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ICE40HX8K-B-EVN

ICE40HX8K-B-EVN

  • 厂商:

    LATTICE(莱迪思半导体)

  • 封装:

    -

  • 描述:

    ICE40-HX8K BREAKOUT BOARD

  • 数据手册
  • 价格&库存
ICE40HX8K-B-EVN 数据手册
iCE40HX-8K Breakout Board User Guide EB85 Version 1.1, January 2016 iCE40HX-8K Breakout Board Introduction Thank you for choosing the Lattice iCE40HX-8K Breakout Board. This document provides technical information and instructions for using the iCE40HX-8K Breakout Board. This kit is based on the Lattice iCE40-HX8K-CT256 high performance FPGA device. Two source codes, one written in Verilog and the other in VHDL, are available to download for the iCE40HX-8K Breakout Board. Both codes are functionally the same. The contents of this user’s guide include demo operation, top-level functional descriptions of the various portions of the evaluation board, descriptions of the on-board connectors, switches, a complete set of schematics and the bill of materials for the iCE40HX-8K Evaluation Board. Features The iCE40HX-8K Breakout Board includes: • iCE40HX-8K Evaluation Board – The iCE40HX-8K Evaluation Board features the following on board capabilities: —iCE40HX-8K CT256 device —8 user accessible LEDs —SPI Flash for programming configuration —40 pin 0.1” header for user connectivity —0.1” holes for user connectivity —FTDI 2232H for USB interface —12MHz oscillator —Jumpers to select programming the SPI flash or iCE40HX-8K • Pre-loaded Demo – The kit comes with a default design that flashes the LEDs on and off • USB connector Cable – A mini B USB cable for programming the SRAM fabric of the iCE40HX-8K or the onboard SPI flash. The USB cable also powers the iCE40HX-8K evaluation board. Figure 1 shows the top side of the iCE40HX-8K Evaluation Board indicating the specific features that are designed on the board. 2 iCE40HX-8K Breakout Board Figure 1. iCE40HX-8K Evaluation Board (Top Side) LEDs iCE40HX-8K 0.1" spaced holes 40 pin header USB Figure 2. Block Diagram HEADER I/Os LEDS(1-8) USB CONNECTOR USB to SPI / RS232 iCE40HX8K-CT256 RS232 Power from USB 5V BANK 2 I/Os HEADER 3 SPI I/Os HEADER FPGA BANK 1 I/Os BANK 3 HEADER BANK 0 iCE40HX-8K Breakout Board iCE40 Device This board features an iCE40HX-8K device with a 1.2v core supply. It is packaged in a 256 caBGA package. For a complete description of this device, see HB1011, iCE40 LP/LX/LM Family Handbook. Software Requirements You should install the following software before you begin developing designs for the evaluation board: • Lattice iCEcube2 Release: 2012.09SP1.22498 or later • Diamond Programmer: Version 2.2 or later These software are available at the Lattice website Design Software & IP page. Make sure you log in to the Lattice website, otherwise these software downloads will not be visible. Demonstration Design The design file iCE40HX8KLED.zip contains the following files: • LED_VHDL.vhd (VHDL code) • LED_Verilog.v (Verilog code) • LED.pcf (pin constraint file) • LED_VHDL_bitmap.hex (Bit stream file for programming FPGA.) • LED_Verilog_bitmap.hex (Bit stream file for programming FPGA.) Two source codes are provided, one written in VHDL and the other in Verilog. Both of these codes function identically. This provides you with an option to use either one of the code when programming the Breakout Board. When the FPGA is programmed with one of these codes, the red LEDs (D2 thru D9) will flash on for ½ second and off for ½ second. Figure 3 shows the block diagram of the Verilog or VHDL code. Figure 3. Block Diagram of the Verilog or VHDL Code 12MHz Clk LED 2 LED 2 16 ÷2 ÷ 96 ½ second pulse 2 bit counter 2 Decoder LED 3 LED 9 The source code has two counters that are used to divide the 12MHz clock by 216 and 96 generating a approximately ½ second pulse. This pulse along with the decoder will turn the LEDs (D2 thru D9) on for ½ second and off for ½ second. The decoder can be modified to have any type of LED sequence by changing either the VHDL or Verilog code. When the board is plugged into a USB port, a +5 volt power is applied to the board that will light a green LED (D11). After the FPGA has been programmed, a green LED (D10) will light. This LED is connected to the CDONE line of the FPGA. 4 iCE40HX-8K Breakout Board Board Power The iCE40HX-8K evaluation board is powered with the USB cable. LED location D11 indicates that the board is powered up. All I/Os are driven at 3.3v. Board I/Os The I/Os that feed the holes and the 0.1” connector are driven at 3.3v levels. Location J2 is the populated 2 x 20 row connector. Locations J1, J3 and J4 have hole locations that the users can connect to for their specific I/O requirements. Programming Options Two jumpers, J6 and J7 can be set for two types of FPGA Configurations: • SPI Flash Mode, for programming the serial flash memory. • SPI Peripheral Mode, for configuring the volatile CRAM in the FPGA. In SPI Flash Mode the SPI signals, from the FTDI USB interface chip, programs the serial flash memory. After the memory is programmed the FPGA reads from the memory and configures its self. The advantage of programming the serial flash is that the FPGA will be re-configured after power-up. Jumpers must be in locations J7:1-2, J6:2-4, and J6:1-3. See Figure 4 Figure 4. SPI Flash Programming In SPI Peripheral Mode the SPI signals loads the program file into the CRAM (configuration ram) of the FPGA directly. In this mode the FPGA will lose its configuration when power is removed and must be re-configured. Jump5 iCE40HX-8K Breakout Board ers must be in locations J6:1-2 and J6:3-4. Jumper J7 is not installed. See Figure 5 Figure 5. CRAM Programming LED in location D10 is connected to the CDONE pin of the iCE40HX-8K. This can be monitored to determine that the iCE40HX-8K is programmed correctly. Ordering Information Description Ordering Part Number ICE40HX-8K Breakout Board ICE40HX8K-B-EVN 6 China RoHS EnvironmentFriendly Use Period (EFUP) iCE40HX-8K Breakout Board Technical Support Assistance Submit a technical support case through www.latticesemi.com/techsupport. Revision History Date Version January 2016 1.1 Change Summary Updated Technical Support AssistanceDemonstration Design section. Changed “demonstration design” to “design file”. Updated Technical Support AssistanceTechnical Support Assistance section. November 2013 1.0 Initial release. © 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 7 8 A B C D 5 USB CONNECTOR 5 USB to SPI / RS232 4 4 Power from USB 5V 3 RS232 I/Os 3 HEADER 2 I/Os BANK 2 iCE40HX8K-CT256 FPGA BANK 0 HEADER I/Os 2 BANK 1 SPI Date: Size B Title HEADER Jul 11, 2013 ICE40HX8K-B-EVN Document Number 1 Sheet 1 of 6 iCE40-HX8K Breakout Board - Block Diagram AXELSYS I/Os LEDS(1-8) 1 Rev A A B C D iCE40HX-8K Breakout Board Appendix A. Schematic Diagrams Figure 6. Block Diagram BANK 3 HEADER A B C 0.1uF C12 +3.3V 8 7 6 5 CS CLK DI DO 5 93LC56-SO8 VCC NU ORG VSS U2 1 2 3 4 10K R8 10K R9 0.1uF 0.1uF 0.1uF 0.1uF +3.3V C8 C7 C6 C5 +3.3V 10K R10 R14 2.2K 0.1uF C9 4 1 2 OUTPUT VDD 12.0000MHZ GND STANDBY# X1 3 4 0.1uF 10uF +3.3V C11 C10 VCC1_8FT +3.3V +3.3V C1 0.1uF C13 12K 2.2K 5 5 iCE_CLK 3 4 FT_EECS FT_EECLK FT_EEDATA R11 R7 0.1uF 4.7uF +3.3V C4 R20 0 C2 0.1uF C3 4.7uF 3 DM DP 13 3 2 63 62 61 6 14 7 8 49 50 VCC1_8FT FT2232H +3.3V PWREN# BCBUS0 BCBUS1 BCBUS2 BCBUS3 BCBUS4 BCBUS5 BCBUS6 BCBUS7 BDBUS0 BDBUS1 BDBUS2 BDBUS3 BDBUS4 BDBUS5 BDBUS6 BDBUS7 ACBUS0 ACBUS1 ACBUS2 ACBUS3 ACBUS4 ACBUS5 ACBUS6 ACBUS7 ADBUS0 ADBUS1 ADBUS2 ADBUS3 ADBUS4 ADBUS5 ADBUS6 ADBUS7 SUSPEND# FTDI High-Speed USB TEST OSCO OSCI EECS EECLK EEDATA REF RESET# DM DP VREGOUT VREGIN U1 FT2232HL AGND 10 D 4 4 9 VPHY VPLL 12 37 64 VCORE VCORE VCORE 20 31 42 56 VCCIO VCCIO VCCIO VCCIO GND GND GND GND GND GND GND GND 9 1 5 11 15 25 35 47 51 5 36 60 48 52 53 54 55 57 58 59 38 39 40 41 43 44 45 46 26 27 28 29 30 32 33 34 16 17 18 19 21 22 23 24 2 2 SS SCK SI SO 0 0 0 0 0 0 0 0 0 0 0 0 0 Title Date: Size B AXELSYS RS232_Rx_TTL RS232_Tx_TTL RTSn CTSn DTRn DSRn DCDn iCE_CDONE iCE_CREST iCE_SS_B iCE_SCK FLASH_MOSI FLASH_MISO 4 4 6 6 6 6 3 3 3 3 3 3 3 Jul 11, 2013 ICE40HX8K-B-EVN Document Number 1 Sheet 2 of 6 Rev A iCE40-HX8K Breakout Board - USB to SPI/RS232 R12 R13 R15 R16 R17 R18 R19 R5 R6 R4 R1 R2 R3 1 A B C D iCE40HX-8K Breakout Board Figure 7. USB to SPI/RS232 10 A B C D 1 5 R23 100 DNI TP7 0.1uF 0.1uF DNI +1.2V TP6 C17 C14 1 R21 1 1 1 5 VCCIO0 0.1uF 10uF PIO0_51 PIO0_47 PIO0_44 PIO0_34 PIO0_45 PIO0_46 PIO0_27 PIO0_30 PIO0_31 PIO0_15 PIO0_14 PIO0_20 PIO0_01 PIO0_03 C23 0.1uF 0.1uF C22 C15 C18 0.1uF VCCIO0 PIO0_00 PIO0_01 PIO0_02 PIO0_03 PIO0_04 PIO0_05 PIO0_06 PIO0_07 PIO0_08 PIO0_09 PIO0_10 PIO0_11 PIO0_12 PIO0_13 PIO0_14 PIO0_15 PIO0_16 PIO0_17 PIO0_18 PIO0_19 PIO0_20 PIO0_21 PIO0_22 PIO0_23 PIO0_24 PIO0_27 PIO0_28 PIO0_29 PIO0_30 PIO0_31 PIO0_32 PIO0_33 PIO0_34 PIO0_35 PIO0_36 PIO0_37 PIO0_38 PIO0_39 PIO0_40 PIO0_41 PIO0_42 PIO0_43 PIO0_44 PIO0_45 PIO0_46 PIO0_47 PIO0_48 PIO0_49 PIO0_50 PIO0_51 C14 B15 D13 B14 C12 E11 C13 A16 A15 B13 E10 C11 D11 B12 B10 B11 C10 A10 A11 D10 C9 E9 D9 A9 F9 B9 D8 B8 A7 C7 B7 B6 C6 D7 A6 D6 A5 B5 E6 B4 A2 D5 A1 C5 C4 B3 D4 E5 D3 C3 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 4 Header2x20 DNI J1 MAKE PWR TRACES CAPABLE OF 1A GBIN0/PIO0_26 GBIN1/PIO0_25 BANK0 PLLVCC0 PLLGND_0 VCCIO0_01 VCCIO0_02 VCCIO0_03 VCCIO0_04 U3A iCE40HX8K-CT256 C25 F7 C8 E8 E7 A13 A3 A8 F8 4 PIO0_39 PIO0_41 PIO0_42 PIO0_36 PIO0_33 PIO0_38 PIO0_23 PIO0_29 PIO0_32 PIO0_13 PIO0_18 PIO0_17 PIO0_07 PIO0_08 PIO0_09 PIO0_51 PIO0_44 PIO0_45 PIO0_46 PIO0_47 PIO0_41 PIO0_42 PIO0_38 PIO0_39 PIO0_36 PIO0_29 PIO0_30 PIO0_31 PIO0_32 PIO0_33 PIO0_34 PIO0_27 PIO0_23 PIO0_20 PIO0_17 PIO0_18 PIO0_13 PIO0_14 PIO0_15 PIO0_07 PIO0_08 PIO0_09 PIO0_03 PIO0_01 LED7 LED3 LED4 LED5 LED6 LED1 LED2 LED0 5 5 5 5 5 5 5 5 RS232_Tx_TTL RS232_Rx_TTL DTRn CTSn RTSn DSRn DCDn 3 3 2 2 2 2 2 2 2 PIO1_44 PIO1_51 PIO1_49 PIO1_32 PIO1_36 PIO1_46 PIO1_22 PIO1_42 PIO1_29 PIO1_14 PIO1_16 PIO1_21 PIO1_01 PIO1_03 DNI +3.3V TP8 0.1uF C24 1 R22 DNI TP9 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 Header2x20 J2 2 0.1uF C27 PIO1_38 PIO1_40 PIO1_47 GBIN2/PIO1_28 PIO1_30 PIO1_34 PIO1_18 PIO1_37 PIO1_19 PIO1_08 PIO1_12 PIO1_20 2 10K R24 Date: Size B Title 0.1uF C20 GBIN2/PIO1_28 PIO1_03 PIO1_01 0.1uF C16 PIO1_04 0.1uF C26 0.1uF C19 VCC_1.2V 0.1uF C21 VCCIO1 MAKE PWR TRACES CAPABLE OF 1A VCCIO1 1 DNI TP5 1 DNI +3.3V TP4 PIO1_04 PIO1_05 PIO1_06 PIO1_07 PIO1_08 PIO1_09 PIO1_10 PIO1_11 PIO1_12 PIO1_13 PIO1_14 PIO1_15 PIO1_16 PIO1_17 PIO1_18 PIO1_19 PIO1_20 PIO1_21 PIO1_22 PIO1_23 PIO1_24 PIO1_25 PIO1_26 PIO1_29 PIO1_30 PIO1_31 PIO1_32 PIO1_33 PIO1_34 PIO1_35 PIO1_36 PIO1_37 PIO1_38 PIO1_39 PIO1_40 PIO1_41 PIO1_42 PIO1_43 PIO1_44 PIO1_45 PIO1_46 PIO1_47 PIO1_48 PIO1_49 PIO1_50 PIO1_51 P16 M13 M14 L12 N16 L13 L14 K12 M16 J10 M15 J11 L16 K13 K14 J15 K15 K16 J14 J12 J13 J16 H13 H14 G16 H12 G15 G10 F16 G11 F15 G14 E16 G13 D16 G12 F14 F12 D15 F11 E14 C16 F13 B16 E13 D14 PIO1_51 PIO1_49 PIO1_46 PIO1_47 PIO1_44 PIO1_42 PIO1_40 PIO1_36 PIO1_37 PIO1_38 PIO1_34 PIO1_32 PIO1_29 PIO1_30 PIO1_18 PIO1_19 PIO1_20 PIO1_21 PIO1_22 PIO1_16 PIO1_14 PIO1_12 PIO1_08 PIO1_04 Jul 27, 2013 ICE40HX8K-B-EVN 1 Sheet 3 of iCE40-HX8K Breakout Board - FPGA AXELSYS GBIN2/PIO1_28 GBIN3/PIO1_27 BANK1 PIO1_00 PIO1_01 PIO1_02 PIO1_03 TRST_B VCCIO1_01 VCCIO1_02 VCCIO1_03 VCCIO1_04 U3B iCE40HX8K-CT256 Document Number H16 H11 R14 R15 P14 P15 N14 H10 C15 H15 N15 1 6 Rev A A B C D iCE40HX-8K Breakout Board Figure 8. FPGA 11 A B C 2 1 iCE_CDONE 2 0.1uF C38 5 PIO2_10 PIO2_09 PIO2_05 PIO2_21 PIO2_16 PIO2_08 PIO2_29 PIO2_28 GBIN5/PIO2_26 VCCIO2 R29 DNI TP16 PIO2_45/CBSEL1 0.1uF GBIN5/PIO2_26 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 Header2x20 DNI J3 MAKE PWR TRACES CAPABLE OF 1A 10K 10uF C37 0.1uF 0.1uF 0.1uF C36 C35 C34 C33 DNI TP13 0.1uF C32 iCE_CREST PIO2_45/CBSEL1 PIO2_37 PIO2_31 PIO2_41 PIO2_36 D10 Green 649 R28 VCCIO2 R26 100 +3.3V DNI +1.2V TP12 1 1 D 1 R27 1 2 1 K9 R9 M10 N11 K11 P13 N8 L8 K8 P3 R13 R8 PIO2_07 PIO2_03 PIO2_01 PIO2_20 PIO2_18 PIO2_15 PIO2_33 PIO2_17 PIO2_24 PIO2_39 PIO2_32 PIO2_34 PIO2_43 PIO2_35 PIO2_38 4 GBIN4/PIO2_27 GBIN5/PIO2_26 CDONE CRESET_B PIO2_44/CBSEL0 PIO2_45/CBSEL1 BANK2 PLLGND_2 PLLVCC2 VCCIO2_01 VCCIO2_02 VCCIO2_03 VCCIO2_04 U3C iCE40HX8K-CT256 4 PIO2_00 PIO2_01 PIO2_02 PIO2_03 PIO2_04 PIO2_05 PIO2_06 PIO2_07 PIO2_08 PIO2_09 PIO2_10 PIO2_11 PIO2_12 PIO2_13 PIO2_14 PIO2_15 PIO2_16 PIO2_17 PIO2_18 PIO2_19 PIO2_20 PIO2_21 PIO2_22 PIO2_23 PIO2_24 PIO2_25 PIO2_28 PIO2_29 PIO2_30 PIO2_31 PIO2_32 PIO2_33 PIO2_34 PIO2_35 PIO2_36 PIO2_37 PIO2_38 PIO2_39 PIO2_40 PIO2_41 PIO2_42 PIO2_43 N6 T1 P4 R2 N5 T2 P5 R3 R5 T3 R4 M7 N7 P6 M8 T5 R6 P8 T6 L9 T7 T8 P7 N9 T9 M9 P9 R10 L10 P10 N10 T10 T11 T15 T14 M11 T13 N12 L11 T16 M12 R16 PIO2_43 PIO2_41 PIO2_31 PIO2_32 PIO2_33 PIO2_34 PIO2_35 PIO2_36 PIO2_37 PIO2_38 PIO2_39 PIO2_28 PIO2_29 PIO2_24 PIO2_20 PIO2_21 PIO2_15 PIO2_16 PIO2_17 PIO2_18 PIO2_07 PIO2_08 PIO2_09 PIO2_10 PIO2_05 PIO2_03 PIO2_01 1 R25 3 3 PIO3_07/DP03B PIO3_05/DP02B PIO3_01/DP00B PIO3_27/DP13B GBIN7/PIO3_25/DP12B PIO3_19/DP09B PIO3_30/DP15A PIO3_29/DP14B GBIN6/PIO3_26/DP13A PIO3_41/DP20B PIO3_35/DP17B PIO3_33/DP16B 0.1uF C39 iCE_CLK 0.1uF C30 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 Header2x20 DNI J4 MAKE PWR TRACES CAPABLE OF 1A VCCIO3 2 0.1uF C29 DNI TP15 VCCIO3 PIO3_50/DP25A PIO3_48/DP24A DNI +3.3V TP14 1 DNI TP11 VCCIO2 1 5 1 DNI +3.3V TP10 0.1uF C28 VCC_3.3V PIO3_09/DP04B PIO3_04/DP02A PIO3_03/DP01B PIO3_21/DP10B PIO3_17/DP08B PIO3_13/DP06B PIO3_31/DP15B PIO3_28/DP14A PIO3_23/DP11B PIO3_45/DP22B PIO3_39/DP19B PIO3_37/DP18B 2 Date: Size B Title GBIN7/PIO3_25/DP12B GBIN6/PIO3_26/DP13A BANK3 VCCIO3_01 VCCIO3_02 VCCIO3_03 VCCIO3_04 U3D iCE40HX8K-CT256 0.1uF C41 PIO3_46/DP23A 0.1uF C40 GBIN7/PIO3_25/DP12B G1 GBIN6/PIO3_26/DP13A J3 0.1uF C31 E1 G6 J6 N1 2 J2 J1 K1 K3 L4 L1 K4 M1 L6 L3 K5 M2 L7 N2 M6 M3 L5 N3 P1 M4 P2 M5 R1 N4 H1 J5 E4 B2 F5 B1 C1 C2 F4 D2 G5 D1 G4 E3 H5 E2 G3 F3 H3 F2 H6 F1 H4 G2 J4 H2 PIO3_01/DP00B PIO3_50/DP25A PIO3_48/DP24A PIO3_45/DP22B PIO3_46/DP23A PIO3_41/DP20B PIO3_39/DP19B PIO3_37/DP18B PIO3_35/DP17B PIO3_33/DP16B PIO3_28/DP14A PIO3_29/DP14B PIO3_30/DP15A PIO3_31/DP15B PIO3_27/DP13B PIO3_23/DP11B PIO3_21/DP10B PIO3_19/DP09B PIO3_17/DP08B PIO3_13/DP06B PIO3_09/DP04B PIO3_07/DP03B PIO3_03/DP01B PIO3_04/DP02A PIO3_05/DP02B Jul 26, 2013 ICE40HX8K-B-EVN Document Number 1 Sheet 4 of iCE40-HX8K Breakout Board - FPGA AXELSYS PIO3_28/DP14A PIO3_29/DP14B PIO3_30/DP15A PIO3_31/DP15B PIO3_32/DP16A PIO3_33/DP16B PIO3_34/DP17A PIO3_35/DP17B PIO3_36/DP18A PIO3_37/DP18B PIO3_38/DP19A PIO3_39/DP19B PIO3_40/DP20A PIO3_41/DP20B PIO3_42/DP21A PIO3_43/DP21B PIO3_44/DP22A PIO3_45/DP22B PIO3_46/DP23A PIO3_47/DP23B PIO3_48/DP24A PIO3_49/DP24B PIO3_50/DP25A PIO3_51/DP25B PIO3_27/DP13B PIO3_24/DP12A PIO3_00/DP00A PIO3_01/DP00B PIO3_02/DP01A PIO3_03/DP01B PIO3_04/DP02A PIO3_05/DP02B PIO3_06/DP03A PIO3_07/DP03B PIO3_08/DP04A PIO3_09/DP04B PIO3_10/DP05A PIO3_11/DP05B PIO3_12/DP06A PIO3_13/DP06B PIO3_14/DP07A PIO3_15/DP07B PIO3_16/DP08A PIO3_17/DP08B PIO3_18/DP09A PIO3_19/DP09B PIO3_20/DP10A PIO3_21/DP10B PIO3_22/DP11A PIO3_23/DP11B 1 6 Rev A A B C D iCE40HX-8K Breakout Board Figure 9. FPGA A B C D VCC DD+ ID GND 1 2 3 4 5 5 SKT_MINIUSB_B_RA J5 1M 1M 10uF 0 0.1uF R48 C62 600 Ohm 500 mA L3 VBUS_5V R35 R34 C54 VBUS_5V 0.1uF C61 21 12 19 11 20 18 17 14 13 1uF 10uF DM DP 1K R53 THERMPAD PWRGD2 PWRGD1 SHDN2 SHDN1 IN1_1 IN1_2 IN2_1 IN2_2 U4 0.1uF GND1 2 2 16 GND2 15 1 2 D11 Green 10 9 8 7 1 2 4 3 0.1uF C46 0.01uF C59 0.01uF C55 0.1uF C47 4 LT3030EFE#TRPBF ADJ2 BYP2 OUT2_2 OUT2_1 ADJ1 BYP1 OUT1_2 OUT1_1 0.1uF C45 GND3 5 GND4 6 C44 357K R32 4.7uF C58 210K A12 A4 E15 G7 G8 G9 H7 H8 H9 J7 J8 J9 K2 K7 L15 R7 T12 T4 0.1 R37 10uF C53 0.1 R31 GND_01 VPP_FAST GND_02 VPP_2V5 GND_03 GND_04 GND_05 GND_06 GND_07 GND_08 POWER GND_09 GND_10 GND_11 GND_12 GND_13 VCC_01 GND_14 VCC_02 VCC_03 GND_15 GND_16 VCC_04 GND_17 VCC_05 VCC_06 GND_18 L2 22uF C56 VCC_3.3V A14 F10 F6 K10 K6 L2 D12 E12 3 D1 C57 1 1 R38 +1.2V L1 +1.2V 600 Ohm 500 mA +3.3V 0.1uF CDBU0520 2 600 Ohm 500 mA 22uF C60 VCC_1.2V 100 R33 +3.31V U3F iCE40HX8K-CT256 100 R39 +1.22V R36 0.01uF C48 LED5 LED7 3 LED4 LED6 LED3 3 3 LED2 3 3 LED1 3 LED0 3 3 +3.3V 2 +3.3V C49 R40 D2 Red 1K C52 Date: Size B Title D3 Red 1K R42 R43 D5 Red 1K D6 Red 1K R44 D7 Red 1K R45 1 D8 Red 1K R46 1 Jul 26, 2013 ICE40HX8K-B-EVN Document Number 1 Sheet 5 of 6 D9 Red 1K R47 iCE40-HX8K Breakout Board - Power, LEDs AXELSYS D4 Red 1K LEDs DNI TP3 DNI TP2 0.01uF DNI R41 1uF +1.2V C51 0.1uF C50 +3.3V TP1 10uF 1 C43 1 2 C42 1 2 +1.2V 2 2 1 2 1 1 1 1 2 3 1 2 4 1 2 12 2 5 Rev A A B C D iCE40HX-8K Breakout Board Figure 10. Power and LEDs 13 A B C 5 JU2 63429-202LF JU1 63429-202LF JU3 63429-202LF Short-circuit Jumper N13 4 0.1uF C63 +3.3V 4 SPI SPI_VCC 2 iCE_SS_B 2 P12 P11 R11 R12 1 J7 iCE_MISO iCE_MOSI 2 1 3 6 5 CS WP SCK SDI U5 10K R49 C64 7 2 FLASH_MISO N25Q032A13ESC40F HOLD SDO 0.1uF R52 10K R51 10K R50 10K 2 iCE_MOSI FLASH_MOSI 2 4 FLASH_MISO iCE_MISO 2 3 For programming iCE - Shunt 3,4 and 1,2 2 For programming Flash - Shunt 1,3 and 2,4 (default) 1 3 J6 J7: Remove shunt only for Programming iCE. Replace shunt for programming Flash and for normal operation. iCE_SCK 2 FLASH_MOSI PIOS_00/SPI_SO PIOS_01/SPI_SI PIOS_02/SPI_SCK PIOS_03/SPI_SS_B U3E iCE40HX8K-CT256 3 8 VCC GND 4 D 5 Date: Size B Title AXELSYS Jul 26, 2013 ICE40HX8K-B-EVN Document Number 1 Sheet iCE40-HX8K Breakout Board - SPI 1 6 of 6 Rev A A B C D iCE40HX-8K Breakout Board Figure 11. SPI
ICE40HX8K-B-EVN 价格&库存

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ICE40HX8K-B-EVN
  •  国内价格 香港价格
  • 1+1191.481011+144.12245
  • 2+1185.913212+143.44897
  • 3+1185.887003+143.44580
  • 4+1185.860794+143.44263
  • 5+1185.834585+143.43946

库存:0

ICE40HX8K-B-EVN
  •  国内价格 香港价格
  • 1+1050.940411+127.12256
  • 3+1046.029363+126.52851
  • 5+1046.006245+126.52571
  • 20+1045.9831220+126.52292
  • 30+1045.9600030+126.52012

库存:0