SFJEC5000473MX1

Filter Type Feedthrough EMI Filter Datasheet SFJE (¼-28 UNF Thread : 9.8mm Round Head) Not Recommended for New Designs – Refer to SFJG Range for Replacement Circuit Configurations Available Electrical Details Electrical Configuration Capacitance Measurement Current Rating Insulation Resistance (IR) Temperature Rating Ferrite Inductance (Typical) See Circuit Configuration @ 1000hr Point 15A 10G or 1000F -55oC to +125oC Not Applicable Mechanical Details Head Diameter Nut A/F Washer Diameter Mounting Torque 9.8mm (0.386") 7.92mm (0.312") 11.35mm (0.447") 0.9Nm (7.97lbf in) max. 6.7mm O.D., 5.5mm A/F (0.264" O.D., 0.217" A/F) Mounting Hole Diameter ¼-28 UNF Class 2A Thread Max. Panel Thickness Weight (Typical) Finish 2.3mm (0.091") 3.0g (0.11oz) Silver plate on copper undercoat C Configuration 1GHz 100pF C0G 3kV# 3.6kV 4 22 SFJEC3K00151MC 150pF C0G 3kV# 3.6kV 7 25 SFJEC3K00221MC 220pF C0G 3kV# 3.6kV 10 29 SFJEC2K00331MC 330pF C0G 2kV# 2.4kV 13 33 SFJEC2K00471MC 470pF C0G 2kV# 2.4kV 1 16 35 SFJEC2K00681MC 680pF C0G 2kV# 2.4kV 2 19 39 SFJEC2K00102MC 1.0nF C0G 2kV# 2.4kV 4 23 41 SFJEC2K00152MX 1.5nF X7R 2kV# 2.4kV 7 26 45 2.2nF X7R 2kV# 2.4kV 10 30 50 3.3nF X7R 2kV# 2.4kV 13 33 52 4.7nF X7R 2kV# 2.4kV 1 16 36 55 6.8nF X7R 2kV# 2.4kV 2 19 39 57 10nF X7R 2kV# 2.4kV 4 22 41 60 15nF X7R 1kV# 1.2kV 7 25 44 62 22nF X7R 1kV# 1.2kV 10 29 46 65 33nF X7R 1kV# 1.2kV 13 33 48 68 47nF X7R 1kV# 1.2kV 1 16 35 50 70 SFJEC2K00222MX SFJEC2K00332MX SFJEC2K00682MX SFJEC2K00103MX SFJEC1K00153MX SFJEC1K00223MX SFJEC1K00333MX SFJEC1K00473MX 0 = No hardware supplied SFJEC2K00472MX SFJEC1K00683MX 10MHz SFJEC3K00101MC 1MHz DWV (dc) 0.1MHz Rated Voltage (dc) Other options available – please contact factory Dielectric Product Code 1 = supplied with standard nut and wavy washer Capacitance  20% 100MHz Hardware (Nuts & Washers etc.) Typical Insertion Loss (db) 0.01MHz Ferrite Inductance (Typical) - 50nH 68nF X7R 1kV# 1.2kV 2 19 39 54 >70 100nF X7R 500# 750 4 22 41 57 >70 150nF X7R 500# 750 7 25 45 60 >70 SFJEC5000224MX 220nF X7R 500# 750 10 29 49 62 >70 SFJEC5000334MX 330nF X7R 500# 750 13 33 52 66 >70 SFJEC5000474MX 470nF X7R 500 750 1 16 35 55 68 >70 SFJEC3000684MX 680nF X7R 300 600 2 19 38 58 70 >70 SFJEC2000105MX 1.0F X7R 200 500 4 22 41 61 >70 >70 SFJEC1000155MX 1.5F X7R 100 250 7 25 45 64 >70 >70 SFJEC1000225MX 2.2F X7R 100 250 10 29 48 66 >70 >70 SFJEC0500335MX 3.3F X7R 50 125 14 34 52 70 >70 >70 SFJEC5000104MX SFJEC5000154MX # - Also rated for operation at 115Vac 400Hz. Self-heating will occur – evaluation in situ recommended Syfer Technology Ltd. Old Stoke Road, Arminghall Norwich, Norfolk, NR14 8SQ United Kingdom Tel: +44 1603 723300 | Email sales@syfer.co.uk | www.syfer.com SFJE Issue 2 (P108893) Release Date 04/03/14 Page 1 of 4 L-C Configuration 0.1MHz 100MHz Typical Insertion Loss (db) 0.01MHz Ferrite Inductance (Typical) - 50nH Rated Voltage (dc) DWV (dc) SFJEL3K00101MC 100pF C0G 3kV# 3.6kV 7 24 SFJEL3K00151MC 150pF C0G 3kV# 3.6kV 10 27 SFJEL3K00221MC 220pF C0G 3kV# 3.6kV 12 30 SFJEL2K00331MC 330pF C0G 2kV# 2.4kV 1 16 34 SFJEL2K00471MC 470pF C0G 2kV# 2.4kV 2 19 38 SFJEL2K00681MC 680pF C0G 2kV# 2.4kV 3 22 41 SFJEL2K00102MC 1.0nF C0G 2kV# 2.4kV 6 25 44 SFJEL2K00152MX 1.5nF X7R 2kV# 2.4kV 9 29 48 SFJEL2K00222MX 2.2nF X7R 2kV# 2.4kV 12 31 51 3.3nF X7R 2kV# 2.4kV 15 35 54 4.7nF X7R 2kV# 2.4kV 1 18 39 57 6.8nF X7R 2kV# 2.4kV 2 21 41 60 10nF X7R 2kV# 2.4kV 4 23 43 63 15nF X7R 1kV# 1.2kV 7 27 46 66 22nF X7R 1kV# 1.2kV 10 30 48 68 33nF X7R 1kV# 1.2kV 13 34 50 70 47nF X7R 1kV# 1.2kV 1 17 37 51 >70 68nF X7R 1kV# 1.2kV 2 20 40 55 >70 100nF X7R 500# 750 4 22 44 60 >70 150nF X7R 500# 750 7 25 47 62 >70 SFJEL5000224MX 220nF X7R 500# 750 10 29 49 66 >70 SFJEL5000334MX 330nF X7R 500# 750 13 33 53 68 >70 SFJEL5000474MX 470nF X7R 500 750 1 16 35 56 70 >70 SFJEL3000684MX 680nF X7R 300 600 2 19 38 58 >70 >70 SFJEL2000105MX 1.0F X7R 200 500 4 22 41 61 >70 >70 SFJEL1000155MX 1.5F X7R 100 250 7 25 45 64 >70 >70 SFJEL1000225MX 2.2F X7R 100 250 10 29 48 66 >70 >70 SFJEL0500335MX 3.3F X7R 50 125 14 34 52 70 >70 >70 SFJEL2K00103MX SFJEL1K00153MX SFJEL1K00223MX SFJEL1K00333MX SFJEL1K00473MX SFJEL1K00683MX SFJEL5000104MX SFJEL5000154MX Other options available – please contact factory SFJEL2K00682MX 0 = No hardware supplied SFJEL2K00472MX 1 = supplied with standard nut and wavy washer SFJEL2K00332MX 1MHz 1GHz Dielectric Hardware 10MHz Capacitance 20% Product Code # - Also rated for operation at 115Vac 400Hz. Self-heating will occur – evaluation in situ recommended Ordering Information Type Case Style Thread Electrical configuration SF J E C Syfer Filter 7.92mm A/F ¼-28 UNF C = C Filter L = L-C Filter Voltage (dc) Capacitance in picofarads (pF) 500 Capacitance Tolerance 0102 M M =  20% 300 = 300V First digit is 0. Second and third digits are significant figures of capacitance code. The fourth digit is the number of zeros following. 500 = 500V Examples: 0101 = 100pF 050 = 50V 100 = 100V 200 = 200V 1K0 = 1kV 2K0 = 2kV Dielectric Hardware X 0 C = C0G/NP0 0 = Without X = X7R 1 = With 0332 = 3300pF 3K0 =3kV Note: The addition of a 4-digit numerical suffix code can be used to denote changes to the standard part. Options include for example: change of pin length / custom body dimensions or threads / alternative voltage rating / non-standard intermediate capacitance values / test requirements. Please refer specific requests to the factory. Syfer Technology Ltd. SFJE Issue 2 (P108893) Release Date 04/03/14 Page 2 of 4 Surface Mount and Panel Mount Solder-in filters Solder pad layouts are included with the detailed information for each part. Recommended soldering profile E01, E03, E07 SBSP ranges are compatible with all standard solder types including lead-free, maximum temperature 260°C. For SBSG, SBSM and SFSS ranges, solder time should be minimised, and the temperature controlled to a maximum of 220°C. For SFSR, SFST and SFSU ranges the maximum temperature is 250°C. Cooling to ambient temperature should be allowed to occur naturally. Natural cooling allows a gradual relaxation of thermal mismatch stresses in the solder joints. Draughts should be avoided. Forced air cooling can induce thermal breakage, and cleaning with cold fluids immediately after a soldering process may result in cracked filters. Note: The use of FlexiCap™ terminations is strongly recommended to reduce the risk of mechanical cracking. Soldering to axial wire leads Soldering temperature The tip temperature of the iron should not exceed 300°C. Dwell time Soldering of filters The soldering process should be controlled such that the filter does not experience any thermal shocks which may induce thermal cracks in the ceramic dielectric. The pre-heat temperature rise of the filter should be kept to around 2°C per second. In practice successful temperature rises tend to be in the region of 1.5°C to 4°C per second dependent upon substrate and components. The introduction of a soak after pre-heat can be useful as it allows temperature uniformity to be established across the substrate thus preventing substrate warping. The magnitude or direction of any warping may change on cooling imposing damaging stresses upon the filter. Dwell time should be 3-5 seconds maximum to minimise the risk of cracking the capacitor due to thermal shock. Heat sink Where possible, a heat sink should be used between the solder joint and the body, especially if longer dwell times are required. Bending or cropping of wire leads Bending or cropping of the filter terminations should not be carried out within 4mm (0.157”) of the epoxy encapsulation, the wire should be supported when cropping. Soldering irons should not be used for mounting surface mount filters as they can result in thermal shock damage to the chip capacitor. A more comprehensive application note covering installation of all Syfer products is available on the Syfer website. Syfer Technology Ltd. Old Stoke Road, Arminghall Norwich, Norfolk, NR14 8SQ United Kingdom Tel: +44 1603 723300 | Email sales@syfer.co.uk | www.syfer.com SFJE Issue 2 (P108893) Release Date 04/03/14 Page 3 of 4 Resin filled screw mounted EMI filters Grounding General To ensure the proper operation of the filters, the filter body should be adequately grounded to the panel to allow an effective path for the interference. The use of locking adhesives is not recommended, but if used should be applied after the filter has been fitted. The ceramic capacitor, which is the heart of the filter, can be damaged by thermal and mechanical shock, as well as by over-voltage. Care should be taken to minimise the risk of stress when mounting the filter to a panel and when soldering wire to the filter terminations. Mounting to chassis Mounting torque It is important to mount the filter to the bulkhead or panel using the recommended mounting torque, otherwise damage may be caused to the capacitor due to distortion of the case. When a threaded hole is to be utilised, the maximum mounting torque should be 50% of the specified figure which relates to unthreaded holes. For details of torque figures for each filter range, please see below. Torque (max.) Thread Minimum plate thickness Users should be aware that the majority of these filters have an undercut between the thread and the mounting flange of the body, equal to 1.5 x the pitch of the thread. Mounting into a panel thinner than this undercut length may result in problems with thread mating and filter position. It is recommended that a panel thicker than this undercut length be used wherever possible. Maximum plate thickness This is specified for each filter in order that the nut can be fully engaged even when using a washer. Soldering to axial wire leads With nut Into tapped hole - 0.15Nm (1.32lbf in) The tip temperature of the iron should not exceed 300°C. 0.25Nm (2.21lbf in) 0.15Nm (1.32lbf in) Dwell time 0.3Nm (2.65lbf in) 0.15Nm (1.32lbf in) Dwell time should be 3-5 seconds maximum to minimise the risk of cracking the capacitor due to thermal shock. 0.35Nm (3.09lbf in) 0.18Nm (1.59lbf in) Heat sink M4 & 8-32 UNC 0.5Nm (4.42lbf in) 0.25Nm (2.21lbf in) M5, 12-32 UNEF & 2BA 0.6Nm (5.31lbf in) 0.3Nm (2.65lbf in) Where possible, a heat sink should be used between the solder joint and the body, especially if longer dwell times are required. M6 & 1/4-28 UNF 0.9Nm (7.97lbf in) - M2.5 & 4-40 UNC M3 6-32 UNC M3.5 Tools Hexagonal devices should be assembled using a suitable socket. Round bodied filters may be fitted to the panel in one of two ways (and should not be fitted using pliers or other similar tools which may damage them):  Round bodies with slotted tops are designed to be screwed in using a simple purpose-designed tool.  Round bodies without slotted tops are intended to be inserted into slotted holes and retained with a nut. Syfer Technology Ltd. Old Stoke Road, Arminghall Norwich, Norfolk, NR14 8SQ United Kingdom Tel: +44 1603 723300 | Email sales@syfer.co.uk | www.syfer.com Soldering temperature Bending or cropping of wire leads Bending or cropping of the filter terminations should not be carried out within 4mm (0.157”) of the epoxy encapsulation, the wire should be supported when cropping. RoHS compliance All surface mount filters, resin sealed panel mount filters and power filters are fully RoHS compliant through material exemption, although care must be taken not to exceed the maximum soldering temperatures of surface mount parts. Standard hermetic sealed panel mount filters use SnPb solders as part of their assembly, and are intended for exempt applications such as aerospace or military. Substitution of the SnPb solder with Pb free solders is possible to create a RoHS compliant part – please contact factory for further details. SFJE Issue 2 (P108893) Release Date 04/03/14 Page 4 of 4