ICE5LP4K-MDP-EVN

iCE40 Ultra™ Mobile Development Platform User Guide EB90 Version 1.1, June 2015 iCE40 Ultra Mobile Development Platform User Guide Introduction This platform is designed to develop and demonstrate various mobile applications using the iCE40 Ultra device. The board is in the form factor of a bar phone featuring various sensors and connectivity to external mobile software development platforms. Kit Contents The following items are included in the development kit: • Main Board – The main board is mounted in lower plastic enclosures. • Key Set – The key set includes keys A, B, C, and Custom. Key A is installed on the main unit by default. • DragonBoard Interface Module • Interconnecting Cables – The cables include USB mini-B cable, DragonBoard interface ribbon cable, and +5 V supply flywire. Variants The unit is built in two variants with different sets of RGB LED and IR LED parts. Variant A includes the following parts on the board: • RGB LED used at D12: AEBMT-RGBZ by Advanced Optoelectronics Technology • IR LED used at D7: SFH 4645 by Osram Opto Semiconductors Variant B includes the following parts on the board: • RGB LED used at D13: APTF1616SEEZGQBDC by Kingbright • IR LED used at D7: VSMB2948SL by Vishay Semiconductor The variants can be distinguished through the populated status of D12 and D13. • Variant A: D12 is populated and D13 is not populated • Variant B: D12 is not populated and D13 is populated 2 iCE40 Ultra Mobile Development Platform User Guide Demo Board Architecture Figure 1 shows the demo board architecture. The different I2C sensors are split up and wired on two separate I2C buses as Pool A and Pool B. The other sensors that are not I2C are either wired separately or are connected instead of Pool B and other resources on the board. Changes to connectivity are user controllable and achieved by means of changing the keys – a method to replace using multiple jumpers to re-route wiring to different resources. Figure 1. Block Diagram LSM330DLC (I2C) Accel. & Gyro HALL SENSOR MAX44008 (I2C) RGB ALS BMP180 (I2C) Pressure LSM303DLHC (I2C) Magentometer APP PROCESSOR (SPI) (10 pin CONN) BLE Module SPI UART SPI CONFIG SPI & BANK 1 3.3V SHT20 (I2C) Humidity &Temp. CONFIG FLASH (SPI) FT2232H USB TMD27711 (I2C) Proximity & ALS #1 CHEETAH CONN iCE5LP4KSWG36 BANK 2 3.3V BANK 0 3.3v POOL-B I2C THESE CONNECTIONS VIA INTERCONNECT [40 pin FPC connector] CURRENT MEASURE CHARGER Li-ion Battery HIGH POWER WHITE LED IR LED (TX) SMA CONN Key-socket selection Operated together SPI Optional JUMPER SEL Key-socket selection CURRENT MEASURE POWER SUPPLIES (from USB / Battery) POOL-B I2C FINGERPRINT SENSOR I2S MIC#1 RGB LED 3 SMA CONN IR RX I2S MIC#2 POOL-B I2C POOL-A I2C TMD27711 (I2C) Proximity & ALS #2 iCE40 Ultra Mobile Development Platform User Guide Figure 2. Top View of Main Unit IR LED (Emitter) Jumper selection between IR and White High Power LEDs BLE Module BMP180 Pressure Sensor MAX4408 RGB ALS Sensor CDONE LED High Power White LED RGB LED iCE40 Ultra TMD2711 Proximity Sensor 27 MHz Oscillator External Power and Charging Status Indicator Barcode LED (Red) Power Switch CRST Button Power LED SMA Footprint FPC1080A Fingerprint Sensor TMD2711 Proximity Sensor J15 (Jumper Pool Header) SHT20 Humidity Sensor AP Connector IR Rx (TSMP58000) ADMP441 I2S Mic USB Port 4 iCE40 Ultra Mobile Development Platform User Guide Figure 3. Bottom View of Main Unit ADMP441 I2S Mic Key Socket Battery Connector LSM303DLHC Magnetometer Sensor LSM330DLC Accelerometer and Gyroscope Sensor FTDI FT2232H M25P80 SPI Flash USB Port 5 iCE40 Ultra Mobile Development Platform User Guide Features • Supports BLE (Bluetooth Low Energy) module • Supports OTA (Over-The-Air) configuration of FPGA • Form factor similar to mobile phone Sensor list The following table lists the different sensors used on the board. Table 1. Sensor List Number Sensor Function Interface Sensor Part Number 1 RGB LED (Variant 1) Direct 2 RGB LED (Variant 2) Direct APTF1616SEEZGQBDC Kingbright 3 High Current IR Tx LED (Variant A) Direct SFH4645 Osram Opto 4 High Current IR Tx LED (Variant B) Direct VSMB2948SL Vishay Semiconductor 5 High Current Visible LED Direct XBDA WT-00-000000000LCE3 Cree Inc. 6 IR Rx Direct TSMP58000 Vishay Semiconductor 7 Proximity Sensor (Two numbers) I2C TMD27711 A MS-TA OS USA Inc 8 RGB Light Sensor I2C MAX44008 Maxim-IC 9 Temperature Sensor I2C BMP180 (integrated) Bosch 10 Barometric Pressure I2C BMP180 Bosch 11 Accelerometer I2C LSM330DLC ST Micro 12 Gyroscope I2C 13 Magnetometer I2C LSM303DLHC ST Micro 14 Humidity 15 Hall AEBMT-RGBZ Manufacturer I2C Direct AOT SHT20 Sensirion BU52051NV X-TR Rohm Semiconductor 16 Fingerprint SPI FPC1080A Fingerprints 17 MEMS Mic (Two numbers) I2S ADMP441 Invensense Key-socket Arrangement Three predefined keys and one user defined key is provided to allow the user to change the wiring of the board between different sensor sets as described in Table 2. The table also denotes pin assignments to the iCE40 Ultra FPGA on the board. While selecting and inserting a particular key of choice, ensure that you align the aligning arrow on the key and on the main PCB. The keys are mechanically delicate, and hence, you must be careful while inserting and removing the keys. Figure 4 shows the four keys and socket on the main board. 6 iCE40 Ultra Mobile Development Platform User Guide Figure 4. Key-socket Arrangement Orient the direction of the key using these arrows Pin assignments iCE40 Ultra FPGA Table 2 lists the complete pin assignments for the iCE40 Ultra FPGA for the different keys and other hard wired peripherals on the board Table 2. Pin Assignment Pin Number Pin Name Bank Pin Assignment for Default Key A Pin Assignment for Key B Pin Assignment for Key C A4 VCCIO_0 Bank 0 3V3 3V3 3V3 B5 IOT_46B_G0 Bank 0 Not used / Optional ext SMA clock Not used / Optional ext SMA clock I2S_WS1 (Microphone 1 (DP R51)) A6 RGB2 Bank 0 BLED (RGB LED) BLED (RGB LED) I2S_CE1 (Microphone 1) B6 RGB1 Bank 0 GLED (RGB LED) GLED (RGB LED) I2S_SCK1 (Microphone 1) C6 RGB0 Bank 0 RLED (RGB LED) RLED (RGB LED) I2S_SD1 (Microphone 1) A2 IRLED Bank 0 HPLED (IRLED or VLED) HPLED (IRLED or VLED HPLED (IRLED or VLED A1 VSSIO_LED Bank 0 GND GND C3 SPI_VCCIO1 Bank 1 3V3 3V3 3V3 D1 IOB_33B_SI_M Bank 1 OSI_SPI1 ICE_SI/FLSH_MOSI ICE_SI/FLSH_MOSI ICE_SI/FLSH_MOSI F2 IOB_32A_SO_ MISO_SPI1 ICE_SO/FLSH_MISO ICE_SO/FLSH_MISO ICE_SO/FLSH_MISO E1 IOB_34A_SCK_ Bank 1 SCK_SPI1 FLSH_SCLK FLSH_SCLK FLSH_SCLK F1 IOB_35B_SS_ MCSNO_SPI1 FLSH_CS FLSH_CS FLSH_CS E4 IOB_12A_G4_C Bank 1 DONE CDONE CDONE CDONE D3 CRESET_B Bank 1 CRESET CRESET CRESET B2 IOB_31B Bank 1 HALL_OUT/BMP_XCLR HALL_OUT/BMP_XCLR HALL_OUT/BMP_XCLR C1 IOB_30A Bank 1 PoolA_Sensor_SDA PoolA_Sensor_SDA PoolA_Sensor_SDA E2 IOB_29B Bank 1 Pool_Sensor_SCL Pool_Sensor_SCL Pool_Sensor_SCL D2 IOB_27B Bank 1 CLK_STNDBY# (Osc. Standby) CLK_STNDBY# (Osc. Standby) CLK_STNDBY# (Osc. Standby) B1 IOB_26A Bank 1 FP_RSTn (Fingerprint reset) FP_RSTn (Fingerprint reset) FP_RSTn ( Fingerprint reset) E3 IOB_20A Bank 1 UART_TX (BLE) UART_TX (BLE) UART_TX (BLE) Bank 1 Bank 1 GND 7 iCE40 Ultra Mobile Development Platform User Guide Pin Number Pin Name Bank Pin Assignment for Default Key A Pin Assignment for Key B Pin Assignment for Key C F3 IOB_16A Bank 1 UART_RX (BLE) UART_RX (BLE) UART_RX (BLE) B4 IOB_10A Bank 1 PROC_INTR PROC_INTR PROC_INTR C2 IOB_25B_G3 Bank 1 PROC_CS PROC_CS PROC_CS F4 IOB_11B_G5 Bank 1 CLK (27 MHz) CLK (27 MHz) CLK (27 MHz) C4 VCCIO_2 Bank 2 3V3 3V3 3V3 E5 IOB_7B Bank 2 BAR_LED FP_INTR (Fingerprint) S_LR2 (Microphone 2) F5 IOB_6A Bank 2 IR_IN (IR Rx) IR_IN (IR Rx) I2S_LR1 (Microphone 1) D5 IOB_5B_MCSN 0_SPI2 Bank 2 Spare GPIO on Exp Header p.16 FP_CS (Fingerprint) I2S_WS2 (Microphone 2) D6 IOB_4A_SCK_ SPI2 Bank 2 PoolB_Sensor_SCL FP_SCK (Fingerprint) I2S_SD2 (Microphone 2) E6 IOB_3B_G6_M OSI_SPI2 Bank 2 PoolB_Sensor_SDA FP_MOSI (Fingerprint) ISS_SCK2 (Microphone 2) F6 IOB_2A_MISO_ SPI2 Bank 2 Spare GPIO on Exp Header p.20 FP_MISO (Fingerprint) I2S_CE2 (Microphone 2) D4 VPP_2V5 Power 2V5 2V5 2V5 B3 VCCPLL Power 1V2 1V2 1V2 A5 VCC Power 1V2 1V2 1V2 C5 GND1 Power GND GND GND A3 GND2 Power GND GND GND External Interfacing The board can be interface to external systems by one of two methods: • SPI based application processor interface via J16 (AP Conn) • BLE wireless module For DragonBoard based SPI based application processor interfacing, a DragonBoard interfacing module and a connecting ribbon cable are required (provided). Figure 5 shows the interfacing module, connecting cable, and method to power the module from the DragonBoard. A BLE module provides a feature on the board for wireless interfacing using Bluetooth Low energy version 4. 8 iCE40 Ultra Mobile Development Platform User Guide Figure 5. Data and 5 V Wiring from DragonBoard to DB Interface Module Clocking The board features an onboard 27 MHz oscillator. When an external clock is required, the SMA footprint can be populated with a suitable SMA SMD connector (such as Molex part # 732511350). You must depopulate R51 on the board. Daisy Chain Interconnect / Expansion Connector Daisy chain interconnect to the iCE FPGA by means of a connecting cable between two boards is possible via J10 on the main board. Refer to the schematics for the pin assignments of J10. All the pins of the FPGA are accessible on this connector – and hence also forms a convenient way to tap into, or expand from any pin on the FPGA. Basic Usage Procedures Powering the Board The board may be powered using one of three following methods: • USB cable: USB A to mini B cable (supplied) connected to a PC may be used to power the board • +5 V supplied to the DragonBoard interface module used to power the board through the provided ribbon cable. The +5 V can be tapped from the DragonBoard as indicated in the Figure 5. • Internal rechargeable battery not supplied with the kit. It must be procured separately. An example is the Nokia BL-5C Lithium-ion battery shown in Figure 7. Charging the Battery The battery is charged when USB power is applied. Glowing of the green LED D3 (CHG) indicates the charging of the battery. Glowing of the green LED D4 (EPW) indicates that an external charging power (USB) is applied. Glowing D3 indicates that charging is in progress. If D3 does not glow and D4 (EPW) glows, it means that charging is complete. 9 iCE40 Ultra Mobile Development Platform User Guide Figure 6. USB Socket Located on the Lower Side Figure 7. Nokia BL-5C Li-ion Battery Mounted Inside Back-cover of the Main Unit Configuring the FPGA The iCE40 Ultra can be configured using one of two methods: • By programming the on-board SPI Flash U3 (ST Micro's M25P80) • By directly configuring the FPGA using a processor to configure via iCE40 Ultra's SPI Configuration by Programming SPI Flash The SPI Flash (M25P80) can be programmed using the on-board FTDI's FT2232H (USB-SPI FIFO) via USB and Lattice Diamond® Programmer. To program the SPI Flash via USB and Lattice Diamond Programmer: 1. Apply a jumper to FLCS on jumper pool header J15. 2. Connect the USB cable to the demo board. 3. Download the bitstream in SPI Flash (M25P80) using Lattice Diamond Programmer. To download the bitstream: a. Open Diamond Programmer version 3.2 or above and select Create a new blank project as shown in Figure 8. 10 iCE40 Ultra Mobile Development Platform User Guide Figure 8. Diamond Programmer Getting Started Dialog Box b. The Diamond Programmer main interface opens, as shown in Figure 9. Figure 9. Diamond Programmer Main Interface c. Select iCE5LP in Device Family and iCE5LP4K in Device, as shown in Figure 10. 11 iCE40 Ultra Mobile Development Platform User Guide Figure 10. Device Selection d. Double-click Fast Program and choose the desired *.bin file. e. In the Device properties dialog box, select the program to be used in programming the device and click OK, as shown in Figure 11. Figure 11. Device Properties Dialog Box 12 iCE40 Ultra Mobile Development Platform User Guide e. Verify that the operation is completed successfully. In the main interface, INFO: Operation: successful is displayed in the Output pane. Figure 12. Verifying Operation Alternatively, the SPI Flash can be programmed using Totalphase's Aardvark or Cheetah. Flash Center GUI flash programming utility can be hooked up to the J29 (SPI PGM) header on the DragonBoard interfacing module. To program the SPI Flash using Aardvark/Cheetah: 1. Apply a jumper on FLCS located on jumper pool header J15. 2. Ensure that the ribbon cable is connected between J16 (AP CONN) on main board and J26 (AP Interconnect) on the DragonBoard interfacing module. 3. Remove shunt on J20 (PGM) header on the DragonBoard interfacing module. 4. Connect Aardvark / Cheetah to the J29 (SPI PGM) header on the DragonBoard interfacing module and its USB to the PC/Laptop running the Flash Center GUI utility. 5. While operating the CRST button or applying the jumper on CRST of J15 (on the main board), use the Flash Center GUI and appropriate bitmap to program the M25P80 SPI Flash. 6. After programming, remove the shunts on CRST and PGM. Direct Configuration by a Processor (Processor Configuration) The iCE40 Ultra FPGA can be configured directly without using an external SPI Flash. This can be done by the application processor interfacing with the iCE40 Ultra SPI lines. While using this method appropriate software and Android Application is required. To configure the hardware: 1. Remove the jumper shunt on FLCS located on J15 (jumper pool header). 2. Apply a jumper shunt on FTRST located on J15 (jumper pool header). 3. Remove the jumper shunt on CRST located on J15 (jumper shunt header). 13 iCE40 Ultra Mobile Development Platform User Guide 4. Using the ribbon cable provided, connect the main PCB and the DragonBoard through the DragonBoard interfacing module. 5. Run the appropriate software / application to configure iCE40 Ultra directly from the DragonBoard processor. Current Measurements FPGA currents are measured by inserting ammeters in series with the respective current paths. This is achieved by means of removing the jumper shunts on the pooled jumper header J15, and replacing those by ammeters. Note the legends printed across each of the jumpers on the PCB and the corresponding wiring in the schematics around region of J15 to make the desired measurements. Current measurements for the high power LED (IR or white) can be done at J9 (LED selecting 3 pin jumper). Note that RGB LED current measurements on J15 (jumper pool header) is for the common Anode limb of the LED and not individual RGB circuits; Thus appropriate drive must be made to measure individual RG Technical Support Assistance Submit a technical support case via www.latticesemi.com/techsupport Revision History Date Version June 2015 1.1 Change Summary General update in multiple sections. Updated Appendix A. Schematic Diagrams section. Added Appendix B. Bill of Materials section. June 2014 01.0 Initial release. © 2015 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 14 A B C D R8 10k VCCIO1 C16 10n 5 VCCIO1 7 2 3 C77 0.1u U22 1 6 5 4 15 16 17 18 19 20 CAP DEN_G DRDY_G/INT2_G INT1_G INT2_A INT1_A U5 LSM330DLC PRESSURE SENSOR poolA_sensor_SDA poolA_sensor_SCL 6 5 4 3 2 1 C11 10u poolA_sensor_SDA poolA_sensor_SCL GND1 RES3 RES2 RES1 RES0 GND0 VCC3V3 C14 0.1u 4 3 J13 ASDA J14 ASCL 1 1 R42 4k7 VCCIO1 R41 4k7 3 [Pg7] [Pg7] VCCIO1 C50 0.1u 4 3 C53 10u VCCIO1 poolA_sensor_SDA poolA_sensor_SCL poolA_sensor_SCL poolA_sensor_SDA DEFAULT VCCIO1 IS SET TO 3.3V GYROSCOPE & ACCELEROMETER SENSOR Notes: - Gyro and Accelerometer interfaces are both set to I2C - I2C address LSB for both Gyro and Accelerometer is '1' - SPI for both Gyro and Accelerometer is disabled C25 0.1u VCCIO1 R9 DNP BMP180 VDD NC1 VDDIO SDA SCL GND NC4 C79 1u 14 13 12 11 10 9 8 7 4 4 3 1 OUT GND 1 2 TMD27711 LEDA GND VDD U16 SCL SDA INT LEDK LDR 10k 2 2 8 7 5 6 R33 A0 VDD GND VCCIO1 C59 1u [Pg7] 2 HALL SENSOR Hall_out RGB ALS SENSOR 1 2 3 PROXIMITY SENSOR-2 Hall_out MAX44008 SDA SCL INT U18 BU52051NVX VDD NC U13 6 5 C57 1u poolA_sensor_SDA poolA_sensor_SCL C56 1u 4 5 RES8 RES7 RES6 RES5 RES4 VDD2 VDD1 VDD0 VDD_IO_0 CS_G CS_A SCL_A/G VDD_IO_1 SDO_G SDO_A SDA_A/G 21 22 23 24 25 26 27 28 15 TPAD 5 Date: Size B Title Wednesday, April 22, 2015 Document Number 102-379-0314 Pool-A I2C Sensors 1 Sheet 2 of iCE5LP Mobile Development Platform Rev B 10 Re v 0 LATTICE SEMICONDUCTOR CORPORATION CONFIDENTIAL 1 A B C D iCE40 Ultra Mobile Development Platform User Guide Appendix A. Schematic Diagrams Figure 13. Pool-A I2C Sensors A B C D GND OUT VDD C8 0.22u C15 4.7u C6 0.1u 5 VDD SDA SCL poolB_sensor_SCL poolB_sensor_SDA 6 1 U14 SHT20 3 2 1 R22 100 VCCIO2 13 12 11 10 6 5 SETC SETP RES2 RES1 C1 U4 LSM303DLHC GND INT1 INT2 SDA SCL COMPASS SENSOR 9 5 4 poolB_sensor_SCL poolB_sensor_SDA 3 C1 0.1u 2 C5 1u DRDY VCC3V3 [Pg7] IR RX MODULE IR_IN Humidity, Temperature Sensor NC1 NC2 PAD VCCIO2 TSMP58000 U11 C49 4.7u 3 4 7 VSS 2 0.1u VCCIO2 14 VDD 1 VDDIO GND NC 16 7 8 C52 5 4 C58 10u VCCIO2 C76 0.1u 4 2 4 GND VDD 1 1 R3 4k7 OUT STDBY# R43 10k R5 4k7 3 1 poolB_sensor_SCL 4 3 1 TMD27711 LEDA GND VDD U15 SCL SDA INT LEDK LDR 10k 2 8 7 5 6 R29 [Pg7] PROXIMITY SENSOR-1 poolB_sensor_SDA poolB_sensor_SCL C55 1u C51 1u clk clk_stndby# poolB_sensor_SDA CLOCK OSCILLATOR U21 ASFLMB-27.000MHZ-LC-T VCCIO2 J1 BSDA J2 BSCL VCCIO2 3 [Pg7] [Pg7] [Pg7] DEFAULT VCCIO2 IS SET TO 3.3V 3 2 2 Date: Size B Title Wednesday, April 22, 2015 Document Number 102-379-0314 Pool-B I2C Sensors, IR Rx & Clocking 1 Sheet 3 of iCE5LP Mobile Development Platform Rev B 10 Rev 0 LATTICE SEMICONDUCTOR CORPORATION CONFIDENTIAL 1 A B C D iCE40 Ultra Mobile Development Platform User Guide Figure 14. Pool-B I2C Sensors, IR Rx and Clocking 17 A B C [Pg5] M25P80_CSn To jumper pool Default: Shunt [Pg7] [Pg4,5,7] 5 flsh_sclk R4 10k ice_SO R37 0 ice_SI flsh_sclk proc_intr 2 4 6 8 10 1 3 5 7 9 R6 10k 6 5 1 3 VCCIO1 R13 0 2 7 ice_SO proc_cs flsh_cs [Pg4,7] [Pg7] [Pg4,5,7] flsh_miso ice_SI flsh_miso R2 10k flsh_miso [Pg5] AP INTERCONNECT ice_SO proc_cs flsh_cs 4 SPI CONFIGURATION / FLASH SDO HOLD VCC SCK GND SDI CS WP M25P80 U3 R12 0 C9 0.1u Note position of pin#1 in reference board CRSTb flsh_mosi flsh_mosi CRSTb ice_SI flsh_sclk proc_intr 8 [Pg4,7] [Pg4,5,7] DRGN5V [Pg7] J16 AP INTERCONNECT SWCLK SWDIO CRSTb flsh_cs ice_SO ice_SI flsh_sclk [Pg7] [Pg7] [Pg4,5,7] [Pg4,5,7] [Pg4,7] [Pg4,7] [Pg4,5,7] 3 3 C17 0.1u R76 DNP 0 R77 DNP 0 R45 DNP 0 R48 DNP DNP 0 R67 DNP 0 R68 0 R75 DNP 0 VCC3V3 R40 0 GND SWCLK SWDIO VCC p13 p12 p11 p10 p9 R35 0 SeeedBLE 1 2 3 4 5 6 7 8 9 U30 UART_RX UART_RX 4 UART_TX UART_TX D 4 2 GND p18 p17 p23 p24 p25 p28 p29 p30 p8 p7 p6 p5 p4 p3 p2 p1 p0 2 10 11 12 13 14 15 16 17 18 [Pg7] 27 26 25 24 23 22 21 20 19 R7 10k CDONE 1 2 3 J18 [Pg5,7] 1 SEEED BLE MODULE BLE PROG SEL VCC3V3 Manufacturer = Osram PART_NUMBER = LS L29K-G1J2-1-Z Date: Size B Title Wednesday, April 22, 2015 Document Number 102-379-0314 INTERCONNECTS 1 Sheet 4 of iCE5LP Mobile Development Platform Rev B 10 Rev 0 LATTICE SEMICONDUCTOR CORPORATION CONFIDENTIAL DNP D14 RED R78 820 VCC3V3 1 2 5 A B C D iCE40 Ultra Mobile Development Platform User Guide Figure 15. Interconnects [Pg7] A B C D C24 0.1u GND VCC GND 5 [Pg7] VCC3V3 C44 0.1u GND U6 93LC56BT-I/OT L3 2 6 600 ohm, 500 mA VCC3V3 VCC3V3 2k2 1k C30 4.7u C37 27p 12MHz Y1 C23 27p FTVCOR R20 C47 0.1u VCC3V3 C19 0.1u Gnd_1 OSCI OSCO VPHY Gnd_7 REF DM DP VPLL AGnd Gnd VCORE_1 TEST RESET# Gnd_2 ADBUS0 FT_DO FT_DI FT_CS 1 2 3 4 5 12k R18 6 USB_DM R16 7 10 USB_DP R17 8 10 9 10 GND 11 C43 FTVCOR GND 12 4.7u 13 GND 14 15 GND FT_SK 16 C29 0.1u EP_CS EP_CLK 4 5 EP_DI 1 R10 3 FTRSTn CS CLK DI DO R11 EP_CS EP_CLK EP_DI 10k [Pg4,7] CDONE flsh_miso flsh_sclk flsh_cs flsh_mosi [Pg4,7] VCC3V3 CRSTb 4 FT_CDONE FT_CRST 470 R23 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 C48 0.1u C20 0.1u FTVCOR C21 10u VCC3V3 BCBUS0 Gnd_5 BDBUS7 BDBUS6 BDBUS5 BDBUS4 VCCIO_2 BDBUS3 U9 BDBUS2 BDBUS1 FT2232H BDBUS0 VCORE SUSPEND# Gnd_4 ACBUS7 ACBUS6 GND [Pg4] [Pg4,7] [Pg4,7] [Pg4] 4 GND 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 VCORE_3 EECS EECLK EEDATA PWREN# BCBUS7 BCBUS6 BCBUS5 VCCIO_1 BCBUS4 BCBUS3 BCBUS2 BCBUS1 Gnd_6 VREGIN VREGOUT C22 0.1u R27 R25 R21 R26 R24 R28 C38 0.1u VCC3V3 FTVCOR FT_CDONE FT_DI FT_SK FT_CS FT_DO FT_CRST 3 FTDI PROGRAMMER VCC3V3 0 0 0 0 0 0 3 L1 600 ohm, 500 mA S2 S4 2 C18 47u S3 S1 J5 USB PWR C13 0.1u USB5V 2 USB - POWER & PROGRAMMING L2 600 ohm, 500 mA 5 G ADBUS1 ADBUS2 ADBUS3 VCCIO ADBUS4 ADBUS5 ADBUS6 ADBUS7 Gnd_3 ACBUS0 ACBUS1 ACBUS2 ACBUS3 ACBUS4 VCCIO_3 ACBUS5 4 ID 18 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 3 D+ USB_DP 2 D- USB_DM 1 5V 5 Date: Size B Title Wednesday, April 22, 2015 Document Number 102-379-0314 USB Programming & Power 1 Sheet 5 of iCE5LP Mobile Development Platform Rev B 10 Re v 0 LATTICE SEMICONDUCTOR CORPORATION CONFIDENTIAL 1 A B C D iCE40 Ultra Mobile Development Platform User Guide Figure 16. USB Programming and Power 19 A B C D D6 TVS/VAR 5 I2S_SD1 R66 100k VCCIO0 R30 100 C36 0.1u 1 13 17 29 20 21 8 9 10 16 15 32 6 7 8 9 ADMP441 GND1 VDD CE GND2 U19 FPC1080A DR1 DR2 DR3 DR4 TXOUT1 TXOUT2 ANATEST1 ANATEST2 TEST4 TEST3 TEST2 TEST1 U17 2 7 12 14 GND7 GND8 GND9 GND10 GND1 GND2 GND3 GND4 18 22 23 28 5 GND LR WS SD SCK 4 3 2 1 SPICLK MISO MOSI CSN RSTN IRQ VDD1 VDD2 VDDA VDDIO GND5 GND6 [Pg7] C63 0.1u C66 0.1u [Pg7] FP_INTR C60 0.1u [Pg7] [Pg7] [Pg7] [Pg7] FP_SCK FP_MISO FP_MOSI FP_CS FP_RSTn 4 R62 10k I2S_CE1 I2S_LR1 I2S_WS1 I2S_SD1 I2S_SCK1 [Pg7] [Pg7] [Pg7] [Pg7] [Pg7] FINGERPRINT SENSOR 24 26 25 6 5 4 3 19 11 27 31 30 4 R73 100k C46 0.1u C54 0.1u VCC1V8 VCCIO2 R34 10k VCCIO2 I2S_SD2 3 6 7 8 9 VCCIO2 FP_CS ADMP441 GND1 VDD CE GND2 U12 R61 10k VCCIO2 3 5 GND 5 4 3 2 1 R63 10k I2S_CE2 I2S_LR2 I2S_WS2 I2S_SD2 I2S_SCK2 [Pg7] [Pg7] [Pg7] [Pg7] [Pg7] I2S MICROPHONES - 2 LR WS SD SCK 2 2 Date: Size B Title Wednesday, April 22, 2015 Document Number 102-379-0314 1 Sheet 6 I2S MIC, FINGERPRINT SENSORS and MICRO SD of iCE5LP Mobile Development Platform Rev B 10 Rev 0 LATTICE SEMICONDUCTOR CORPORATION CONFIDENTIAL 1 A B C D iCE40 Ultra Mobile Development Platform User Guide Figure 17. I2S MIC, Fingerprint Sensors and Micro SD A B C D J15 2 500mA track VIS VCC3V3HP A D5 5 K [Pg5] D1 F2 E1 F1 E4 D3 CDONE CRSTb 2 R47 [Pg4] 500mA track VCC3V3HP IR D7 RGB Anode Red D12 C78 0.1u C75 10n 4 BLED GLED C68 C62 0.1u 1u 100 R44 C65 10n RLED 2 GLED 3 A B 4 1 4 Bank 0 ALTERNATE RGB LED IRLED VSSIO_LED RGB2 RGB1 RGB0 IOT_46B_G0 VCCIO_0 BAR D8 0 3 R14 150 R39 C64 10n C70 10n C61 C67 0.1u 1u C69 C72 0.1u 1u GPIO_B2 C90 0.1u CRSTb VCCIO1 Note: Place close to DUT J17 SMA 4 5 Sh2 A Sh1 2 3 1 SMA_CLK OPTIONAL SMA CLOCK DNP Sh3 Sh4 2 I2S_LR2 I2S_CE2 [Pg6] I2S_SCK2 I2S_SD2 I2S_SD1 I2S_CE1 2 [Pg6] [Pg6] [Pg6] [Pg6] [Pg6] GPIO_B5 De-populate when using SMA CLK R51 0 I2S_WS1 [Pg6] 500mA track HPLED 500mA track GPIO_A6 GPIO_B6 GPIO_C6 A6 B6 C6 A2 A1 GPIO_B5 VCCIO0_A4 GPIO_E5 GPIO_F5 GPIO_D5 GPIO_D6 GPIO_E6 GPIO_F6 B5 A4 E5 F5 D5 D6 E6 F6 PB SW3 R49 10k CRST C4 VCCIO2_C4 DONE D9 LED VCCIO_2 BAR_LED 3 CDONE IOB_7B IOB_6A IOB_5B_MCSN0_SPI2 IOB_4A_SCK_SPI2 IOB_3B_G6_MOSI_SPI2 IOB_2A_MISO_SPI2 RGB_Anode BLED R46 2k2 VCCIO1 Hall_out R38 2k2 Bank 2 APTF1616SEEZGQBDC R G D13 iCE5LP4KSWG36 IR, RGB and HI-POWER LEDs IRLED 500mA track Blue Green 1 iCE5LP4KSWG36 IOB_31B IOB_30A IOB_29B IOB_27B IOB_26A IOB_20A IOB_16A IOB_10A IOB_25B_G3 IOB_11B_G5 IOB_12A_G4_CDONE CRESET_B IOB_33B_SI_MOSI_SPI1 IOB_32A_SO_MISO_SPI1 IOB_34A_SCK_SCK_SPI1 IOB_35B_SS_MCSNO_SPI1 SPI_VCCIO1 U20 GPIO_D6 B2 C1 E2 D2 B1 E3 F3 B4 C2 CLK_F4 F4 RGB_Anode 3 100mA track RLED DNP proc_intr proc_cs 0 C3 ice_SI ice_SO flsh_sclk flsh_cs GPIO_B2 poolA_sensor_SDA poolA_sensor_SCL GPIO_D2 0 R74 GPIO_B1 1VLED 500mA track Default: Shunt 1,2 (for IR LED) J9 HP LED SEL All 500mA traces 1 VLED 2 HPLED 3 IRLED All 500mA traces FTRSTn M25P80_CSn JUMPER POOL HEADER CRSTb VCC_A5 VCCPLL_B3 VPP2V5_D4 VCCIO0_A4 SPIVCCIO1_C3 VCCIO2_C4 RGB_Anode 100mA track SPIVCCIO1_C3 clk_stndby# Pg[3] clk [Pg6] FP_RSTn Pg[4] UART_TX Pg[4] UART_RX Note: Place close to DUT [Pg3] 1 3 5 7 9 11 13 15 17 19 A3-20PA-2SV(71) 2 4 6 8 10 12 14 16 18 20 VCC1V2 C74 C73 C71 1u 0.1u 10n 100mA track flsh_cs VCC3V3HP VCCIO0 VPP2V5_D4 VCC2V5 Note: Place close to DUT VCCPLL_B3 VCCIO1 CONFIG SPI & Bank 1 4 GND2 VCCIO2 3 3 VCC_A5 A5 VCC B3 VCCPLL D4 VPP_2V5 GND1 C5 20 A3 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 GND SWCLK SWDIO I2S_SCK1 RLED poolB_sensor_SCL BLED GLED [Pg6] IR_IN CON40A J10 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 poolA_sensor_SDA GPIO_B1 VCCPLL_B3 proc_intr VCCIO2_C4 GPIO_B5 GPIO_C6 GPIO_D5 VPP2V5_D4 GPIO_F6 CDONE CLK_F4 UART_RX ice_SO poolA_sensor_SCL flsh_sclk ice_SI GND GND GND IR_IN CDONE CRSTb Hall_out poolB_sensor_SCL poolB_sensor_SDA [Pg4,5] [Pg4,5] [Pg2] [Pg3] poolA_sensor_SDA poolA_sensor_SCL flsh_cs [Pg4,5] [Pg4,5] flsh_sclk ice_SI [Pg4] [Pg4] proc_intr [Pg4] ice_SO proc_cs [Pg4] [Pg3] [Pg3] [Pg2] [Pg2] DAISY CHAIN INTERCONNECT 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 I2S_LR1 KEY & SOCKET HEADER [Pg6] [Pg6] [Pg6] FP_INTR FP_MISO FP_SCK [Pg6] FP_CS [Pg6] I2S_WS2 [Pg6] poolB_sensor_SDA FP_MOSI [Pg6] BAR_LED SPIVCCIO1_C3 proc_cs GPIO_B2 HPLED VCCIO0_A4 VCC_A5 GPIO_A6 GPIO_B6 GPIO_D6 GPIO_E6 GPIO_E5 GPIO_F5 UART_TX flsh_cs CRSTb GPIO_D2 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 1 Date: Size B Title Wednesday, April 22, 2015 Document Number 102-379-0314 iCE5LP4KSWG36 FPGA & LEDs 1 Sheet 7 of iCE5LP Mobile Development Platform Rev B 10 Re v 0 LATTICE SEMICONDUCTOR CORPORATION CONFIDENTIAL [Pg4] [Pg4] VCC3V3 KEY GPIO_F5 GPIO_F6 GPIO_E5 GPIO_D5 GPIO_E6 GPIO_D6 GPIO_B6 GPIO_C6 GPIO_A6 J7 31 32 5 A B C D iCE40 Ultra Mobile Development Platform User Guide Figure 18. iCE5LP4KSWG36 FPGA and LEDs A B C 5 LED GREEN YELLOW 1k 1k LED D4 C2 1u USB5V R31 R32 D3 C45 10u C7 10u VDC C42 10u VCC1V8 C39 0.1u VCC3V3 C10 C12 47u 0.1u 500mA traces VDC 4 3 2 1 U1 C41 10u CE Vin Vss NC Vout 4 5 nEN nCHG nPPR 3V3EN 3V3VO U2 MIC5335-SJYMT VIN VDC 4 6 3 1 U8 XC6222B331MR-G 3 5 1 2V5EN 2V5VO GND nFAST ISET BAT 3 5 5 C4 10u 4 2.2u C28 0.1u VCC1V2 3 2 1 6 7 4 5 CHARGER Bat connector MH1 GND MH2 NTC VIN NC1 NC2 BC1 LDO REGULATORS C40 10u C26 VCC2V5 0.1u LDO_CE_VDC 500mA traces C27 10u VBAT 2 6 C3 5k6 1.2EN 1.2VO 6 R1 7 8 MC34673AEPR2 1.8EN 1.8VO 4 C31 C32 10u 0.1u VCC3V3HP 500mA traces U10 AP7312-1218FM-7 GND PAD VIN 2 7 D VIN 1 GND 4 EPAD 7 2 EPAD 9 1 VCCIO0 J3 GND 1 Default: 3V3 0 DNP DNP J11 GND R52 R53 R54 1 VCC3V3 VCC2V5 VCC1V8 C35 10u VBAT USB5V DRGN5V 3 3 1 Ctl In U7 LTC4411 4 5 C34 10u VDC SW2 PWR R55 R56 R57 Default: 3V3 0 DNP DNP POWER SOURCE SELECTOR Stat Out D1 PMEG2010AEH D2 PMEG2010AEH VCCIO1 VDC spread across board, easy access J12 GND PWR D10 LED R50 1k VCC3V3 3 Gnd 21 2 5 2 2 VCC3V3 VCC2V5 VCC1V8 C33 0.1u R58 R59 R60 Default: 3V3 0 DNP DNP VCC3V3 VCC1V8 VCC2V5 R19 1k Date: Size B Title Wednesday, April 22, 2015 Document Number 102-379-0314 Power Supplies 1 Sheet 8 of iCE5LP Mobile Development Platform Rev B 10 Re v 0 LATTICE SEMICONDUCTOR CORPORATION CONFIDENTIAL VCCIO2 LDO_CE_VDC 1 A B C D iCE40 Ultra Mobile Development Platform User Guide Figure 19. Power Supplies A B C 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 J21 DF12B(3.0)-30DP-0.5V(86) 5 KEY-D (CUSTOM KEY) CON15 J23 32 KEY-A (DEFAULT) 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 31 J4 DF12B(3.0)-30DP-0.5V(86) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 4 KEY-B (GETS FP ILO PoolB) CON15 J22 4 J6 DF12B(3.0)-30DP-0.5V(86) 31 32 D 31 22 32 3 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 3 KEY-C (GETS I2S MICs ILO PoolB, IR Rx, RGB) 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 J8 DF12B(3.0)-30DP-0.5V(86) 31 32 5 2 2 Date: Size B Title Wednesday, April 22, 2015 Document Number 102-379-0314 KEYS (4 different PCB modules) 1 Sheet 9 of iCE5LP Mobile Development Platform Rev B 10 Rev 0 LATTICE SEMICONDUCTOR CORPORATION CONFIDENTIAL 1 A B C D iCE40 Ultra Mobile Development Platform User Guide Figure 20. Keys (4 Different PCB Modules) A B C D 5 GND1 NC2 NC1 MOSI GND2 J29 Aardvark Header SS2 SS3 MISO SCLK SS1 VCC1V8V 10k SPI_MISO 16 15 14 13 12 11 10 9 GPIO_PROC_CS 0 R72 SPI_MISO SPI_CS 4 J20 PRGM SPI_MISO SPI_MOSI SPI_CLK GPIO_PROC_CS VCC1V8V VLTOE VCCA VCCB B1 B2 B3 B4 GND OE 74AVC4T774 DIR1 DIR2 A1 A2 A3 A4 DIR3 DIR4 R70 1 2 3 4 5 6 7 8 U23 C84 0.1u J28 DNP 1 3 5 7 9 J26 10p 2mm SPICS3V3 SPI_MOSI 2 SPI_CLK 4 6 INTRV VCC5VLT 8 CReset3V3 10 MISO FOR iCE, MOSI FOR FLASH SPI_MISO_1V8 SPI_MOSI_1V8 SPI_CLK_1V8 CS 2 4 6 8 10 1 3 5 7 9 11 13 15 INTRV_1V8 17 SPI_CS_1V8 19 SPI_CLK_1V8 21 23 GPIO_CS_1V8 1 3 SPI_MOSI 5 SPI_CLK 7 GPIO_PROC_CS 9 MISO FOR iCE, MOSI FOR FLASH SPI_MOSI_1V8 SPI_MISO_1V8 CReset1V8 2 4 6 8 10 12 14 16 18 20 22 24 C83 0.1u C88 0.1u C80 10u VCCBVLT C86 10u VCC5VLT 3 TAB VOUT 2 VIN 0 R64 R65 DNP 4 2 3 C82 10u VCC3V3V 3 VCC3V3V TAB VOUT U25 LD1117-1V8 VCC1V8V 3 VIN U24 LD1117-3V3 4 GND 1 4 GND 1 C87 0.1u VCC1V8V +5V R71 VCC1V8V VCC5VLT 1 C81 C85 10u 0.1u TP10 INTRV_1V8 SPI_CS_1V8 10k CReset1V8 2 1 2 3 4 5 6 7 8 2 SPI_CS_1V8 1 0 R69 B A 16 15 VCCBVLT 14 INTRV SPI_CS 13 SPICS3V3 12 11 CReset3V3 10 9 VCC1V8V J24 SPICS GPIO_CS_1V8 2 Y 4 DNP C119 0.1u DNP CS 1 Date: Size B Title Wednesday, April 22, 2015 Document Number 102-379B-0314 DragonBoard VLT Adapter module 1 Sheet 10 of iCE5LP Mobile Development Platform Rev B 10 Re v 0 LATTICE SEMICONDUCTOR CORPORATION CONFIDENTIAL VLTOE VCCA VCCB B1 B2 B3 B4 GND OE C118 0.1u 74AVC4T774 DIR1 DIR2 A1 A2 A3 A4 DIR3 DIR4 U29 C89 0.1u VCC1V8V U26 SN74AUP1G08DBVR 5 VCC 5 3 2 1 2 1 23 1 2 GND 3 J27 24p 2p54mm A B C D iCE40 Ultra Mobile Development Platform User Guide Figure 21. DragonBoard VLT Adapter Module iCE40 Ultra Mobile Development Platform User Guide Appendix B. Bill of Materials Item Reference Quantity Part PCB Footprint 1 BC1 1 Bat connector BATT_009155003 301006 Comments Part Number — 0915500330100 6 Manufacturer Description AVX CONN BATTERY 3 POS RIGHT ANGLE 2 C1,C6,C9,C12,C13,C14,C17, C19,C20,C22,C24,C25,C26, C28,C29,C32,C33,C36,C38, C39,C44,C46,C47,C48,C50, C52,C54,C60,C61,C63,C66, C68,C69,C73,C76,C77,C78, C83,C84,C85,C87,C88,C89, C90,C118 45 0.1 u C0402 — CL05A104MP5N Samsung NNC CAP CER 0.1UF 10V 20% X5R 0402 3 C2,C5,C51,C55,C56,C57,C59, 12 C62,C67,C72,C74,C79 1u C0402 — CL05A105KP5N Samsung NNC CAP CER 1UF 10V 10% X5R 0402 4 C3 1 2.2 u C0603 — CC0603ZRY5V6 Yageo BB225 CAP CER 2.2UF 10V Y5V 0603 5 C4,C11,C21,C27,C31,C35,C4 0,C45,C53,C58,C81,C82 12 10 u C0603 — CL10A106MQ8 NNNC CAP CER 10UF 6.3V 20% X5R 0603 6 C7,C34,C41,C42,C80,C86 6 10 u C0603 — CL10X106MP8N Samsung RNC CAP CER 10UF 10V 20% X6S 0603 7 C8 1 0.22 u C0603 — CL10B224KO8N Samsung NNC CAP CER 0.22UF 16V 10% X7R 0603 8 C10,C18 2 47 u C3528 — TCJB476M010R AVX 0070 CAP TANT 47UF 10V 20% 1210 9 C15,C30,C43,C49 4 4.7 u C0603 — CC0603KRX5R6 Yageo BB475 CAP CER 4.7UF 10V 10% X5R 0603 10 C16,C64,C65,C70,C71,C75 6 10 n C0402 — CL05B103KO5N Samsung CNC CAP CER 10000PF 16V 10% X7R 0402 11 C23,C37 2 27 p C0402 — CL05C270JB5N NNC CAP CER 27PF 50V 5% NP0 0402 12 C119 1 0.1 u C0402 DNP 13 D1,D2 2 PMEG2010AEH SOD123F 14 D3 1 LED 15 D4 1 16 D5 17 Samsung Samsung CL05A104MP5N Samsung NNC CAP CER 0.1UF 10V 20% X5R 0402 — PMEG2010AEH, NXP Semicon115 ductor DIODE SCHOTTKY 20V 1A SOD123F led0603 — LG L29K-G2J124-Z Osram Opto LED SMARTLED GREEN 570NM 0603 LED led0603 — LY Q976-P1S236 Osram Opto LED CHIPLED 587NM YLW 0603 SMD 1 VIS XBDAWT — XBDAWT-00000000000LCE3 Cree Inc LED HIGH BRIGHTNESS D6 1 TVS/VAR R0603 — VC060330A650 DP AVX VARISTOR 36.9V 30A 0603 18 D7 1 IR IRD — VSMB2948SL Vishay IR EMITTER HIGH SPEED 940NM SMD 19 D8 1 BAR LED0805 — APT2012SRCP RV Kingbright Corp LED 2X1.2MM 640NM RD WTR CLR SMD 20 D9 1 LED led0603 — LG L29K-G2J124-Z Osram Opto LED SMARTLED GREEN 570NM 0603 21 D10 1 LED led0603 — LS Q976-NR-1 Osram Opto LED CHIPLED 633NM RED 0603 SMD 22 D12 1 RGB RGBD DNP AEBMTRGBZ Custom 23 D13 1 APTF1616SEEZ RGBOPT2 GQBDC 24 D14 1 RED LED0603 25 J1 1 BSDA 26 J2 1 BSCL 27 J3,J11,J12 3 28 J4,J6,J8,J21 29 — — APTF1616SEEZ KingbrightCorp GQBDC LED RED/GREEN/BLUE WTR CLEAR SMD DNP LS L29K-G1J21-Z Osram LED SMARTLED GREEN 570NM 0603 TP_TH_40_24_S DNP PCB MDN TP_TH_40_24_S DNP PCB MDN GND TUR_TH DNP 1573-2 Keystone Electronics TERMINAL TURRET DBL .082"L 4 DF12B(3.0)30DP-0.5V(86) HIROSE_DF12B_ 30_mirror — DF12B(3.0)30DP-0.5V(86) Hirose CONN HEADER 30POS 3MM SMD 0.5MM J5 1 USB PWR CONN_S5P1RMI NIUSBB_MOLEX — 67503-1020 Molex CONN RECEPT MINIUSB R/A 5POS SMD 30 J7 1 KEY HIROSE_DF12B_ 30 — DF12B(3.0)30DS-0.5V(86) Hirose CONN RCPT 30POS 3MM SMD 0.5MM 31 J9 1 HP LED SEL hdr1x3-40_2mm — NRPN031PARN- Sullins Connector Solutions RC CONN HEADER 2MM SINGLE R/A 3POS 32 J10 1 CON40A hdr20x2_2mm DNP 0877582016 Molex Inc CONN HEADER 20POS 2MM VERT GOLD 33 J13 1 ASDA TP_TH_40_24_S DNP PCB MDN 24 — — — iCE40 Ultra Mobile Development Platform User Guide Item Reference Quantity Part PCB Footprint 34 J14 1 ASCL TP_TH_40_24_S Comments Part Number DNP 35 J15 1 A3-20PA2SV(71) hirose_10x2_2m m 36 J16 1 AP INTERCONNECT 37 J17 1 38 J18 39 Manufacturer Description PCB MDN — A3-20PA2SV(71) Hirose CONN HEADER 20POS 2MM GOLD SMD hirose_5x2_2mm — A3-10PA2SV(71) Hirose CONN HEADER 10POS 2MM GOLD SMD SMA molex_07325113 50 DNP 732511350 Molex CONN SMA JACK STR 50 Ohm SMD 1 BLE PROG SEL hdr1x3-40_2mm — NRPN031PARN- Sullins ConnecRC tor Solutions CONN HEADER 2MM SINGLE R/A 3POS J20 1 PRGM HDR1X2-40 — 77311-801-02LF FCI CONN HEADER .100 SINGL STR 2POS 40 J22,J23 2 CON15 HDR1x15_2mm_ TH 41 J24 1 SPICS HDR1X2-40 — 77311-801-02LF FCI CONN HEADER .100 SINGL STR 2POS 42 J26 1 10p 2 mm hdr_5x2_2mm — 0877581016 Molex Inc CONN HEADER 10POS 2MM VERT GOLD 43 J27 1 24p 2p 54 mm hdr12x2_TH_2p5 4_mirror — M20-7831242 Harwin Inc 12+12 DIL VERT SOCKET L/FREE 44 J28 1 DNP hdr1x3-40 45 J29 1 46 L1,L2,L3 47 48 DNP PCB MDN — — DNP 77311-801-03LF FCI CONN HEADER .100 SINGL STR 3POS Aardvark Header hdr5x2 — 77313-801-10LF FCI CONN HEADER .100 SINGL STR 10POS 3 600 Ohm, 500 mA L0603 — MMZ1608R601A TDK Corp FERRITE CHIP 600 Ohm 500MA 0603 R1 1 5k6 R0402 — RC1005F562CS Samsung RES 5.6 kOhm 1/16W 1% 0402 R2,R4,R6,R7,R8,R11,R29, R33,R34,R43,R49,R61,R62, R63,R70,R71 16 10k R0402 — RC1005J103CS Samsung RES 10 kOhm 1/16W 5% 0402 49 R3,R5,R41,R42 4 4k7 R0402 — RC1005J472CS Samsung RES 4.7 kOhm 1/16W 5% 0402 50 R9 1 DNP R0402 DNP WR04X000PTL Walsin 51 R10,R38,R46 3 2k2 R0402 — RC1005J222CS Samsung RES 2.2 kOhm 1/16W 5% 0402 52 R12,R13,R35,R40 4 0 R0402 — RC1005J000CS Samsung RES 0.0 Ohm 1/16W JUMP 0402 53 R14 1 150 R0402 — RMCF0402JT15 Stackpole Elec0R tronics RES 150 Ohm 1/16W 5% 0402 54 R16,R17 2 10 R0402 — RC1005J100CS RES 10 Ohm 1/16W 5% 0402 55 R18 1 12k R0402 — RC1005F123CS Samsung RES 12 kOhm 1/16W 1% 0402 56 R19,R20,R31,R32,R50 5 1k R0402 — RC1005J102CS Samsung RES 1 kOhm 1/16W 5% 0402 57 R21,R24,R25,R26,R27,R28, R37,R39,R51,R52,R55,R58, R64,R69,R72,R74 16 0 R0402 — RC1005J000CS Samsung RES 0.0 Ohm 1/16W JUMP 0402 58 R22 1 100 R0603 — RC1608J101CS Samsung RES 100 Ohm 1/10W 5% 0603 59 R23 1 470 R0402 — RC1005J471CS Samsung RES 470 Ohm 1/16W 5% 0402 60 R30,R44 2 100 R0402 — RC1005J101CS Samsung RES 100 Ohm 1/16W 5% 0402 61 R45,R47,R48,R67,R68,R75, R76,R77 8 0 R0402 DNP RC1005J000CS Samsung RES 0.0 Ohm 1/16W JUMP 0402 62 R53,R54,R56,R57,R59,R60, R65 7 DNP R0402 DNP RC1005J000CS Samsung RES 0.0 Ohm 1/16W JUMP 0402 63 R66,R73 2 100k R0402 — RC1005J104CS Samsung RES 100 kOhm 1/16W 5% 0402 64 R78 1 820 R0402 — RC1005F821CS Samsung RES SMD 820 Ohm 1% 1/16W 0402 65 SW2 1 PWR EG1218O_switch — EG1218 E-Switch SWITCH SLIDE SPDT 30V.2A PC MNT 66 SW3 1 PB 2psmd_eswitch — TL1015AF160Q G E-Switch SWITCH TACTILE SPST-NO 0.05A 12V 67 TP10 1 +5 V HDR1 — 77311-801-01LF FCI HEADER BERGSTIK 68 U1 1 MC34673AEPR 2 8-UDFN — MC34673AEPR 2 Freescale Semiconductor IC SGL CELL BATTERY CHRGR 8UDFN 69 U2 1 MIC5335SJYMT 6TMLF — MIC5335SJYMT Micrel IC REG LDO 3.3 V/2.5 V 0.3A 6TMLF 70 U3 1 M25P80 SOIC8-W — M25P80VMW6G Numonyx/ST Micro IC FLASH 8MBIT 75MHZ 8SO 71 U4 1 LSM303DLHC LGA14_LSM303 — LSM303DLHC ST Micro ACCELEROMETER/MAGNETOMETER 14LGA 72 U5 1 LSM330DLC LGA-28 — LSM330DLC ST Micro ACCELEROMETER/MAGNETOMETER 28LGA 73 U6 1 93LC56BT-I/OT SOT23-6 — 93LC56BT-I/OT Microchip Technology IC EEPROM 2KBIT 2MHZ SOT23-6 25 Samsung — iCE40 Ultra Mobile Development Platform User Guide Item Reference Quantity Part PCB Footprint 74 U7 1 LTC4411 TSOT23-5 75 U8 1 76 U9 77 Comments Part Number Manufacturer Description Linear Technology IC OR CTRLR SRC SELECT TSOT235 — LTC4411ES5#T RMPBF XC6222B331MR SOT25 -G — XC6222B331MR Torex Semicon-G ductor Ltd IC REG LDO 3.3 V 0.7A SOT25 1 FT2232H LQFP64 — FT2232HL FTDI IC USB HS DUAL UART/FIFO 64LQFP U10 1 AP73121218FM-7 AP7312_6DFN — AP73121218FM-7 Diodes Inc IC REG LDO 1.2 V/1.8 V 0.15A 6DFN 78 U11 1 TSMP58000 TSOPIRx3P — TSMP58000 Vishay 3 V PH.MODULE S.VIEW 79 U12,U19 2 ADMP441 ADMP441 — INMP441ACEZ Invensense Omnidirectional Microphone with bottom port and I2S digital port 80 U13 1 BU52051NVX SSON004X1216 — BU52051NVX ROHM Semicon- IC LATCH SENSOR BIPO CMOS ductor 4SSON 81 U14 1 SHT20 DFN6 — SHT20 Sensirion 82 U15,U16 2 TMD27711 DFNL8 — TMD27711 AMS-TAOS USA IC PROXIMITY DETECTOR DGTL 8Inc MOD 83 U17 1 FPC1080A FPC1080A — FPC1080A Fingerprints 84 U18 1 MAX44008 OTDFN-6 — MAX44008EDT+ Maxim Integrated 85 U20 1 iCE5LP4KSWG3 36WLCSP 6 86 U21 1 ASFLMB27.000MHZ-LCT osc_5x3p2 87 U22 1 BMP180 88 U23,U29 2 74AVC4T774 89 U24 1 90 U25 1 91 U26 92 Swipe Sensor Package IC AMBIENT/PROXIMITY SENS TDFN iCE5LP4KSWG36CTR Lattice Semiconductor — ASFLMB27.000MHZ-LCT ABRACON OSC MEMS 27.000MHZ CMOS SMD BMP180 — BMP180 Bosch SENSOR PRESSURE ABS 16TSSOP — SN74AVC4T774 Texas InstruPWR ments IC BUS TRANSCVR 4BIT DL 16TSSOP LD1117-3V3 sot223_ns — LD1117S33CTR ST Micro IC REG LDO 3.3 V 0.8A SOT223 LD1117-1V8 SOT223_NS — LD1117AS18 ST Micro IC REG LDO 1.8 V 1A SOT223 1 SN74AUP1G08 DBVR SOT23-5 SN74AUP1G08 DBVR Texas Instruments IC GATE AND 1CH 2-INP SOT-23-5 U30 1 SeeedBLE SeeedBLE — 113050012 Seeed Low cost ARM cortex-m0 based module for Bluetooth module 93 Y1 1 12 MHz 5x3p2mm2p — ABM312.000MHZ-B2T Abracon Corp CRYSTAL 12MHZ 18PF SMD 94 iCE40 Ultra MDP BOARD PCB 1 — 305-PD-15-0056 PACTRON — Customer Supplied Humidity and Temperature Sensor IC DNP — — — BAG and TAG Item Reference Qty Part PCB Footprint 1 Battery 1 Li-ion Battery Battery unit Comments PART_NUMBER Manufacturer 2 Plastic Enclosure 1 Plastic enclosure Plastic Enclosure Customer Supplied Enclosure / full Nokia or OEM housing set used for Nokia 1110 ** 3 SPI cable assembly 1 SPI cable assembly SPI cable assembly Customer Supplied Custom made or Custom made or 2 mm pitch, dual row, 5x2 FRC / IDC Samtech part # equivalent Sam- female terminated, 15 cms ribbon TCSD-05-Dcable tec Inc 06.00-01-N 4 Fasteners / screws 2 PCB-Plastic fastening screws PCB-Plastic fastening screws BAG and TAG SMPPS0003 #0 x 3/16 - Pan Head Sheet Metal Screws – Phillips Micro Fasteners SMPPS0003 - #0 x 3/16 - Pan Head Sheet Metal Screws – Phillips 5 2 mm jumper shunts for J15 7 2 mm jumper shunts for J16 2 mm jumper shunts for J17 BAG and TAG SPN02SYBNRC Sullins 2 mm jumper shunts for J15 6 2 mm jumper shunts with grip for J15 & J9, J18 3 2 mm jumper shunts with grip for J15 and J10 2 mm jumper shunts with grip for J15 and J11 BAG and TAG NPN02SXLNRC Sullins 2 mm jumper shunts with grip for J15 & J9 7 2.54 mm jumper shunt for J20 1 2.54 mm jumper shunt for J21 2.54 mm jumper shunt for J22 BAG and TAG STC02SYAN Sullins 2.54 mm jumper shunt for J20 8 Jumper / Flywire for DB +5 V 1 Jumper / Flywire 4” Jumper / Flyfor DB +5 V wire for DB +5 V Customer Supplied - 26 BL-5C Nokia — Description From Amazon or other Nokia vendor From ebay or other Nokia accessory vendor ** see note in comments Custom made or One side bare wire (28 or 26 AWG), equivalent one side female header (single socket, for 2.54 pitch type header)