KK74HC112AN

TECHNICAL DATA KK74HC112A Dual J-K Flip-Flop with Set and Reset High-Performance Silicon-Gate CMOS The KK74HC112A is identical in pinout to the LS/ALS112. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LS/ALSTTL outputs. Each flip-flop is negative-edge clocked and has active-low asynchronous Set and Reset inputs. • Outputs Directly Interface to CMOS, NMOS, and TTL • Operating Voltage Range: 2.0 to 6.0 V • Low Input Current: 1.0 µA • High Noise Immunity Characteristic of CMOS Devices ORDERING INFORMATION KK74HC112AN Plastic KK74HC112AD SOIC TA = -55° to 125° C for all packages PIN ASSIGNMENT LOGIC DIAGRAM FUNCTION TABLE Inputs Set L H L H H H H H PIN 16=VCC PIN 8 = GND H H Reset H L L H H H H H H H L H Clock X X X J X X X L L H H X X X K X X X L H L H X X X Outputs Q H L L * Q L H L* H L No Change L H Toggle No Change No Change No Change * Both output will remain low as long as Set and Reset are low, but the output states are unpredictable if Set and Reset go high simultaneously X = Don’t Care 1 KK74HC112A MAXIMUM RATINGS* Symbol VCC VIN VOUT IIN IOUT ICC PD Tstg TL * Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) DC Output Voltage (Referenced to GND) DC Input Current, per Pin DC Output Current, per Pin DC Supply Current, VCC and GND Pins Power Dissipation in Still Air, Plastic DIP+ SOIC Package+ Storage Temperature Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP or SOIC Package) Value -0.5 to +7.0 -1.5 to VCC +1.5 -0.5 to VCC +0.5 ±20 ±25 ±50 750 500 -65 to +150 260 Unit V V V mA mA mA mW °C °C Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. +Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C SOIC Package: : - 7 mW/°C from 65° to 125°C RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN, VOUT TA tr, tf Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) Operating Temperature, All Package Types Input Rise and Fall Time (Figure 1) VCC =2.0 V VCC =4.5 V VCC =6.0 V Min 2.0 0 -55 0 0 0 Max 6.0 VCC +125 1000 500 400 Unit V V °C ns This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND≤(VIN or VOUT)≤VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. 2 KK74HC112A DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) VCC Symbol Parameter Test Conditions V Guaranteed Limit 2 5 °C to -55°C 1.5 3.15 4.2 0.3 0.9 1.2 1.9 4.4 5.9 3.98 5.48 0.1 0.1 0.1 0.26 0.26 ±0.1 4.0 ≤85 °C 1.5 3.15 4.2 0.3 0.9 1.2 1.9 4.4 5.9 3.84 5.34 0.1 0.1 0.1 0.33 0.33 ±1.0 40 ≤125 °C 1.5 3.15 4.2 0.3 0.9 1.2 1.9 4.4 5.9 3.7 5.2 0.1 0.1 0.1 0.4 0.4 ±1.0 80 µA µA V Unit VIH Minimum HighLevel Input Voltage Maximum Low Level Input Voltage Minimum HighLevel Output Voltage VOUT=0.1 V or VCC-0.1 V ⎢IOUT⎢≤ 20 µA VOUT=0.1 V or VCC-0.1 V ⎢IOUT⎢ ≤ 20 µA VIN=VIH or VIL ⎢IOUT⎢ ≤ 20 µA VIN=VIH or VIL ⎢IOUT⎢ ≤ 4.0 mA ⎢IOUT⎢ ≤ 5.2 mA 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 4.5 6.0 2.0 4.5 6.0 4.5 6.0 6.0 6.0 V VIL V VOH V VOL Maximum LowLevel Output Voltage VIN= VIL or VIH ⎢IOUT⎢ ≤ 20 µA VIN= VIL or VIH ⎢IOUT⎢ ≤ 4.0 mA ⎢IOUT⎢ ≤ 5.2 mA IIN ICC Maximum Input Leakage Current Maximum Quiescent Supply Current (per Package) VIN=VCC or GND VIN=VCC or GND IOUT=0µA 3 KK74HC112A AC ELECTRICAL CHARACTERISTICS (CL=50pF,Input tr=tf=6.0 ns) VCC Symbol fmax Parameter Maximum Clock Frequency (50% Duty Cycle) (Figures 1 and 4) Maximum Propagation Delay, Clock to Q or Q (Figures 1 and 4) Maximum Propagation Delay , Reset to Q or Q (Figures 2 and 4) Maximum Propagation Delay ,Set to Q or Q (Figures 2 and 4) Maximum Output Transition Time, Any Output (Figures 1 and 4) Maximum Input Capacitance Power Dissipation Capacitance (Per Flip-Flop) CPD Used to determine the no-load dynamic power consumption: PD=CPDVCC2f+ICCVCC V 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 Guaranteed Limit 25 °C to ≤85°C -55°C 6.0 30 35 125 25 21 155 31 26 165 33 28 75 15 13 10 4.8 24 28 155 31 26 195 39 33 205 41 35 95 19 16 10 ≤125°C 4.0 20 24 190 38 32 235 47 40 250 50 43 110 22 19 10 Unit MHz tPLH, tPHL ns tPLH, tPHL ns tPLH, tPHL ns tTLH, tTHL ns CIN pF Typical @25°C,VCC=5.0 V 35 pF TIMING REQUIREMENTS (CL=50pF,Input tr=tf=6.0 ns) VCC Symbol tSU Parameter Minimum Setup Time,J or K to Clock (Figure 3) Minimum Hold Time, Clock to J or K (Figure 3) Minimum Recovery Time, Set or Reset Inactive to Clock (Figure 2) Minimum Pulse Width, Clock (Figure 1) Minimum Pulse Width, Set or Reset (Figure 2) Maximum Input Rise and Fall Times (Figure 1) V 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 100 20 17 3 3 3 100 20 17 80 16 14 80 16 14 1000 500 400 Guaranteed Limit 25 °C to-55°C ≤85°C 125 25 21 3 3 3 125 25 21 100 20 17 100 20 17 1000 500 400 ≤125°C 150 30 26 3 3 3 150 30 26 120 24 20 120 24 20 1000 500 400 Unit ns th ns trec ns tw ns tw ns tr, tf ns 4 KK74HC112A Figure 1. Switching Waveforms Figure 2. Switching Waveforms Figure 3. Switching Waveforms Figure 4. Test Circuit EXPANDED LOGIC DIAGRAM 5 KK74HC112A N S UFFIX PLAS TIC DIP (MS - 0 0 1 BB) A Dimens ion, mm 16 9 B Symbol A MIN 18.67 6.1 MAX 19.69 7.11 5.33 1 8 B C F L D F 0.36 1.14 2.54 7.62 0° 2.92 7.62 0.2 0.38 0.56 1.78 C -T- SEATING PLAN E G H H J N G D 0.25 (0.010) M T K M J K L M N 10° 3.81 8.26 0.36 NOTES : 1. Dimen s io n s “A ”, “B” d o n o t in clu d e mo ld flas h o r p ro tru s io n s . Maximu m mo ld flas h o r p ro tru s io n s 0.25 mm (0.010) p er s id e. D S UFFIX S OIC (MS - 0 1 2 AC) Dimens ion, mm A 16 9 Symbol A MIN 9.8 3.8 1.35 0.33 0.4 1.27 5.72 0° 0.1 0.19 5.8 0.25 MAX 10 4 1.75 0.51 1.27 H B P B C 1 G 8 C R x 45 D F G -TD 0.25 (0.010) M T C M K SEAT ING PLAN E J F M H J K M P R 8° 0.25 0.25 6.2 0.5 NOTES : 1. Dimen s io ns A an d B d o n o t in clud e mo ld flas h o r p rotru s ion . 2. M aximu m mo ld flas h o r p ro tru s io n 0.15 mm (0.006) p er s id e fo r A ; fo r B ‑ 0.25 mm (0.010) p er s id e. 6