ISPLSI2032VE-180LTN44I

ispLSI® 2032VE Device Datasheet June 2010 Select Devices Discontinued! Product Change Notification (PCN) #09-10 has been issued to discontinue select devices in this data sheet. The original datasheet pages have not been modified and do not reflect those changes. Please refer to the table below for reference PCN and current product status. Product Line Ordering Part Number ispLSI 2032VE ispLSI 2032VE-110LJ44 ispLSI 2032VE-135LJ44 ispLSI 2032VE-180LJ44 ispLSI 2032VE-225LJ44 ispLSI 2032VE-110LT44 ispLSI 2032VE-135LT44 ispLSI 2032VE-180LT44 ispLSI 2032VE-225LT44 ispLSI 2032VE-300LT44 ispLSI 2032VE-180LT44I ispLSI 2032VE-110LT48 ispLSI 2032VE-135LT48 ispLSI 2032VE-180LT48 ispLSI 2032VE-225LT48 ispLSI 2032VE-300LT48 ispLSI 2032VE-110LB49 ispLSI 2032VE-135LB49 ispLSI 2032VE-180LB49 ispLSI 2032VE-225LB49 ispLSI 2032VE-300LB49 ispLSI 2032VE-110LTN44 ispLSI 2032VE-135LTN44 ispLSI 2032VE-180LTN44 ispLSI 2032VE-300LTN44 ispLSI 2032VE-180LTN44I ispLSI 2032VE-110LTN48 ispLSI 2032VE-135LTN48 ispLSI 2032VE-180LTN48 ispLSI 2032VE-300LTN48 Product Status Reference PCN Active / Orderable Discontinued PCN#09-10 Active / Orderable 5555 N.E. Moore Ct. z Hillsboro, Oregon 97124-6421 z Phone (503) 268-8000 z FAX (503) 268-8347 Internet: http://www.latticesemi.com ® ispLSI 2032VE LeadFree Package Options Available! Features 3.3V In-System Programmable High Density SuperFAST™ PLD Functional Block Diagram SE L D E IS C C T O D N E TI VI N C U E ED S • SuperFAST HIGH DENSITY IN-SYSTEM PROGRAMMABLE LOGIC — 1000 PLD Gates — 32 I/O Pins, Two Dedicated Inputs — 32 Registers — High Speed Global Interconnect — Wide Input Gating for Fast Counters, State Machines, Address Decoders, etc. — Small Logic Block Size for Random Logic — 100% Functional, JEDEC and Pinout Compatible with ispLSI 2032V Devices A2 D Q GLB Logic Array A6 D Q D Q A5 D Q A3 Input Bus Input Bus • HIGH PERFORMANCE E2CMOS® TECHNOLOGY — fmax = 300 MHz Maximum Operating Frequency — tpd = 3.0 ns Propagation Delay — Electrically Erasable and Reprogrammable — Non-Volatile — 100% Tested at Time of Manufacture — Unused Product Term Shutdown Saves Power Output Routing Pool (ORP) • 3.3V LOW VOLTAGE 2032 ARCHITECTURE — Interfaces With Standard 5V TTL Devices A1 A7 Output Routing Pool (ORP) Global Routing Pool (GRP) A0 A4 0139Bisp/2000 • IN-SYSTEM PROGRAMMABLE — 3.3V In-System Programmability Using Boundary Scan Test Access Port (TAP) — Open-Drain Output Option for Flexible Bus Interface Capability, Allowing Easy Implementation of Wired-OR or Bus Arbitration Logic — Increased Manufacturing Yields, Reduced Time-toMarket and Improved Product Quality — Reprogram Soldered Devices for Faster Prototyping Description The ispLSI 2032VE is a High Density Programmable Logic Device that can be used in both 3.3V and 5V systems. The device contains 32 Registers, 32 Universal I/O pins, two Dedicated Input Pins, three Dedicated Clock Input Pins, one dedicated Global OE input pin and a Global Routing Pool (GRP). The GRP provides complete interconnectivity between all of these elements. The ispLSI 2032VE features in-system programmability through the Boundary Scan Test Access Port (TAP) and is 100% IEEE 1149.1 Boundary Scan Testable. The ispLSI 2032VE offers non-volatile reprogrammability of the logic, as well as the interconnect to provide truly reconfigurable systems. • 100% IEEE 1149.1 BOUNDARY SCAN TESTABLE • THE EASE OF USE AND FAST SYSTEM SPEED OF PLDs WITH THE DENSITY AND FLEXIBILITY OF FPGAs — Enhanced Pin Locking Capability — Three Dedicated Clock Input Pins — Synchronous and Asynchronous Clocks — Programmable Output Slew Rate Control — Flexible Pin Placement — Optimized Global Routing Pool Provides Global Interconnectivity — Lead-Free Package Options The basic unit of logic on the ispLSI 2032VE device is the Generic Logic Block (GLB). The GLBs are labeled A0, A1 .. A7 (see Figure 1). There are a total of eight GLBs in the ispLSI 2032VE device. Each GLB is made up of four macrocells. Each GLB has 18 inputs, a programmable AND/OR/Exclusive OR array, and four outputs which can be configured to be either combinatorial or registered. Inputs to the GLB come from the GRP and dedicated inputs. All of the GLB outputs are brought back into the GRP so that they can be connected to the inputs of any GLB on the device. Copyright © 2006 Lattice Semiconductor Corp. All brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A. Tel. (503) 268-8000; 1-800-LATTICE; FAX (503) 268-8556; http://www.latticesemi.com 2032ve_11 1 August 2006 Specifications ispLSI 2032VE Functional Block Diagram Figure 1. ispLSI 2032VE Functional Block Diagram SE L D E IS C C T O D N E TI VI N C U E ED S GOE 0 I/O 12 I/O 13 I/O 14 I/O 15 A1 I/O 31 I/O 30 I/O 29 I/O 28 A7 Global Routing Pool (GRP) A6 A2 A5 A3 A4 I/O 27 Input Bus I/O 9 I/O 10 I/O 11 Output Routing Pool (ORP) I/O 8 Input Bus I/O 4 I/O 5 I/O 6 I/O 7 A0 Output Routing Pool (ORP) I/O 0 I/O 1 I/O 2 I/O 3 I/O 26 I/O 25 I/O 24 I/O 23 I/O 22 I/O 21 I/O 20 I/O 19 I/O 18 I/O 17 I/O 16 TDI/IN 0 TDO/IN 1 CLK 0 CLK 1 CLK 2 Generic Logic Blocks (GLBs) TMS/NC BSCAN Y0 Y1* TCK/Y2 Note: *Y1 and RESET are multiplexed on the same pin 0139B/2032VE The device also has 32 I/O cells, each of which is directly connected to an I/O pin. Each I/O cell can be individually programmed to be a combinatorial input, output or bidirectional I/O pin with 3-state control. The signal levels are TTL compatible voltages and the output drivers can source 4 mA or sink 8 mA. Each output can be programmed independently for fast or slow output slew rate to minimize overall output switching noise. Device pins can be safely driven to 5 Volt signal levels to support mixed-voltage systems. Clocks in the ispLSI 2032VE device are selected using the dedicated clock pins. Three dedicated clock pins (Y0, Y1, Y2) or an asynchronous clock can be selected on a GLB basis. The asynchronous or Product Term clock can be generated in any GLB for its own clock. Programmable Open-Drain Outputs In addition to the standard output configuration, the outputs of the ispLSI 2032VE are individually programmable, either as a standard totem-pole output or an open-drain output. The totem-pole output drives the specified Voh and Vol levels, whereas the open-drain output drives only the specified Vol. The Voh level on the open-drain output depends on the external loading and pull-up. This output configuration is controlled by a programmable fuse. The default configuration when the device is in bulk erased state is the totem-pole configuration. The open-drain/totem-pole option is selectable through the Lattice design tools. Eight GLBs, 32 I/O cells, two dedicated inputs and two ORPs are connected together to make a Megablock (see Figure 1). The outputs of the eight GLBs are connected to a set of 32 universal I/O cells by the ORPs. Each ispLSI 2032VE device contains one Megablock. The GRP has as its inputs the outputs from all of the GLBs and all of the inputs from the bi-directional I/O cells. All of these signals are made available to the inputs of the GLBs. Delays through the GRP have been equalized to minimize timing skew. 2 Specifications ispLSI 2032VE Absolute Maximum Ratings 1 Supply Voltage Vcc .................................. -0.5 to +5.4V Input Voltage Applied ............................... -0.5 to +5.6V SE L D E IS C C T O D N E TI VI N C U E ED S Off-State Output Voltage Applied ............ -0.5 to +5.6V Storage Temperature .............................. -65 to +150°C Case Temp. with Power Applied .............. -55 to 125°C Max. Junction Temp. (TJ) with Power Applied ... 150°C 1. Stresses above those listed under the “Absolute Maximum Ratings” may cause permanent damage to the device. Functional operation of the device at these or at any other conditions above those indicated in the operational sections of this specification is not implied (while programming, follow the programming specifications). DC Recommended Operating Condition PARAMETER SYMBOL Commercial VCC Supply Voltage VIL VIH Input Low Voltage Industrial MIN. MAX. UNITS TA = 0°C to + 70°C 3.0 3.6 V TA = -40°C to + 85°C 3.0 3.6 V 0.8 V 5.25 V VSS – 0.5 Input High Voltage 2.0 Table 2-0005/2032VE Capacitance (TA=25°C, f=1.0 MHz) TYPICAL UNITS 8 pf VCC = 3.3V, VIN = 0.0V I/O Capacitance 6 pf VCC = 3.3V, VI/O = 0.0V Clock Capacitance 10 pf VCC = 3.3V, VY = 0.0V SYMBOL C1 C2 C3 PARAMETER Dedicated Input Capacitance TEST CONDITIONS Table 2-0006/2032VE Erase Reprogram Specifications PARAMETER MINIMUM MAXIMUM UNITS 10,000 – Cycles Erase/Reprogram Cycles Table 2-0008A/2032VE 3 Specifications ispLSI 2032VE Switching Test Conditions Input Pulse Levels Figure 2. Test Load GND to 3.0V ≤ 1.5 ns + 3.3V SE L D E IS C C T O D N E TI VI N C U E ED S Input Rise and Fall Time 10% to 90% Input Timing Reference Levels 1.5V Output Timing Reference Levels 1.5V Output Load R1 Device Output See Figure 2 Table 2-0003/2032VE 3-state levels are measured 0.5V from steady-state active level. R2 Output Load Conditions (see Figure 2) TEST CONDITION A B C Test Point R1 R2 CL 316Ω 348Ω 35pF Active High ∞ 348Ω 35pF Active Low 316Ω 348Ω 35pF Active High to Z at VOH -0.5V ∞ 348Ω 5pF Active Low to Z at VOL +0.5V 316Ω 348Ω 5pF CL* *CL includes Test Fixture and Probe Capacitance. 0213A/2032VE Table 2-0004A/2032VE DC Electrical Characteristics Over Recommended Operating Conditions SYMBOL VOL VOH IIL IIH IIL-isp IIL-PU IOS1 ICC2, 4, 5 CONDITION PARAMETER 3 MIN. TYP. MAX. UNITS Output Low Voltage IOL= 8 mA – – 0.4 V Output High Voltage IOH = -4 mA 2.4 – – V Input or I/O Low Leakage Current 0V ≤ VIN ≤ VIL (Max.) – – -10 μA Input or I/O High Leakage Current (VCC - 0.2)V ≤ VIN ≤ VCC – – 10 μA VCC ≤ VIN ≤ 5.25V – – 10 μA BSCAN Input Low Leakage Current 0V ≤ VIN ≤ VIL – – -150 μA I/O Active Pull-Up Current 0V ≤ VIN ≤ VIL – – -150 μA Output Short Circuit Current VCC = 3.3V, VOUT = 0.5V – – -100 mA Operating Power Supply Current VIL = 0.0V, VIH = 3.0V -300/-225 – 80 – mA fCLOCK = 1MHz – 65 – mA Others Table 2-0007/2032VE 1. One output at a time for a maximum duration of one second. VOUT = 0.5V was selected to avoid test problems by tester ground degradation. Characterized but not 100% tested. 2. Measured using two 16-bit counters. 3. Typical values are at VCC = 3.3V and TA = 25°C. 4. Maximum ICC varies widely with specific device configuration and operating frequency. Refer to Power Consumption section of this data sheet and Thermal Management section of the Lattice Semiconductor Data Book or CD-ROM to estimate maximum ICC . 5. Unused inputs at VIL = 0V. 4 Specifications ispLSI 2032VE External Timing Parameters Over Recommended Operating Conditions 3 PARAMETER # A 1 DESCRIPTION -225 -300 1 MIN. MAX. MIN. MAX. Data Propagation Delay, 4PT Bypass, ORP Bypass – 3.0 – UNITS 4.0 ns SE L D E IS C C T O D N E TI VI N C U E ED S tpd1 tpd2 fmax fmax (Ext.) fmax (Tog.) tsu1 tco1 th1 tsu2 tco2 th2 tr1 trw1 tptoeen tptoedis tgoeen tgoedis twh twl TEST COND. 2 Data Propagation Delay 2 – 4.5 A 3 Clock Frequency with Internal Feedback 300 – – 4 Clock Frequency with External Feedback ( tsu2 + tco1) 208 – – 5 Clock Frequency, Max. Toggle 333 – – 6 GLB Reg. Setup Time before Clock, 4 PT Bypass 2.0 – 1 A 7 GLB Reg. Clock to Output Delay, ORP Bypass – 2.0 – 8 GLB Reg. Hold Time after Clock, 4 PT Bypass 0.0 – – 9 GLB Reg. Setup Time before Clock 2.8 – A 10 GLB Reg. Clock to Output Delay – 2.5 – 11 GLB Reg. Hold Time after Clock 0.0 – A 12 Ext. Reset Pin to Output Delay, ORP Bypass – 4.5 – 6.0 ns 225 – MHz 154 – MHz 250 – MHz 2.5 – ns USE 2032VE-3 00 FOR NEW DESIGNS A – 3.0 ns 0.0 – ns 3.5 – ns – 4.0 ns 0.0 – ns – 5.0 ns 3.5 – ns – 7.0 ns – 7.0 ns – 3.5 ns – 13 Ext. Reset Pulse Duration 3.0 – B 14 Input to Output Enable – 5.0 C 15 Input to Output Disable – 5.0 B 16 Global OE Output Enable – 3.0 C 17 Global OE Output Disable – 3.0 – 3.5 ns – 18 External Synchronous Clock Pulse Duration, High 1.5 – 2.0 – ns – 19 External Synchronous Clock Pulse Duration, Low 1.5 – 2.0 – ns 1. Unless noted otherwise, all parameters use a GRP load of 4, 20 PTXOR path, ORP and Y0 clock. 2. Standard 16-bit counter using GRP feedback. 3. Reference Switching Test Conditions section. 5 Table 2-0030A/2032VE v.0.1 Specifications ispLSI 2032VE External Timing Parameters Over Recommended Operating Conditions 3 PARAMETER # A 1 DESCRIPTION -180 1 -135 -110 MIN. MAX. MIN. MAX. MIN. MAX. Data Propagation Delay, 4PT Bypass, ORP Bypass – 5.0 – 7.5 – UNITS 10.0 ns SE L D E IS C C T O D N E TI VI N C U E ED S tpd1 tpd2 fmax fmax (Ext.) fmax (Tog.) tsu1 tco1 th1 tsu2 tco2 th2 tr1 trw1 tptoeen tptoedis tgoeen tgoedis twh twl TEST COND. A 2 Data Propagation Delay 2 – 7.5 – 10.0 180 – – 13.0 ns A 3 Clock Frequency with Internal Feedback 135 – 111 – MHz – 4 Clock Frequency with External Feedback ( tsu2 + tco1) 118 – 100 – 77.0 – MHz – 5 Clock Frequency, Max. Toggle 200 – 167 – 125 – MHz – 6 GLB Reg. Setup Time before Clock, 4 PT Bypass 3.0 – 4.0 – 5.5 – ns A 7 GLB Reg. Clock to Output Delay, ORP Bypass – 4.0 – 4.5 – 5.0 ns – 8 GLB Reg. Hold Time after Clock, 4 PT Bypass 0.0 – 0.0 – 0.0 – ns – 9 GLB Reg. Setup Time before Clock 4.0 – 5.5 – 7.5 – ns A 10 GLB Reg. Clock to Output Delay – 5.0 – 5.5 – 6.5 ns – 11 GLB Reg. Hold Time after Clock 0.0 – 0.0 – 0.0 – ns A 12 Ext. Reset Pin to Output Delay, ORP Bypass – 6.0 – 9.0 – 12.5 ns 1 – 13 Ext. Reset Pulse Duration 4.0 – 5.0 – 6.5 – ns B 14 Input to Output Enable – 10.0 – 12.0 – 14.5 ns C 15 Input to Output Disable – 10.0 – 12.0 – 14.5 ns B 16 Global OE Output Enable – 5.0 – 6.0 – 7.0 ns C 17 Global OE Output Disable – 5.0 – 6.0 – 7.0 ns – 18 External Synchronous Clock Pulse Duration, High 2.5 – 3.0 – 4.0 – ns – 19 External Synchronous Clock Pulse Duration, Low 2.5 – 3.0 – 4.0 – ns 1. Unless noted otherwise, all parameters use a GRP load of 4, 20 PTXOR path, ORP and Y0 clock. 2. Standard 16-bit counter using GRP feedback. 3. Reference Switching Test Conditions section. 6 Table 2-0030B/2032VE v.0.1 Specifications ispLSI 2032VE Internal Timing Parameters1 Over Recommended Operating Conditions PARAMETER #2 DESCRIPTION -225 -300 MIN. MAX. MIN. MAX. UNITS SE L D E IS C C T O D N E TI VI N C U E ED S Inputs tio tdin 20 Input Buffer Delay – 0.4 – 0.6 ns 21 Dedicated Input Delay – 1.0 – 1.3 ns 22 GRP Delay – 0.6 – 0.7 ns 23 4 Product Term Bypass Path Delay (Combinatorial) – 0.9 – 24 4 Product Term Bypass Path Delay (Registered) – 1.1 – 25 1 Product Term/XOR Path Delay – 1.9 – 26 20 Product Term/XOR Path Delay – 1.9 – 27 XOR Adjacent Path Delay 3 – 1.9 – 28 GLB Register Bypass Delay – 0.0 – 29 GLB Register Setup Time before Clock 0.5 – 0.8 30 GLB Register Hold Time after Clock 1.5 – 31 GLB Register Clock to Output Delay – 0.3 32 GLB Register Reset to Output Delay – 1.3 – 33 GLB Product Term Reset to Register Delay – 2.5 – GRP tgrp ns 2.2 ns 2.2 ns 2.2 ns 0.0 ns – ns 1.7 – ns – 0.7 ns 1.3 ns 3.2 ns 4.2 ns 2.8 ns – 3.0 – 2.3 0.5 36 ORP Delay – 0.6 37 ORP Bypass Delay – 0.1 38 Output Buffer Delay – 1.0 39 Output Slew Limited Delay Adder – 2.0 40 I/O Cell OE to Output Enabled – 1.0 41 I/O Cell OE to Output Disabled – 1.0 42 Global Output Enable – 2.0 43 Clock Delay, Y0 to Global GLB Clock Line (Ref. clock) 0.6 44 Clock Delay, Y1 or Y2 to Global GLB Clock Line 0.8 – – 1.3 ns – 0.3 ns – 1.2 ns – 2.0 ns – 1.5 ns – 1.5 ns – 2.0 ns 0.6 0.8 0.8 ns 0.8 1.0 1.0 ns 2.1 – 2.2 ns Outputs tob tsl toen todis tgoe 1.2 0.4 35 GLB Product Term Clock Delay ORP torp torpbp ns 00 FOR NEW D 34 GLB Product Term Output Enable to I/O Cell Delay 1.2 USE 2032VE-3 t4ptbpc t4ptbpr t1ptxor t20ptxor txoradj tgbp tgsu tgh tgco tgro tptre tptoe tptck ESIGNS GLB Clocks tgy0 tgy1/2 Global Reset tgr 45 Global Reset to GLB 1. Internal Timing Parameters are not tested and are for reference only. 2. Refer to Timing Model in this data sheet for further details. 3. The XOR adjacent path can only be used by hard macros. 7 Table 2-0036A/2032VE v.0.1 Specifications ispLSI 2032VE Internal Timing Parameters1 Over Recommended Operating Conditions PARAMETER #2 -135 -180 DESCRIPTION -110 MIN. MAX. MIN. MAX. MIN. MAX. UNITS SE L D E IS C C T O D N E TI VI N C U E ED S Inputs tio tdin 20 Input Buffer Delay – 0.8 – 0.8 – 1.3 ns 21 Dedicated Input Delay – 1.5 – 1.7 – 2.5 ns 22 GRP Delay – 0.7 – 0.9 – 1.2 ns 23 4 Product Term Bypass Path Delay (Combinatorial) – 1.8 – 3.9 – 4.8 ns 24 4 Product Term Bypass Path Delay (Registered) – 2.1 – 2.9 – 3.4 ns 25 1 Product Term/XOR Path Delay – 3.1 – 4.4 – 5.4 ns 26 20 Product Term/XOR Path Delay – 3.1 – 4.4 – 5.4 ns – 3.1 – 4.4 – 5.4 ns – 0.2 – 1.0 – 1.4 ns 29 GLB Register Setup Time before Clock 0.9 – 1.1 – 1.4 – ns 30 GLB Register Hold Time after Clock 2.1 – 2.9 – 4.1 – ns 31 GLB Register Clock to Output Delay – 0.8 – 0.9 – 1.0 ns 32 GLB Register Reset to Output Delay – 1.3 – 1.8 – 2.7 ns 33 GLB Product Term Reset to Register Delay – 4.0 – 6.1 – 7.1 ns 34 GLB Product Term Output Enable to I/O Cell Delay – 5.7 – 6.9 – 8.6 ns 1.4 3.6 1.7 4.1 2.5 4.4 ns 36 ORP Delay – 1.4 – 1.5 – 1.9 ns 37 ORP Bypass Delay – 0.4 – 0.5 – 0.9 ns 38 Output Buffer Delay – 1.3 – 1.4 – 1.8 ns 39 Output Slew Limited Delay Adder – 2.0 – 2.0 – 2.0 ns 40 I/O Cell OE to Output Enabled – 2.8 – 3.4 – 3.4 ns 41 I/O Cell OE to Output Disabled – 2.8 – 3.4 – 3.4 ns 42 Global Output Enable – 2.2 – 2.6 – 3.6 ns 43 Clock Delay, Y0 to Global GLB Clock Line (Ref. clock) 1.5 1.5 1.7 1.7 1.8 1.8 ns 44 Clock Delay, Y1 or Y2 to Global GLB Clock Line 1.7 1.7 1.9 1.9 2.0 2.0 ns – 3.0 – 5.3 – 7.1 ns GRP tgrp GLB t4ptbpc t4ptbpr t1ptxor t20ptxor txoradj tgbp tgsu tgh tgco tgro tptre tptoe tptck 27 XOR Adjacent Path Delay 3 28 GLB Register Bypass Delay 35 GLB Product Term Clock Delay ORP torp torpbp Outputs tob tsl toen todis tgoe Clocks tgy0 tgy1/2 Global Reset tgr 45 Global Reset to GLB 1. Internal Timing Parameters are not tested and are for reference only. 2. Refer to Timing Model in this data sheet for further details. 3. The XOR adjacent path can only be used by hard macros. 8 Table 2-0036A/2032VE v.0.1 Specifications ispLSI 2032VE ispLSI 2032VE Timing Model I/O Cell GRP GLB ORP I/O Cell SE L D E IS C C T O D N E TI VI N C U E ED S Feedback Ded. In I/O Pin (Input) Comb 4 PT Bypass #23 #21 I/O Delay GRP Reg 4 PT Bypass GLB Reg Bypass ORP Bypass #20 #22 #24 #28 #37 20 PT XOR Delays GLB Reg Delay ORP Delay #25, 26, 27 D Q #38, 39 #36 RST #45 Reset #29, 30, 31, 32 Control RE PTs OE #33, 34, CK 35 #40, 41 #43, 44 Y0,1,2 #42 GOE 0 0491/2000 Derivations of tsu, th and tco from the Product Term Clock tsu = = = 2.0ns = Logic + Reg su - Clock (min) (tio + tgrp + t20ptxor) + (tgsu) - (tio + tgrp + tptck(min)) (#20 + #22 + #26) + (#29) - (#20 + #22 + #35) (0.4 + 0.6 + 1.9) + (0.5) - (0.4 + 0.6 + 0.4) th = = = 1.9ns = Clock (max) + Reg h - Logic (tio + tgrp + tptck(max)) + (tgh) - (tio + tgrp + t20ptxor) (#20 + #22 + #35) + (#30) - (#20 + #22 + #26) (0.4 + 0.6 + 2.3) + (1.5) - (0.4 + 0.6 + 1.9) tco = = = 5.2ns = Clock (max) + Reg co + Output (tio + tgrp + tptck(max)) + (tgco) + (torp + tob) (#20 + #22 + #35) + (#31) + (#36 + #38) (0.4 + 0.6 + 2.3) + (0.3) + (0.6 + 1.0) Note: Calculations are based on timing specifications for the ispLSI 2032VE-300L. Table 2-0042/2032VE 9 I/O Pin (Output) Specifications ispLSI 2032VE Power Consumption Power consumption in the ispLSI 2032VE device depends on two primary factors: the speed at which the device is operating and the number of product terms used. Figure 3 shows the relationship between power and operating speed. SE L D E IS C C T O D N E TI VI N C U E ED S Figure 3. Typical Device Power Consumption vs fmax 150 125 ispLSI 2032VE-300 and -225 ICC (mA) 100 75 ispLSI 2032VE-180 and slower 50 25 0 25 50 75 100 125 150 175 200 225 250 275 300 fmax (MHz) Notes: Configuration of two 16-bit counters Typical current at 3.3V, 25° C ICC can be estimated for the ispLSI 2032VE using the following equation: For ispLSI 2032VE-300 and -225: ICC(mA) = 4.5 + (# of PTs * 1.29) + (# of nets * Fmax * 0.0068) For ispLSI 2032VE-180 and slower: ICC(mA) = 4.5 + (# of PTs * 1.05) + (# of nets * Fmax * 0.0068) Where: # of PTs = Number of product terms used in design # of nets = Number of signals used in device Max freq = Highest clock frequency to the device (in MHz) The ICC estimate is based on typical conditions (VCC = 3.3V, room temperature) and an assumption of two GLB loads on average exists. These values are for estimates only. Since the value of ICC is sensitive to operating conditions and the program in the device, the actual ICC should be verified. 0127A/2032VE 10 Specifications ispLSI 2032VE Signal Descriptions Signal Name Description Global Output Enable input pin Y0 Dedicated Clock input. This clock input is connected to one of the clock inputs of all the GLBs in the device. RESET/Y1 This pin performs two functions: (1) Active Low (0) Reset pin which resets all of the registers in the device. (2) Dedicated Clock input. BSCAN Input – Dedicated in-system programming Boundary Scan enable input pin. This pin is brought low to enable the programming mode. The TMS, TDI, TDO and TCK controls become active. TDI/IN 0 Input – This pin performs two functions. (1) When BSCAN is logic low, it functions as a serial data input pin to load programming data into the device. (2) When BSCAN is high, it functions as a dedicated input pin. TMS/NC1 Input – This pin performs two functions. (1) When BSCAN is logic low, it functions as a mode control pin for the Boundary Scan state machine. (2) When BSCAN is high, this pin is not to be connected to any active signals, VCC or GND. TDO/IN 1 Output/Input – This pin performs two functions. (1) When BSCAN is logic low, it functions as an output pin to read serial shift register data. (2) When BSCAN is high, it functions as a dedicated input pin. TCK/Y2 Input – This pin performs two functions. (1) When BSCAN is logic low, it functions as a clock pin for the Boundary Scan state machine. (2) When BSCAN is high, it functions as a Dedicated Clock input. GND Ground (GND) VCC Vcc NC1 No Connect I/O Input/Output pins – These are the general purpose I/O pins used by the logic array. SE L D E IS C C T O D N E TI VI N C U E ED S GOE 0 Signal Locations Signal 44-Pin TQFP 44-Pin PLCC 48-Pin TQFP 49-Ball caBGA GOE 0 40 2 43 Y0 5 11 5 A4 C1 RESET/Y1 29 35 31 D7 BSCAN 7 13 7 D1 TDI/IN 0 8 14 8 E2 1 30 36 32 C6 TDO/IN 1 18 24 19 G4 TCK/Y2 27 33 29 E7 GND 17, 39 1, 23 18, 42 C4, E4 VCC 6, 28 12, 34 6, 30 D3, D5 — — 12, 24, 36, 48 A1, A7, D4, G1, G7 TMS/NC NC 1 I/O Locations Signal 44-Pin TQFP 44-Pin PLCC 15, 16, 17, 18, 19, 20, 21 48-Pin TQFP 49-Ball caBGA I/O 0 - I/O 6 9, 10, 11, 12, 13, 14, 15 9, 10, 11, 13, 14, 15, 16 E1, F2, F1, E3, F3, G2, F4 I/O 7 - I/O 13 16, 19, 20, 21, 22, 23, 24 22, 25, 26, 27, 28, 29, 30 17, 20, 21, 22, 23, 25, 26 G3, F5, G5, F6, G6, E5, E6 I/O 14 - I/O 20 25, 26, 31, 32, 33, 34, 35 31, 32, 37, 38, 39, 40, 41 27, 28, 33, 34, 35, 37, 38 F7, D6, C7, B6, B7, C5, B5 I/O 21 - I/O 27 36, 37, 38, 41, 42, 43, 44 42, 43, 44, 3, 4, 5, 6 39, 40, 41, 44, 45, 46, 47 A6, B4, A5, B3, A3, B2, A2 I/O 28 - I/O 31 1, 2, 3, 4 1, 2, 3, 4 C3, C2, B1, D2 7, 8, 9, 10 1. NC pins are not to be connected to any active signals, VCC or GND. 11 Specifications ispLSI 2032VE Pin Configuration I/O 21 I/O 20 I/O 19 I/O 22 GND I/O 23 GOE 0 I/O 24 I/O 26 I/O 25 I/O 27 ispLSI 2032VE 44-Pin TQFP Pinout Diagram (0.8mm Lead Pitch/10.0 x 10.0mm Body Size) SE L D E IS C C T O D N E TI VI N C U E ED S 44 43 42 41 40 39 38 37 36 35 34 I/O 28 I/O 29 I/O 30 I/O 31 1 2 3 4 5 33 I/O 18 32 31 I/O 17 I/O 16 30 TMS/NC1 RESET/Y1 VCC 6 ispLSI 2032VE 29 28 BSCAN 7 Top View 27 TCK/Y2 TDI/IN 0 8 26 I/O 15 9 10 11 25 24 23 I/O 14 I/O 13 I/O 12 Y0 VCC I/O 0 I/O 1 I/O 2 I/O 9 I/O 10 I/O 11 I/O 8 GND TDO/IN 1 I/O 7 I/O 6 I/O 4 I/O 5 I/O 3 12 13 14 15 16 17 18 19 20 21 22 0851/2032VE 1. NC pins are not to be connected to any active signals, VCC or GND. Pin Configuration I/O 21 I/O 20 I/O 19 I/O 22 GND I/O 23 GOE 0 I/O 24 I/O 26 I/O 25 I/O 27 ispLSI 2032VE 44-Pin PLCC Pinout Diagram (0.5in Lead Pitch/0.65 x 0.65in Body Size) 6 5 4 3 2 1 44 43 42 41 40 I/O 28 I/O 29 I/O 30 I/O 31 Y0 VCC 7 8 9 10 11 39 I/O 18 38 37 I/O 17 I/O 16 36 TMS/NC1 RESET/Y1 VCC 12 ispLSI 2032VE 35 34 Top View BSCAN 13 33 TCK/Y2 TDI/IN 0 14 32 I/O 15 I/O 0 I/O 1 I/O 2 15 16 17 31 30 29 I/O 14 I/O 13 I/O 12 I/O 9 I/O 10 I/O 11 I/O 8 TDO/IN 1 GND I/O 7 I/O 6 I/O 4 I/O 5 I/O 3 18 19 20 21 22 23 24 25 26 27 28 0123/2032VE 1. NC pins are not to be connected to any active signals, VCC or GND. 12 Specifications ispLSI 2032VE Pin Configuration I/O 21 I/O 20 I/O 19 I/O 22 GND I/O 23 GOE 0 I/O 24 I/O 26 I/O 25 I/O 27 NC2 ispLSI 2032VE 48-Pin TQFP Pinout Diagram (0.5mm Lead Pitch/7.0 x 7.0mm Body Size) SE L D E IS C C T O D N E TI VI N C U E ED S 48 47 46 45 44 43 42 41 40 39 38 37 I/O 28 I/O 29 I/O 30 I/O 31 Y0 VCC BSCAN 1TDI/IN 0 I/O 0 I/O 1 I/O 2 2NC 36 NC2 35 I/O 18 34 33 I/O 17 I/O 16 32 TMS/NC2 31 30 RESET/Y11 VCC 8 29 TCK/Y21 9 10 11 12 28 I/O 15 27 26 25 I/O 14 I/O 13 I/O 12 1 2 3 4 5 6 ispLSI 2032VE 7 Top View I/O 9 I/O 10 I/O 11 2NC I/O 8 I/O 7 GND 1TDO/IN 1 I/O 6 I/O 4 I/O 5 I/O 3 13 14 15 16 17 18 19 20 21 22 23 24 48TQFP/2032VE 1. Pins have dual function capability. 2. NC pins are not to be connected to any active signals, VCC or GND. Signal Configuration ispLSI 2032VE 49-Ball caBGA Signal Diagram (0.8mm Lead Pitch/7.0 x 7.0mm Body Size) 7 6 5 4 3 2 1 A NC1 I/O 21 I/O 23 GOE 0 I/O 25 I/O 27 NC1 A B I/O 18 I/O 17 I/O 20 I/O 22 I/O 24 I/O 26 I/O 30 B C I/O 16 TMS/ NC1 I/O 19 GND I/O 28 I/O 29 Y0 C D RESET/ Y1 I/O 15 VCC NC1 VCC I/O 31 BSCAN D E TCK/ Y2 I/O 13 I/O 12 GND I/O 3 TDI/ IN0 I/O 0 E F I/O 14 I/O 10 I/O 8 I/O 6 I/O 4 I/O 1 I/O 2 F G NC1 I/O 11 I/O 9 TDO/ IN1 I/O 7 I/O 5 NC1 G 2 1 ispLSI 2032VE Bottom View 7 6 5 4 3 49-BGA/2032VE 1. NCs are not to be connected to any active signals, VCC or GND. Note: Ball A1 indicator dot on top side of package. 13 Specifications ispLSI 2032VE Part Number Description ispLSI 2032VE – XXX X XXXX X Device Family Grade Blank = Commercial I = Industrial SE L D E IS C C T O D N E TI VI N C U E ED S Device Number 2032VE Package T44 = 44-Pin TQFP T48 = 48-Pin TQFP J44 = 44-Pin PLCC B49 = 49-Ball caBGA TN44 = Lead-Free 44-Pin TQFP TN48 = Lead-Free 48-Pin TQFP Speed 300 = 300 MHz fmax 225 = 225 MHz fmax 180 = 180 MHz fmax 135 = 135 MHz fmax 110 = 110 MHz fmax Power L = Low ispLSI 2032VE Ordering Information Conventional Packaging FAMILY ispLSI COMMERCIAL fmax (MHz) tpd (ns) ORDERING NUMBER PACKAGE 300 300 3.0 3.0 ispLSI 2032VE-300LT44 ispLSI 2032VE-300LT48 44-Pin TQFP 48-Pin TQFP 300 3.0 ispLSI 2032VE-300LB49 49-Ball caBGA 225 225 4.0 4.0 ispLSI 2032VE-225LT44* ispLSI 2032VE-225LT48* 44-Pin TQFP 48-Pin TQFP 225 225 4.0 4.0 ispLSI 2032VE-225LJ44 ispLSI 2032VE-225LB49* 44-Pin PLCC 49-Ball caBGA 180 5.0 ispLSI 2032VE-180LT44 44-Pin TQFP 180 5.0 180 180 5.0 5.0 ispLSI 2032VE-180LT48 ispLSI 2032VE-180LJ44 ispLSI 2032VE-180LB49 48-Pin TQFP 44-Pin PLCC 49-Ball caBGA 135 7.5 ispLSI 2032VE-135LT44 44-Pin TQFP 135 7.5 ispLSI 2032VE-135LT48 48-Pin TQFP 135 7.5 ispLSI 2032VE-135LJ44 44-Pin PLCC 135 7.5 ispLSI 2032VE-135LB49 49-Ball caBGA 110 110 10 10 ispLSI 2032VE-110LT44 ispLSI 2032VE-110LT48 44-Pin TQFP 48-Pin TQFP 110 10 ispLSI 2032VE-110LJ44 44-Pin PLCC ispLSI 2032VE-110LB49 49-Ball caBGA 110 10 *2032VE-300 recommended for new designs Table 2-0041A/2032VE INDUSTRIAL FAMILY fmax (MHz) tpd (ns) ORDERING NUMBER PACKAGE ispLSI 180 5.0 ispLSI 2032VE-180LT44I 44-Pin TQFP Table 2-0041B/2032VE 14 Specifications ispLSI 2032VE ispLSI 2032VE Ordering Information (Cont.) Lead-Free Packaging COMMERCIAL fmax (MHz) tpd (ns) ORDERING NUMBER PACKAGE 300 300 3.0 3.0 ispLSI 2032VE-300LTN44 ispLSI 2032VE-300LTN48 Lead-Free 44-Pin TQFP Lead-Free 48-Pin TQFP 180 5.0 ispLSI 2032VE-180LTN44 Lead-Free 44-Pin TQFP 180 135 5.0 7.5 ispLSI 2032VE-180LTN48 ispLSI 2032VE-135LTN44 Lead-Free 48-Pin TQFP Lead-Free 44-Pin TQFP 135 7.5 ispLSI 2032VE-135LTN48 Lead-Free 48-Pin TQFP 110 110 10 10 ispLSI 2032VE-110LTN44 ispLSI 2032VE-110LTN48 Lead-Free 44-Pin TQFP Lead-Free 48-Pin TQFP SE L D E IS C C T O D N E TI VI N C U E ED S FAMILY ispLSI INDUSTRIAL FAMILY fmax (MHz) tpd (ns) ORDERING NUMBER PACKAGE ispLSI 180 5.0 ispLSI 2032VE-180LTN44I Lead-Free 44-Pin TQFP Revision History Date Version Change Summary — 10 Previous Lattice release. August 2006 11 Updated for 48-pin TQFP lead-free package option. 15