TECHNICAL DATA
KK7472
AND-Gated J-K Master-Slave FlipFlops with Reset and Clear
LOGIC DIAGRAM
ORDERING INFORMATION KK7472N Plastic KK7472D SOIC TA = -10° to 70° C for all packages
PIN ASSIGNMENT
PIN 14 =VCC PIN 7 = GND NC - No internal connection
FUNCTION TABLE
Inputs Reset L H L H H H H Clear H L L H H H H Clock X X X J X X X L H L H K X X X L L H H Output Q H L H
*
Q L H H* Q0 L H
Q0 H L
TOGGLE
X =don’t care Q0 = the level of Q before the indicated input conditions were established. TOGGLE: Each output changes to the complement of its previous level on each active transition (pulse) of the clock. * This configuration is nonstable; that is, it will not persist whenpreset and clear inputs return to their inactive (high) level.
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KK7472
MAXIMUM RATINGS*
Symbol VCC VIN IOL Tstg
*
Parameter Supply Voltage Input Voltage Low Level Output Current Storage Temperature Range
Value 7.0 5.5 16 -65 to +150
Unit V V mA °C
Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions.
RECOMMENDED OPERATING CONDITIONS
Symbol VCC VIH VIL IOH IOL tw tsu th fmax TA Supply Voltage High Level Input Voltage Low Level Input Voltage High Level Output Current Low Level Output Current Clock high Pulse Width Input Setup Time InputHold Time Maximum Clock Frequency Ambient Temperature Range -10 Clock low Reset or Clear low 20 47 25 0↑ 0↓ 15 +70 ns ns MHz °C ns Parameter Min 4.75 2.0 0.8 -400 16 Max 5.25 Unit V V V µA mA
↑↓ The arrow indicates the edge of the clock pulse used for reference: ↑ for the rising edge, ↓ for the falling edge.
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KK7472
DC ELECTRICAL CHARACTERISTICS over full operating conditions
Symbol VIK VOH VOL II Parameter Input Clamp Voltage High Level Output Voltage Low Level Output Voltage Input Current at Maximum Input Voltage D, J, K IIH High Level Input Current Clear Reset Clock D, J, K IIL Low Level Input Current IOS* ICC Clear Reset Clock Short-Circuit Output Current Supply Current VCC = max VCC = max, See Note 1 -18 VCC = max, VIN = 0.4 V VCC = max, VIN = 2.4 V Test Conditions VCC = min, IIN = -10 mA VCC = min, IOH =max VCC = min, IOL =max VCC = max, VIN= 5.5 V 2.4 0.4 1 40 80 80 80 -1.6 -3.2 -3.2 -3.2 -55 20 mA mA mA µA Guaranteed Limit Min Max -1.5 V V V mA Unit
*Not more than one output should be shorted at a time, and duration of the short-circuit should not exceed one second. Note 1: With outputs open, ICC is measured with the Q and Q outputs high in turn. At the time of measurement, the clock input is grounded.
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KK7472
AC ELECTRICAL CHARACTERISTICS (T = 25°C, VCC = 5.0 V, CL = 15 pF,
RL = 390 Ω, Input tr = tf = 10 ns) Symbol tPLH tPHL tPLH tPHL tPLH tPHL Parameter Propagation Delay Time, Low to High Level Output (from Reset to Q) Propagation Delay Time, High to Low Level Output (from Reset to Q) Propagation Delay Time, Low to High Level Output (from Clear to Q) Propagation Delay Time, High to Low Level Output (from Clear to Q) Propagation Delay Time, Low to High Level Output (from Clock to Q or Q) Propagation Delay Time, High to Low Level Output (from Clock to Q or Q) Min Max 25 40 25 40 25 40 Unit ns ns ns ns ns ns
Figure 1. Switching Waveforms
Figure 2. Switching Waveforms
NOTES A. CL includes probe and jig capacitance. B. All diodes are 1N916 or 1N3064. Figure 3. Test Circuit
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KK7472
N S UFFIX PLAS TIC DIP (MS - 0 0 1 AA)
A 14 8 B 1 7
Dimens ion, mm Symbol A B C MIN 18.67 6.1 MAX 19.69 7.11 5.33 0.36 1.14 2.54 7.62 0° 2.92 7.62 0.2 0.38 10° 3.81 8.26 0.36 0.56 1.78
F
L
D F
C -T- SEATING N G D 0.25 (0.010) M T K
PLAN E
G H
H J
M
J K L M N
NOTES : 1. Dimen s io n s “A ”, “B” d o n o t in clu d e mo ld flas h o r p ro tru s io n s . Maximu m mo ld flas h o r p ro tru s io n s 0.25 mm (0.010) p er s id e.
D S UFFIX S OIC (MS - 0 1 2 AB) Dimens ion, mm
8
A 14
Symbol A
MIN 8.55 3.8 1.35 0.33 0.4 1.27 5.27 0° 0.1 0.19 5.8 0.25
MAX 8.75 4 1.75 0.51 1.27
H
B
P
B C
1
G
7 C R x 45
D F G
-TD 0.25 (0.010) M T C M K
SEATING PLAN E
H
J F M
J K M P R
8° 0.25 0.25 6.2 0.5
NOTES : 1. Dimen s io ns A an d B d o n o t in clud e mo ld flas h o r p rotru s ion . 2. M aximu m mo ld flas h o r p ro tru s io n 0.15 mm (0.006) p er s id e fo r A ; fo r B ‑ 0.25 mm (0.010) p er s id e.
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