KK74HC166AD

TECHNICAL DATA KK74HC166A 8-Bit Serial or Parallel-Input/ Serial-Output Shift Register High-Performance Silicon-Gate CMOS The KK74HC166A is identical in pinout to the LS/ALS166. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LS/ALSTTL outputs. This device is a parallel-in or serial-in, serial-out shift register with gated clock inputs and an overriding clear input. The shift/load input establishes the parallel-in or serial-in mode. When high, this input enables the serial data input and couples the eight flip-flops for serial shifting with each clock pulse. Synchronous loading occurs on the next clock pulse when this is low and the parallel data inputs are enabled. Serial data flow is inhibited during parallel loading. Clocking is done on the low-tohigh level edge of the clock pulse via a two input positive NOR gate, which permits one input to be used as a clock enable or clock inhibit function. Clocking is inhibited when either of the clock inputs are held high, holding either input low enables the other clock input. This will allow the system clock to be free running and the register stopped on command with the other clock input. A change from low-to-high on the clock inhibit input should only be done when the clock input is high. A buffered direct clear input overrides all other inputs, including the clock, andsets all flip-flop to zero. • Outputs Directly Interface to CMOS, NMOS, and TTL • Operating Voltage Range: 2.0 to 6.0 V • Low Input Current: 1.0 µA • High Noise Immunity Characteristic of CMOS Devices ORDERING INFORMATION KK74HC166AN Plastic KK74HC166AD SOIC TA = -55° to 125° C for all packages PIN ASSIGNMENT LOGIC DIAGRAM PIN 16 =VCC PIN 8 = GND 1 KK74HC166A MAXIMUM RATINGS* Symbol VCC VIN VOUT IIN IOUT ICC PD Tstg TL * Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) DC Output Voltage (Referenced to GND) DC Input Current, per Pin DC Output Current, per Pin DC Supply Current, VCC and GND Pins Power Dissipation in Still Air, Plastic DIP+ SOIC Package+ Storage Temperature Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP or SOIC Package) Value -0.5 to +7.0 -1.5 to VCC +1.5 -0.5 to VCC +0.5 ±20 ±25 ±50 750 500 -65 to +150 260 Unit V V V mA mA mA mW °C °C Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. +Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C SOIC Package: : - 7 mW/°C from 65° to 125°C RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN, VOUT TA tr, tf Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) Operating Temperature, All Package Types Input Rise and Fall Time (Figure 1) VCC =2.0 V VCC =4.5 V VCC =6.0 V Min 2.0 0 -55 0 0 0 Max 6.0 VCC +125 1000 500 400 Unit V V °C ns This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND≤(VIN or VOUT)≤VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. 2 KK74HC166A DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) VCC Symbol Parameter Test Conditions V Guaranteed Limit 2 5 °C to -55°C 1.5 3.15 4.2 0.3 0.9 1.2 1.9 4.4 5.9 3.98 5.48 0.1 0.1 0.1 0.26 0.26 ±0.1 8.0 ≤85 °C 1.5 3.15 4.2 0.3 0.9 1.2 1.9 4.4 5.9 3.84 5.34 0.1 0.1 0.1 0.33 0.33 ±1.0 80 ≤125 °C 1.5 3.15 4.2 0.3 0.9 1.2 1.9 4.4 5.9 3.7 5.2 0.1 0.1 0.1 0.4 0.4 ±1.0 160 µA µA V Unit VIH Minimum HighLevel Input Voltage Maximum Low Level Input Voltage Minimum HighLevel Output Voltage VOUT=0.1 V or VCC-0.1 V ⎢IOUT⎢≤ 20 µA VOUT=0.1 V or VCC-0.1 V ⎢IOUT⎢ ≤ 20 µA VIN=VIH or VIL ⎢IOUT⎢ ≤ 20 µA VIN=VIH or VIL ⎢IOUT⎢ ≤ 4.0 mA ⎢IOUT⎢ ≤ 5.2 mA 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 4.5 6.0 2.0 4.5 6.0 4.5 6.0 6.0 6.0 V VIL V VOH V VOL Maximum LowLevel Output Voltage VIN=VIH or VIL ⎢IOUT⎢ ≤ 20 µA VIN=VIH or VIL ⎢IOUT⎢ ≤ 4.0 mA ⎢IOUT⎢ ≤ 5.2 mA IIN ICC Maximum Input Leakage Current Maximum Quiescent Supply Current (per Package) V =VCC or GND VIN=VCC or GND IOUT=0µA FUNCTION TABLE Inputs Clear L H H H H H Shift/Load X X L H H X Clock Inhibit X X L L L H X Clock X SA X X X H L X Parallel A...H X X a...h X X X a H L Internal Outputs QA L QB L No change b QAn QAn No change h QGn QGn Output QH L X = don’t care a...h = the level of steady state input voltage at input A trough H respectively 3 KK74HC166A AC ELECTRICAL CHARACTERISTICS (CL=50pF,Input tr=tf=6.0 ns) VCC Symbol Parameter V Guaranteed Limit 2 5 °C to -55°C 6.0 31 36 140 28 24 150 30 26 75 16 14 10 ≤85°C ≤125°C Unit fmax Minimum Clock Frequency (50% Duty Cycle) (Figures 2 and 4) Maximum Propagation Delay, Clock (or Clock Inhibit) to QH (Figures 2,3 and 4) Maximum Propagation Delay , Clear to QH (Figures 1 and 4) Maximum Output Transition Time, Any Output (Figures 1 and 4) Maximum Input Capacitance Power Dissipation Capacitance (Per Package) 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 - 5.0 25 28 175 35 30 200 40 34 95 20 18 10 4.2 21 25 210 42 36 230 48 40 110 25 20 10 MHz tPLH, tPHL ns tPHL ns tTLH, tTHL ns CIN pF Typical @25°C,VCC=5.0 V 140 pF CPD Used to determine the no-load dynamic power consumption: PD=CPDVCC2f+ICCVCC TIMING REQUIREMENTS (CL=50pF,Input tr=tf=6.0 ns) VCC Symbol tsu Parameter Minimum Setup Time, Shift/Load to Clock (Figure 3) Minimum Setup Time, Data before Clock (or Clock Inhibit) (Figure 3) Minimum Pulse Width, Clock (or Clock Inhibit) (Figure 2) V 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 Guaranteed Limit 25 °C to -55°C 80 16 14 80 16 14 80 16 14 ≤85°C 100 20 18 100 20 18 100 20 17 ≤125°C 120 24 20 120 24 20 120 24 20 Unit ns tsu ns tw ns 4 KK74HC166A Figure 1. Switching Waveforms Figure 2. Switching Waveforms Figure 3. Switching Waveforms Figure 4. Test Circuit 5 KK74HC166A TIMING DIAGRAM EXPANDED LOGIC DIAGRAM 6 KK74HC166A N S UFFIX PLAS TIC DIP (MS - 0 0 1 BB) A Dimens ion, mm 16 9 B Symbol A MIN 18.67 6.1 MAX 19.69 7.11 5.33 1 8 B C F L D F 0.36 1.14 2.54 7.62 0° 2.92 7.62 0.2 0.38 0.56 1.78 C -T- SEATING PLAN E G H H J N G D 0.25 (0.010) M T K M J K L M N 10° 3.81 8.26 0.36 NOTES : 1. Dimen s io n s “A ”, “B” d o n o t in clu d e mo ld flas h o r p ro tru s io n s . Maximu m mo ld flas h o r p ro tru s io n s 0.25 mm (0.010) p er s id e. D S UFFIX S OIC (MS - 0 1 2 AC) Dimens ion, mm A 16 9 Symbol A MIN 9.8 3.8 1.35 0.33 0.4 1.27 5.72 0° 0.1 0.19 5.8 0.25 MAX 10 4 1.75 0.51 1.27 H B P B C 1 G 8 C R x 45 D F G -TD 0.25 (0.010) M T C M K SEAT ING PLAN E J F M H J K M P R 8° 0.25 0.25 6.2 0.5 NOTES : 1. Dimen s io ns A an d B d o n o t in clud e mo ld flas h o r p rotru s ion . 2. M aximu m mo ld flas h o r p ro tru s io n 0.15 mm (0.006) p er s id e fo r A ; fo r B ‑ 0.25 mm (0.010) p er s id e. 7