XR73H1EUTWL49R9F

XR73B,XR73H,XR73Z resistors flat thick film resistors (for embedded substrates) EU features • Interlayer embedding in the multilayer substrate is applicable from the height of 0.13 to 0.14mm • Cu via hole connection is applicable by the Cu electrode dimensions and construction L c Type c L (Inch Size Code) W Cu Plating Ni Plating t Protective Coating d Dimensions inches (mm) W c d t 1H (0201) .024±.001 .012±.001 .009±.001 .009±.001 .005±.001 (0.6±0.03) (0.3±0.03) (0.23±0.03) (0.23±0.03) (0.13±0.02) 1E (0402) .039±.002 .020±.002 .011±.002 .011±.002 .006±.001 (1.0±0.05) (0.5±0.05) (0.28±0.05) (0.28±0.05) (0.14±0.03) Resistive Inner Film Electrode Ceramic Substrate New Part # New Part # XR73H 1E U TWL 1001 F Type Power Rating Termination Material Packaging Nominal Resistance Resistance Tolerance XR73B XR73H 1H, 1E: 0.063W U: CU TWL: 2mm pitch plastic embossed TWA: 1mm pitch plastic embossed (1H only) For further information on packaging, please refer to Appendix A ±1%: 3 significant figures + 1 multiplier “R” indicates decimal on value