KK74AC574N

TECHNICAL DATA Octal 3-State Noninverting D Flip-Flop High-Performance Silicon-Gate CMOS The KK74AC574 is identical in pinout to the LS/ALS574, HC/HCT574. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LS/ALS outputs. Data meeting the setup time is clocked to the outputs with the rising edge of the Clock. The Output Enable input does not affect the states of the flip-flops, but when Output Enable is high, all device outputs are forced to the high-impedance state; thus, data may be stored even when the outputs are not enabled. • Outputs Directly Interface to CMOS, NMOS, and TTL • Operating Voltage Range: 2.0 to 6.0 V • Low Input Current: 1.0 µA; 0.1 µA @ 25°C • High Noise Immunity Characteristic of CMOS Devices • Outputs Source/Sink 24 mA KK74AC574 ORDERING INFORMATION KK74AC574N Plastic KK74AC574DW SOIC TA = -40° to 85° C for all packages PIN ASSIGNMENT LOGIC DIAGRAM FUNCTION TABLE PIN 20=VCC PIN 10 = GND Inputs Output Enable L L L H L,H, X Clock D H L X X Output Q H L no change Z X = don’t care Z = high impedance 1 KK74AC574 MAXIMUM RATINGS* Symbol VCC VIN VOUT IIN IOUT ICC PD Tstg TL * Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) DC Output Voltage (Referenced to GND) DC Input Current, per Pin DC Output Sink/Source Current, per Pin DC Supply Current, VCC and GND Pins Power Dissipation in Still Air, Plastic DIP+ SOIC Package+ Storage Temperature Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP or SOIC Package) Value -0.5 to +7.0 -0.5 to VCC +0.5 -0.5 to VCC +0.5 ±20 ±50 ±50 750 500 -65 to +150 260 Unit V V V mA mA mA mW °C °C Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. +Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C SOIC Package: : - 7 mW/°C from 65° to 125°C RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN, VOUT TJ TA IOH IOL tr, tf Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) Junction Temperature (PDIP) Operating Temperature, All Package Types Output Current - High Output Current - Low Input Rise and Fall Time (except Schmitt Inputs) * Min 2.0 0 -40 Max 6.0 VCC 140 +85 -24 24 Unit V V °C °C mA mA ns/V VCC =3.0 V VCC =4.5 V VCC =5.5 V 0 0 0 150 40 25 * VIN from 30% to 70% VCC This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND≤(VIN or VOUT)≤VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. 2 KK74AC574 DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) VCC Symbol VIH Parameter Minimum HighLevel Input Voltage Maximum Low Level Input Voltage Minimum HighLevel Output Voltage Test Conditions VOUT=0.1 V or VCC-0.1 V V 3.0 4.5 5.5 3.0 4.5 5.5 3.0 4.5 5.5 3.0 4.5 5.5 3.0 4.5 5.5 3.0 4.5 5.5 5.5 5.5 Guaranteed Limits 2 5 °C 2.1 3.15 3.85 0.9 1.35 1.65 2.9 4.4 5.4 2.56 3.86 4.86 0.1 0.1 0.1 0.36 0.36 0.36 ±0.1 ±0.5 -40°C to 8 5 °C 2.1 3.15 3.85 0.9 1.35 1.65 2.9 4.4 5.4 2.46 3.76 4.76 0.1 0.1 0.1 0.44 0.44 0.44 ±1.0 ±5.0 µA µA V Unit V VIL VOUT=0.1 V or VCC-0.1 V V VOH IOUT ≤ -50 µA V VIN=VIH or VIL IOH=-12 mA IOH=-24 mA IOH=-24 mA VOL Maximum LowLevel Output Voltage IOUT ≤ 50 µA * * VIN= VIH or VIL IOL=12 mA IOL=24 mA IOL=24 mA VIN=VCC or GND IIN IOZ Maximum Input Leakage Current Maximum ThreeState Leakage Current +Minimum Dynamic Output Current +Minimum Dynamic Output Current Maximum Quiescent Supply Current (per Package) VIN (OE)= VIH or VIL VIN =VCC or GND VOUT =VCC or GND VOLD=1.65 V Max VOHD=3.85 V Min VIN=VCC or GND IOLD IOHD ICC 5.5 5.5 5.5 8.0 75 -75 80 mA mA µA * All outputs loaded; thresholds on input associated with output under test. +Maximum test duration 2.0 ms, one output loaded at a time. Note: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC 3 KK74AC574 AC ELECTRICAL CHARACTERISTICS (CL=50pF, Input tr=tf=3.0 ns) VCC* Symbol Parameter V Guaranteed Limits 2 5 °C Min fmax tPLH tPHL tPZH tPZL tPHZ tPLZ CIN Maximum Clock Frequency (50% Duty Cycle) (Figure 1) Propagation Delay, Clock to Q (Figure 1) Propagation Delay, Clock to Q (Figure 1) Propagation Delay, Output Enable to Q (Figure 2) Propagation Delay, Output Enable to Q (Figure 2) Propagation Delay, Output Enable to Q (Figure 2) Propagation Delay, Output Enable to Q (Figure 2) Maximum Input Capacitance 3.3 5.0 3.3 5.0 3.3 5.0 3.3 5.0 3.3 5.0 3.3 5.0 3.3 5.0 5.0 75 95 3.5 2.0 3.5 2.0 2.5 2.0 3.0 1.5 4.0 2.0 2.0 1.5 5.0 13.5 9.5 12 8.5 11 8.5 10.5 8.0 12 9.5 9.0 7.5 Max -40°C to 8 5 °C Min 60 85 3.5 2.0 3.5 2.0 2.5 2.0 3.5 2.0 4.5 2.0 2.5 1.5 5.0 15 11 13.5 9.5 12 9.0 11.5 9.0 13 10.5 10 8.5 Max MHz ns ns ns ns ns ns pF Unit Typical @25°C,VCC=5.0 V CPD * Power Dissipation Capacitance 25 pF Voltage Range 3.3 V is 3.3 V ±0.3 V Voltage Range 5.0 V is 5.0 V ±0.5 V TIMING REQUIREMENTS (CL=50pF, Input tr=tf=3.0 ns) VCC* Symbol tSU th tw * Guaranteed Limit 2 5 °C 2.5 1.5 1.5 1.5 6.0 4.0 -40°C to 85°C 3.0 2.0 1.5 1.5 7.0 5.0 Unit ns ns ns Parameter Minimum Setup Time, Data to Clock (Figure 3) Minimum Hold Time, Clock to Data (Figure 3) Minimum Pulse Width, Clcok (Figure 1) V 3.3 5.0 3.3 5.0 3.3 5.0 Voltage Range 3.3 V is 3.3 V ±0.3 V Voltage Range 5.0 V is 5.0 V ±0.5 V 4 KK74AC574 Figure 1. Switching Waveforms Figure 2. Switching Waveforms Figure 3. Switching Waveforms EXPANDED LOGIC DIAGRAM 5 KK74AC574 N S UFFIX PLAS TIC DIP (MS - 0 0 1 AD) A Dimens ion, mm 20 11 B 1 10 Symbol A B C MIN 24.89 6.1 MAX 26.92 7.11 5.33 F L D F 0.36 1.14 2.54 7.62 0° 2.92 7.62 0.2 0.38 0.56 1.78 C -T- SEATING PLAN E G H H J N G D 0.25 (0.010) M T K M J K L M N 10° 3.81 8.26 0.36 NOTES : 1. Dimen s io n s “A ”, “B” d o n o t in clu d e mo ld flas h o r p ro tru s io n s . Maximu m mo ld flas h o r p ro tru s io n s 0.25 mm (0.010) p er s id e. D S UFFIX S OIC (MS - 0 1 3 AC) A 20 11 Dimens ion, mm Symbol MIN 12.6 7.4 2.35 0.33 0.4 1.27 9.53 0° 0.1 0.23 10 0.25 8° 0.3 0.32 10.65 0.75 MAX 13 7.6 2.65 0.51 1.27 H B P A B 1 G 10 C R x 45 C D F -TD 0.25 (0.010) M T C M K SE AT IN G PL AN E J F M G H J K M P R NOTES : 1. Dimen s io ns A an d B d o n o t in clud e mo ld flas h o r p ro tru s ion . 2. M aximu m mo ld flas h o r p ro tru s io n 0.15 mm (0.006) p er s id e fo r A ; fo r B ‑ 0.25 mm (0.010) p er s id e. 6