TECHNICAL DATA
KK74HC373A
Octal 3-State Noninverting Transparent Latch
High-Performance Silicon-Gate CMOS
The KK74HC373A is identical in pinout to the LS/ALS373. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LS/ALSTTL outputs. These latches appear transparent to data (i.e., the outputs change asynchronously) when Latch Enable is high. When Latch Enable goes low, data meeting the setup and hold time becomes latched. The Output Enable input does not affect the state of the latches, but when Output Enable is high, all device outputs are forced to the highimpedance state. Thus, data may be latched even when the outputs are not enabled. • Outputs Directly Interface to CMOS, NMOS, and TTL • Operating Voltage Range: 2.0 to 6.0 V • Low Input Current: 1.0 µA • High Noise Immunity Characteristic of CMOS Devices
ORDERING INFORMATION KK74HC373AN Plastic KK74HC373ADW SOIC TA = -55° to 125° C for all packages
PIN ASSIGNMENT LOGIC DIAGRAM
FUNCTION TABLE
Inputs PIN 20=VCC PIN 10 = GND Output Enable L L L H Latch Enable H H L X D H L X X Output Q H L No Change Z
X = Don’t Care Z = High Impedance
1
KK74HC373A
MAXIMUM RATINGS*
Symbol VCC VIN VOUT IIN IOUT ICC PD Tstg TL
*
Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) DC Output Voltage (Referenced to GND) DC Input Current, per Pin DC Output Current, per Pin DC Supply Current, VCC and GND Pins Power Dissipation in Still Air, Plastic DIP+ SOIC Package+ Storage Temperature Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP or SOIC Package)
Value -0.5 to +7.0 -1.5 to VCC +1.5 -0.5 to VCC +0.5 ±20 ±35 ±75 750 500 -65 to +150 260
Unit V V V mA mA mA mW °C °C
Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. +Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C SOIC Package: : - 7 mW/°C from 65° to 125°C
RECOMMENDED OPERATING CONDITIONS
Symbol VCC VIN, VOUT TA tr, tf Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) Operating Temperature, All Package Types Input Rise and Fall Time (Figure 1) VCC =2.0 V VCC =4.5 V VCC =6.0 V Min 2.0 0 -55 0 0 0 Max 6.0 VCC +125 1000 500 400 Unit V V °C ns
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND≤(VIN or VOUT)≤VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.
2
KK74HC373A
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
VCC Symbol Parameter Test Conditions V Guaranteed Limit 2 5 °C to -55°C 1.5 3.15 4.2 0.5 1.35 1.8 1.9 4.4 5.9 3.98 5.48 0.1 0.1 0.1 0.26 0.26 ±0.1 ±0.5 ≤85 °C 1.5 3.15 4.2 0.5 1.35 1.8 1.9 4.4 5.9 3.84 5.34 0.1 0.1 0.1 0.33 0.33 ±1.0 ±5.0 ≤125 °C 1.5 3.15 4.2 0.5 1.35 1.8 1.9 4.4 5.9 3.7 5.2 0.1 0.1 0.1 0.4 0.4 ±1.0 ±10 µA µA V Unit
VIH
Minimum HighLevel Input Voltage Maximum Low Level Input Voltage Minimum HighLevel Output Voltage
VOUT=0.1 V or VCC-0.1 V ⎢IOUT⎢≤ 20 µA VOUT=0.1 V or VCC-0.1 V ⎢IOUT⎢ ≤ 20 µA VIN=VIH or VIL ⎢IOUT⎢ ≤ 20 µA VIN=VIH or VIL ⎢IOUT⎢ ≤ 6.0 mA ⎢IOUT⎢ ≤ 7.8 mA
2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 4.5 6.0 2.0 4.5 6.0 4.5 6.0 6.0 6.0
V
VIL
V
VOH
V
VOL
Maximum LowLevel Output Voltage
VIN= VIL or VIH ⎢IOUT⎢ ≤ 20 µA VIN= VIL or VIH ⎢IOUT⎢ ≤ 6.0 mA ⎢IOUT⎢ ≤ 7.8 mA
IIN IOZ
Maximum Input Leakage Current Maximum ThreeState Leakage Current Maximum Quiescent Supply Current (per Package)
VIN=VCC or GND Output in High-Impedance State VIN= VIL or VIH VOUT=VCC or GND VIN=VCC or GND IOUT=0µA
ICC
6.0
4.0
40
160
µA
3
KK74HC373A
AC ELECTRICAL CHARACTERISTICS (CL=50pF,Input tr=tf=6.0 ns)
VCC Symbol Parameter V Guaranteed Limit 2 5 °C to -55°C 125 25 21 140 28 24 150 30 26 150 30 26 60 12 10 10 15 ≤85°C ≤125°C Unit
tPLH, tPHL
Maximum Propagation Delay, Input D to Q (Figures 1 and 5) Maximum Propagation Delay , Latch Enable to Q (Figures 2 and 5) Maximum Propagation Delay ,Output Enable to Q (Figures 3 and 6) Maximum Propagation Delay , Output Enable to Q (Figures 3 and 6) Maximum Output Transition Time, Any Output (Figures 1 and 5) Maximum Input Capacitance Maximum Three-State Output Capacitance (Output in High-Impedance State) Power Dissipation Capacitance (Per Enabled Output)
2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 -
155 31 26 175 35 30 190 38 33 190 38 33 75 15 13 10 15
190 38 32 210 42 36 225 45 38 225 45 38 90 18 15 10 15
ns
tPLH, tPHL
ns
tPLZ, tPHZ
ns
tPZL, tPZH
ns
tTLH, tTHL
ns
CIN COUT
pF pF
Typical @25°C,VCC=5.0 V 36 pF
CPD
Used to determine the no-load dynamic power consumption: PD=CPDVCC2f+ICCVCC
TIMING REQUIREMENTS (CL=50pF,Input tr=tf=6.0 ns)
VCC Symbol tSU Parameter Minimum Setup Time, Input D to Latch Enable (Figure 4) Minimum Hold Time,Latch Enable to Input D (Figure 4) Minimum Pulse Width, Latch Enable (Figure 2) Maximum Input Rise and Fall Times (Figure 1) V 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 25 °C to -55°C 25 5.0 5.0 5.0 5.0 5.0 60 12 10 1000 500 400 Guaranteed Limit ≤85°C 30 6.0 6.0 5.0 5.0 5.0 75 15 13 1000 500 400 ≤125°C 40 8.0 7.0 5.0 5.0 5.0 90 18 15 1000 500 400 Unit ns
th
ns
tw
ns
tr, tf
ns
4
KK74HC373A
Figure 1. Switching Waveforms
Figure 2. Switching Waveforms
Figure 3. Switching Waveforms
Figure 4. Switching Waveforms
Figure 5. Test Circuit
Figure 6. Test Circuit
EXPANDED LOGIC DIAGRAM
5
KK74HC373A
N S UFFIX PLAS TIC DIP (MS - 0 0 1 AD)
A
Dimens ion, mm
20 11 B 1 10
Symbol A B C
MIN 24.89 6.1
MAX 26.92 7.11 5.33
F
L
D F
0.36 1.14 2.54 7.62 0° 2.92 7.62 0.2 0.38
0.56 1.78
C -T- SEATING
PLAN E
G H
H J
N G D 0.25 (0.010) M T K M
J K L M N
10° 3.81 8.26 0.36
NOTES :
1. Dimen s io n s “A ”, “B” d o n o t in clu d e mo ld flas h o r p ro tru s io n s . Maximu m mo ld flas h o r p ro tru s io n s 0.25 mm (0.010) p er s id e.
D S UFFIX S OIC (MS - 0 1 3 AC)
A 20 11
Dimens ion, mm Symbol MIN 12.6 7.4 2.35 0.33 0.4 1.27 9.53 0° 0.1 0.23 10 0.25 8° 0.3 0.32 10.65 0.75 MAX 13 7.6 2.65 0.51 1.27
H
B
P
A B
1
G
10 C R x 45
C D F
-TD 0.25 (0.010) M T C M K
SE AT IN G PL AN E
J
F
M
G H J K M P R
NOTES : 1. Dimen s io ns A an d B d o n o t in clud e mo ld flas h o r p ro tru s ion . 2. M aximu m mo ld flas h o r p ro tru s io n 0.15 mm (0.006) p er s id e fo r A ; fo r B ‑ 0.25 mm (0.010) p er s id e.
6
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