KK74ACT34D

TECHNICAL DATA KK74ACT34 Hex Noninverter Buffer High-Speed Silicon-Gate CMOS The KK74ACT34 is identical in pinout to the LS/ALS34, HC/HCT34. The KK74ACT34 may be used as a level converter for interfacing TTL or NMOS outputs to High Speed CMOS inputs. • • • • • TTL/NMOS Compatible Input Levels Outputs Directly Interface to CMOS, NMOS, and TTL Operating Voltage Range: 4.5 to 5.5 V Low Input Current: 1.0 µA; 0.1 µA @ 25°C Outputs Source/Sink 24 mA ORDERING INFORMATION KK74ACT34N Plastic KK74ACT34D SOIC TA = -40° to 85° C for all packages LOGIC DIAGRAM PIN ASSIGNMENT FUNCTION TABLE Inputs PIN 14 =VCC PIN 7 = GND A L H Output Y L H 1 KK74ACT34 MAXIMUM RATINGS* Symbol VCC VIN VOUT IIN IOUT ICC PD Tstg TL * Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) DC Output Voltage (Referenced to GND) DC Input Current, per Pin DC Output Sink/Source Current, per Pin DC Supply Current, VCC and GND Pins Power Dissipation in Still Air, Plastic DIP+ SOIC Package+ Storage Temperature Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP or SOIC Package) Value -0.5 to +7.0 -0.5 to VCC +0.5 -0.5 to VCC +0.5 ±20 ±50 ±50 750 500 -65 to +150 260 Unit V V V mA mA mA mW °C °C Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. +Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C SOIC Package: : - 7 mW/°C from 65° to 125°C RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN, VOUT TJ TA IOH IOL tr, tf * Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) Junction Temperature (PDIP) Operating Temperature, All Package Types Output Current - High Output Current - Low Input Rise and Fall Time (except Schmitt Inputs) * Min 4.5 0 -40 Max 5.5 VCC 140 +85 -24 24 Unit V V °C °C mA mA ns/V VCC =4.5 V VCC =5.5 V 0 0 10 8.0 VIN from 0.8 V to 2.0 V This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND≤(VIN or VOUT)≤VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. 2 KK74ACT34 DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) VCC Symbol VIH VIL VOH Parameter Minimum HighLevel Input Voltage Maximum Low Level Input Voltage Minimum HighLevel Output Voltage Test Conditions VOUT=VCC - 0.1 V VOUT=0.1 V IOUT ≤ -50 µA VIN=VIH IOH=-24 mA IOH=-24 mA VOL Maximum LowLevel Output Voltage IOUT ≤ 50 µA * * Guaranteed Limits 2 5 °C 2.0 2.0 0.8 0.8 4.4 5.4 3.86 4.86 0.1 0.1 0.36 0.36 ±0.1 -40°C to 8 5 °C 2.0 2.0 0.8 0.8 4.4 5.4 3.76 4.76 0.1 0.1 0.44 0.44 ±1.0 1.5 75 -75 4.0 40 µA mA mA mA µA V Unit V V V V 4.5 5.5 4.5 5.5 4.5 5.5 4.5 5.5 4.5 5.5 4.5 5.5 5.5 5.5 5.5 5.5 5.5 VIN=VIL IOL=24 mA IOL=24 mA VIN=VCC or GND VIN=VCC - 2.1 V VOLD=1.65 V Max VOHD=3.85 V Min VIN=VCC or GND IIN ∆ICCT IOLD IOHD ICC Maximum Input Leakage Current Additional Max ICC/Input +Minimum Dynamic Output Current +Minimum Dynamic Output Current Maximum Quiescent Supply Current (per Package) * All outputs loaded; thresholds on input associated with output under test. +Maximum test duration 2.0 ms, one output loaded at a time. 3 KK74ACT34 AC ELECTRICAL CHARACTERISTICS (VCC=5.0 V ± 10%, CL=50pF,Input tr=tf=3.0 ns) Guaranteed Limits Symbol Parameter 2 5 °C Min tPLH tPHL CIN Propagation Delay, Input A to Output Y (Figure 1) Propagation Delay, Input A to Output Y (Figure 1) Maximum Input Capacitance 1.5 1.5 4.5 Max 8.5 9.5 -40°C to 8 5 °C Min 1.0 1.0 4.5 Max 9.0 10.0 ns ns pF Unit Typical @25°C,VCC=5.0 V CPD Power Dissipation Capacitance 35 pF Figure 1. Switching Waveforms 4 KK74ACT34 N S UFFIX PLAS TIC DIP (MS - 0 0 1 AA) A 14 8 B 1 7 Dimens ion, mm Symbol A B C MIN 18.67 6.1 MAX 19.69 7.11 5.33 0.36 1.14 2.54 7.62 0° 2.92 7.62 0.2 0.38 10° 3.81 8.26 0.36 0.56 1.78 F L D F C -T- SEATING N G D 0.25 (0.010) M T K PLAN E G H H J M J K L M N NOTES : 1. Dimen s io n s “A ”, “B” d o n o t in clu d e mo ld flas h o r p ro tru s io n s . Maximu m mo ld flas h o r p ro tru s io n s 0.25 mm (0.010) p er s id e. D S UFFIX S OIC (MS - 0 1 2 AB) Dimens ion, mm 8 A 14 Symbol A MIN 8.55 3.8 1.35 0.33 0.4 1.27 5.27 0° 0.1 0.19 5.8 0.25 MAX 8.75 4 1.75 0.51 1.27 H B P B C 1 G 7 C R x 45 D F G -TD 0.25 (0.010) M T C M K SEATING PLAN E H J F M J K M P R 8° 0.25 0.25 6.2 0.5 NOTES : 1. Dimen s io ns A an d B d o n o t in clud e mo ld flas h o r p rotru s ion . 2. M aximu m mo ld flas h o r p ro tru s io n 0.15 mm (0.006) p er s id e fo r A ; fo r B ‑ 0.25 mm (0.010) p er s id e. 5