KK7407D

TECHNICAL DATA KK7407 Hex Buffers/Drivers with OpenCollector High-Voltage Outputs LOGIC DIAGRAM ORDERING INFORMATION KK7407N Plastic KK7407D SOIC TA = -10° to 70° C for all packages PIN ASSIGNMENT FUNCTION TABLE Inputs PIN 14 =VCC PIN 7 = GND A H L Z = High Impedance Output Y Z H 1 KK7407 MAXIMUM RATINGS* Symbol VCC VIN VOUT Tstg * Parameter Supply Voltage Input Voltage Output Voltage Storage Temperature Range Value 7.0 5.5 30 -65 to +150 Unit V V V °C Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. RECOMMENDED OPERATING CONDITIONS Symbol VCC VIH VIL UOH IOL TA Supply Voltage High Level Input Voltage Low Level Input Voltage High Level Output Voltage Low Level Output Current Ambient Temperature Range -10 Parameter Min 4.75 2.0 0.8 30 40 +70 Max 5.25 Unit V V V V mA °C DC ELECTRICAL CHARACTERISTICS over full operating conditions Guaranteed Limit Symbol VIK IOH VOL IIH IIL ICC Parameter Input Clamp Voltage High Level Output Current Low Level Output Voltage High Level Input Current Low Level Input Current Supply Current Test Conditions VCC = min, IIN = -12 mA VCC = min, VOH =max VCC = min, IOL = 16 mA VCC = min, IOL = 40 mA VCC = max, VIN = 2.4 V VCC = max, VIN =5.5 V VCC = max, VIN = 0.4 V VCC = max Outputs High Outputs Low Min Max -1.5 0.25 0.4 0.7 0.04 1.0 -1.6 41 30 µA mA mA mA Unit V mA V 2 KK7407 AC ELECTRICAL CHARACTERISTICS (T = 25°C, VCC = 5.0 V, CL = 15 pF, RL = 110 Ω, Input tr = tf = 10 ns) Symbol tPLH tPHL Parameter Propagation Delay Time, Low to High Level Output (from Input to Output) Propagation Delay Time, High to Low Level Output (from Input to Output) Min Max 10 35 Unit ns ns Figure 1. Switching Waveforms * Includes all probe and jig capacitance Figure 2. Test Circuit 3 KK7407 N S UFFIX PLAS TIC DIP (MS - 0 0 1 AA) A 14 8 B 1 7 Dimens ion, mm Symbol A B C MIN 18.67 6.1 MAX 19.69 7.11 5.33 0.36 1.14 2.54 7.62 0° 2.92 7.62 0.2 0.38 10° 3.81 8.26 0.36 0.56 1.78 F L D F C -T- SEATING N G D 0.25 (0.010) M T K PLAN E G H H J M J K L M N NOTES : 1. Dimen s io n s “A ”, “B” d o n o t in clu d e mo ld flas h o r p ro tru s io n s . Maximu m mo ld flas h o r p ro tru s io n s 0.25 mm (0.010) p er s id e. D S UFFIX S OIC (MS - 0 1 2 AB) Dimens ion, mm 8 A 14 Symbol A MIN 8.55 3.8 1.35 0.33 0.4 1.27 5.27 0° 0.1 0.19 5.8 0.25 MAX 8.75 4 1.75 0.51 1.27 H B P B C 1 G 7 C R x 45 D F G -TD 0.25 (0.010) M T C M K SEATING PLAN E H J F M J K M P R 8° 0.25 0.25 6.2 0.5 NOTES : 1. Dimen s io ns A an d B d o n o t in clud e mo ld flas h o r p rotru s ion . 2. M aximu m mo ld flas h o r p ro tru s io n 0.15 mm (0.006) p er s id e fo r A ; fo r B ‑ 0.25 mm (0.010) p er s id e. 4