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SPU1410LR5H-QB

SPU1410LR5H-QB

  • 厂商:

    KNOWLES(楼氏)

  • 封装:

    -

  • 描述:

    MIC SISONIC ULTRAMINI MAX RF

  • 详情介绍
  • 数据手册
  • 价格&库存
SPU1410LR5H-QB 数据手册
SPU1410LR5H-QB Zero-Height SiSonicTM Microphone With Extended Low Frequency Performance The SPU1410LR5H-QB is a miniature, highperformance, low power, bottom port silicon microphone. Using Knowles’ proven high performance SiSonicTM MEMS technology, the SPU1410LR5H-QB consists of an acoustic sensor, a low noise input buffer, and an output amplifier. These devices are suitable for applications such as cellphones, smart phones, laptop computers, sensors, digital still cameras, portable music recorders, and other portable electronic devices where excellent wideband audio performance and RF immunity are required. Revision: D Sheet 1 of 11 Features:  Extended Low Frequency Performance  Flat Frequency Response  Low Current  Small package  MaxRF protection  Zero-Height MicTM  Ultra-Stable Performance  Standard SMD Reflow  Omnidirectional 3/27/2013 ©2013 Knowles Electronics SPU1410LR5H-QB 1. ABSOLUTE MAXIMUM RATINGS Parameter Absolute Maximum Rating Units VDD to Ground -0.5, +5.0 V OUT to Ground -0.3, VDD + 0.3 V ±5 mA -40 to +100 °C Input Current to Any Pin Temperature Range Stresses exceeding these “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only. Functional operation at these or any other conditions beyond those indicated under “Acoustic & Electrical Specifications” is not implied. Exposure beyond those indicated under “Acoustic & Electrical Specifications” for extended periods may affect device reliability. 2. ACOUSTIC & ELECTRICAL SPECIFICATIONS TEST CONDITIONS: 23 ±2°C, 55±20% R.H., VDD(min) < VDD < VDD(max), no load, unless otherwise indicated Parameter Symbol 1 1,2 Supply Voltage Supply Current Sensitivity 1 Signal to Noise Ratio Total Harmonic Distortion Acoustic Overload Point Min Typ Max Units VDD 1.5 - 3.6 V IDD - 120 160 µA S 94 dB SPL @ 1 kHz -41 -38 -35 dBV/Pa SNR 94 dB SPL @ 1 kHz, A-weighted - 63 - dB(A) - 0.15 1 % 115 118 - dB SPL VDD = 1.5V - 0.73 - V @ 1 kHz - - 400  THD AOP DC Output Output Impedance Conditions ZOUT 94 dB SPL @ 1 kHz, S = Typ, Rload > 3 k 10% THD @ 1 kHz, S = Typ, VDD = 3.6V, Rload > 3 k Directivity Polarity 1 2 Omnidirectional Increasing sound pressure Increasing output voltage 100% tested. Maximum specifications are measured at maximum VDD. Typical specifications are measured at VDD = 1.8V. Revision: D Sheet 2 of 11 3/27/2013 ©2013 Knowles Electronics SPU1410LR5H-QB 3. FREQUENCY RESPONSE CURVE Sensitivity (dB) Typical Free Field Response Normalized to 1kHz 20 18 16 14 12 10 8 6 4 2 0 -2 -4 -6 -8 -10 -12 -14 -16 -18 -20 10 100 1,000 10,000 Frequency (Hz) Revision: D Sheet 3 of 11 3/27/2013 ©2013 Knowles Electronics SPU1410LR5H-QB 4. INTERFACE CIRCUIT VDD .1f RF VDD OUTPUT GROUND RS VREF External Gain = -RF/RS (Set By User) Dotted Section Represents SiSonicTM Microphone Note: All Ground pins must be connected to ground. Capacitors near the microphone should not contain Class 2 dielectrics. Detailed information on acoustic, mechanical, and system integration can be found in the latest SiSonicTM Design Guide application note. Revision: D Sheet 4 of 11 3/27/2013 ©2013 Knowles Electronics SPU1410LR5H-QB 5. MECHANICAL SPECIFICATIONS Item Dimension Tolerance Length (L) 3.76 ±0.10 Width (W) 3.00 ±0.10 Height (H) 1.10 ±0.10 Ø0.25 ±0.08 Acoustic Port (AP) Pin # Pin Name Type Description 1 OUTPUT Signal Output Signal 2 GROUND Power Ground 3 GROUND Power Ground 4 VDD Power Power Supply 5 GROUND Power Ground 6 GROUND Power Ground Notes: Pick Area only extends to 0.25 mm of any edge or hole unless otherwise specified. Dimensions are in millimeters unless otherwise specified. Tolerance is ±0.15mm unless otherwise specified Revision: D Sheet 5 of 11 3/27/2013 ©2013 Knowles Electronics SPU1410LR5H-QB 6. EXAMPLE LAND PATTERN 7. EXAMPLE SOLDER STENCIL PATTERN Notes: Dimensions are in millimeters unless otherwise specified. Detailed information on AP size considerations can be found in the latest SiSonicTM Design Guide application note. Further optimizations based on application should be performed. Revision: D Sheet 6 of 11 3/27/2013 ©2013 Knowles Electronics SPU1410LR5H-QB 8. PACKAGING & MARKING DETAIL Model Number Suffix Reel Diameter Quantity Per Reel SPU1410LR5H-QB -7 13” 5,700 Pin 1 Alpha Character A: “S”: Knowles SiSonicTM Production “E”: Knowles Engineering Samples “P”: Knowles Prototype Samples “JIN NUMBER”: Unique Job Identification Number for product traceability Notes: Dimensions are in millimeters unless otherwise specified. Vacuum pickup only in the pick area indicated in Mechanical Specifications. Tape & reel per EIA-481. Labels applied directly to reel and external package. Shelf life: Twelve (12) months when devices are to be stored in factory supplied, unopened ESD moisture sensitive bag under maximum environmental conditions of 30°C, 70% R.H. Revision: D Sheet 7 of 11 3/27/2013 ©2013 Knowles Electronics SPU1410LR5H-QB 9. RECOMMENDED REFLOW PROFILE tP TP Ramp-up Temperature TL tL TSMAX TSMIN tS Preheat Ramp-down 25°C Time Time 25°C to Peak Profile Feature Average Ramp-up rate (TSMAX to TP) Preheat  Temperature Min (TSMIN)  Temperature Max (TSMAX)  Time (TSMIN to TSMAX) (tS) Time maintained above:  Temperature (TL)  Time (tL) Peak Temperature (TP) Time within 5°C of actual Peak Temperature (tP) Ramp-down rate (TP to TSMAX) Time 25°C to Peak Temperature Pb-Free 3°C/second max. 150°C 200°C 60-180 seconds 217°C 60-150 seconds 260°C 20-40 seconds 6°C/second max 8 minutes max Notes: Based on IPC/JDEC J-STD-020 Revision C. All temperatures refer to topside of the package, measured on the package body surface. Revision: D Sheet 8 of 11 3/27/2013 ©2013 Knowles Electronics SPU1410LR5H-QB 10. ADDITIONAL NOTES (A) MSL (moisture sensitivity level) Class 1. (B) Maximum of 3 reflow cycles is recommended. (C) In order to minimize device damage:  Do not board wash or clean after the reflow process.  Do not brush board with or without solvents after the reflow process.  Do not directly expose to ultrasonic processing, welding, or cleaning.  Do not insert any object in port hole of device at any time.  Do not apply over 30 psi of air pressure into the port hole.  Do not pull a vacuum over port hole of the microphone.  Do not apply a vacuum when repacking into sealed bags at a rate faster than 0.5 atm/sec. 11. MATERIALS STATEMENT Meets the requirements of the European RoHS directive 2011/65/EC as amended. Meets the requirements of the industry standard IEC 61249-2-21:2003 for halogenated substances and Knowles Green Materials Standards Policy section on Halogen-Free. Ozone depleting substances are not used in the product or the processes used to make the product, including compounds listed in Annex A, B, and C of the “Montreal Protocol on Substances That Deplete the Ozone Layer.” Revision: D Sheet 9 of 11 3/27/2013 ©2013 Knowles Electronics SPU1410LR5H-QB 12. RELIABILITY SPECIFICATIONS Test Description Thermal Shock 100 cycles air-to-air thermal shock from -40oC to +125oC with 15 minute soaks. (IEC 68-2-4) High Temperature Storage 1,000 hours at +105oC environment (IEC 68-2-2 Test Ba) Low Temperature Storage 1,000 hours at -40oC environment (IEC 68-2-2 Test Aa) High Temperature Bias 1,000 hours at +105oC under bias (IEC 68-2-2 Test Ba) Low Temperature Bias 1,000 hours at -40oC under bias (IEC 68-2-2 Test Aa) Temperature / Humidity Bias 1,000 hours at +85oC/85% R.H. under bias. (JESD22-A101A-B) Vibration ESD-HBM ESD-LID/GND ESD-MM 4 cycles of 20 to 2,000 Hz sinusoidal sweep with 20 G peak acceleration lasting 12 minutes in X, Y, and Z directions. (Mil-Std-883E, Method 2007.2 A) 3 discharges of ±2 kV direct contact to I/O pins. (MIL 883E, Method 3015.7) 3 discharges of ±8 kV direct contact to lid while unit is grounded. (IEC 61000-4-2) 3 discharges of ±200 V direct contact to I/O pins. (ESD STM5.2) Reflow 5 reflow cycles with peak temperature of +260oC Mechanical Shock 3 pulses of 10,000 G in the X, Y, and Z direction (IEC 68-2-27, Test Ea) Note: After reliability tests are performed, the sensitivity of the microphones shall not deviate more than 3 dB from its initial value. Revision: D Sheet 10 of 11 3/27/2013 ©2013 Knowles Electronics SPU1410LR5H-QB 13. SPECIFICATION REVISIONS Revision A B C D Specification Changes Initial Release (C10113345) Released in new format; add DC Output; new JIN designation; new RoHS statement (C10114438) Updated humidity conditions, ESD descriptions, AP and Pin 1 designation (C10114466); moved Shelf Life information; new page 1 description (C10114629) Fixed typos in Reliability Section 12 (C10114690) Date 2/14/12 12/17/12 3/01/13 3/27/13 Information contained herein is subject to change without notice. It may be used by a party at their own discretion and risk. We do not guarantee any results or assume any liability in connection with its use. This publication is not to be taken as a license to operate under any existing patents. Revision: D Sheet 11 of 11 3/27/2013 ©2013 Knowles Electronics
SPU1410LR5H-QB
物料型号:SPU1410LR5H-QB 器件简介:微型、高性能、低功耗、底部端口硅麦克风,使用 Knowles 公司的高性能 SiSonic™ MEMS 技术,包括声学传感器、低噪声输入缓冲器和输出放大器。

引脚分配:1号引脚为输出信号,2、3、5、6号引脚为接地,4号引脚为电源。

参数特性:供电电压 1.5V 至 3.6V,供电电流 120 至 160 微安,灵敏度 -35 至 -41 分贝伏每帕,信噪比 63 分贝(A),总谐波失真 0.15% 至 1%,声学过载点 115 至 118 分贝 SPL。

功能详解:提供扩展低频性能、平坦的频率响应、低电流消耗、小尺寸封装、最大射频保护、零高度麦克风、超稳定性能、标准 SMD 回流焊接、全向性和增加的输出电压。

应用信息:适用于手机、智能手机、笔记本电脑、传感器、数字静态相机、便携式音乐录音机和其他便携式电子设备,这些设备需要出色的宽带音频性能和射频免疫。

封装信息:尺寸为 3.76mm x 3.00mm x 1.10mm,公差为 ±0.10mm,声学端口尺寸为 0.25mm,公差为 ±0.08mm。
SPU1410LR5H-QB 价格&库存

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