KC1JTTD220P8N0L

KOA SPEER ELECTRONICS, INC. SS-229 R4 AHA 8/05/05 Noise Filters KC Series 1. Features I I I I I CERTIFIED CERTIFIED Compact physical dimensions Excellent wave reflection control Exceptional EMI attenuation Excellent as impedance matching for signal lines Marking: Brown and black body color with no marking (1J & 2AF) White and black body color with no marking (2A) 2. Applications I I I I Clock output signal line In/out video signal line for super high resolution High speed signal line Noise reduction for various signal circuits 3. Ordering & Specifying Information Type designation shall be as the following form. KC Type 2AF Size 1J 2AF 2A T Termination Material T: Sn L: SnPb TE Packaging TD: 7" paper tape (1J & 2AF only 4,000 pieces/reel) TE: 7" embossed plastic (2A only 2,000 pcs/reel) 120 Capacitance Value (pF) 2 significant digits + num. of zeros N Capacitance Tolerance N: ±30% P: ±25% 6N5 Inductance Value (nH) 6.5nH L Inductance Tolerance L: ±15% 4. Circuit Schematic 1J & 2AF 2A PAGE 1 OF 8 Bolivar Drive I P.O. Box 547 I Bradford, PA 16701 I USA I 814-362-5536 I Fax 814-362-8883 I www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. KOA SPEER ELECTRONICS, INC. SS-229 R4 5. Rating Item Operating temperature range Storage temperature range Measuring condition (Standard) Temperature Relative humidity Measuring condition (Precision) Temperature Relative humidity Specification -25°C ~ +85°C (1J & 2AF) -40°C ~ +85°C (2A) -40°C ~ +85°C (After soldering) 15 ~ 35°C 20 ~ 90% 20°C ±1°C 60 ~ 67% 6. Dimension L W f Size 1J & 2AF t 1J 2AF 2A Dimensions inches (mm) L W t g e .062±.008 .031±.008 .024±.008 .016±.012 .008±.006 (1.6±0.2) (0.8±0.2) (0.6±0.2) (0.4±0.3) (0.2±0.15) .079±.008 .049±.008 .031±.008 .016±.012 .012±.008 (2.0±0.2) (1.25±0.2) (0.8±0.2) (0.4±0.3) (0.3±0.2) .079±.008 .049±.008 .063±.008 .016±.008 (2.0±0.2) (1.25±0.2) (1.6±0.2) (0.4±0.2) f N/A N/A e g L e .004 Min. .02±.006 (0.1 Min.) (0.25±0.15) 2A W f 2A t 1J & 2AF e g e PAGE 2 OF 8 Bolivar Drive I P.O. Box 547 I Bradford, PA 16701 I USA I 814-362-5536 I Fax 814-362-8883 I www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. KOA SPEER ELECTRONICS, INC. SS-229 R4 7. Applications and Ratings Item Specification Operating Temperature Range -25°C to +85°C (1J & 2AF) -40°C to +85°C (2A) Storage Temperature Range -40°C to +85°C (after soldering) Measuring Condition (Standard) Temperature 15°C to 35°C Relative Humidity 20 - 90% Measuring Condition (Precision) Temperature 20°C ± 1°C Relative Humidity 60 - 67% Capacitance (pF) % 22 ± 25% 35 ± 25% 55 ± 25% 150 ± 30% 70 ± 30% 12 ± 30% 18 ± 30% 35 ± 30% Inductance (nH) % 8.0 ± 15% 8.0 ± 15% 8.0 ± 15% 16.5 ± 15% 8.5 ± 15% 6.5 ± 15% 13 ± 15% 15 ± 15% Rated Voltage DC (V) 16 Rated Current DC (A) 200 Insulation Resistance Minimum (MΩ) 1000 Operating Temperature Range -25°C to +85°C Typical Cut-off Frequency (Att = 3dB) 200 MHz 100 MHz 50 MHz 50 MHz 100 MHz 530 MHz 360 MHz 180 MHz Part Designation KC1JTTD220P8N0L KC1JTTD350P8N0L KC1JTTD550P8N0L KC2AFLTD151N16N5L KC2AFLTD700N8N50L KC2ALTE120N6N5L KC2ALTE180N13NL KC2ALTE350N15NL 25 200 1000 -25°C to +85°C 25 200 1000 -40°C to +85°C 8. Pattern design The land pattern is recommended as follows. Chip Mounting Side 1J & 2AF Resist Back Side 2A Resist Connect to ground pattern of mounting side Ground Pattern Through Hole Through Hole (unit: mm) PAGE 3 OF 8 Bolivar Drive I P.O. Box 547 I Bradford, PA 16701 I USA I 814-362-5536 I Fax 814-362-8883 I www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. KOA SPEER ELECTRONICS, INC. SS-229 R4 9. Characteristics Item Insulation Resistance Requirement Within the tolerance Conditions Voltage: DC25V Test Time: 60 sec Frequency: 1MHz Voltage: 1V Equipment: HP4192A Fixture: HP16034E Frequency: 1MHz Current: 10mA Equipment: HP4192A Fixture: HP16034E Frequency: 1MHz Current: 10mA Equipment: HP4192A Fixture: HP16034E The capacitance shall be measured at each stage below. The rate shall be calculated against the capacitance measured at 20°C Step Temperature 1 20°C 2 -40°C ± 3°C 3 20°C 4 85°C ± 3°C Solder a chip to a test substrate and then laterally apply a load (5N, 500gf) in the arrow direction. Substrate Chip Force Direction Capacitance Within the tolerance Inductance Within the tolerance Resistance (2A only) Within the tolerance Capacitance vs. Temperature Characteristics Variation rate of capacitance in operate temperature are shown in below. Part Rate KC2AL120N6NSL ± 10% KC2AL180N13NL ± 10% KC2AL350N15NL ± 10% Terminal Adhesion Strength No physical damage Resistance to Soldering Heat Appearance: No physical damage Capacitance: Within tolerance Dielectric Loss: Within tolerance Insulation Resistance: Within tolerance Withstand Voltage: No abnormality Flux: 25% rosin Pre-heating: 120 to 180 sec Pre-heating Temp: 150°C to 200°C (1J & 2AF) Solder: H60A Solder Temp: 260°C ±5°C Dip Time: 5 ±0.5 sec PAGE 4 OF 8 Bolivar Drive I P.O. Box 547 I Bradford, PA 16701 I USA I 814-362-5536 I Fax 814-362-8883 I www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. KOA SPEER ELECTRONICS, INC. SS-229 R4 9. Characteristics Cont. Item Solderablility Requirement More than 95% of the terminal electrode shall be covered with new solder. Conditions Flux: 25% rosin Solder: H60A Solder Temp: 235°C ±5°C Dip Time: 2 ±0.5 sec Repeat the following heat cycle 10 times: Step Temperature Time 1 -40°C ±3°C 30 min ±3 min 2 Room Temp. 15 min max. 3 85°C ±2°C 30 min ±3 min 4 Room Temp. 15 min max. Temp: 70°C ±2°C Bias: DC25V Bias: DC200mA Test Time: 500 hours Temperature Cycle* Appearance: No physical damage Capacitance: Within tolerance Dielectric Loss: Within tolerance Insulation Resistance: Within tolerance Withstand Voltage: No abnormality High Temperature Resistance* Appearance: No physical damage Capacitance: Within tolerance Dielectric Loss: Within tolerance Insulation Resistance: Within tolerance Withstand Voltage: No abnormality Appearance: No physical damage Capacitance: Within tolerance Dielectric Loss: Within tolerance Insulation Resistance: Within tolerance Appearance: No physical damage Capacitance: Within tolerance Humidity Resistance (unload)* Temp: 85°C ±2°C Humidity: 85% ±5% Test Time: 500 hours Substrate Bending Test After soldering a chip to a test substrate, bend the substrate by 1 mm and then measure. The substrate is GE4 or based on GE4. 20 Substrate Weight Displacement 45 ± 2 45 ± 2 Humidity Resistance (load)* Appearance: No physical damage Capacitance: Within tolerance Dielectric Loss: Within tolerance Insulation Resistance: Within tolerance Temp: 40°C ±2°C Humidity: 90% ~ 95% Bias: DC25V Bias: DC200mA Test Time: 500 hours * After Temperature cycle test, High temperature resistance test, Humidity resistance test or Low temperature resistance test, the tested sample should be measured after having left in temperature from 15° to 35°C and relative humidity from 20% to 90% for 24 hours. PAGE 5 OF 8 Bolivar Drive I P.O. Box 547 I Bradford, PA 16701 I USA I 814-362-5536 I Fax 814-362-8883 I www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. KOA SPEER ELECTRONICS, INC. SS-229 R4 10. Packaging Specifications 10.1 Taping Packaging of components on continuous tape is complete with carrier tape for putting components and cover tape for sealing. Feeding Hole t1 Chip Pocket D0 E F B W t2 A Chip Component P1 P2 P0 (1) Dimensions of Carrier Tape Series KC1J Series KC2AF Series KC2A Series Dimensions in inches (mm) B W 0.314 ± 0.003 (8.0 ± 0.1) 0.314 ± 0.0078 (8.0 ± 0.2) 0.314 ± 0.0078 (8.0 ± 0.2) A 0.043 ± 0.002 (1.1 ± 005) 0.061 ± 0.003 (1.55 ± 01) 0.061 ± 0.003 (1.55 ± 0.1) F N/A 0.137 ± 0.001 (3.5 ± 0.05) 0.137 ± 0.001 (3.5 ± 0.05) E 0.068 ± 0.003 (1.75 ± 0.1) 0.068 ± 0.003 (1.75 ± 0.1) 0.068 ± 0.003 (1.75 ± 0.1) P1 0.157 ± 0.003 (4.0 ± 0.1) 0.157 ± 0.003 (4.0 ± 0.1) 0.157 ± 0.003 (4.0 ± 0.1) 0.075 ± 0.002 (1.9 ± 0.05) 0.090 ± 0.003 (2.3 ± 0.1) 0.090 ± 0.003 (2.3 ± 0.1) Dimensions in inches (mm) Series KC1J Series KC2AF Series KC2A Series P2 0.078 ± 0.001 (2.0 ± 0.05) 0.078 ± 0.001 (2.0 ± 0.05) 0.078 ± 0.001 (2.0 ± 0.05) P0 0.157 ± 0.003 (4.0 ± 0.1) 0.157 ± 0.003 (4.0 ± 0.1) 0.157 ± 0.003 (4.0 ± 0.1) D0 + 0.003 0.059... -0 .... + 0.1 (1.5 -0 ) + .... 0.059... 0.003 -0 + 0.1) (1.5 t1 0.037 ± 0.001 (0.95 ± 0.05) 0.037 ± 0.001 (0.95 ± 0.05) 0.009 ± 0.001 (0.25 ± 0.05) t2 0.030 ± 0.002 (0.75 ± 0.04) N/A 0.074 ± 0.003 (1.9 ± 0.1) PAGE 6 OF 8 -0 + .... 0.059... 0.003 -0 0.1 (1.5 + -0 ) Bolivar Drive I P.O. Box 547 I Bradford, PA 16701 I USA I 814-362-5536 I Fax 814-362-8883 I www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. KOA SPEER ELECTRONICS, INC. SS-229 R4 (1) Dimensions of Carrier Tape Cont. 15.75 (400) 6.30 (160) 6.30 (160) Top tape Empty Empty Tape running direction (2) Reel dimensions .079 (2.0±0.5) øD A øB Embossed cavity øC W 2A Embossed carrier (2AF size: Paper tape) Dimensions in inches (mm) A KC Series 7.00 ± 0.78 (178 ± 2) B 2.36 (60 min) C 0.511 ± 0.02 (13 ± 0.5) D 0.83 ± 0.03 (21 ± 0.8) E 0.079 ± 0.02 (2 ± 0.5) W (min) 0.311 ± 0.059 (7.9 ± 1.5) W (max) 0.429 ± 0.059 (10.9 ± 1.5) 10.2 Construction of Packaging on Continuous Tapes (2AF only) Packaging of components on continuous tape is complete with carrier tape for putting components and cover tape for sealing. Materials Reel: Carrier Tape: Top Cover Tape: Bottom Cover Tape: Polystyrene Paper Polyester base Paper PAGE 7 OF 8 Bolivar Drive I P.O. Box 547 I Bradford, PA 16701 I USA I 814-362-5536 I Fax 814-362-8883 I www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. KOA SPEER ELECTRONICS, INC. SS-229 R4 11. General Information (1) Storage The products must be stored from 10° to 35°C and from 30% to 70% RH before soldering. (2) Soldering In general, ceramics are very sensitive to thermal shocks. Therefore the parts shall not be exposed to a sudden temperature increase, decrease or partial heating. Products shall be pre-heated prior to soldering. The temperature difference between the solder temperature and product temperature does not exceed 130°C. It is desirable that the soldering temperature be kept 240° - 250°C and that soldering time be less than 4 seconds. Flux shall be rosin type. Do not use strong acid type flux. The tip of the soldering iron shall be 20 W or less, 3ƒ or less, and 220° - 250° C. Recommended soldering thermal and time conditions are shown Appendix 2. (3) Mounting After mounting components on the printed circuit board, do not apply stress through board bending or mishandling. 12. Recommended Soldering Conditions Recommended Condition for Reflow Soldering Preheat 180 Seconds Max. 250°C Soldering 10 Seconds Max. Natural Cooling 120 Seconds Min. 150°C 230°C - 250°C Recommended Condition for Flow Soldering Preheat 120 Seconds Max. 250°C Soldering 3-4 Seconds Max. Natural Cooling 120 Seconds Min. 150°C 230°C - 250°C Recommended Condition for Iron Soldering Preheat 120 Seconds Max. 250°C Soldering 4 Seconds Max. Natural Cooling 120 Seconds Min. 150°C 220°C - 250°C PAGE 8 OF 8 Bolivar Drive I P.O. Box 547 I Bradford, PA 16701 I USA I 814-362-5536 I Fax 814-362-8883 I www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.