KL732BTTE5N6

KOA SPEER ELECTRONICS, INC. SS-211 R5 AHA 06/28/06 Thin Film Chip Inductors Type KL73 1206 1. Scope This specification applies to Thin Film Chip Inductors (KL73) 2B size produced by KOA Corporation. CERTIFIED CERTIFIED 2. Type Designation The type designation shall be the following form: New Type KL73 Type 2B Size 2B: 1206 T Termination Material T: Sn (Other termination styles available, contact factory for options) TE Packaging TE: 7" embossed plastic 4mm pitch (2B - 4,000 pieces/reel) 4N7 Nominal Inductance 4N7: 4.7nH 47N: 47nH B: C: G: J: G Tolerance ±0.1nH ±0.2nH ±2% ±5% 3. Rating Item Nominal Inductance Range (nH) Inductance Tolerance Quality Factor (typ.) Self Resonant Frequency (typ.) (MHz) DC Resistance (typ.) (Ω) Allowable Current (max.) (mA) Operating Temperature Range (°C) Storage Temperature Range (°C) Ratings 2.2 ~ 100 (E-12 series) ± 2%, ± 5% (± 0.2nH: Under 4.7nH) 15 ~ 40 400 ~ 9,000 0.25 ~ 2.00 250 ~ 1,000 -40°C ~ +85°C -40°C ~ +125°C PAGE 1 OF 7 Bolivar Drive I P.O. Box 547 I Bradford, PA 16701 I USA I 814-362-5536 I Fax 814-362-8883 I www.koaspeer.com Specifications given herein may be changed at any time without pr ior notice. Please confir m technical specifications before you order and/or use. KOA SPEER ELECTRONICS, INC. SS-211 R5 Rating Table Part Designation KL732BTTE2N2* KL732BTTE2N7* KL732BTTE3N3* KL732BTTE3N9* KL732BTTE4N7* KL732BTTE5N6* KL732BTTE6N8* KL732BTTE8N2* KL732BTTE10N* KL732BTTE12N* KL732BTTE15N* KL732BTTE18N* KL732BTTE22N* KL732BTTE27N* KL732BTTE33N* KL732BTTE39N* KL732BTTE47N* KL732BTTE56N* KL732BTTE68N* KL732BTTE82N* KL732BTTE100* Inductance (nH) 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 Inductance Tolerance Quality Factor Minimum Self Resonant Frequency Minimum (MHz) 9000 7000 6000 5000 4500 4000 3500 3000 2500 40 G: ±2% J: ±5% 25 2000 1.00 1500 500 DC Resistance Maximum (Ω) Allowable DC Current Maximum (mA) 1000 Measured Frequency (MHz) 25 C: ±0.2nH 0.25 900 900 0.50 800 500 35 1000 2.00 400 200 500 15 400 200 * Add tolerance character (B, C, G, J) 4. Dimensions and Construction c L c Marking Protective Coating Inner Electrode t d Coil Pattern Ceramic Substrate Electrode 5. Marking 5-1 Coating and Marking Color Coating color: Dark blue Direction mark color: Yellow 5-2 Marking Method Inductance value shall be indicated to two letters marking of significant figures. An alphabetical letter N shall replace position of decimal point. (Example of marking) 2.2 2.2nH 5.6 5.6nH 10 10nH 47 47nH Direction mark W Insulation Direction Mark Film Type (Inch Size Code) L Dimensions inches (mm) W c d .02±.008 (0.5±0.2) .016 +.008 -.004 (0.4 +0.2 ) -0.1 t .024±.004 (0.6±0.1) 2B (1206) .126±.008 .063±.008 (3.2±0.2) (1.6±0.2) 5N6 Decimal point PAGE 2 OF 7 Bolivar Drive I P.O. Box 547 I Bradford, PA 16701 I USA I 814-362-5536 I Fax 814-362-8883 I www.koaspeer.com Specifications given herein may be changed at any time without pr ior notice. Please confir m technical specifications before you order and/or use. KOA SPEER ELECTRONICS, INC. SS-211 R5 6. Characteristics 6-1 Test Condition Unless otherwise specified, the standard range of atmospheric conditions for marking measurements and tests is as follows: Ambient temperature: 20 ± 15°C Relative humidity: 65 ± 20% If there may be any doubt on results, measurements shall be made within the following limits: Ambient temperature: 20 ± 2°C Relative humidity: 65 ± 5% 6-2 Measurement Method of L and Q Test equipment: Fixture: Measuring frequency: Hewlett Packard RF Impedance analyzer 4191A Hewlett Packard Test fixture 16092A 500 MHz/1.0nH ~ 22nH (1.0nH ~ 15nH) 200 MHz/27nH ~ 100nH (18nH ~ 27nH) 1. Perform auto-calibration to the HP4191A .275" (7mm) unknown connector connected to 0Ω/0S/50Ω standard terminations. 2. Connected the test fixture 16092A. Measure the open circuit admittance (Go, Bo), and the short circuit impedance (Ro, Xo). Ro Xo Rx Gm + j Bm 4191A Caribration plane Go Bo Xx 16092A Spring clip fixture Coil Gm Ro Go Rx + jBm: + jXo: + jBo: + jXx: Measured admittance [S] Residual impedance [Ω] Stray admittance [S] Unknown impedance [Q] 3. Set pattern up and ground side to direction mark on insulator. Measure admittance (Gm, Bm). Chip inductor (Face up) Spring clip Insulator (Teflon) Dimensions of insulator (Teflon) in inches (mm) .118 (3.0) Grand plane Terminal Cross section of 16092A .039 (1.0) .106 (2.7) 4. The L and Q value shall be given the following equation. (Compensated calculation) Gm - Go - Ro (Gm - Go) 2+ (Bm - Bo)2 Bo - Bm Xx = - Xo (Gm - Go) 2- (Bm - Bo)2 Xx Q = Xx L= , 2πf Rx Rx = L: Inductance of coil Q: Quality factor of coil f: Measuring frequency PAGE 3 OF 7 I Bolivar Drive I P.O. Box 547 I Bradford, PA 16701 USA I 814-362-5536 I Fax 814-362-8883 I www.koaspeer.com Specifications given herein may be changed at any time without pr ior notice. Please confir m technical specifications before you order and/or use. KOA SPEER ELECTRONICS, INC. SS-211 R5 6-3 Characteristics Item Insulation resistance Requirement More than 104 MΩ Test Method DC 500V, 1 minute between both terminals and center of reverse side. V More than 103 MΩ DC 500V, 1 minute Between both terminals and center of protection coating. V Dielectric withstanding voltage Without distinct damage DC 500V, 1 minute Between both terminals and center of protection coating. V Terminal strength ∆ R/R: Within ± 1% ∆ L/L: Within ± 2% ∆ Q/Q: Within ± 20% No mechanical damage by cracks or stripping, etc. Soldered chip on wiring board A for test is to be bent down to .118" (3 mm) as below drawing. (Set condition) Dimensions in inches (mm) Wiring board A for test Chip coil Support (ø5) Solder 1.77 (45.0) Within ±2 1.77 (45.0) PAGE 4 OF 7 Bolivar Drive I P.O. Box 547 I Bradford, PA 16701 I USA I 814-362-5536 I Fax 814-362-8883 I www.koaspeer.com Specifications given herein may be changed at any time without pr ior notice. Please confir m technical specifications before you order and/or use. KOA SPEER ELECTRONICS, INC. SS-211 R5 6-3 Characteristics (continued) Item Requirement Test Method .786 (20) 1.97 (50) Weight R230 .118 (3.0) Ohmmeter Dimensions in inches (mm) Vibration ∆ L/L: Within ± 2% ∆ Q/Q: Within ± 20% Without distinct damage in appearance and construction ∆ L/L: Within ± 2% ∆ Q/Q: Within ± 20% Without distinct damage in appearance and construction 95% of the terminal should be covered with new solder ∆ L/L: Within ± 2% ∆ Q/Q: Within ± 20% Without distinct damage in appearance and construction ∆ L/L: Within ± 2% ∆ Q/Q: Within ± 20% Without distinct damage in appearance and construction ∆ L/L: Within ± 2% ∆ Q/Q: Within ± 20% Without distinct damage in appearance and construction ∆ L/L: Within ± 2% ∆ Q/Q: Within ± 20% Without distinct damage in appearance and construction Inflict 2 hours in each direction of X, Y, Z at vibration of 10 ~ 55Hz, amplitude .059 (1.5) 260 ± 5°C, 10 ± 1 second Resistance to solder heat Solderability Shock resistance 230 ± 5°C, 3 ± 0.5 second Inflict the impulse 3 times to both directions (total 18 times) along perpendicular axis that test condition 100G, 6 months -40°C ± 3°C, 1,000 ± 4 hours Low temperature operation Heat resisting property 125°C ± 2°C, 1,000 ± 4 hours Temperature cycling -40 ± 3°C, 30 minutes/125 ± 2°C, 30 minutes 100 cycles PAGE 5 OF 7 Bolivar Drive I P.O. Box 547 I Bradford, PA 16701 I USA I 814-362-5536 I Fax 814-362-8883 I www.koaspeer.com Specifications given herein may be changed at any time without pr ior notice. Please confir m technical specifications before you order and/or use. KOA SPEER ELECTRONICS, INC. SS-211 R5 6-3 Characteristics (continued) Item Humidity Requirement ∆ L/L: Within ± 2% ∆ Q/Q: Within ± 20% Without distinct damage in appearance and construction. Insulation resistance: more than 50MΩ ∆ L/L: Within ± 2% ∆ Q/Q: Within ± 20% Without distinct damage in appearance, construction and marking Test Method 40 ± 2°C, 90 ~ 95% RH 1,000 ± 4 hours Resistance to solvent Immerse 30 ± 5 seconds in the regent (20 ~ 25°C) of JIS K 8839 (1995) 7. Packaging 7-1 Taping The tapes for taping shall be embossed carrier tapes of .315" (8 mm) width and .157" (4 mm) pitches. The standard quantity per reel shall be 4,000 pieces. (1) Dimensions of carrier tape .010 (0.25 ± 0.1) .069 (1.75 ± 0.1) .059 (1.5 ± 0.1) .157 (4.0 ± 0.1) Dimensions in inches (mm) .079 (2.0 ± 0.1) .138 (3.5 ± 0.05) .315 (8.0 ± 0.2) Direction of mark 5N6 .094 (2.4 ± 0.2) .037 (0.95 ± 0.1) .057 (1.45 ± 0.15) .157 (4.0 ± 0.1) Tape running direction 11.80 (300 ± 20 ) 0 4,000 pieces 13.76 (350 ± 20 ) 0 5.90 (150 ± 20 ) 0 Top tape Empty Empty Tape running direction PAGE 6 OF 7 Bolivar Drive I P.O. Box 547 I Bradford, PA 16701 I USA I 814-362-5536 I Fax 814-362-8883 I www.koaspeer.com Specifications given herein may be changed at any time without pr ior notice. Please confir m technical specifications before you order and/or use. KOA SPEER ELECTRONICS, INC. SS-211 R5 (2) Reel dimensions Dimensions in inches (mm) Marking place .079 (2 ± 0.5) .511 (13 ± 0.5) 2.36 (60 ± 2.0) .393 (10 ± 1.5) .448 (11.4 ± 1.5) 7.00 (178 ± 2.0) (Marking item) (1) Type designation (2) Nominal inductance (3) Quantity (4) Production lot number (5) Manufacturer's name 8. Recommended Soldering Condition 8-1 Dimensions of Standard Land C A Solder resist Dimensions in inches (mm) Size 2B B Chip coil Land A .079 ~ .094 (2.0 ~ 2.4) B .047 ~ .063 (1.2 ~ 1.6) C .016 ~ .031 (0.4 ~ 0.8) 8-2 Soldering Condition Reflow soldering should be done at 240°C within 20 seconds. Flow soldering should be done at 260°C within 10 seconds. Please use suitable solder quantity, too much solder may affect performance of product. 9. Recommended Washing Condition Isopropyl alcohol and methyl alcohol used for the washing process will not affect the part performance. Ultrasonic cleaning should be changed to condition for size of printed wiring board and type of oscillator. Overpowering of ultrasonic cleaning will cause problems according to resonant phenomenon. Condition of ultrasonic cleaner should be confirmed prior to use. We recommend the following conditions: Ultrasonic power: Within 20W/1 Cleaning times: Within 5 minutes 10. Storage Chip inductors should not be stored under high temperature and high humidity conditions. In particular, do not store taping where it is exposed to heat or direct sunlight. Otherwise, the packing material may be deformed, causing problems during mounting. PAGE 7 OF 7 Bolivar Drive I Solder Solder P.O. Box 547 I Bradford, PA 16701 I USA I 814-362-5536 I Fax 814-362-8883 I www.koaspeer.com Specifications given herein may be changed at any time without pr ior notice. Please confir m technical specifications before you order and/or use.