
1.6 - Precious Metal Electrodes Vs. Base
Metal Electrodes
20
15
10
5
0
0603 50V 33nF
Syfer PME
0805 50V 100nF
BME1
1206 50V 220nF
BME2
In all cases the Syfer PME parts out-performed the BME capacitors
suggesting that the long term reliability of PME systems is superior to
BME, and PME parts should be regarded as the component of choice
for high reliability applications.
1.8 to 1.10
Surface mount capacitors
1.8 - Release documentation
Syfer reliability SM product group
S (space grade) High Rel
Standard SM
capacitors
IECQ-CECC
AEC-Q200
MIL grade
Certificate of conformance
l
-
l
IECQ-CECC Release certificate of conformity
-
l
-
-
Included in
data pack
l
S05
S02A
l
l
Batch electrical test report
m
m
m
Included in
data pack
S (space grade) data documentation package
-
-
-
l
l Release documentation supplied as standard.
m Original documentation.
1.9 - Technical summary
Dielectric characteristics
C0G/NP0
X7R
Ultra stable
Stable
1B/CG
IECQ-CECC
2C1
2R1
C0G/NP0
EIA
X7R
MIL
CG(BP)
Rated temperature range
2X1
BZ
-55ºC to +125ºC
BX
-55ºC to +125ºC
Maximum capacitance change over
temperature range
0 ± 30 ppm/ºC
± 20%
± 15%
± 15%
Rated DC voltage applied
-
+20-30%
-
+15-25%
Syfer dielectric ordering code
C
R
X
B
No DC voltage applied
Cr > 50pF ≤ 0.0015
Cr ≤ 50pF = 0.0015 (15 + 0.7)
Cr
Tangent of loss angle (tan δ)
The table above highlights the difference in coding for IECQ-CECC, EIA and MIL standards when defining the temperature coeffiecient and the
voltage coefficient.
1.10 - Periodic tests conducted and
reliability data availability
Standard Surface Mount Capacitors
Components are randomly selected on a sample basis and the
following routine tests are conducted:
l Load Test. 1000 hours @125ºC. Applied voltage depends
on components tested.
l Humidity Test. 168 hours @ 85ºC/85%RH.
l Board Deflection (bend test).
Test results are available on request.
Example of FIT (Failure In Time) data available:
Component type: 0805 (C0G/NP0 and X7R).
Testing location: Syfer reliability test department.
Results based on: 14,942,000 component test hours.
10000
RV
50% of RV
25% of RV
Conversion factors:
10% of RV
FIT
10
0.01
From
To
Operation
FITS
MTBF (hours)
109 ÷ FITS
FITS
MTBF (years)
109 ÷ (FITS x 8760)
FITS = Failures in 109 hours.
MTBF = Mean time between failures.
0.00001
25ºC
50ºC
75ºC
100ºC
125ºC
7
Surface mount capacitors
1.10
1.10 - Periodic tests conducted for IECQ-CECC and AEC-Q200
Test
ref
Test
Termination
type
D or
ND
Additional requirements
P1
High
temperature
exposure
(storage)
All types
D
P2
Temperature
cycling
C0G/NP0: All
types X7R: Y
and H only
P3
Moisture
resistance
P4
Reference
P
n
c
Un-powered. 1000 hours @ T=150ºC.
Measurement at 24 ± 2 hours after test conclusion
12
77
0
MIL-STD-202
Method 108
D
1000 cycles -55ºC to +125ºC
Measurement at 24 ± 2 hours after test conclusion
12
77
0
JESD22
Method JA-104
All types
D
T = 24 hours/cycle. Note: Steps 7a and 7b not
required. Un-powered.
Measurement at 24 ± 2 hours after test conclusion
12
77
0
MIL-STD-202
Method 106
Biased
humidity
All types
D
1000 hours 85ºC/85%RH. Rated voltage or 50V
whichever is the least and 1.5V.
Measurement at 24 ± 2 hours after test conclusion
12
77
0
MIL-STD-202
Method 103
P5
Operational
life
All types
D
Condition D steady state TA=125ºC at full rated.
Measurement at 24 ± 2 hours after test conclusion
12
77
0
MIL-STD-202
Method 108
P6
Resistance
to solvents
All types
D
Note: Add aqueous wash chemical.
Do not use banned solvents
12
5
0
MIL-STD-202
Method 215
P7
Mechanical
shock
C0G/NP0: All
types X7R: Y
and H only
D
Figure 1 of Method 213. Condition F
12
30
0
MIL-STD-202
Method 213
P8
Vibration
C0G/NP0: All
types X7R: Y
and H only
D
5g for 20 minutes, 12 cycles each of 3 orientations.
Note: Use 8” x 5” PCB 0.031” thick 7 secure points
on one long side and 2 secure points at corners of
opposite sides. Parts mounted within 2” from any
secure point. Test from 10-2000Hz
12
30
0
MIL-STD-202
Method 204
P9
Resistance to
soldering heat
All types
D
Condition B, no pre-heat of samples:
Single wave solder - Procedure 2
3
12
0
MIL-STD-202
Method 210
P10
Thermal shock
C0G/NP0: All
types X7R: Y
and H only
D
-55ºC/+125ºC. Number of cycles 300.
Maximum transfer time - 20 seconds,
Dwell time - 15 minutes. Air-Air
12
30
0
MIL-STD-202
Method 107
P11
Adhesion,
rapid temp
change and
climatic
sequence
X7R: A, F and
J only
D
5N force applied for 10s, -55ºC/ +125ºC for 5 cycles,
damp heat cycles
12
27
0
BS EN132100
Clause 4.8, 4.12
and 4.13
C0G/NP0: All
types X7R: Y
and H only
D
3mm deflection Class I
2mm deflection Class II
12
30
0
AEC-Q200-005
X7R: A, F and
J only
D
1mm deflection.
12
12
0
BS EN132100
Clause 4.9
P12
Board flex
P13
8
Sample
acceptance
P14
Terminal
strength
All types
D
Force of 1.8kg for 60 seconds
12
30
0
AEC-Q200-006
P15
Beam load
test
All types
D
-
12
30
0
AEC-Q200-003
P16
Damp heat
steady state
All types
D
56 days, 40°C/93%RH, 15 x no volts, 15 x 5Vdc,
15 x rated voltage or 50V whichever is the less
12
45
0
BS EN132100
Clause 4.14
Test results are available on request.
1.11
Surface mount capacitors
1.11 - Standard product ranges - 10V to 6kV ranges
= X5R Range
Capacitance values F.
0603
0805
1206
1210
1808
1812
1825
2220
2225
3640
5550
8060
0.47p-3.9n
1.0p-15n
1.0p-47n
3.9p-100n
4.7p-100n
10p-220n
10p-470n
10p-470n
10p-560n
n/a
n/a
n/a
X7R
100p-100n 100p-330n 100p-1.0μ
330n-1.5μ
100p-1.5μ
150n-3.3μ
220n-4.7μ
220n-5.6μ
330n-6.8µ
n/a
n/a
n/a
X5R
120n-150n 390n-680n 100p-1.5µ
330p-3.3µ
100p-2.7µ
150p-10µ
220p-15µ
220p-18µ
330p-22µ
n/a
n/a
n/a
0.47p-2.7n
1.0p-33n
3.9p-68n
4.7p-68n
10p-180n
10p-330n
10p-330n
10p-470n
n/a
n/a
n/a
X7R
100p-100n 100p-330n 100p-1.0μ
330p-1.5μ
100p-1.5μ
150p-3.3μ
220p-4.7μ
220p-5.6μ
330p-6.8µ
n/a
n/a
n/a
X5R
100p-120n 100p-470n 100p-1.2µ
330p-2.7µ
100p-2.2µ
150p-6.8µ
220p-12µ
220p-12µ
330p-15µ
n/a
n/a
n/a
0.47p-2.2n
3.9p-56n
4.7p-47n
10p-150n
10p-220n
10p-220n
10p-330n
n/a
n/a
n/a
X7R
100p-100n 100p-220n 100p-820n 330p-1.2μ
100p-1.2μ
150p-2.2μ
220p-3.9μ
220p-4.7μ
330p-5.6μ
n/a
n/a
n/a
X5R
100p-100n 100p-390n 100p-1.0µ
330p-2.2µ
100p-1.5µ
150p-4.7µ
220p-10µ
220p-10µ
330p-12µ
n/a
n/a
n/a
C0G/NP0
0.47p-1.5n
3.9p-33n
4.7p-33n
10p-100n
10p-150n
10p-150n
10p-220n
10p-330n
X7R
100p-47n
100p-220n 100p-470n 330p-1.0μ 100p-680n 150p-2.2μ
220p-1.8μ
220p-3.3μ
330p-3.3μ
470p-10μ
1.0n-15μ
2.2n-22μ
X5R
100p-68n
100p-330n 100p-680n 330p-1.5µ
n/a
n/a
C0G/NP0
10V
C0G/NP0
16V
C0G/NP0
1.0p-12n
1.0p-10n
25V
50/63V
1.0p-5.6n
1.0p-27n
1.0p-22n
390p-680n 680p-1.0µ
220p-6.8µ
220p-6.8µ
330p-10µ
n/a
4.7p-18n
10p-47n
10p-68n
10p-68n
10p-82n
10p-270n
220p-1.5μ
220p-2.2μ
330p-2.7μ
470p-5.6μ
10p-27n
10p-27n
10p-39n
10p-100n
390p-220n 680p-330n
220p-1.0μ
330p-1.5μ
470p-3.3μ
1.0n-5.6μ
10p-15n
10p-22n
10p-68n
C0G/NP0
n/a
1.0p-180p
1.0p-1.0n
3.9p-1.8n
4.7p-2.2n
X7R
n/a
100p-6.8n
100p-33n
330p-47n
100p-68n
C0G/NP0
n/a
1.0p-100p
1.0p-470p
3.9p-1.2n
4.7p-1.2n
X7R
n/a
100p-4.7n
100p-27n
330p-33n
100p-47n
C0G/NP0
n/a
n/a
1.0p-220p
3.9p-680p
4.7p-1.0n
10p-2.2n
10p-3.9n
10p-4.7n
X7R
n/a
n/a
100p-15n
330p-10n
100p-10n
150p-33n
220p-68n
220p-82n
C0G/NP0
n/a
n/a
1.0p-180p
3.9p-470p
4.7p-680p
10p-1.5n
10p-2.7n
10p-3.3n
10p-4.7n
X7R
n/a
n/a
100p-10n
330p-6.8n
100p-6.8n
150p-22n
220p-47n
220p-47n
330p-68n
C0G/NP0
n/a
n/a
1.0p-150p
3.9p-220p
4.7p-270p
10p-820p
10p-1.2n
10p-1.8n
10p-2.2n
10p-5.6n
390p-10n
680p-18n
X7R
n/a
n/a
100p-2.2n
330p-4.7n
100p-4.7n
150p-10n
220p-10n
220p-27n
330p-33n
470p-47n
1.0n-82n
2.2n-150n
C0G/NP0
n/a
n/a
n/a
n/a
4.7p-220p
10p-680p
10p-1.0n
10p-1.5n
10p-1.8n
10p-4.7n
390p-6.8n
680p-12n
X7R
n/a
n/a
n/a
n/a
100p-1.5n
150p-3.3n
220p-6.8n
220p-8.2n
330p-12n
470p-33n
1.0n-68n
2.2n-100n
C0G/NP0
n/a
n/a
n/a
n/a
4.7p-180p
10p-470p
10p-820p
10p-1.2n
10p-1.5n
10p-3.3n
390p-6.8n
680p-10n
X7R
n/a
n/a
n/a
n/a
100p-1.2n
150p-2.7n
220p-3.9n
220p-6.8n
330p-8.2n
470p-22n
1.0n-47n
2.2n-82n
C0G/NP0
n/a
n/a
n/a
n/a
4.7p-150p* 10p-390p* 10p-680p* 10p-1.0n*
10p-1.2n*
10p-1.5n
390p-4.7n
680p-6.8n
X7R
n/a
n/a
n/a
n/a
100p-1.0n* 150p-2.2n* 220p-2.2n* 220p-4.7n* 330p-5.6n* 470p-6.8n
1.0n-15n
2.2n-33n
C0G/NP0
n/a
n/a
n/a
n/a
4.7p-82p* 10p-270p* 10p-470p* 10p-680p* 10p-820p*
10p-1.0n
390p-2.2n
680p-3.9n
X7R
n/a
n/a
n/a
n/a
100p-680p* 150p-1.2n* 220p-1.8n* 220p-3.9n* 330p-4.7n*
n/a
1.0n-10n
2.2n-22n
C0G/NP0
n/a
n/a
n/a
n/a
4.7p-56p* 10p-220p* 10p-330p* 10p-470p* 10p-560p*
n/a
n/a
n/a
X7R
n/a
n/a
n/a
n/a
100p-390p* 150p-1.0n* 220p-1.5n* 220p-2.2n* 330p-2.7n*
n/a
n/a
n/a
0603
0805
1206
1210
3640
5550
8060
1kV
C0G/NP0
630V
150p-3.3µ
100V 200/250V 500V
100p-1.0µ
X7R
C0G/NP0
X7R
0.47p-470p 1.0p-2.2n
100p-33n
3.9p-18n
100p-100n 100p-330n 330p-680n 100p-560n 150p-1.5μ
0.47p-150p 1.0p-820p
100p-10n
1.0p-8.2n
100p-56n
1.0p-2.7n
3.9p-6.8n
4.7p-6.8n
10p-15n
100p-150n 330p-330n 100p-270n 150p-680n 220p-1.0μ
390p-470n 680p-680n
1n-10μ
2.2n-15μ
2.2n-10μ
C0G/NP0
0.47p-68p* 1.0p-390p
1.0p-1.5n
3.9p-4.7n
X7R
100p-1.5n* 100p-10n
100p-47n
330p-120n 100p-120n 150p-330n 220p-560n 220p-560n 330p-820n 470p-1.0μ
1.0n-1.8μ
2.2n-3.3μ
390p-68n
680p-150n
1.0n-1.2μ
2.2n-2.2μ
390p-39n
680p-68n
150p-100n 220p-120n 220p-120n 330p-150n 470p-180n 1.0n-390n
2.2n-1.0μ
4.7p-3.9n
1.2kV 1.5kV
2kV
2.5kV
3kV
4kV
5kV
6kV
1808
10p-10n
10p-5.6n
10p-18n
10p-10n
10p-10n
10p-15n
10p-39n
150p-180n 220p-180n 220p-330n 330p-390n 470p-680n
10p-3.3n
1812
Note: * Indicates components that require conformal coating post soldering.
10p-6.8n
1825
10p-8.2n
2220
10p-10n
10p-6.8n
10p-22n
390p-33n
680p-47n
330p-100n 470p-150n 1.0n-220n
2.2n-470n
2225
10p-18n
390p-150n 680p-220n
10p-12n
390p-22n
680p-33n
470p-100n 1.0n-150n
2.2n-330n
9
Surface mount capacitors
1.11
1.11 - IECQ-CECC
Maximum capacitance values.
16V
25V
50/63V
100V
200V
500V
1kV
0603
0805
1206
1210
1808
1812
2220
2225
C0G/NP0
1.5nF
6.8nF
22nF
33nF
33nF
100nF
150nF
220nF
X7R
100nF
330nF
1.0µF
1.5µF
1.5µF
3.3µF
5.6µF
6.8µF
C0G/NP0
1.0nF
4.7nF
15nF
22nF
27nF
68nF
100nF
150nF
X7R
56nF
220nF
820nF
1.2µF
1.2µF
2.2µF
4.7µF
5.6µF
C0G/NP0
470pF
2.7nF
10nF
18nF
18nF
33nF
68nF
100nF
X7R
47nF
220nF
470nF
1.0µF
680nF
1.5µF
2.2µF
3.3µF
C0G/NP0
330pF
1.8nF
6.8nF
12nF
12nF
27nF
47nF
68nF
X7R
10nF
47nF
150nF
470nF
330nF
1.0µF
1.5µF
1.5µF
C0G/NP0
100pF
680pF
2.2nF
4.7nF
4.7nF
12nF
22nF
27nF
X7R
5.6nF
27nF
100nF
220nF
180nF
470nF
1.0µF
1.0µF
C0G/NP0
n/a
330pF
1.5nF
3.3nF
3.3nF
10nF
15nF
22nF
X7R
n/a
8.2nF
33nF
100nF
100nF
270nF
560nF
820nF
C0G/NP0
n/a
n/a
470pF
1.0nF
1.2nF
3.3nF
8.2nF
10nF
X7R
n/a
n/a
4.7nF
15nF
18nF
56nF
120nF
150nF
1.11 - S05, S02A(1) Space Grade and MIL-PRF-55681(2) ranges
Maximum capacitance values.
16V
25V
50/63V
100V
200V
0603
0805
1206
1210
C0G/
NP0
390pF - 1.5nF
1pF - 6.8nF
1pF - 22nF
10pF - 33nF
X7R
330pF - 100nF 100pF - 330nF 680pF - 1.0µF 1.0nF - 1.5µF
3.9nF - 3.3µF
C0G/
NP0
390pF - 1.0nF
220pF - 68nF 470pF - 100nF 560pF - 150nF
X7R
330pF - 56nF 100pF - 220nF 680pF - 820nF 1.0nF - 1.2µF
3.9nF - 2.2µF
10nF - 4.7µF
C0G/
NP0
0.5pF - 470pF
220pF - 39nF
470pF - 68nF 560pF - 100nF
X7R
330pF - 47nF 100pF - 220nF 680pF - 470nF 1.0nF - 1.0µF
3.9nF - 2.2µF
10nF - 3.3µF
18nF - 3.3µF
C0G/
NP0
1pF - 330pF
220pF - 27nF
470pF - 47nF
560pF - 68nF
X7R
100pF - 10nF
100pF - 47nF 100pF - 150nF 1.0nF - 470nF 3.9nF - 1.0µF
10nF - 1.5µF
18nF - 1.5µF
C0G/
NP0
1pF - 100pF
1pF - 680pF
220pF - 12nF
470pF - 22nF
560pF - 27nF
X7R
100pF - 5.6nF
100pF - 27nF 100pF - 100nF 1.0nF - 220nF 3.9nF - 470nF
10nF - 1.0µF
18nF - 1.0µF
1pF - 4.7nF
1pF - 2.7nF
1pF - 1.8nF
Notes:
1) In accordance with ESCC 3009.
2) In accordance with MIL-PRF-55681 Group A tests.
10
1pF - 15nF
1pF - 10nF
1pF - 6.8nF
1pF - 2.2nF
10pF - 22nF
10pF - 18nF
10pF - 12nF
10pF - 4.7nF
1812
2220
2225
220pF - 100nF 470pF - 150nF 560pF - 220nF
10nF - 5.6µF
18nF - 6.8µF
18nF - 5.6µF
1.11 to 1.13
Surface mount capacitors
1.11 - AEC-Q200 Rev C ranges
Maximum capacitance values.
0603
50/63V
100V
200V
500V
630V
1kV
0805
1206
1210
1812
C0G/NP0
470pF
2.7nF
10nF
18nF
39nF
X7R
33nF
150nF
330nF
680nF
1.5µF
C0G/NP0
330pF
1.8nF
6.8nF
12nF
27nF
X7R
10nF
47nF
150nF
470nF
1µF
C0G/NP0
100pF
680pF
2.2nF
4.7nF
12nF
X7R
5.6nF
27nF
100nF
220nF
470nF
C0G/NP0
n/a
330pF
1.5nF
3.9nF
10nF
X7R
n/a
8.2nF
33nF
100nF
270nF
C0G/NP0
n/a
n/a
1.0nF
1.8nF
5.6nF
X7R
n/a
n/a
10nF
27nF
150nF
C0G/NP0
n/a
n/a
470pF
1nF
3.3nF
X7R
n/a
n/a
4.7nF
15nF
56nF
1.12 - Termination types available
Syfer reliability SM product group
Standard
SM
capacitors
IECQ-CECC
AEC-Q200
MIL-PRF
55681(1)
F = Silver Palladium. RoHS compliant.
n
n
-
J = Silver base with nickel barrier (100% matte tin
plating). RoHS compliant.
n
n
A = Silver base with nickel barrier (Tin/lead plating with
min. 10% lead).
n
Y = FlexiCapTM termination base with Ni barrier (100%
matte tin plating). RoHS compliant.
H = FlexiCapTM termination base with Ni barrier (Tin/
lead plating with min. 10% lead).
S (space grade) High Rel
S05
S02A
n
n
n
C0G/NP0
dielectric
only
n
r
r
n
-
n
n
n
n
n
n
n
r
r
n
n
-
n
n
n
n Termination available.
r Termination available but generally not requested for space grade components. Please discuss with Syfer Sales.
Notes:
1) In accordance with MIL-PRF-55681 group A. Additional optional tests available.
1.13 - Ordering information
Standard product code construction
1210
Chip
size
Y
100
Termination
Voltage
Y = FlexiCapTM
termination base with Ni
barrier (100% matte tin
plating). RoHS compliant.
010 = 10V
016 = 16V
025 = 25V
050 = 50V
063 = 63V
100 = 100V
200 = 200V
250 = 250V
500 = 500V
630 = 630V
1K0 = 1kV
1K2 = 1.2kV
1K5 = 1.5kV
2K0 = 2kV
2K5 = 2.5kV
3K0 = 3kV
4K0 = 4kV
5K0 = 5kV
6K0 = 6kV
H = FlexiCapTM
termination base with Ni
barrier (Tin/lead plating
with min. 10% lead).
F = Silver Palladium.
RoHS compliant.
J = Silver base with nickel
barrier (100% matte tin
plating). RoHS compliant.
A = Silver base with
nickel barrier (Tin/lead
plating with min. 10%
lead).
0103
J
X
T
___
Capacitance in
picofarads (pF)
Capacitance
tolerance
Dielectric
Rel
Release
codes
Packaging
Suffix
code
First digit is 0.
10pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
B = Bulk
pack - tubs
Used for
specific
customer
requirements
11
Surface mount capacitors
1.13
1.13 - IECQ-CECC product code construction
1210
Y
100
0103
J
D
T
___
Chip
size
Termination
Voltage
Capacitance in
picofarads (pF)
Capacitance
tolerance
Dielectric
Release codes(1)
Packaging
Suffix
code
Y = FlexiCapTM
termination base with Ni
barrier (100% matte tin
plating). RoHS compliant.
016 = 16V
025 = 25V
050 = 50V
063 = 63V
100 = 100V
200 = 200V
250 = 250V
500 = 500V
630 = 630V
1K0 = 1kV
First digit is 0.
10pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
A = Silver base with
nickel barrier (Tin/lead
plating with min. 10%
lead).
T = 178mm
(7”) reel
F = C0G/NP0
(1B/NP0) with IECQCECC release
B = 2X1/
BX released in
accordance with
IECQ-CECC
R = 2C1/
BZ released in
accordance with
IECQ-CECC
R = 330mm
(13”) reel
B = Bulk
pack - tubs
Used for
specific
customer
requirements
1.13 - S05 and S02A product code construction
1210
A
100
0103
J
X
T
___
Chip
size
Termination
Voltage
Capacitance in
picofarads (pF)
Capacitance
tolerance
Dielectric
Rel
Release codes
Packaging
Suffix code
A = Silver base with
nickel barrier (Tin/
lead plating with min.
10% lead).
F = Silver Palladium.
RoHS compliant.
016 = 16V
025 = 25V
050 = 50V
063 = 63V
100 = 100V
200 = 200V
First digit is 0.
Second and third digits
are significant figures of
capacitance code.
10pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
S05 = S
B = Bulk pack
(Space Grade)
- tubs
High Rel
Q = Waffle
S02A =
pack
(2)
S (Space
Grade) High
Rel
1.13 - Ordering information
AEC-Q200 product code construction
1210
Chip
size
Y
100
Termination
Voltage
Y = FlexiCapTM
termination base with
Ni barrier (100% matte
tin plating). RoHS
compliant.
050 = 50V
063 = 63V
100 = 100V
200 = 200V
250 = 250V
500 = 500V
630 = 630V
1K0 = 1kV
J = Silver base with
nickel barrier (100%
matte tin plating).
RoHS compliant. (J
termination not available
with X7R products).
0103
J
E
T
___
Capacitance in
picofarads (pF)
Capacitance
tolerance
Dielectric
Rel
Release codes
Packaging
Suffix code
First digit is 0.
10pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
B = Bulk pack
- tubs
Notes:
1) A & F approved for Space applications. If another termination type is required then contact Syfer Sales.
12
2)
Please include Lot Acceptance Test requirement (LAT1, LAT2 or LAT3) on purchase order against each line item. Tests conducted after 100%
Burn-In (2xRV @125ºC for 168 hours):
LAT1: 4 x adhesion, 8 x rapid temp change + LAT2 and LAT3.
LAT2: 20 x 1000 hour life test + LAT3.
LAT3: 6 x TC and 4 x solderability.
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
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2220Y5000105KXTWS2 0805Y1000103MET 0603Y0500103KET 0603Y0500471KET 0603Y0500102KET
0603Y0250104KETFB6 0603Y0500104KETFB6 0603Y0500473KET 0603Y1000223KET 0603Y1000473KET
0805Y0500103KST 0805Y1000103KST 0805Y1000223KST 1206Y1000224KET 1210J6300682JKTAG1
0805Y1000104KST 0805Y1K00102KST 0805Y1K00472KST 1206Y2K00222KST 1812Y2K00103KST
1812Y2K00222KST 1812Y2K00472KST 0805Y1000104KET 2220Y4K00222KET 1812Y4K00222KET
0805Y0500150KAT 2220JA250221KXTB16 0603Y0500104KET 060330160104JXT 0603J0503P30DAT
0603J0630271JAT 0603J0630560JAT 0603J0634P70DAT 0603Y0500271JAT 0603Y0500471KAT
0603Y0630120JAT 0603Y2000182KET 0805Y0630470KAT 0805Y2001P20CAT 0805Y5000151KET
1206J0630150JAT 1206J0631P20CAT 1206J2000220JAT 1206Y0500390JAT 1206Y0500561KAT
1206Y0630102JAT 1206Y0630274JET 1206Y0630681MET 1206Y0638P20BAT 1206Y2000333JET
1206Y5000560JAT 1206Y6300121KET 1210J0500153GAT 1210J0630102FAT 1210J0630102KAT
1210J0630153KAT 1210J1000181JAT 1210J1K00680JAT 1210J2000152JAT 1210J2000272FAT
1210J6300122KAT 1210J6300470KAT 1210Y0500822KET 1210Y0630120KAT 1210Y0630181GAT
1210Y1000122MET 1210Y1000471GAT 1210Y2000122MET 1210Y2000333JET 1210Y5000103JET
1210Y5000471JET 1210Y5000821MET 1210Y6300681KAT 1812J0630103GAT 1812J0630392FAT
1812J0630472KAT 1812J1K00152GAT 1812J1K00821JAT 1812J5000180KAT 1812J5000560KAT
1812J6300122GAT 1812Y0500125MET 1812Y0500471GAT 1812Y0630563KET 1812Y1K00183JET
1812Y1K00561KAT 1812Y2000184JET 1812Y5000104KET 1812Y5000562MET 1812Y6300122JET
1812Y6300271JAT 1812Y6300473KET 0805Y0500151KAT 0603J1000121GAT 0603J1000271GAT
0603J2000270KAT 0603Y0630330GAT 0603Y1006P80CAT 0805J0630330JAT 0805J2006P80DAT