ISPLSI2064VE-135LT100

LeadFree a P ckage Options Available! Features ® ispLSI 2064VE 3.3V In-System Programmable High Density SuperFAST™ PLD Functional Block Diagram • SuperFAST HIGH DENSITY PROGRAMMABLE LOGIC — 2000 PLD Gates — 64 and 32 I/O Pin Versions, Four Dedicated Inputs — 64 Registers — High Speed Global Interconnect — Wide Input Gating for Fast Counters, State Machines, Address Decoders, etc. — Small Logic Block Size for Random Logic — 100% Functional, JEDEC and Pinout Compatible with ispLSI 2064V Devices Input Bus Output Routing Pool (ORP) Input Bus Output Routing Pool (ORP) • HIGH-PERFORMANCE E2CMOS® TECHNOLOGY — fmax = 280MHz Maximum Operating Frequency — tpd = 3.5ns Propagation Delay — Electrically Erasable and Reprogrammable — Non-Volatile — 100% Tested at Time of Manufacture — Unused Product Term Shutdown Saves Power A1 A2 Logic Array B3 B2 D Q GLB B4 D Q B1 D Q D Q Input Bus Global Routing Pool (GRP) A0 • 3.3V LOW VOLTAGE 2064 ARCHITECTURE — Interfaces with Standard 5V TTL Devices B5 Output Routing Pool (ORP) B6 B7 B0 A3 A5 A4 A6 A7 Output Routing Pool (ORP) Input Bus 0139A/2064V • IN-SYSTEM PROGRAMMABLE — 3.3V In-System Programmability (ISP™) Using Boundary Scan Test Access Port (TAP) — Open-Drain Output Option for Flexible Bus Interface Capability, Allowing Easy Implementation of Wired-OR or Bus Arbitration Logic — Increased Manufacturing Yields, Reduced Time-toMarket and Improved Product Quality — Reprogram Soldered Devices for Faster Prototyping Description The ispLSI 2064VE is a High Density Programmable Logic Device available in 64 and 32 I/O-pin versions. The device contains 64 Registers, four Dedicated Input pins, three Dedicated Clock Input pins, two dedicated Global OE input pins and a Global Routing Pool (GRP). The GRP provides complete interconnectivity between all of these elements. The ispLSI 2064VE features in-system programmability through the Boundary Scan Test Access Port (TAP) and is 100% IEEE 1149.1 Boundary Scan Testable. The ispLSI 2064VE offers non-volatile reprogrammability of the logic, as well as the interconnect, to provide truly reconfigurable systems. • 100% IEEE 1149.1 BOUNDARY SCAN TESTABLE • THE EASE OF USE AND FAST SYSTEM SPEED OF PLDs WITH THE DENSITY AND FLEXIBILITY OF FPGAs — Enhanced Pin Locking Capability — Three Dedicated Clock Input Pins — Synchronous and Asynchronous Clocks — Programmable Output Slew Rate Control — Flexible Pin Placement — Optimized Global Routing Pool Provides Global Interconnectivity The basic unit of logic on the ispLSI 2064VE device is the Generic Logic Block (GLB). The GLBs are labeled A0, A1…B7 (see Figure 1). There are a total of 16 GLBs in the ispLSI 2064VE device. Each GLB is made up of four macrocells. Each GLB has 18 inputs, a programmable AND/OR/Exclusive OR array, and four outputs which can be configured to be either combinatorial or registered. Inputs to the GLB come from the GRP and dedicated inputs. All of the GLB outputs are brought back into the GRP so that they can be connected to the inputs of any GLB on the device. • LEAD-FREE PACKAGE OPTIONS Copyright © 2004 Lattice Semiconductor Corp. All brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A. Tel. (503) 268-8000; 1-800-LATTICE; FAX (503) 268-8556; http://www.latticesemi.com 2064ve_09 1 August 2004 Specifications ispLSI 2064VE Functional Block Diagram Generic Logic Blocks (GLBs) B7 A6 I/O 28 I/O 29 I/O 30 I/O 31 Input Bus I/O 24 I/O 25 I/O 26 I/O 27 BSCAN I/O 20 I/O 21 I/O 22 I/O 23 Output Routing Pool (ORP) I/O 18 I/O 19 RESET I/O 16 I/O 17 TDI/IN 0 TDO/IN 1 TDO/IN 2 B2 A2 B1 A3 B0 A5 BSCAN The 64-I/O 2064VE contains 64 I/O cells, while the 32I/O version contains 32 I/O cells. Each I/O cell is directly connected to an I/O pin and can be individually programmed to be a combinatorial input, output or bi-directional I/O pin with 3-state control. The signal levels are TTL compatible voltages and the output drivers can source 4 mA or sink 8 mA. Each output can be programmed independently for fast or slow output slew rate to minimize overall output switching noise. Device pins can be safely driven to 5-Volt signal levels to support mixed-voltage systems. I/O 19 I/O 18 I/O 17 I/O 16 GOE0/IN 3 A4 A6 A7 Output Routing Pool (ORP) 0139B/2064VE I/O 22 I/O 21 I/O 20 Input Bus Input Bus Input Bus TCK/IN 3 A7 Global Routing Pool (GRP) A1 Input Bus I/O 8 A5 CLK 0 CLK 1 CLK 2 A4 I/O 4 I/O 5 I/O 6 I/O 7 I/O 35 I/O 34 I/O 33 I/O 32 B3 Output Routing Pool (ORP) B0 B4 TMS/IN 2 CLK 0 CLK 1 CLK 2 A3 I/O 39 I/O 38 I/O 37 I/O 36 B5 A0 I/O 9 I/O 10 I/O 11 B1 I/O 43 I/O 42 I/O 41 I/O 40 B6 I/O 23 I/O 0 I/O 1 I/O 2 I/O 3 I/O 46 I/O 45 I/O 44 Output Routing Pool (ORP) A2 Output Routing Pool (ORP) B2 Y0 Y1 Y2 TDI/IN 0 TMS/IN 1 Output Routing Pool (ORP) I/O 12 I/O 13 I/O 14 I/O 15 Global Routing Pool (GRP) A1 Output Routing Pool (ORP) Megablock B4 B3 A0 Input Bus I/O 8 I/O 9 I/O 10 I/O 11 B5 I/O 47 I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 B6 GOE1/Y0 RESET/Y1 TCK/Y2 Output Routing Pool (ORP) B7 Generic Logic Blocks (GLBs) Input Bus I/O 12 I/O 13 I/O 14 I/O 15 Input Bus Megablock I/O 27 I/O 26 I/O 25 I/O 24 I/O 31 I/O 30 I/O 29 I/O 28 I/O 51 I/O 50 I/O 49 I/O 48 I/O 55 I/O 54 I/O 53 I/O 52 I/O 56 I/O 58 I/O 57 I/O 59 I/O 63 I/O 62 I/O 61 I/O 60 GOE 1 GOE 0 Figure 1. ispLSI 2064VE Functional Block Diagram (64-I/O and 32-I/O Versions) 0139B/2064VE.32IO Y1, Y2) or an asynchronous clock can be selected on a GLB basis. The asynchronous or Product Term clock can be generated in any GLB for its own clock. Programmable Open-Drain Outputs In addition to the standard output configuration, the outputs of the ispLSI 2064VE are individually programmable, either as a standard totem-pole output or an open-drain output. The totem-pole output drives the specified Voh and Vol levels, whereas the open-drain output drives only the specified Vol. The Voh level on the open-drain output depends on the external loading and pull-up. This output configuration is controlled by a programmable fuse. The default configuration when the device is in bulk erased state is totem-pole configuration. The open-drain/totem-pole option is selectable through the Lattice software tools. Eight GLBs, 32 or 16 I/O cells, two dedicated inputs and two or one ORPs are connected together to make a Megablock (see Figure 1). The outputs of the eight GLBs are connected to a set of 32 or 16 universal I/O cells by two or one ORPs. Each ispLSI 2064VE device contains two Megablocks. The GRP has as its inputs, the outputs from all of the GLBs and all of the inputs from the bi-directional I/O cells. All of these signals are made available to the inputs of the GLBs. Delays through the GRP have been equalized to minimize timing skew. Clocks in the ispLSI 2064VE device are selected using the dedicated clock pins. Three dedicated clock pins (Y0, 2 Specifications ispLSI 2064VE Absolute Maximum Ratings 1 Supply Voltage Vcc ................................................... -0.5 to +5.4V Input Voltage Applied ..................................... -0.5 to +5.6V Off-State Output Voltage Applied .................. -0.5 to +5.6V Storage Temperature ..................................... -65 to 150°C Case Temp. with Power Applied .................... -55 to 125°C Max. Junction Temp. (TJ) with Power Applied ............ 150°C 1. Stresses above those listed under the “Absolute Maximum Ratings” may cause permanent damage to the device. Functional operation of the device at these or at any other conditions above those indicated in the operational sections of this specification is not implied (while programming, follow the programming specifications). DC Recommended Operating Condition SYMBOL PARAMETER VCC Supply Voltage VIL VIH Input Low Voltage MIN. MAX. UNITS Commercial TA = 0°C to + 70°C 3.0 3.6 V Industrial TA = -40°C to + 85°C 3.0 3.6 V 0.8 V VSS – 0.5 Input High Voltage 2.0 5.25 V Table 2-0005/2064V Capacitance (TA=25°C, f=1.0 MHz) TYPICAL UNITS 8 pf VCC = 3.3V, VIN = 0.0V I/O Capacitance 6 pf VCC = 3.3V, VI/O = 0.0V Clock and Global Output Enable Capacitance 10 pf VCC = 3.3V, VY = 0.0V SYMBOL C1 C2 C3 PARAMETER Dedicated Input Capacitance TEST CONDITIONS Table 2-0006/2064VE Erase Reprogram Specifications PARAMETER Erase/Reprogram Cycles MINIMUM MAXIMUM UNITS 10000 – Cycles Table 2-0008/2064VE 3 Specifications ispLSI 2064VE Switching Test Conditions Input Pulse Levels Figure 2. Test Load GND to 3.0V Input Rise and Fall Time ≤ 1.5 ns 10% to 90% Input Timing Reference Levels 1.5V Output Timing Reference Levels 1.5V Output Load + 3.3V R1 See Figure 2 Device Output Table 2-0003/2064VE 3-state levels are measured 0.5V from steady-state active level. Test Point R2 CL* Output Load Conditions (see Figure 2) TEST CONDITION R1 R2 CL 316Ω 348Ω 35pF Active High ∞ 348Ω 35pF Active Low 316Ω 348Ω 35pF Active High to Z at VOH -0.5V ∞ 348Ω 5pF Active Low to Z at VOL +0.5V 316Ω 348Ω 5pF A B C *CL includes Test Fixture and Probe Capacitance. 0213A/2064V Table 2-0004/2064V DC Electrical Characteristics Over Recommended Operating Conditions SYMBOL VOL VOH IIL PARAMETER CONDITION 3 MIN. TYP. MAX. UNITS Output Low Voltage IOL= 8 mA – – 0.4 V Output High Voltage IOH = -4 mA 2.4 – – V 0V ≤ VIN ≤ VIL (Max.) – – -10 µA (VCC – 0.2)V ≤ VIN ≤ VCC – – 10 µA VCC ≤ VIN ≤ 5.25V – – 10 µA 0V ≤ VIN ≤ VIL – – -150 µA I/O Active Pull-Up Current Input or I/O Low Leakage Current IIH Input or I/O High Leakage Current IIL-isp IIL-PU IOS1 BSCAN Input Low Leakage Current 0V ≤ VIN ≤ VIL – – -150 µA Output Short Circuit Current VCC = 3.3V, VOUT = 0.5V – – -100 mA ICC2, 4 Operating Power Supply Current VIL = 0.0V, VIH = 3.0V – 90 – mA fCLOCK = 1 MHz Table 2-0007/2064VE 1. One output at a time for a maximum duration of one second. VOUT = 0.5V was selected to avoid test problems by tester ground degradation. Characterized but not 100% tested. 2. Measured using four 16-bit counters. 3. Typical values are at VCC = 3.3V and TA= 25°C. 4. Maximum I CC varies widely with specific device configuration and operating frequency. Refer to the Power Consumption section of this data sheet and Thermal Management section of the Lattice Semiconductor Data Book or CD-ROM to estimate maximum ICC . 4 Specifications ispLSI 2064VE External Timing Parameters Over Recommended Operating Conditions 3 PARAMETER tpd1 tpd2 fmax fmax (Ext.) fmax (Tog.) tsu1 tco1 th1 tsu2 tco2 th2 tr1 trw1 tptoeen tptoedis tgoeen tgoedis twh twl TEST COND. # DESCRIPTION -280 1 -200 MIN. MAX. MIN. MAX. UNITS A 1 Data Propagation Delay, 4PT Bypass, ORP Bypass – 3.5 – 4.5 ns A 2 Data Propagation Delay – 5.5 – 7.0 ns A 3 Clock Frequency with Internal Feedback 280 – 200 – MHz 2 1 tsu2 + tco1 – 4 Clock Frequency with External Feedback ( 182 – 133 – MHz – 5 Clock Frequency, Max. Toggle ) 300 – 200 – MHz – 6 GLB Reg. Setup Time before Clock, 4 PT Bypass 2.3 – 3.0 – ns A 7 GLB Reg. Clock to Output Delay, ORP Bypass – 2.5 – 3.5 ns – 8 GLB Reg. Hold Time after Clock, 4 PT Bypass 0.0 – 0.0 – ns GLB Reg. Setup Time before Clock – 9 3.0 – 4.0 – ns A 10 GLB Reg. Clock to Output Delay – 3.3 – 4.5 ns 0.0 – 0.0 – ns – 5.5 – 6.0 ns – 11 GLB Reg. Hold Time after Clock A 12 Ext. Reset Pin to Output Delay, ORP Bypass – 13 Ext. Reset Pulse Duration 3.5 – 4.0 – ns B 14 Input to Output Enable – 6.0 – 8.0 ns C 15 Input to Output Disable – 6.0 – 8.0 ns B 16 Global OE Output Enable – 3.5 – 5.0 ns C 17 Global OE Output Disable – 3.5 – 5.0 ns – 18 External Synchronous Clock Pulse Duration, High 1.6 – 2.5 – ns – 19 External Synchronous Clock Pulse Duration, Low 1.6 – 2.5 – ns 1. Unless noted otherwise, all parameters use a GRP load of four, 20 PTXOR path, ORP and Y0 clock. 2. Standard 16-bit counter using GRP feedback. 3. Reference Switching Test Conditions section. 5 Table 2-0030A/2064VE v.0.0 Specifications ispLSI 2064VE External Timing Parameters Over Recommended Operating Conditions 3 PARAMETER tpd1 tpd2 fmax fmax (Ext.) fmax (Tog.) tsu1 tco1 th1 tsu2 tco2 th2 tr1 trw1 tptoeen tptoedis tgoeen tgoedis twh twl -135 -100 TEST COND. # A 1 Data Propagation Delay, 4PT Bypass, ORP Bypass – 7.5 – 10.0 ns A 2 Data Propagation Delay – 10.0 – 13.0 ns DESCRIPTION 1 MIN. MAX. MIN. MAX. 2 UNITS A 3 Clock Frequency with Internal Feedback 135 – 100 – MHz – 4 Clock Frequency with External Feedback ( tsu2 + tco1) 100 – 77 – MHz – 5 Clock Frequency, Max. Toggle 143 – 100 – MHz 1 – 6 GLB Reg. Setup Time before Clock, 4 PT Bypass 5.0 – 6.5 – ns A 7 GLB Reg. Clock to Output Delay, ORP Bypass – 4.0 – 5.0 ns – 8 GLB Reg. Hold Time after Clock, 4 PT Bypass 0.0 – 0.0 – ns – 9 GLB Reg. Setup Time before Clock 6.0 – 8.0 – ns A 10 GLB Reg. Clock to Output Delay – 5.0 – 6.0 ns 0.0 – 0.0 – ns – 9.0 – 12.5 ns – 11 GLB Reg. Hold Time after Clock A 12 Ext. Reset Pin to Output Delay, ORP Bypass – 13 Ext. Reset Pulse Duration 5.0 – 6.5 – ns B 14 Input to Output Enable – 12.0 – 15.0 ns C 15 Input to Output Disable – 12.0 – 15.0 ns B 16 Global OE Output Enable – 7.0 – 9.0 ns C 17 Global OE Output Disable – 7.0 – 9.0 ns – 18 External Synchronous Clock Pulse Duration, High 3.5 – 5.0 – ns – 19 External Synchronous Clock Pulse Duration, Low 3.5 – 5.0 – ns 1. Unless noted otherwise, all parameters use a GRP load of four, 20 PTXOR path, ORP and Y0 clock. 2. Standard 16-bit counter using GRP feedback. 3. Reference Switching Test Conditions section. 6 Table 2-0030B/2064VE v.0.0 Specifications ispLSI 2064VE Internal Timing Parameters1 Over Recommended Operating Conditions PARAMETER 2 # DESCRIPTION -280 -200 MIN. MAX. MIN. MAX. UNITS Inputs tio tdin 20 Input Buffer Delay – 0.4 – 0.5 ns 21 Dedicated Input Delay – 0.8 – 1.1 ns 22 GRP Delay – 0.4 – 0.6 ns 23 4 Product Term Bypass Path Delay (Combinatorial) – 1.1 – 1.4 ns 24 4 Product Term Bypass Path Delay (Registered) – 1.6 – 1.9 ns 25 1 Product Term/XOR Path Delay – 2.3 – 2.9 ns 26 20 Product Term/XOR Path Delay – 2.3 – 2.9 ns – 2.3 – 2.9 ns – 0.0 – 0.0 ns 29 GLB Register Setup Time before Clock 0.6 – 1.2 – ns 30 GLB Register Hold Time after Clock 1.7 – 1.8 – ns 31 GLB Register Clock to Output Delay – 0.2 – 0.3 ns 32 GLB Register Reset to Output Delay – 0.4 – 0.4 ns 33 GLB Product Term Reset to Register Delay – 4.1 – 4.3 ns 34 GLB Product Term Output Enable to I/O Cell Delay – 2.9 – 3.9 ns 0.8 2.9 1.0 4.0 ns 36 ORP Delay – 1.2 – 1.5 ns 37 ORP Bypass Delay – 0.4 – 0.5 ns 38 Output Buffer Delay – 1.2 – 1.5 ns 39 Output Slew Limited Delay Adder – 1.8 – 2.0 ns 40 I/O Cell OE to Output Enabled – 2.3 – 3.0 ns 41 I/O Cell OE to Output Disabled – 2.3 – 3.0 ns 42 Global Output Enable – 1.2 – 2.0 ns 43 Clock Delay, Y0 to Global GLB Clock Line (Ref. clock) 0.7 0.7 1.2 1.2 ns 44 Clock Delay, Y1 or Y2 to Global GLB Clock Line 0.9 0.9 1.4 1.4 ns – 3.5 – 3.6 ns GRP tgrp GLB t4ptbpc t4ptbpr t1ptxor t20ptxor txoradj tgbp tgsu tgh tgco tgro tptre tptoe tptck 27 XOR Adjacent Path Delay 3 28 GLB Register Bypass Delay 35 GLB Product Term Clock Delay ORP torp torpbp Outputs tob tsl toen todis tgoe Clocks tgy0 tgy1/2 Global Reset tgr 45 Global Reset to GLB 1. Internal Timing Parameters are not tested and are for reference only. 2. Refer to Timing Model in this data sheet for further details. 3. The XOR adjacent path can only be used by hard macros. 7 Table 2-0036A/2064VE v.0.0 Specifications ispLSI 2064VE Internal Timing Parameters1 Over Recommended Operating Conditions PARAMETER 2 # DESCRIPTION -100 -135 MIN. MAX. MIN. MAX. UNITS Inputs tio tdin 20 Input Buffer Delay – 0.5 – 0.7 ns 21 Dedicated Input Delay – 1.7 – 2.5 ns 22 GRP Delay – 1.2 – 1.8 ns 23 4 Product Term Bypass Path Delay (Combinatorial) – 3.7 – 5.2 ns 24 4 Product Term Bypass Path Delay (Registered) – 3.7 – 4.7 ns 25 1 Product Term/XOR Path Delay – 4.7 – 6.2 ns 26 20 Product Term/XOR Path Delay – 4.7 – 6.2 ns – 4.7 – 6.2 ns – 0.5 – 1.0 ns 29 GLB Register Setup Time before Clock 1.2 – 1.7 – ns 30 GLB Register Hold Time after Clock 3.8 – 4.8 – ns 31 GLB Register Clock to Output Delay – 0.3 – 0.3 ns 32 GLB Register Reset to Output Delay – 1.1 – 3.1 ns 33 GLB Product Term Reset to Register Delay – 6.1 – 7.1 ns 34 GLB Product Term Output Enable to I/O Cell Delay – 6.9 – 9.1 ns 1.6 5.0 2.6 5.6 ns 36 ORP Delay – 1.5 – 1.7 ns 37 ORP Bypass Delay – 0.5 – 0.7 ns 38 Output Buffer Delay – 1.6 – 1.6 ns 39 Output Slew Limited Delay Adder – 2.0 – 2.0 ns 40 I/O Cell OE to Output Enabled – 3.4 – 3.4 ns 41 I/O Cell OE to Output Disabled – 3.4 – 3.4 ns 42 Global Output Enable – 3.6 – 5.6 ns 43 Clock Delay, Y0 to Global GLB Clock Line (Ref. clock) 1.6 1.6 2.4 2.4 ns 44 Clock Delay, Y1 or Y2 to Global GLB Clock Line 1.8 1.8 2.6 2.6 ns – 5.8 – 7.1 ns GRP tgrp GLB t4ptbpc t4ptbpr t1ptxor t20ptxor txoradj tgbp tgsu tgh tgco tgro tptre tptoe tptck 27 XOR Adjacent Path Delay 3 28 GLB Register Bypass Delay 35 GLB Product Term Clock Delay ORP torp torpbp Outputs tob tsl toen todis tgoe Clocks tgy0 tgy1/2 Global Reset tgr 45 Global Reset to GLB 1. Internal Timing Parameters are not tested and are for reference only. 2. Refer to Timing Model in this data sheet for further details. 3. The XOR adjacent path can only be used by hard macros. 8 Table 2-0036B/2064VE v.0.0 Specifications ispLSI 2064VE ispLSI 2064VE Timing Model I/O Cell GRP GLB ORP I/O Cell Feedback Ded. In I/O Pin (Input) Comb 4 PT Bypass #23 #21 I/O Delay GRP Reg 4 PT Bypass GLB Reg Bypass ORP Bypass #20 #22 #24 #28 #37 20 PT XOR Delays GLB Reg Delay ORP Delay #25, 26, 27 D Q #38, 39 #36 RST #45 Reset #29, 30, 31, 32 Control RE PTs OE #33, 34, CK 35 #40, 41 #43, 44 Y0,1,2 #42 GOE 0,1 0491/2064 Derivations of tsu, th and tco from the Product Term Clock tsu th tco = = = 2.1ns = = = = 2.3ns = Logic + Reg su - Clock (min) (tio + tgrp + t20ptxor) + (tgsu) - (tio + tgrp + tptck(min)) (#20 + #22 + #26) + (#29) - (#20 + #22 + #35) (0.4 + 0.4 + 2.3) + (0.6) - (0.4 + 0.4 + 0.8) = = = 6.3ns = Clock (max) + Reg co + Output (tio + tgrp + tptck(max)) + (tgco) + (torp + tob) (#20 + #22 + #35) + (#31) + (#36 + #38) (0.4 + 0.4 + 2.9) + (0.2) + (1.2 + 1.2) Clock (max) + Reg h - Logic (tio + tgrp + tptck(max)) + (tgh) - (tio + tgrp + t20ptxor) (#20 + #22 + #35) + (#30) - (#20 + #22 + #26) (0.4 + 0.4 + 2.9) + (1.7) - (0.4 + 0.4 + 2.3) Note: Calculations are based on timing specifications for the ispLSI 2064VE-280L. Table 2-0042/2064VE 9 I/O Pin (Output) Specifications ispLSI 2064VE Power Consumption used. Figure 3 shows the relationship between power and operating speed. Power consumption in the ispLSI 2064VE device depends on two primary factors: the speed at which the device is operating and the number of Product Terms Figure 3. Typical Device Power Consumption vs fmax 180 160 ispLSI 2064VE ICC (mA) 140 120 100 80 0 50 100 150 200 250 300 fmax (MHz) Notes: Configuration of four 16-bit counters Typical current at 3.3V, 25° C ICC can be estimated for the ispLSI 2064VE using the following equation: ICC(mA) = 8 + (# of PTs * 0.67) + (# of Nets * Fmax * 0.0045) Where: # of PTs = Number of Product Terms used in design # of nets = Number of Signals used in device Max freq = Highest Clock Frequency to the device (in MHz) The ICC estimate is based on typical conditions (VCC = 3.3V, room temperature) and an assumption of two GLB loads on average exists. These values are for estimates only. Since the value of ICC is sensitive to operating conditions and the program in the device, the actual ICC should be verified. 0127/2064VE 10 Specifications ispLSI 2064VE 64-I/O Signal Descriptions Signal Name Description RESET Active Low (0) Reset pin resets all the registers in the device. GOE 0, GOE1 Global Output Enable input pins. Y0, Y1, Y2 Dedicated Clock Input – These clock inputs are connected to one of the clock inputs of all the GLBs in the device. BSCAN Input – Dedicated in-system programming Boundary Scan enable input pin. This pin is brought low to enable the programming mode. The TMS, TDI, TDO and TCK controls become active. TDI/IN 0 Input – This pin performs two functions. (1) When BSCAN is logic low, it functions as a serial data input pin to load programming data into the device. When BSCAN is high, it functions as a dedicated input pin. TCK/IN 3 Input – This pin performs two functions. (1) When BSCAN is logic low, it functions as a clock pin for the Boundary Scan state machine. (2) When BSCAN is high, it functions as a dedicated input pin. TMS/IN 1 Input – This pin performs two functions. (1) When BSCAN is logic low, it functions as a mode control pin for the Boundary Scan state machine. (2) When BSCAN is high, it functions as a dedicated input pin. TDO/IN 2 Output/Input – This pin performs two functions. (1) When BSCAN is logic low, it functions as an output pin to read serial shift register data. (2) When BSCAN is high, it functions as a dedicated input pin. GND Ground (GND) VCC Vcc NC1 No Connect I/O Input/Output Pins – These are the general purpose I/O pins used by the logic array. 1. NC pins are not to be connected to any active signals, VCC or GND. 32-I/O Signal Descriptions Signal Name Description GOE 0/IN 3 This pin performs one of two functions. It can be programmed to function as a Global Output Enable pin or a Dedicated Input pin. GOE 1/Y0 This pin performs one of two functions. (1) It can be programmed to function as a GLobal Output Enable or a Dedicated Clock input. (2) This clock input is connected to one of the clock inputs of all GLBs on the device. RESET/Y1 This pin performs two functions: (1) Active Low (0) Reset pin which resets all of the registers in the device. (2) When active low (0), it functions as a dedicated clock input. BSCAN Input – Dedicated in-system programming Boundary Scan Enable input pin. This pin is brought low to enable the programming mode. The TMS, TDI, TDO and TCK controls become active. TDI/IN 0 Input – This pin performs two functions. (1) When BSCAN is logic low, it functions as a serial data input pin to load programming data into the device. (2) When BSCAN is high, it functions as a dedicated input pin. TMS/IN 2 Input – This pin performs two functions. (1) When BSCAN is logic low, it functions as a mode control pin for the Boundary Scan state machine. (2) When BSCAN is high, it functions as a dedicated input pin. TDO/IN 1 Output/Input – This pin performs two functions. (1) When BSCAN is logic low, it functions as an output pin to read serial shift register data. (2) When BSCAN is high, it functions as a dedicated input pin. TCK/Y2 Input – This pin performs two functions. (1) When BSCAN is logic low, it functions as a clock pin for the Boundary Scan state machine. (2) When BSCAN is high, it functions as a dedicated clock input. GND Ground (GND) VCC Vcc NC1 No Connect I/O Input/Output pins – These are the general purpose I/O pins used by the logic array. 1. NC pins are not to be connected to any active signals, VCC or GND. 11 Specifications ispLSI 2064VE 64-I/O Signal Locations Signal I/O Locations 100-Ball caBGA 100 Signal caBGA 100-Pin TQFP RESET D2 11 GOE 0, GOE 1 F9, E1 62, 13 Y0, Y1, Y2 E3, F6, F8 10, 65, 60 BSCAN E5 15 TDI/IN 0 F2 16 TCK/IN 3 G10 59 TMS/IN 1 J5 37 TDO/IN 2 GND B6 B7, F1, G9, K6 87 14, 39, 61, 86 VCC A5, E2, F10, J4 12, 36, 63, 89 NC1 A6, A8, C3, C4, D1, D6, D8, E7, E9, E10, F4, G3, G5, H7, H8, K3, K5 4, 9, 21, 25, 31, 38, 44, 50, 54, 64, 66, 71, 75, 81, 88, 94, 100 I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 I/O 8 I/O 9 I/O 10 I/O 11 I/O 12 I/O 13 I/O 14 I/O 15 I/O 16 I/O 17 I/O 18 I/O 19 I/O 20 I/O 21 I/O 22 I/O 23 I/O 24 I/O 25 I/O 26 I/O 27 I/O 28 I/O 29 I/O 30 I/O 31 I/O 32 I/O 33 I/O 34 I/O 35 I/O 36 I/O 37 I/O 38 I/O 39 I/O 40 I/O 41 I/O 42 I/O 43 I/O 44 I/O 45 I/O 46 I/O 47 I/O 48 I/O 49 I/O 50 I/O 51 I/O 52 I/O 53 I/O 54 I/O 55 I/O 56 I/O 57 I/O 58 I/O 59 I/O 60 I/O 61 I/O 62 I/O 63 1. NC pins are not to be connected to any active signals, VCC or GND. 32-I/O Signal Locations Signal 44-Pin TQFP 44-Pin PLCC GOE 0/ IN 3 40 2 GOE 1/Y0 5 11 RESET/Y1 29 35 BSCAN 7 13 TDI/IN 0 8 14 TMS/IN 2 30 36 TDO/IN 1 18 24 TCK/Y2 GND 27 17, 39 33 1, 23 VCC 6, 28 12, 34 NC1 — — 1. NC pins are not to be connected to any active signals, VCC or GND. 12 G1 F3 E4 H1 G2 J1 H2 K1 J2 K2 H3 J3 G4 H4 K4 H5 F5 J6 K7 H6 K8 G6 J7 K9 J8 K10 J9 J10 H9 H10 G7 G8 D10 E8 F7 C10 D9 B10 C9 A10 B9 A9 C8 B8 D7 C7 A7 C6 E6 B5 A4 C5 A3 D5 B4 A2 B3 A1 B2 B1 C2 C1 D4 D3 100 TQFP 44 TQFP 44 PLCC 17 18 19 20 22 23 24 26 27 28 29 30 32 33 34 35 40 41 42 43 45 46 47 48 49 51 52 53 55 56 57 58 67 68 69 70 72 73 74 76 77 78 79 80 82 83 84 85 90 91 92 93 95 96 97 98 99 1 2 3 5 6 7 8 9 10 11 12 13 14 15 16 19 20 21 22 23 24 25 26 31 32 33 34 35 36 37 38 41 42 43 44 1 2 3 4 — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — 15 16 17 18 19 20 21 22 25 26 27 28 29 30 31 32 37 38 39 40 41 42 43 44 3 4 5 6 7 8 9 10 — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — Specifications ispLSI 2064VE Signal Configuration ispLSI 2064VE 100-Ball caBGA Signal Diagram (0.8mm Ball Pitch/10.0 x 10.0mm Body Size) 10 9 8 7 6 5 4 3 2 1 A I/O 39 I/O 41 NC1 I/O 46 NC1 VCC I/O 50 I/O 52 I/O 55 I/O 57 A B I/O 37 I/O 40 I/O 43 GND TDO/ IN 2 I/O 49 I/O 54 I/O 56 I/O 58 I/O 59 B C I/O 35 I/O 38 I/O 42 I/O 45 I/O 47 I/O 51 NC1 NC1 I/O 60 I/O 61 C D I/O 32 I/O 36 NC1 I/O 44 NC1 I/O 53 I/O 62 I/O 63 RESET NC1 D E NC1 NC1 I/O 33 NC1 I/O 48 BSCAN I/O 2 Y0 VCC GOE 1 E F VCC GOE 0 Y2 I/O 34 Y1 I/O 16 NC1 I/O 1 TDI/ IN 0 GND F G TCK/ IN 3 GND I/O 31 I/O 30 I/O 21 NC1 I/O 12 NC1 I/O 4 I/O 0 G H I/O 29 I/O 28 NC1 NC1 I/O 19 I/O 15 I/O 13 I/O 10 I/O 6 I/O 3 H J I/O 27 I/O 26 I/O 24 I/O 22 I/O 17 TMS/ IN 1 VCC I/O 11 I/O 8 I/O 5 J K I/O 25 I/O 23 I/O 20 I/O 18 GND NC1 I/O 14 NC1 I/O 9 I/O 7 K 3 2 1 ispLSI 2064VE Bottom View 10 9 8 7 6 5 4 100-BGA/2064VE 1NCs are not to be connected to any active signals, VCC or GND. Note: Ball A1 indicator dot on top side of package. 13 Specifications ispLSI 2064VE Pin Configuration 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 ispLSI 2064VE Top View 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 NC1 I/O 38 I/O 37 I/O 36 NC1 I/O 35 I/O 34 I/O 33 I/O 32 NC1 Y1 NC1 VCC GOE 0 GND Y2 TCK/IN 3 I/O 31 I/O 30 I/O 29 I/O 28 NC1 I/O 27 I/O 26 I/O 25 I/O 7 I/O 8 I/O 9 I/O 10 I/O 11 1NC I/O 12 I/O 13 I/O 14 I/O 15 VCC TMS/IN 1 1NC GND I/O 16 I/O 17 I/O 18 I/O 19 1NC I/O 20 I/O 21 I/O 22 I/O 23 I/O 24 1NC 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 I/O 57 I/O 58 I/O 59 1NC I/O 60 I/O 61 I/O 62 I/O 63 1NC Y0 RESET VCC GOE 1 GND BSCAN TDI/IN 0 I/O 0 I/O 1 I/O 2 I/O 3 1NC I/O 4 I/O 5 I/O 6 1NC 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 NC1 I/O 56 I/O 55 I/O 54 I/O 53 I/O 52 NC1 I/O 51 I/O 50 I/O 49 I/O 48 VCC NC1 TDO/IN 2 GND I/O 47 I/O 46 I/O 45 I/O 44 NC1 I/O 43 I/O 42 I/O 41 I/O 40 I/O 39 ispLSI 2064VE 100-Pin TQFP Pinout Diagram (0.5mm Lead Pitch/14.0 x 14.0mm Body Size) 100 TQFP/2064VE 1. NC pins are not to be connected to any active signals, VCC or GND. 14 Specifications ispLSI 2064VE Pin Configuration I/O 20 I/O 19 I/O 21 I/O 22 I/O 23 GOE 0/IN 3 GND I/O 24 I/O 26 I/O 25 I/O 27 ispLSI 2064VE 44-Pin PLCC Pinout Diagram (0.05in Lead Pitch/0.65 x 0.65in Body Size) 6 5 4 3 2 1 44 43 42 41 40 I/O 28 I/O 29 I/O 30 I/O 31 GOE1/Y0 VCC 7 8 9 10 11 39 I/O 18 38 37 I/O 17 36 TMS/IN 2 I/O 16 12 ispLSI 2064VE 35 34 RESET/Y1 VCC Top View BSCAN 13 33 TCK/Y2 TDI/IN 0 14 32 I/O 15 I/O 0 15 31 I/O 14 I/O 1 I/O 2 16 17 30 29 I/O 13 I/O 12 I/O 10 I/O 11 I/O 9 I/O 8 TDO/IN 1 GND I/O 7 I/O 6 I/O 4 I/O 5 I/O 3 18 19 20 21 22 23 24 25 26 27 28 44 PLCC/2064VE Pin Configuration I/O 21 I/O 20 I/O 19 I/O 22 GND I/O 23 GOE 0/IN 3 I/O 24 I/O 26 I/O 25 I/O 27 ispLSI 2064VE 44-Pin TQFP Pinout Diagram (0.8mm Lead Pitch/10.0 x 10.0mm Body Size) 44 43 42 41 40 39 38 37 36 35 34 I/O 28 I/O 29 I/O 30 I/O 31 GOE1/Y0 VCC 1 2 3 4 5 ispLSI 2064VE 6 Top View 33 I/O 18 32 31 I/O 17 I/O 16 30 TMS/IN 2 29 28 RESET/Y1 VCC BSCAN 7 27 TCK/Y2 TDI/IN 0 8 26 I/O 15 I/O 0 I/O 1 9 10 I/O 14 I/O 13 I/O 2 11 25 24 23 I/O 12 I/O 9 I/O 10 I/O 11 I/O 8 GND TDO/IN 1 I/O 7 I/O 6 I/O 4 I/O 5 I/O 3 12 13 14 15 16 17 18 19 20 21 22 44 TQFP/2064VE 15 Specifications ispLSI 2064VE Part Number Description ispLSI 2064VE – XXX X XXXXX X Device Family Grade Blank = Commercial I = Industrial Device Number Package T100 = 100-Pin TQFP TN100 = Lead-Free 100-Pin TQFP B100 = 100-Ball caBGA T44 = 44-Pin TQFP TN44 = Lead-Free 44-Pin TQFP J44 = 44-Pin PLCC Speed 280 = 280 MHz fmax 200 = 200 MHz fmax 135 = 135 MHz fmax 100 = 100 MHz fmax Power L = Low ispLSI 2064VE Ordering Information Conventional Packaging COMMERCIAL FAMILY ispLSI fmax (MHz) tpd (ns) I/Os ORDERING NUMBER PACKAGE 280 3.5 64 ispLSI 2064VE-280LT100 100-Pin TQFP 280 3.5 64 ispLSI 2064VE-280LB100 100-Ball caBGA 280 3.5 32 ispLSI 2064VE-280LT44 44-Pin TQFP 200 4.5 64 ispLSI 2064VE-200LT100 100-Pin TQFP 200 4.5 64 ispLSI 2064VE-200LB100 100-Ball caBGA 200 4.5 32 ispLSI 2064VE-200LJ44 44-Pin PLCC 200 4.5 32 ispLSI 2064VE-200LT44 44-Pin TQFP 135 7.5 64 ispLSI 2064VE-135LT100 100-Pin TQFP 135 7.5 64 ispLSI 2064VE-135LB100 100-Ball caBGA 135 7.5 32 ispLSI 2064VE-135LJ44 44-Pin PLCC 135 7.5 32 ispLSI 2064VE-135LT44 44-Pin TQFP 100 10 64 ispLSI 2064VE-100LT100 100-Pin TQFP 100 10 64 ispLSI 2064VE-100LB100 100-Ball caBGA 100 10 32 ispLSI 2064VE-100LJ44 44-Pin PLCC 100 10 32 ispLSI 2064VE-100LT44 44-Pin TQFP Table 2-0041A/2064VE INDUSTRIAL FAMILY ispLSI fmax (MHz) tpd (ns) I/Os ORDERING NUMBER PACKAGE 135 7.5 64 ispLSI 2064VE-135LT100I 100-Pin TQFP 135 7.5 32 ispLSI 2064VE-135LT44I 44-Pin TQFP Table 2-0041B/2064VE 16 Specifications ispLSI 2064VE ispLSI 2064VE Ordering Information (Cont.) Lead-Free Packaging COMMERCIAL FAMILY ispLSI fmax (MHz) tpd (ns) I/Os ORDERING NUMBER PACKAGE 280 3.5 64 ispLSI 2064VE-280LTN100 Lead-Free 100-Pin TQFP 280 3.5 32 ispLSI 2064VE-280LTN44 Lead-Free 44-Pin TQFP 200 4.5 64 ispLSI 2064VE-200LTN100 Lead-Free 100-Pin TQFP 200 4.5 32 ispLSI 2064VE-200LTN44 Lead-Free 44-Pin TQFP 135 7.5 64 ispLSI 2064VE-135LTN100 Lead-Free 100-Pin TQFP 135 7.5 32 ispLSI 2064VE-135LTN44 Lead-Free 44-Pin TQFP 100 10 64 ispLSI 2064VE-100LTN100 Lead-Free 100-Pin TQFP 100 10 32 ispLSI 2064VE-100LTN44 Lead-Free 44-Pin TQFP INDUSTRIAL FAMILY ispLSI fmax (MHz) tpd (ns) I/Os ORDERING NUMBER PACKAGE 135 7.5 64 ispLSI 2064VE-135LTN100I Lead-Free 100-Pin TQFP 135 7.5 32 ispLSI 2064VE-135LTN44I Lead-Free 44-Pin TQFP 17