KK33153

TECHNICAL DATA SINGLE IGBT GATE DRIVER KK33153 The KK33153 is specifically designed as an IGBT driver for high power applications that include ac induction motor control, brushless dc motor control and uninterruptable power supplies. Although designed for driving discrete and module IGBTs, this device offers a cost effective solution for driving power MOSFETs and Bipolar Transistors. Device protection features include the choice of desaturation or overcurrent sensing and undervoltage detection. These devices are available in dual-inline and surface mount packages and include the following features: FEATURES • High Current Output Stage: 1.0 A Source/2.0 A Sink • Protection Circuits for Both Conventional and Sense IGBTs • Programmable Fault Blanking Time • Protection against Overcurrent and Short Circuit • Undervoltage Lockout Optimized for IGBT's • Negative Gate Drive Capability • Cost Effectively Drives Power MOSFETs and Bipolar Transistors BLOCK SCHEME 1 KK33153 ABSOLUTE MAXIMUM RATINGS Rating Power Supply Voltage VCC to VEE Kelvin Ground to VEE (Note 1 ) Logic Input Current Sense Input Blanking/Desaturation Input Gate Drive Output Source Current Sink Current Diode Clamp Current Fault Output Source Current Sink Curent Power Dissipation and Thermal Characteristics D Suffix SO-8 Package, Case 751 Maximum Power Dissipation @ TA = 5O°C Thermal Resistance, Junction-to-Air P Suffix DIP-8 Package, Case 626 Maximum Power Dissipation @ TA = 5O°C Thermal Resistance, Junction-to-Air Operating Junction Temperature Operating Ambient Temperature Storage Temperature Range Symbol VCC-VEE KGnd - VEE Value Unit V Vin VS VBD IO IFO 20 20 VEE-O,3 to VCC V -0.3 to Vcc V -0.3 to Vcc V A 1.0 2.0 1.0 mA 25 10 PD RθJA PD RθJA TJ TA Tstg 0.56 180 1.0 100 +150 -40 to +105 -65 to +150 W °C/W W °C/W °C °C °C 2 KK33153 ELECTRICAL CHARACTERISTICS (Vcc=15V, VEE=0V, Kelvin Gnd connected to VEE. For typical values TA=25°C, for min/max values TA is the operating ambient temperature range that applies (Note 2), unless otherwise noted.) Characteristic Input Threshold Voltage ] High State (Logic 1 ) Low State (Logic 0) Input Current High State (VIH = 3.0 V) Low State (Vii. = 1.2 V) Output Voltage Low State (Isink = 1.0 A) High State (Isource = 500 mA) Output Pull-Down Resistor Output voltage Low Slate (Isink = 5.0 mA) High State (Isource = 20 mA) Symbol LOGIC INPUT VIH VIL Min Typ Max V Unit 1.2 - 2.70 2.30 130 50 3.2 µA 500 100 V IIH IIL DRIVE OUTPUT VOL VOH RPD 12 - 2.0 13.9 100 2.5 200 kΩ V FAULT OUTPUT VFL VFH 12 0.2 13.3 1.0 ns SWITCHING CHARACTERISTICS Propagation Delay (50% Input to 50% Output CL = 1.0 nF) Logic Input to Drive Output Rise tPLH(in/out) tPHL Logic Input to Drive Output Fall (in/out) Drive Output Rise Time (10% to 90%) CL = 1.0 nF tr Drive Output Fall Time (90% to 10%) CL= 1.0 nF tf Propagation Delay tp(OC) Current Sense Input to Drive Output Fault Blanking/Desaturation Input to Drive Output tp(FLT) UVLO Startup Voltage VSS Start 11.3 Disable Voltage VSS dis 10.4 COMPARATORS Overcurrent Threshold Voltage (Vpin8 > 7,0 V) VSOC 50 Short Circuit Threshold Voltage (Vpine8> 7,0 V) VSSC 100 Fault Blanking/Desaturation Threshold (Vpin1 > 100 mV) Vth(FLT) 6.0 Current Sense Input Current (Vsi = 0 V) ISI FAULT BLANKING/DESATURATION INPUT Current Source (Vpjn8 = 0 V, Vpin4 = 0 V) Ichg -200 Discharge Current (Vpin8 = 15 V, Vpin4 = 5.0 V) Idschg 1.0 TOTAL DEVICE ICC Power Supply Current Standby (Vpin 4 = VCC, Output Open) Operating (CL= 1.0 nF, f= 20 kHz) 80 120 17 17 0.3 0.3 12 11 65 130 6.5 -1.4 -270 2.5 300 300 55 55 1.0 1.0 12.6 11.7 80 160 7.0 -10 -300 - ns ns µs V V mV mV V mA mA mA mA 7.2 7.9 14 20 NOTES: 1. Kelvin Ground must always be between VEE and VCC. 2.Low duty cycle pulse techniques are used during test to maintain the junction temperature as close to ambient as possible. Tlow = -40°C lor KK33153 Thigh = +105°Clor KK33153 3 KK33153 N S UFFIX PLAS TIC DIP (MS – 0 0 1BA) A 8 5 B 1 4 Dimens ion, mm Symbol A B MIN 8.51 6.1 MAX 10.16 7.11 5.33 0.36 1.14 2.54 7.62 0° 2.92 7.62 0.2 0.38 10° 3.81 8.26 0.36 0.56 1.78 F L C D C -T- SEATING PL AN E F G M H J N G D 0.25 (0.010) M T K H J K L M N NOTES : 1. Dimen s io n s “A ”, “B” d o n o t in clu d e mo ld flas h o r p ro tru s io n s . Maximu m mo ld flas h o r p ro tru s io n s 0.25 mm (0.010) p er s id e. 4