KL32TTER56

TN-100 R3 AHA 10/13/06 Chip Inductors Type KL32 Series 1. Scope This specification applies to Chip Inductors (KL32) produced by KOA Corporation. 2. Type Designation The type designation shall be the following form: CERTIFIED CERTIFIED KL Type 32 Size 1210 T Termination Material T: Sn (Other termination styles available, contact factory for options) TE Packaging TE: 7" embossed plastic (2,000 pieces/reel) TED: 10" embossed plastic (4,000 pieces/reel) 101 Nominal Inductance Reference inductance marking chart J Tolerance J: ±5% K: ±10% M: ±20% 3. Dimensions and Construction Type KL32 L W1 Dimensions inches (mm) W2 t h d .126±.008 .098±.008 .067±.004 .087±.008 .075±.004 .02 nominal (3.2±0.2) (2.5±0.2) (1.7±0.1) (2.2±0.2) (1.9±0.1) (.5 nominal) Inductance Marking L W1 Value 0.005µH - 0.082µH 0.10µH - 8.2µH t h 10µH - 330µH d Magnet Wire Ferrite Core Electrode W2 Code 005 - 082 R10 - 8R2 R indicates decimal point. 100 - 331 1st two figures are significant, the last figure indicates the number of zeros to follow. Molded Resin PAGE 1 OF 8 Bolivar Drive ■ P.O. Box 547 ■ Bradford, PA 16701 ■ USA ■ 814-362-5536 ■ Fax 814-362-8883 ■ www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. TN-100 R3 4. Standard Applications Part Designation KL32TTE005* KL32TTE010* KL32TTE012* KL32TTE015* KL32TTE018* KL32TTE022* KL32TTE027* KL32TTE033* KL32TTE039* KL32TTE047* KL32TTE056* KL32TTE068* KL32TTE082* KL32TTER10* KL32TTER12* KL32TTER15* KL32TTER18* KL32TTER22* KL32TTER27* KL32TTER33* KL32TTER39* KL32TTER47* KL32TTER56* KL32TTER68* KL32TTER82* KL32TTE1R0* KL32TTE1R2* KL32TTE1R5* KL32TTE1R8* KL32TTE2R2* KL32TTE2R7* KL32TTE3R3* KL32TTE3R9* KL32TTE4R7* KL32TTE5R6* KL32TTE6R8* KL32TTE8R2* KL32TTE100* KL32TTE120* KL32TTE150* KL32TTE180* KL32TTE220* KL32TTE270* KL32TTE330* KL32TTE390* KL32TTE470* KL32TTE560* KL32TTE680* KL32TTE820* KL32TTE101* KL32TTE121* KL32TTE151* KL32TTE181* KL32TTE221* KL32TTE271* KL32TTE331* Inductance (µH) 0.005 0.010 0.012 0.015 0.018 0.022 0.027 0.033 0.039 0.047 0.056 0.068 0.082 0.10 0.12 0.15 0.18 0.22 0.27 0.33 0.39 0.47 0.56 0.68 0.82 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 Inductance Tolerance M: ±20% Quality Factor Minimum 11 15 17 19 21 23 25 26 27 28 J: ±5% K: ±10% M: ±20% Self Resonant Frequency Minimum (MHz) 2700 2500 2300 2100 1900 1700 1500 1400 1300 1200 1100 1000 900 700 500 450 400 350 320 300 250 220 180 160 140 120 100 85 80 75 70 60 55 50 47 43 40 36 33 30 27 25 20 17 16 15 13 12 11 10 8 20 7 6 5 DC Resistance Maximum (Ω) 0.12 0.13 0.14 0.16 0.18 0.20 0.22 0.24 0.27 0.30 0.33 0.36 0.40 0.44 0.22 0.25 0.28 0.32 0.36 0.40 0.45 0.50 0.55 0.60 0.65 0.70 0.75 0.85 0.90 1.0 1.1 1.2 1.3 1.5 1.6 1.8 2.0 2.1 2.5 2.8 3.3 3.7 5.0 5.6 6.4 7.0 8.0 9.0 10 11 15 17 21 28 34 Allowable DC Current Maximum (mA) Measured Frequency (MHz) K: ±10% M: ±20% 100 450 25.2 30 J: ±5% K: ±10% M: ±20% 400 390 370 350 320 290 260 250 220 200 180 170 150 140 130 120 110 80 70 65 60 55 50 45 40 70 65 60 50 7.96 2.52 0.796 * Add tolerance character (J, K, M) PAGE 2 OF 8 Bolivar Drive ■ P.O. Box 547 ■ Bradford, PA 16701 ■ USA ■ 814-362-5536 ■ Fax 814-362-8883 ■ www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. TN-100 R3 5. Measurement Method of L and Q Nominal Inductance Range (µH) 0.005 ~ 0.10 0.12 ~ 0.82 1.0 ~ 8.2 10 ~ 82 100 ~ 330 Please see Method-1 Measurement Method Measuring Frequency (MHz) 100 25.2 7.96 2.52 0.796 Please see Method-2 Method-1 Test Equipment: Fixture: Electrical Length: Setting: Hewlett Packard RF Impedance analyzer 4191A Hewlett Packard Spring clip fixture 16092A 2.10 cm Please see the following figure KL32 Center Post Slide Clip Terminal 0.087 (2.2) Method-2 Test Equipment: Fixture: OSC Level: Spacer (Unmagnetic Insulator) Hewlett Packard LF Impedance analyzer 4192 Hewlett Packard Test fixture 16034E 0.3 V 6. Test Condition Unless otherwise specified, the test shall be performed in accordance with JIS-C-5202 specifying marking measurements as follows: Ambient temperature: 20 ± 15°C Relative humidity: 65 ± 20% If there may be any doubt on results, measurements shall be made within the following limits: Ambient temperature: 20 ± 2°C Relative humidity: 65 ± 5% PAGE 3 OF 8 Bolivar Drive ■ P.O. Box 547 ■ Bradford, PA 16701 ■ USA ■ 814-362-5536 ■ Fax 814-362-8883 ■ www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. TN-100 R3 7. Reliability Data 7-1 Electrical Characteristics Item DC Bias Characteristic Requirement Δ L/L: Within - 10% Test Method Measure inductance with application of rated current using LCR meter to compare it with the initial value. 5 seconds at DC 1000V between terminal 1 (one electrode of inductor) and terminal 2 (the thin copper wire which is wound around the inductor more than twice). Measure resistance immediately after 1 minute passed since DC 500V was applied between terminal 1 and 2. Dielectric Withstanding Voltage No fuming, flaming, or breakdown Insulation Resistance More than 1000MΩ 7-2 Mechanical Characteristics Item Terminal Pull Strength Terminal Bending Strength Requirement No damage Test Method Terminals shall withstand a pull of 0.5kgf in a horizontal direction. Specimen shall be soldered on PCB-A (see figure below) and support by applying strength so that the bending width becomes 10 mm. 0.197 (5.0) 0.039 (1.0) ø 0.177 (ø 4.5) 0.079 (2.0) 1.575 (40.0) Adhesive Agent Spreading Area No damage Thickness: 1.6 mm Material: Paper Phenol (a) Board 0.087 (2.2) 0.197 (5.0) 3.937 (100.0) (b) Install 1.77 (45.0) Soldering 1.77 (45.0) 0.063 (1.6) Solder Resist Units: inches (mm) Chip Inductor ø 0.394 x 1.969 (ø 10 x 50) (Support Stick) PAGE 4 OF 8 Bolivar Drive ■ P.O. Box 547 ■ Bradford, PA 16701 ■ USA ■ 814-362-5536 ■ Fax 814-362-8883 ■ www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. TN-100 R3 7-2 Mechanical Characteristics Continued Item Vibration Requirement No significant abnormality in appearance Δ L/L: Within ± 3% Test Method 2 hours in each X, Y and Z directions on PCB-B (see figure below) at a frequency range of 10 to 55 to 10 Hz (1 min.) with 1.5 mm amplitude. 0.118 (3.0) 0.110 (2.8) 0.059 (1.5) 0.039 (1.0) 0.157 (4.0) 0.118 (3.0) 0.118 (3.0) 0.079 (2.0) 0.276 (7.0) 0.984 (25.0) Thickness: 1.6 mm Material: Glass Epoxy Adhesive Agent Spreading Area Solder Resist 0.087 (2.2) 0.079 ~ 0.138 (2.0 ~ 3.5) Terminal Connection 0.082 (2.08) 2.180 (55.38) 2.436 or more (2.441 to 2.559) (61.88 or more) (62 to 65) 0.098 (2.5) Units: inches (mm) Resistance to Solder Heat Solderability No significant abnormality in appearance Δ L/L: Within ± 3% Over 95% of electrode surface shall be covered with solder No significant abnormality in appearance Δ L/L: Within ± 3% Immerse in the solder (H63A) of 260 ± 5°C for 10 ± 1 sec. Immerse in the solder (H63A) of 230 ± 5°C for 3 ± 0.5 sec. Drop from a height of 1 m to the ground of concrete or tile 1 time. Drop Test PAGE 5 OF 8 Bolivar Drive ■ P.O. Box 547 ■ Bradford, PA 16701 ■ USA ■ 814-362-5536 ■ Fax 814-362-8883 ■ www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. TN-100 R3 7-3 Environmental Characteristics * Item Low Temperature Life Test High Temperature Life Test Thermal Shock Requirement Δ L/L: Within ± 5% Δ Q/Q: Within ± 20% Δ L/L: Within ± 5% Δ Q/Q: Within ± 30% Δ L/L: Within ± 5% Test Method Store at -55 ± 2°C for 1000 hours. Store at 100 ± 2°C for 1000 hours. 100 cycles between -55 ± 2°C / 1 hour and +100 ± 2°C / 1 hour. Measure Δ L/L at the temperature of between -55°C and +100°C as based on the temperature of 20°C. Store at 40 ± 2°C, 90 to 95% RH for 1000 hours. Apply rated current continuously at 40 ± 2°C, 90 to 95% RH for 1000 hours. Apply rated current continuously at 100 ± 2°C for 1000 hours. According to MIL-STD-202 Method 215 (1990). ––– Temperature Characteristic Humidity Δ L/L: Within ± 10% Δ L/L: Within ± 5% Δ Q/Q: Within ± 30% Δ L/L: Within ± 5% Δ Q/Q: Within ± 30% Δ L/L: Within ± 5% Δ Q/Q: Within ± 30% No outstanding damage and markings can be easily judged -55°C to +100°C Humidity Loading Test High Temperature Loading Test Solvent Resistance Storage Temperature Range Operating Temperature Range -55°C to +100°C ––– * Unless otherwise specified, at least one hour of recovery under the normal temperature and normal humidity after the test, followed by the measurement within two hours. PAGE 6 OF 8 Bolivar Drive ■ P.O. Box 547 ■ Bradford, PA 16701 ■ USA ■ 814-362-5536 ■ Fax 814-362-8883 ■ www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. TN-100 R3 8. Packaging 8-1 Taping The tapes for taping shall be embossed carrier tapes of .315" (8 mm) width and .157" (4 mm) pitch. The standard quantity per reel shall be 2,000 pieces. (1) Dimensions of carrier tape A B W E F T1 T2 Dimensions in inches (mm) T2 P0 P1 P2 øD* øD1 .011 (0.28 ± 0.05) .157 (4.00 ± 0.10) .157 (4.00 ± 0.10) .079 (2.00 ± 0.05) 0.1 .059 (1.50 ± 0.10) 0 0.2 .039 (1.00 ± 0.2 0) 0 .140 (3.55 ± 0.10) .106 (2.70 ± 0.10) .315 (8.00 ± 0.10) .069 (1.75 ± 0.10) .138 (3.50 ± 0.05) .106 (2.70 ± 0.15) E øD The top tape requires a peel-off force of 15 to 60 gf. * 20 pitches accumulation of sprocket holes shall be 80.00 ± 0.15 mm. P2 P0 F øD1 5N6 W T1 Direction of mark B A P1 Tape running direction Blank portions 300 mm or more Chip cavity Blank portions 230 mm or more Leader 270 mm or more End Top tape Empty Empty Tape running direction Beginning (2) Reel dimensions Dimensions in inches (mm) Marking place 0.079 (2.0 ± 0.5) 0.512 (13 ± 0.2) 2.362 (60 ± 1 ) 0 0.354 (9.0 ± 0.3) 0.449 (11.4 ± 1.0) ■ 7.087 (180 ± 0 ) 3 0.413 (R10.5 ± 0.4) (Marking item) (1) Type designation (2) Nominal inductance and tolerance (3) Quantity (4) Production lot number (5) Manufacturer's name PAGE 7 OF 8 814-362-5536 ■ Bolivar Drive ■ P.O. Box 547 Bradford, PA 16701 ■ USA ■ Fax 814-362-8883 ■ www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. TN-100 R3 9. Recommended Soldering Condition 9-1 Dimensions of Standard Land The following figure is recommended land dimensions. When two or more chip inductors are closely mounted, they must be separated by means of solder resists to prevent excessive solder. Dimensions in inches (mm) 0.197 (5.0) 0.087 (2.2) 0.079 (2.0) 0.055 (1.4) KL32 9-2 Soldering Condition Wave soldering should be done at 260°C for less than 10 seconds. Reflow soldering should be done at 240°C for less than 20 seconds. (Please see the following figures.) Recommended Temperature Profile for Wave Soldering Preheat 120 Seconds Max. 260°C Soldering 10 Seconds Max. Natural Cooling 240°C When using a soldering iron, temperature shall not exceed 350°C and within three seconds. Soldering iron time shall be allowed only one time. After soldering, chip inductors shall not be stressed excessively. Recommended Temperature Profile for Reflow Soldering Preheat 120 Seconds Max. Soldering 20 Seconds Max. Natural Cooling 150°C 100°C 150°C 100°C 10. Mounting Placement force should not be excessive. 11. Recommended Washing Condition Since this chip inductor is a coil of ultra-thin wire, it is susceptible to vibration. If an ultrasonic cleaning unit is used for cleaning, check for any possibility of problem generation before practical use since such cleaning units considerably differ in vibration level and mode. Although the conditions differ depending on the printed board size, ultrasonic cleaning is generally used in the conditions described below as examples: Ultrasonic power: Within 20W/1 Cleaning times: Within 5 minutes 12. Storage Chip inductors should not be stored under high temperature and high humidity conditions. In particular, do not store taping where it is exposed to heat or direct sunlight. Otherwise, the packing material may be deformed, causing problems during mounting. Bolivar Drive ■ PAGE 8 OF 8 www.koaspeer.com P.O. Box 547 ■ Bradford, PA 16701 ■ USA ■ 814-362-5536 ■ Fax 814-362-8883 ■ Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.