KK74LS06N

TECHNICAL DATA KK74LS06 Hex Inverted Buffers with Open-Collector Outputs This device contains hex inverted buffers with open-collector. It performs the Boolean function Y=A in positive Logic. • High Output Voltage (30 V) • High Speed ( tPD = 8.5 ns typical) • Low Power Dissipation (PD = 18 mW per Gate) ORDERING INFORMATION KK74LS06N Plastic KK74LS06D SOIC TA = 0° to 70° C for all packages LOGIC DIAGRAM PIN ASSIGNMENT A1 1 2 Y1 A2 3 4 Y2 A3 5 6 Y3 A4 9 8 Y4 A5 11 10 Y5 FUNCTION TABLE Inputs A H L Output Y L H A6 13 12 Y6 PIN 14 =VCC PIN 7 = GND 1 KK74LS06 MAXIMUM RATINGS* Symbol VCC VIN VOUT Tstg * Parameter Supply Voltage Input Voltage Output Voltage Storage Temperature Range Value 7.0 5.5 30 -65 to +150 Unit V V V °C Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. RECOMMENDED OPERATING CONDITIONS Symbol VCC VIH VIL VOH IOL TA Supply Voltage High Level Input Voltage Low Level Input Voltage High Level Output Voltage Low Level Output Current Ambient Temperature Range 0 Parameter Min 4.75 2.0 0.8 30 40 +70 Max 5.25 Unit V V V V mA °C DC ELECTRICAL CHARACTERISTICS over full operating conditions Guaranteed Limit Symbol VIK IOH VOL IIH IIL ICC Parameter Input Clamp Voltage High Level Output Current Low Level Output Voltage High Level Input Current Low Level Input Current Supply Current Test Conditions VCC = min, IIN = -18 mA VCC = min, VOH= max VCC = min, IOL = 16 mA VCC = min, IOL = 40 mA VCC = max, VIN = 2.7 V VCC = max, VIN = 5.5 V VCC = max, VIN = 0.4 V VCC = max Total with outputs high Total with outputs low Min Max -1.5 250 0.4 0.7 20 1 -0.2 18 60 µA mA mA mA Unit V µA V 2 KK74LS06 RL = 110 Ω, tr = 15 ns, tf = 6.0 ns) Symbol tPLH tPHL AC ELECTRICAL CHARACTERISTICS (TA = 25°C, VCC = 5.0 V, CL = 15 pF, Parameter Propagation Delay, Input A to Output Y Propagation Delay, Input A to Output Y Min Max 15 20 Unit ns ns Figure 1. Switching Waveforms NOTE A. CL includes probe and jig capacitance. Figure 2. Test Circuit 3 KK74LS06 N S UFFIX PLAS TIC DIP (MS - 0 0 1 AA) A 14 8 B 1 7 Dimens ion, mm Symbol A B C MIN 18.67 6.1 MAX 19.69 7.11 5.33 0.36 1.14 2.54 7.62 0° 2.92 7.62 0.2 0.38 10° 3.81 8.26 0.36 0.56 1.78 F L D F C -T- SEATING N G D 0.25 (0.010) M T K PLAN E G H H J M J K L M N NOTES : 1. Dimen s io n s “A ”, “B” d o n o t in clu d e mo ld flas h o r p ro tru s io n s . Maximu m mo ld flas h o r p ro tru s io n s 0.25 mm (0.010) p er s id e. D S UFFIX S OIC (MS - 0 1 2 AB) Dimens ion, mm 8 A 14 Symbol A MIN 8.55 3.8 1.35 0.33 0.4 1.27 5.27 0° 0.1 0.19 5.8 0.25 MAX 8.75 4 1.75 0.51 1.27 H B P B C 1 G 7 C R x 45 D F G -TD 0.25 (0.010) M T C M K SEATING PLAN E H J F M J K M P R 8° 0.25 0.25 6.2 0.5 NOTES : 1. Dimen s io ns A an d B d o n o t in clud e mo ld flas h o r p rotru s ion . 2. M aximu m mo ld flas h o r p ro tru s io n 0.15 mm (0.006) p er s id e fo r A ; fo r B ‑ 0.25 mm (0.010) p er s id e. 4