KK74HC174AN

TECHNICAL DATA KK74HC174A Hex D Flip-Flop with Common Clock and Reset High-Performance Silicon-Gate CMOS The KK74HC174A is identical in pinout to the LS/ALS174. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LS/ALSTTL outputs. This device consists of six D flip-flops with common Clock and Reset inputs. Each flip-flop is loaded with a low-to-high transition of the Clock input. Reset is asynchronous and active-low. • Outputs Directly Interface to CMOS, NMOS, and TTL • Operating Voltage Range: 2.0 to 6.0 V • Low Input Current: 1.0 µA • High Noise Immunity Characteristic of CMOS Devices ORDERING INFORMATION KK74HC174AN Plastic KK74HC174AD SOIC TA = -55° to 125° C for all packages PIN ASSIGNMENT LOGIC DIAGRAM FUNCTION TABLE Inputs Reset L PIN 16=VCC PIN 8 = GND H H H H X = Don’t care L = LOW voltage level H = HIGH voltage level L Clock X D X H L X X Output Q L H L no change no change 1 KK74HC174A MAXIMUM RATINGS* Symbol VCC VIN VOUT IIN IOUT ICC PD Tstg TL * Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) DC Output Voltage (Referenced to GND) DC Input Current, per Pin DC Output Current, per Pin DC Supply Current, VCC and GND Pins Power Dissipation in Still Air, Plastic DIP+ SOIC Package+ Storage Temperature Lead Temperature, 1,5 mm from Case for 4 Seconds (Plastic DIP or SOIC Package) Value -0.5 to +7.0 -1.5 to VCC +1.5 -0.5 to VCC +0.5 ±20 ±25 ±50 750 500 -65 to +150 260 Unit V V V mA mA mA mW °C °C Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. +Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C SOIC Package: : - 7 mW/°C from 65° to 125°C RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN, VOUT TA tr, tf Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) Operating Temperature, All Package Types Input Rise and Fall Time (Figure 1) VCC =2.0 V VCC =4.5 V VCC =6.0 V Min 2.0 0 -55 0 0 0 Max 6.0 VCC +125 1000 500 400 Unit V V °C ns This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND≤(VIN or VOUT)≤VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. 2 KK74HC174A DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) VCC Symbol Parameter Test Conditions V Guaranteed Limit -55°C to 2 5 °C 1.5 3.15 4.2 0.5 1.35 1.8 1.9 4.4 5.9 3.98 5.48 0.1 0.1 0.1 0.26 0.26 ±0.1 4.0 ≤85 °C 1.5 3.15 4.2 0.5 1.35 1.8 1.9 4.4 5.9 3.84 5.34 0.1 0.1 0.1 0.33 0.33 ±1.0 40 ≤125 °C 1.5 3.15 4.2 0.5 1.35 1.8 1.9 4.4 5.9 3.7 5.2 0.1 0.1 0.1 0.4 0.4 ±1.0 160 µA µA V Unit VIH Minimum HighLevel Input Voltage Maximum Low Level Input Voltage Minimum HighLevel Output Voltage VOUT≥ VCC-0.1 V or ≤0.1 V ⎢IOUT⎢≤ 20 µA VOUT≤0.1 V or ≥VCC-0.1 V ⎢IOUT⎢ ≤ 20 µA VIN=VIH or VIL ⎢IOUT⎢ ≤ 20 µA VIN=VIH or VIL ⎢IOUT⎢ ≤ 4.0 mA ⎢IOUT⎢ ≤ 5.2 mA 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 4.5 6.0 2.0 4.5 6.0 4.5 6.0 6.0 6.0 V VIL V VOH V VOL Maximum LowLevel Output Voltage VIN= VIL or VIH ⎢IOUT⎢ ≤ 20 µA VIN= VIL or VIH ⎢IOUT⎢ ≤ 4.0 mA ⎢IOUT⎢ ≤ 5.2 mA IIN ICC Maximum Input Leakage Current Maximum Quiescent Supply Current (per Package) VIN=VCC or GND VIN=VCC or GND IOUT=0µA 3 KK74HC174A AC ELECTRICAL CHARACTERISTICS (CL=50pF, Input tr=tf=6.0 ns, VIL= 0 V, VIH=Vcc) VCC Symbol Parameter V Guaranteed Limit -55°C to 2 5 °C 6.0 30 35 110 22 19 110 21 19 75 15 13 10 ≤85°C ≤125°C Unit fmax Maximum Clock Frequency (50% Duty Cycle) (Figures 1 and 4) Maximum Propagation Delay, Clock to Q (Figures 1 and 4) Maximum Propagation Delay , Reset to Q (Figures 2 and 4) Maximum Output Transition Time, Any Output (Figures 1 and 4) Maximum Input Capacitance Power Dissipation Capacitance (Per Enabled Output) 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 - 4.8 24 28 140 28 24 140 28 24 95 19 16 10 4.0 20 24 165 33 28 160 32 27 110 22 19 10 MHz tPLH, tPHL ns tPHL ns tTLH, tTHL ns CIN pF Typical @25°C,VCC=5.0 V 62 pF CPD Used to determine the no-load dynamic power consumption: PD=CPDVCC2f+ICCVCC TIMING REQUIREMENTS (CL=50pF,Input tr=tf=6.0 ns, VIL= 0 V, VIH=Vcc) VCC Symbol tSU Parameter Minimum Setup Time, Data to Clock (Figure 3) Minimum Hold Time, Clock to Data (Figure 3) Minimum Recovery Time, Reset Inactive to Clock (Figure 2) Minimum Pulse Width, Clock (Figure 1) Minimum Pulse Width, Reset (Figure 2) Maximum Input Rise and Fall Times (Figure 1) V 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 -55 °C to 2 5 °C 50 10 9 5 5 5 5 5 5 75 15 13 75 15 13 1000 500 400 Guaranteed Limit ≤85°C 65 13 11 5 5 5 5 5 5 95 19 16 95 19 16 1000 500 400 ≤125°C 75 15 13 5 5 5 5 5 5 110 22 19 110 22 19 1000 500 400 Unit ns th ns trec ns tw ns tw ns tr, tf ns 4 KK74HC174A tw tr CLOCK 90% 50% 10% tf VCC GND RESET t PHL Q 50% VCC GND tw 1/fmax tPLH Q 50% 10% 90% 50% t PHL t rec CLOCK VCC 50% t TL H t THL GND Figure 1. Switching Waveforms Figure 2. Switching Waveforms VALID DATA VCC 50% TEST POINT GND t su th VCC 50% DEVICE UNDER TEST OUTPUT CL * CLOCK GND Figure 3. Switching Waveforms Figure 4. Test Circuit EXPANDED LOGIC DIAGRAM 5 KK74HC174A N S UFFIX PLAS TIC DIP (MS - 0 0 1 BB) A Dimens ion, mm 16 9 B Symbol A MIN 18.67 6.1 MAX 19.69 7.11 5.33 1 8 B C F L D F 0.36 1.14 2.54 7.62 0° 2.92 7.62 0.2 0.38 0.56 1.78 C -T- SEATING PLAN E G H H J N G D 0.25 (0.010) M T K M J K L M N 10° 3.81 8.26 0.36 NOTES : 1. Dimen s io n s “A ”, “B” d o n o t in clu d e mo ld flas h o r p ro tru s io n s . Maximu m mo ld flas h o r p ro tru s io n s 0.25 mm (0.010) p er s id e. D S UFFIX S OIC (MS - 0 1 2 AC) Dimens ion, mm A 16 9 Symbol A MIN 9.8 3.8 1.35 0.33 0.4 1.27 5.72 0° 0.1 0.19 5.8 0.25 MAX 10 4 1.75 0.51 1.27 H B P B C 1 G 8 C R x 45 D F G -TD 0.25 (0.010) M T C M K SEAT ING PLAN E J F M H J K M P R 8° 0.25 0.25 6.2 0.5 NOTES : 1. Dimen s io ns A an d B d o n o t in clud e mo ld flas h o r p rotru s ion . 2. M aximu m mo ld flas h o r p ro tru s io n 0.15 mm (0.006) p er s id e fo r A ; fo r B ‑ 0.25 mm (0.010) p er s id e. 6