404025K00561JQRAF9LM 数据手册
MLCC
Non-magnetic Surface Mount &
Ribbon Leaded MLC Capacitors
Electrical Details
Non-magnetic MLCC Ranges
Capacitance Range
The use of a copper barrier instead of a nickel barrier,
with a tin finish on top, is the solution Knowles has
developed for non-magnetic applications.
This non-magnetic termination is offered with selected
non-magnetic High Q (C0G/NP0), X5R and X7R dielectrics,
providing a fully non-magnetic component (μr=1.0000).
To meet high temperature 260°C soldering reflow profiles
as detailed in J-STD-020, High Q dielectrics are supplied
with sintered solder terminations, while X5R and X7R
dielectrics use Knowles’ award-winning FlexiCap™ solder
termination.
Temperature
Coefficient
of Capacitance
(TCC)
Dissipation Factor
Palladium silver termination for conductive epoxy
mounting is also available for selected parts in the High Q
Standard range and X5R/X7R ranges.
Ribbon lead terminations for optimum mechanical
performance are available on High Q High Power RF parts.
0.2pF to 6.8µF
High Q (C0G/NP0)
0 ± 30ppm/˚C
X5R
±15% from -55oC to +85oC
X7R
±15% from -55oC to +125oC
High Q (C0G/NP0)
Surface mount
≤ 0.0014 for capacitance values 25V
≤ 0.035 for rated voltages ≤25V
Minimum Insulation Resistance (IR)
100GΩ or (1000s/cap in F), whichever is less
Dielectric Withstand Voltage (DWV)
Voltage applied for 5 seconds maximum, at
50mA maximum charging current
Ageing Rate
High Q (C0G/NP0)
Zero
X5R and X7R
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