KK4516B

TECHNICAL DATA KK4516B Presettable Up/Down Counter High-Voltage Silicon-Gate CMOS The KK4516B Presettable Binary Up/Down Counter consists of four synchronously clocked D-type flip-flops (with a gating structure to provide T-type flip-flop capability) connected as counters. This counter can be cleared by a high level on the RESET line, and can be preset to any binary number present on the jam inputs by a high level on the PRESET ENABLE line. If the CARRY-IN input is held low, the counter advances up or down on each positive-going clock transition. Synchronous cascading is accomplished by connecting all clock inputs in parallel and connecting the CARRY-OUT of a less significant stage to the CARRY-IN of a more significant stage. The KK4516B can be cascaded in the ripple mode by connecting the CARRY-OUT to the clock of the next stage. If the UP/DOWN input changes during a terminal count, the CARRY-OUT must be gated with the clock, and the UP/DOWN input must change while the clock is high. This method provides a clean clock signal to the subsequent counting stage. • Operating Voltage Range: 3.0 to 18 V • Maximum input current of 1 µA at 18 V over full packagetemperature range; 100 nA at 18 V and 25°C • Noise margin (over full package temperature range): 1.0 V min @ 5.0 V supply 2.0 V min @ 10.0 V supply 2.5 V min @ 15.0 V supply ORDERING INFORMATION KK4516BN Plastic KK 4516BD SOIC TA = -55° to 125° C for all packages PIN ASSIGNMENT LOGIC DIAGRAM FUNCTION TABLE Inputs CL CI X H L L X X PIN 16=VCC PIN 8= GND X X U/D X H L X X PE R L L L H X L L L L H Outputs Mode NO COUNT COUNT UP COUNT DOWN PRESET RESET X = don’t care 1 KK4516B MAXIMUM RATINGS* Symbol VCC VIN VOUT IIN PD PD Tstg TL * Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) DC Output Voltage (Referenced to GND) DC Input Current, per Pin Power Dissipation in Still Air, Plastic DIP+ SOIC Package+ Power Dissipation per Output Transistor Storage Temperature Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP or SOIC Package) Value -0.5 to +20 -0.5 to VCC +0.5 -0.5 to VCC +0.5 ±10 750 500 100 -65 to +150 260 Unit V V V mA mW mW °C °C Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. +Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C SOIC Package: : - 7 mW/°C from 65° to 125°C RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN, VOUT TA Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) Operating Temperature, All Package Types Min 3.0 0 -55 Max 18 VCC +125 Unit V V °C This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND≤(VIN or VOUT)≤VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. 2 KK4516B DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) VCC Symbol VIH Parameter Minimum High-Level Input Voltage Maximum Low Level Input Voltage Minimum High-Level Output Voltage Maximum Low-Level Output Voltage Maximum Input Leakage Current Maximum Quiescent Supply Current (per Package) Minimum Output Low (Sink) Current Test Conditions VOUT= 0.5 V or VCC - 0.5V VOUT= 1.0 V or VCC - 1.0 V VOUT= 1.5 V or VCC - 1.5V VOUT= 0.5 V or VCC - 0.5V VOUT= 1.0 V or VCC - 1.0 V VOUT= 1.5 V or VCC - 1.5V VIN=GND or VCC V 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 18 5.0 10 15 20 5.0 10 15 5.0 5.0 10 15 Guaranteed Limit ≥-55°C 3.5 7 11 1.5 3 4 4.95 9.95 14.95 0.05 0.05 0.05 ±0.1 5 10 20 100 0.64 1.6 4.2 -2 -0.64 -1.6 -4.2 2 5 °C 3.5 7 11 1.5 3 4 4.95 9.95 14.95 0.05 0.05 0.05 ±0.1 5 10 20 100 0.51 1.3 3.4 -1.6 -0.51 -1.3 -3.4 ≤125 °C 3.5 7 11 1.5 3 4 4.95 9.95 14.95 0.05 0.05 0.05 ±1.0 150 300 600 3000 0.36 0.9 2.4 mA -1.15 -0.36 -0.9 -2.4 Unit V VIL V VOH V VOL VIN=GND or VCC V IIN ICC VIN= GND or VCC VIN= GND or VCC µA µA IOL VIN= GND or VCC UOL=0.4 V UOL=0.5 V UOL=1.5 V mA IOH Minimum Output VIN= GND or VCC High (Source) Current UOH=2.5 V UOH=4.6 V UOH=9.5 V UOH=13.5 V 3 KK4516B AC ELECTRICAL CHARACTERISTICS (CL=50pF, RL=200kΩ, Input tr=tf=20 ns) VCC Symbol tPHL, tPLH Parameter Maximum Propagation Delay, Clock to Q (Figure 1) Maximum Propagation Delay, Preset or Reset to Q (Figure 1) Maximum Propagation Delay, Clock to Carry Out (Figure 1) Maximum Propagation Delay, Carry In to Carry Out (Figure 1) Maximum Propagation Delay, Preset or Reset to Carry Out (Figure 1) Maximum Output Transition Time, Any Output (Figure 1) Maximum Input Capacitance V 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 400 200 150 420 210 160 480 240 180 250 120 100 640 320 250 200 100 80 Guaranteed Limit ≥-55°C 2 5 °C 400 200 150 420 210 160 480 240 180 250 120 100 640 320 250 200 100 80 7.5 ≤125°C 800 400 300 840 420 320 960 480 360 500 240 200 1280 640 500 400 200 160 Unit ns tPHL, tPLH ns tPHL, tPLH ns tPHL, tPLH ns tPHL, tPLH ns tTHL, tTLH ns CIN pF TIMING REQUIREMENTS(CL=50pF, RL=200 kΩ, Input tr=tf=20 ns) VCC Symbol tsu Parameter Minimum Setup Time, P to Preset Enable (Figure 1) Minimum Setup Time, Up/Down to Clock (Figure 1) Minimum Setup Time, Carry In to Clock (Figure 1) Minimum Hold Time, Clock to Carry In (Figure 1) Minimum Hold Time, Clock to Up/Down (Figure 1) Minimum Hold Time, Preset enable to P (Figure 1) V 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 60 30 30 30 30 30 70 40 40 60 30 30 30 30 30 70 40 40 120 60 60 60 60 60 140 80 80 25 10 10 Guaranteed Limit ≥-55°C 2 5 °C 25 10 10 ≤125°C 50 20 20 Unit ns tsu ns tsu ns th ns th ns th ns 4 KK4516B Figure 1. Switching Waveforms TIMING DIAGRAM 5 KK4516B EXPANDED LOGIC DIAGRAM 6 KK4516B N S UFFIX PLAS TIC DIP (MS - 0 0 1 BB) A Dimens ion, mm 16 9 B Symbol A MIN 18.67 6.1 MAX 19.69 7.11 5.33 1 8 B C F L D F 0.36 1.14 2.54 7.62 0° 2.92 7.62 0.2 0.38 0.56 1.78 C -T- SEATING PLAN E G H H J N G D 0.25 (0.010) M T K M J K L M N 10° 3.81 8.26 0.36 NOTES : 1. Dimen s io n s “A ”, “B” d o n o t in clu d e mo ld flas h o r p ro tru s io n s . Maximu m mo ld flas h o r p ro tru s io n s 0.25 mm (0.010) p er s id e. D S UFFIX S OIC (MS - 0 1 2 AC) Dimens ion, mm A 16 9 Symbol A MIN 9.8 3.8 1.35 0.33 0.4 1.27 5.72 0° 0.1 0.19 5.8 0.25 MAX 10 4 1.75 0.51 1.27 H B P B C 1 G 8 C R x 45 D F G -TD 0.25 (0.010) M T C M K SEAT ING PLAN E J F M H J K M P R 8° 0.25 0.25 6.2 0.5 NOTES : 1. Dimen s io ns A an d B d o n o t in clud e mo ld flas h o r p rotru s ion . 2. M aximu m mo ld flas h o r p ro tru s io n 0.15 mm (0.006) p er s id e fo r A ; fo r B ‑ 0.25 mm (0.010) p er s id e. 7