ISPLSI3256A-70LQI

ispLSI® 3256A Device Datasheet June 2010 All Devices Discontinued! Product Change Notification (PCN) #09-10 has been issued to discontinue all devices in this data sheet. The original datasheet pages have not been modified and do not reflect those changes. Please refer to the table below for reference PCN and current product status. Product Line ispLSI 3256A Ordering Part Number ispLSI 3256A-70LQ ispLSI 3256A-90LQ ispLSI 3256A-70LQI Product Status Reference PCN Discontinued PCN#09-10 5555 N.E. Moore Ct. z Hillsboro, Oregon 97124-6421 z Phone (503) 268-8000 z FAX (503) 268-8347 Internet: http://www.latticesemi.com ispLSI 3256A ® In-System Programmable High Density PLD Functional Block Diagram Output Routing Pool Output Routing Pool H3 G3 H2 H1 H0 A0 A1 OR G2 G1 G0 Boundary Scan D Q F3 D Q F2 A D LL IS C DE O N VIC TI N ES U ED Output Routing Pool • HIGH-DENSITY PROGRAMMABLE LOGIC — 128 I/O Pins — 11000 PLD Gates — 384 Registers — High Speed Global Interconnect — Wide Input Gating for Fast Counters, State Machines, Address Decoders, etc. — Small Logic Block Size for Random Logic Output Routing Pool Features • HIGH-PERFORMANCE E CMOS TECHNOLOGY — fmax = 90 MHz Maximum Operating Frequency — tpd = 12 ns Propagation Delay — TTL Compatible Inputs and Outputs — Electrically Erasable and Reprogrammable — Non-Volatile — 100% Tested at Time of Manufacture — Unused Product Term Shutdown Saves Power A3 Output Routing Pool • IN-SYSTEM PROGRAMMABLE — 5V In-System Programmable (ISP™) using Lattice ISP or Boundary Scan Test (IEEE 1149.1) Protocol — Increased Manufacturing Yields, Reduced Time-toMarket, and Improved Product Quality — Reprogram Soldered Devices for Faster Debugging Twin GLB D Q Array B1 F1 D Q OR B0 D Q F0 D Q E3 D Q E2 D Q B2 E1 Global Routing Pool B3 E0 C0 C1 C2 C3 Output Routing Pool D0 D1 D2 Output Routing Pool ® AND Array 2 Array A2 D3 Output Routing Pool 0139A Description • 100% IEEE 1149.1 BOUNDARY SCAN COMPATIBLE The ispLSI 3256A is a High-Density Programmable Logic Device containing 384 Registers, 128 Universal I/O pins, five Dedicated Clock Input Pins, eight Output Routing Pools (ORP) and a Global Routing Pool (GRP) which allows complete inter-connectivity between all of these elements. The ispLSI 3256A features 5V in-system programmability and in-system diagnostic capabilities. The ispLSI 3256A offers non-volatile reprogrammability of the logic, as well as the interconnect to provide truly reconfigurable systems. • OFFERS THE EASE OF USE AND FAST SYSTEM SPEED OF PLDs WITH THE DENSITY AND FLEXIBILITY OF FIELD PROGRAMMABLE GATE ARRAYS — Complete Programmable Device Can Combine Glue Logic and Structured Designs — Enhanced Pin Locking Capability — Five Dedicated Clock Input Pins — Synchronous and Asynchronous Clocks — Programmable Output Slew Rate Control to Minimize Switching Noise — Flexible Pin Placement — Optimized Global Routing Pool Provides Global Interconnectivity The basic unit of logic on the ispLSI 3256A device is the Twin Generic Logic Block (Twin GLB) labelled A0, A1...H3. There are a total of 32 Twin GLBs in the ispLSI 3256A device. Each Twin GLB has 24 inputs, a programmable AND array and two OR/Exclusive-OR Arrays, and eight outputs which can be configured to be either combinatorial or registered. All Twin GLB inputs come from the GRP. • ispDesignEXPERT™ – LOGIC COMPILER AND COMPLETE ISP DEVICE DESIGN SYSTEMS FROM HDL SYNTHESIS THROUGH IN-SYSTEM PROGRAMMING — Superior Quality of Results — Tightly Integrated with Leading CAE Vendor Tools — Productivity Enhancing Timing Analyzer, Explore Tools, Timing Simulator and ispANALYZER™ — PC and UNIX Platforms Copyright © 1999 Lattice Semiconductor Corp. All brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A. Tel. (503) 268-8000; 1-800-LATTICE; FAX (503) 268-8556; http://www.latticesemi.com 3256a_09 1 May 1999 Specifications ispLSI 3256A Functional Block Diagram Input Bus TMS/MODE TCLK/SCLK BSCAN/ispEN I/O 99 I/O 98 I/O 97 I/O 96 I/O 103 I/O 102 I/O 101 I/O 100 I/O 107 I/O 106 I/O 105 I/O 104 I/O 111 I/O 110 I/O 109 I/O 108 I/O 115 I/O 114 I/O 113 I/O 112 I/O 119 I/O 118 I/O 117 I/O 116 I/O 123 I/O 122 I/O 121 I/O 120 I/O 127 I/O 126 I/O 125 I/O 124 Generic Logic Blocks Input Bus Output Routing Pool (ORP) Output Routing Pool (ORP) ISP and Boundary Scan TAP TDI/SDI TRST I/O 24 I/O 25 I/O 26 I/O 27 I/O 28 I/O 29 I/O 30 I/O 31 G3 G2 G1 G0 A0 F3 A1 F2 A2 F1 A3 F0 E3 B1 E2 B2 E1 B3 E0 C0 C1 C2 C3 D0 D1 D2 D3 Output Routing Pool (ORP) Output Routing Pool (ORP) Input Bus Input Bus Y0 Y1 Y2 Y3 Y4 I/O 60 I/O 61 I/O 62 I/O 63 I/O 56 I/O 57 I/O 58 I/O 59 I/O 52 I/O 53 I/O 54 I/O 55 I/O 48 I/O 49 I/O 50 I/O 51 I/O 44 I/O 45 I/O 46 I/O 47 I/O 40 I/O 41 I/O 42 I/O 43 I/O 36 I/O 37 I/O 38 I/O 39 I/O 32 I/O 33 I/O 34 I/O 35 I/O 87 I/O 86 I/O 85 I/O 84 I/O 79 I/O 78 I/O 77 I/O 76 RESET 0139isp/3256A 2 I/O 91 I/O 90 I/O 89 I/O 88 I/O 83 I/O 82 I/O 81 I/O 80 Global Routing Pool (GRP) B0 TDO/SDO I/O 95 I/O 94 I/O 93 I/O 92 Input Bus H0 Input Bus I/O 20 I/O 21 I/O 22 I/O 23 Input Bus I/O 16 I/O 17 I/O 18 I/O 19 H1 Output Routing Pool (ORP) I/O 12 I/O 13 I/O 14 I/O 15 H2 CLK 0 CLK 1 CLK 2 IOCLK 0 IOCLK 1 I/O 8 I/O 9 I/O 10 I/O 11 Input Bus I/O 4 I/O 5 I/O 6 I/O 7 Output Routing Pool (ORP) I/O 0 I/O 1 I/O 2 I/O 3 Output Routing Pool (ORP) H3 Output Routing Pool (ORP) A D LL IS C DE O N VIC TI N ES U ED TOE GOE1 GOE0 Figure 1. ispLSI 3256A Functional Block Diagram I/O 75 I/O 74 I/O 73 I/O 72 I/O 71 I/O 70 I/O 69 I/O 68 I/O 67 I/O 66 I/O 65 I/O 64 Specifications ispLSI 3256A Description (continued) All local logic block outputs are brought back into the GRP so they can be connected to the inputs of any other logic block on the device. The device also has 128 I/O cells, each of which is directly connected to an I/O pin. Each I/O cell can be individually programmed to be a combinatorial input, a registered input, a latched input, an output or a bidirectional I/O pin with 3-state control. The signal levels are TTL compatible voltages and the output drivers can source 4 mA or sink 8 mA. Each output can be programmed independently for fast or slow output slew rate to minimize overall output switching noise. An additional feature of the ispLSI 3256A is its Boundary Scan capability, which is composed of cells connected between the on-chip system logic and the device’s input and output pins. All I/O pins have associated boundary scan registers, with 3-state I/O using three boundary scan registers and inputs using one. A D LL IS C DE O N VIC TI N ES U ED The ispLSI 3256A supports the full boundary scan IEEE 1149.1 specification for ISP programming and boardlevel tests via the TAP controller port. It is also fully backward compatible to the Lattice ISP interface. While fully JEDEC file and functionally compatible with the earlier ispLSI 3256 devices, the 3256A requires a modified Boundary Scan Description Library (BSDL) model to support boundary scan test and programming. As a result, existing 3256 test programs that use the boundary scan test feature must be updated to use the 3256A. Please contact Lattice Applications for the new model. The 128 I/O cells are grouped into eight sets of 16 bits. Each of these I/O groups is associated with a logic Megablock through the use of the ORP. These groups of 16 I/O cells share one Product Term Output Enable which is associated with a specific pair of Megablocks and two Global Output Enables. Four Twin GLBs, 16 I/O cells and one ORP are connected together to make a logic Megablock. The Megablock is defined by the resources that it shares. The outputs of the four Twin GLBs are connected to a set of 16 I/O cells by the ORP. The ispLSI 3256A device contains eight of these Megablocks. The ispLSI 3256A supports all IEEE 1149.1 mandatory instructions, which include BYPASS, EXTEST and SAMPLE. Key Attributes of the ispLSI 3256A Attribute The GRP has as its inputs the outputs from all of the Twin GLBs and all of the inputs from the bidirectional I/O cells. All of these signals are made available to the inputs of the Twin GLBs. Delays through the GRP have been equalized to minimize timing skew and logic glitching. Clocks in the ispLSI 3256A device are provided through five dedicated clock pins. The five pins provide three clocks to the Twin GLBs and two clocks to the I/O cells. Quantity Twin GLBs 32 Registers 384 I/O Pins 128 Global Clocks 5 Global OE 2 Test OE 1 Table 1-0003A/3256 The table at right lists key attributes of the device along with the number of resources available. 3 Specifications ispLSI 3256A Absolute Maximum Ratings 1 Supply Voltage Vcc .................................. -0.5 to +7.0V Input Voltage Applied ........................ -2.5 to VCC +1.0V Off-State Output Voltage Applied ..... -2.5 to VCC +1.0V Storage Temperature ................................ -65 to 150°C A D LL IS C DE O N VIC TI N ES U ED Case Temp. with Power Applied .............. -55 to 125°C Max. Junction Temp. (TJ) with Power Applied ... 150°C 1. Stresses above those listed under the “Absolute Maximum Ratings” may cause permanent damage to the device. Functional operation of the device at these or at any other conditions above those indicated in the operational sections of this specification is not implied (while programming, follow the programming specifications). DC Recommended Operating Condition PARAMETER SYMBOL MIN. MAX. UNITS Commercial TA = 0°C to + 70°C 4.75 5.25 V Industrial TA = -40°C to + 85°C 4.5 5.5 V Input Low Voltage 0 0.8 V Input High Voltage 2.0 VCC Supply Voltage VIL VIH Vcc+1 V Table 2-0005/3256A Capacitance (TA=25°C,f=1.0 MHz) TYPICAL UNITS I/O Capacitance (Commercial/Industrial) 9 pf VCC = 5.0V, VI/O = 2.0V Clock Capacitance 11 pf VCC = 5.0V, VY = 2.0V SYMBOL C1 C2 PARAMETER TEST CONDITIONS Table 2-0006/3256A Data Retention Specifications PARAMETER MINIMUM MAXIMUM 20 – Years 10000 – Cycles Data Retention ispLSI Erase/Reprogram Cycles UNITS Table 2-0008/3256A 4 Specifications ispLSI 3256A Switching Test Conditions Input Pulse Levels Figure 2. Test Load GND to 3.0V + 5V ≤ 3ns 10% to 90% Input Rise and Fall Time Input Timing Reference Levels 1.5V Output Timing Reference Levels 1.5V Output Load R1 Device Output See Figure 2 Table 2-0003/3256A 3-state levels are measured 0.5V from steady-state active level. Test Point CL* A D LL IS C DE O N VIC TI N ES U ED R2 *CL includes Test Fixture and Probe Capacitance. Output Load conditions (See Figure 2) 0213A TEST CONDITION A B C R1 R2 CL 470Ω 390Ω 35pF Active High ∞ 390Ω 35pF Active Low 470Ω 390Ω 35pF Active High to Z at VOH -0.5V ∞ 390Ω 5pF Active Low to Z at VOL +0.5V 470Ω 390Ω 5pF Table 2 - 0004A DC Electrical Characteristics Over Recommended Operating Conditions SYMBOL VOL VOH IIL IIH IIL-isp IIL-PU IOS1 ICC2, 4 CONDITION PARAMETER 3 MIN. TYP. MAX. UNITS Output Low Voltage IOL= 8 mA – – 0.4 V Output High Voltage IOH = -4 mA 2.4 – – V Input or I/O Low Leakage Current 0V ≤ VIN ≤ VIL (Max.) – – -10 µA Input or I/O High Leakage Current 3.5V ≤ VIN ≤ VCC – – 10 µA ispEN Input Low Leakage Current 0V ≤ VIN ≤ VIL – – -150 µA I/O Active Pull-Up Current 0V ≤ VIN ≤ VIL – – -150 µA Output Short Circuit Current VCC = 5V, VOUT = 0.5V – – -200 mA Operating Power Supply Current VIL = 0.0V, VIH = 3.0V Commercial – 200 – mA fCLOCK = 1 MHz Industrial – 200 – mA Table 2-0007/3256A 1. One output at a time for a maximum duration of one second. VOUT = 0.5V was selected to avoid test problems by tester ground degradation. Characterized but not 100% tested. 2. Measured using 16 16-bit counters. 3. Typical values are at VCC = 5V and TA= 25°C. 4. Maximum I CC varies widely with specific device configuration and operating frequency. Refer to the Power Consumption section of this data sheet and Thermal Management section of the Lattice Semiconductor Data Book or CD-ROM to estimate maximum ICC . 5 Specifications ispLSI 3256A External Switching Characteristics1, 2, 3 Over Recommended Operating Conditions 5 PARAMETER DESCRIPTION -70 -90 1 -50 MIN. MAX. MIN. MAX. MIN. MAX. UNITS A 1 Data Prop. Delay, 4PT Bypass, ORP Bypass – 12.0 – 15.0 – 20.0 ns A 2 Data Prop. Delay – 15.0 – 18.0 – 24.5 ns 90.0 – 77.0 – 57.0 – MHz 61.0 – 50.0 – 37.0 – MHz 125 – 83.0 – 63.0 – MHz 8.0 – 9.5 – 12.5 – ns – 12.0 ns 0.0 – ns A – 3 Clk Frequency with Internal Feedback 4 Clk Frequency with Ext. Feedback ( 3 1 tsu2 + tco1 ) 1. 2. 3. 4. 5. 4 – 5 Clk Frequency, Max. Toggle – 6 GLB Reg. Setup Time before Clk, 4 PT Bypass A 7 GLB Reg. Clk to Output Delay, ORP Bypass – 7.5 – 9.0 – 8 GLB Reg. Hold Time after Clk, 4 PT Bypass 0.0 – 0.0 – – 9 GLB Reg. Setup Time before Clk 9.0 – 11.0 – – 10 GLB Reg. Clk to Output Delay – 9.0 – 10.5 – 11 GLB Reg. Hold Time after Clk 0.0 – 0.0 – A 12 Ext. Reset Pin to Output Delay – 13.5 – 15.0 – 13 Ext. Reset Pulse Duration 6.5 – 10.0 – B 14 Input to Output Enable – 16.0 – 18.0 C 15 Input to Output Disable – 16.0 – 18.0 B 16 Global OE Output Enable – 10.0 – 11.0 C 17 Global OE Output Disable – 10.0 – B 18 Test OE Output Enable – 10.0 – C 19 Test OE Output Disable – 10.0 – 20 Ext. Synchronous Clk Pulse Duration, High 4.0 – 21 Ext. Synchronous Clk Pulse Duration, Low – – 23 I/O Reg Hold Time after Ext. Sync Clk (Y3, Y4) USE 3256A70 FOR NEW DESIG NS A D LL IS C DE O N VIC TI N ES U ED tpd1 tpd2 fmax fmax (Ext.) fmax (Tog.) tsu1 tco1 th1 tsu2 tco2 th2 tr1 trw1 tptoeen tptoedis tgoeen tgoedis ttoeen ttoedis twh twl tsu3 th3 TEST 2 # COND. 15.0 – ns – 14.0 ns 0.0 – ns – 20.0 ns 13.5 – ns – 24.5 ns – 24.5 ns – 13.5 ns 11.0 – 13.5 ns 17.0 – 23.0 ns – 17.0 – 23.0 ns – 6.0 – 8.0 – ns 4.0 – 6.0 – 8.0 – ns 22 I/O Reg Setup Time before Ext. Sync Clk (Y3, Y4) 5.0 – 5.0 – 7.0 – ns – 0.0 – 0.0 – ns 0.0 Unless noted otherwise, all parameters use 20 PTXOR path and ORP. Refer to Timing Model in this data sheet for further details. Standard 16-bit counter using GRP feedback. fmax (Toggle) may be less than 1/(twh + twl). This is to allow for a clock duty cycle of other than 50%. Reference Switching Test Conditions section. 6 Table 2-0030C/3256A Specifications ispLSI 3256A Internal Timing Parameters1 Over Recommended Operating Conditions PARAMETER # 2 -90 DESCRIPTION -70 -50 MIN. MAX. MIN. MAX. MIN. MAX. UNITS 24 I/O Register Bypass – 1.9 – 2.4 – 3.3 ns 25 I/O Latch Delay – 10.9 – 12.4 – 15.8 ns 5.7 – 6.2 – 8.6 ns 26 I/O Register Setup Time before Clock – A D LL IS C DE O N VIC TI N ES U ED tiobp tiolat tiosu tioh tioco tior FOR NEW D ESIGNS Inputs -3.7 – -5.2 – -7.0 – ns 28 I/O Register Clock to Out Delay – 4.2 – 4.2 – 5.3 ns 29 I/O Register Reset to Out Delay – 2.8 – 3.6 – 4.9 ns 30 GRP Delay – 2.4 – 3.0 – 4.1 ns 31 4 Product Term Bypass Path Delay (Comb.) – 4.8 – 5.9 – 7.6 ns 32 4 Product Term Bypass Path Delay (Reg.) – 4.8 – 5.9 – 7.6 ns 33 1 Product Term/XOR Path Delay – 5.4 – 6.4 – 8.8 ns 34 20 Product Term/XOR Path Delay – 6.4 – 7.4 – 10.1 ns 35 XOR Adjacent Path Delay 3 – 6.9 – 8.1 – 11.1 ns 36 GLB Register Bypass Delay – 0.1 – 0.1 37 GLB Register Setup Time before Clock 1.0 – 1.8 – 38 GLB Register Hold Time after Clock 4.8 – 6.0 – 39 GLB Register Clock to Output Delay – 1.6 – 1.8 40 GLB Register Reset to Output Delay – 2.6 – 2.8 41 GLB Product Term Reset to Register Delay – 8.6 – 10.5 27 I/O Register Hold Time after Clock GRP tgrp t4ptbp t4ptbp t1ptxor t20ptxor txoradj tgbp tgsu tgh tgco tgro tptre tptoe tptck – 4.9 – 5.4 2.8 5.3 3.2 6.3 44 ORP Delay – 2.3 – 45 ORP Bypass Delay – 0.9 – 42 GLB Product Term Output Enable to I/O Cell Delay 43 GLB Product Term Clock Delay 1. Internal Timing Parameters are not tested and are for reference only. 2. Refer to Timing Model in this data sheet for further details. 3. The XOR adjacent path can only be used by hard macros. 7 – 0.1 ns 2.4 – ns 8.2 – ns – 2.2 ns – 3.8 ns – 14.2 ns – 7.3 ns 4.3 8.5 ns 2.7 – 3.6 ns 1.2 – 1.6 ns ORP torp torpbp USE 3256A70 GLB Table 2-0036C/3256A Specifications ispLSI 3256A Internal Timing Parameters1 Over Recommended Operating Conditions 2 # -70 -90 DESCRIPTION -50 MIN. MAX. MIN. MAX. MIN. MAX. Outputs 46 Output Buffer Delay – 1.9 – 2.4 47 Output Buffer Delay, Slew Limited Adder – 11.9 – 12.4 48 I/O Cell OE to Output Enabled – 6.8 – 7.2 UNITS – 3.3 ns – 13.3 ns – 9.8 ns A D LL IS C DE O N VIC TI N ES U ED tob tobs toen todis USE 3256A70 FOR NEW DESIG NS PARAMETER 49 I/O Cell OE to Output Disabled – 6.8 – 7.2 50 Clock Delay, Y0 or Y1 or Y2 to Global GLB Clock Line 2.7 2.7 3.6 3.6 51 Clock Delay, Y3 or Y4 to I/O Cell Global Clock Line 0.7 3.7 1.2 5.2 52 Global Reset to GLB and I/O Registers – 6.7 – 7.1 53 Global OE Pad Buffer – 2.3 – 2.8 54 Test OE Pad Buffer – 3.2 – 9.8 Clocks tgy0/1/2 tioy3/4 Global Reset tgr tgoe ttoe 1. Internal Timing Parameters are not tested and are for reference only. 2. Refer to Timing Model in this data sheet for further details. 8 – 9.8 ns 4.9 4.9 ns 1.6 7.0 ns – 9.6 ns – 3.7 ns 13.2 ns – Table 2-0037C/3256A Specifications ispLSI 3256A ispLSI 3256A Timing Model I/O Cell GRP GLB ORP I/O Cell Feedback #31 I/O Reg Bypass I/O Pin (Input) #24 #30 Input D Register Q RST #25 - 29 4 PT Bypass GLB Reg Bypass ORP Bypass #32 #36 #45 20 PT XOR Delays GLB Reg Delay ORP Delay D #33 - 35 Q #44 #46, 47 #48, 49 I/O Pin (Output) A D LL IS C DE O N VIC TI N ES U ED #52 GRP RST #52 Reset Y3,4 #37 - 40 #51 Control RE PTs OE #41 - 43 CK #50 Y0,1,2 #53 GOE0,1 #54 TOE 0902/3256A Derivations of tsu, th and tco from the Product Term Clock 1 tsu = = = 4.6 ns = Logic + Reg su - Clock (min) (tiobp + tgrp + t20ptxor) + (tgsu) - (tiobp + tgrp + tptck(min)) (#24+ #30+ #34) + (#37) - (#24+ #30+ #43) (1.9 + 2.4 + 6.4) + (1.0) - (1.9 + 2.4 + 2.8) th = = = 3.7 ns = Clock (max) + Reg h - Logic (tiobp + tgrp + tptck(max)) + (tgh) - (tiobp + tgrp + t20ptxor) (#24+ #30+ #43) + (#38) - (#24+ #30+ #34) (1.9 + 2.4 + 5.3) + (4.8) - (1.9 + 2.4 + 6.4) tco = = = 15.4 ns = Clock (max) + Reg co + Output (tiobp + tgrp + tptck(max)) + (tgco) + (torp + tob) (#24 + #30 + #43) + (#39) + (#44 + #46) (1.9 + 2.4 + 5.3) + (1.6) + (2.3 + 1.9) Table 2-0042/3256A Note: Calculations are based on timing specs for the ispLSI 3256A-90L. 9 Specifications ispLSI 3256A Power Consumption Power consumption in the ispLSI 3256A device depends on two primary factors: the speed at which the device is operating and the number of product terms used. Figure 3 shows the relationship between power and operating speed. Figure 3. Typical Device Power Consumption vs fmax ispLSI 3256A ICC (mA) A D LL IS C DE O N VIC TI N ES U ED 400 300 200 0 10 20 30 40 50 60 70 80 90 100 fmax (MHz) Notes: Configuration of 16 16-bit Counters Typical Current at 5V, 25° C ICC can be estimated for the ispLSI 3256A using the following equation: ICC = 40 + (# of PTs * 0.31) + (# of nets * Max. freq * 0.0094) where: # of PTs = Number of Product Terms used in design # of nets = Number of Signals used in device Max. freq = Highest Clock Frequency to the device The ICC estimate is based on typical conditions (VCC = 5.0V, room temperature) and an assumption of two GLB loads on average exists. These values are for estimates only. Since the value of ICC is sensitive to operating conditions and the program in the device, the actual ICC should be verified. 0127A-16-80-isp/3256A 10 Specifications ispLSI 3256A Pin Description NAME PQFP/MQFP PIN NUMBERS 29, 35, 40, 46, 52, 57, 62, 68, 74, 79, 85, 90, 96, 110, 116, 121, 127, 133, 138, 144, 149, 155, 160, 6, 13, 30, 36, 41, 47, 53, 58, 64, 69, 75, 80, 86, 92, 105, 112, 117, 122, 128, 134, 139, 145, 150, 156, 2, 7, 14, DESCRIPTION I/O 0 - I/O 4 I/O 5 - I/O 9 I/O 10 - I/O 14 I/O 15 - I/O 19 I/O 20 - I/O 24 I/O 25 - I/O 29 I/O 30 - I/O 34 I/O 35 - I/O 39 I/O 40 - I/O 44 I/O 45 - I/O 49 I/O 50 - I/O 54 I/O 55 - I/O 59 I/O 60 - I/O 64 I/O 65 - I/O 69 I/O 70 - I/O 74 I/O 75 - I/O 79 I/O 80 - I/O 84 I/O 85 - I/O 89 I/O 90 - I/O 94 I/O 95 - I/O 99 I/O 100 - I/O 104 I/O 105 - I/O 109 I/O 110 - I/O 114 I/O 115 - I/O 119 I/O 120 - I/O 124 I/O 125 - I/O 127 25, 32, 37, 42, 48, 54, 59, 65, 70, 76, 82, 87, 93, 106, 113, 118, 123, 129, 135, 140, 146, 152, 157, 3, 8, 15, GOE0 and GOE1 TOE 100 and 99 98 Global Output Enable input pins. Test output enable pin - This pin tristates all I/O pins when a logic low is driven RESET 20 Y0, Y1 and Y2 18, 19, 103 Y3 and Y4 102, 101 Active Low (0) Reset pin which resets all of the GLB and I/O registers in the device. Dedicated Clock inputs. These clock inputs are connected to one of the clock inputs of all the GLBs on the device. Dedicated Clock inputs. These clock inputs are connected to one of the clock inputs of all the I/O cells in the device. BSCAN/ispEN 21 Input – Dedicated in-system programming enable input pin. When this pin is high, the BSCAN TAP controller pins TMS, TDI, TDO and TCK are enabled. When this pin is brought low, the ISP state machine control pins MODE, SDI, SDO and SLCK are enabled. High-to-low transition of this pin will put the device in the programming mode and put all I/O pins in high-Z state. TDI/SDI 22 Input – This pin performs two functions depending on the state of the BSCAN/ispEN pin. It is the Test Data input to the TAP Controller when the ispEN is logic high. TDI is used to load BSCAN test data or programming data. When ispEN is logic low, it functions as an input pin to load programming data into the ISP state machine. TCK/SCLK 23 Input – This pin performs two functions, depending on the state of the BSCAN/ispEN pin. It is the Test Clock input pin when BSCAN/ispEN is logic high. When BSCAN/ispEN is logic low, it functions as the clock for the ISP state machine. TMS/MODE 24 Input – This pin performs two functions, depending on the state of the BSCAN/ispEN pin. It is the Test Mode Select input pin when BSCAN/ispEN is logic high. When BSCAN/ispEN is logic low, it functions to control the operation of the ISP state machine. 28, 34, 39, 44, 50, 56, 61, 67, 73, 78, 84, 89, 95, 109, 115, 120, 126, 132, 137, 142, 148, 154, 159, 5, 11, 17 Input/Output Pins - These are the general purpose I/O pins used by the logic array. A D LL IS C DE O N VIC TI N ES U ED 26, 33, 38, 43, 49, 55, 60, 66, 72, 77, 83, 88, 94, 108, 114, 119, 124, 130, 136, 141, 147, 153, 158, 4, 9, 16, TRST 97 Input – Test Reset, active low to reset the Boundary Scan state machine. TDO/SDO 104 Output – This pin performs two functions, depending on the state of the BSCAN/ispEN pin. It is the Test Data Output pin when BSCAN/ispEN is logic high, and either BSCAN test data or programming data is shifted out. When BSCAN/ispEN is logic low, it is the Serial Data Output of the ISP state machine. GND 1, 81, 10, 107, 27, 125, 45, 143 63, Ground (GND) VCC 12, 111, 31, 131, 51, 151 71, 91, VCC Table 2-0002/3256A.a 11 Specifications ispLSI 3256A Pin Configuration A D LL IS C DE O N VIC TI N ES U ED 160 159 158 157 156 155 154 153 152 151 150 149 148 147 146 145 144 143 142 141 140 139 138 137 136 135 134 133 132 131 130 129 128 127 126 125 124 123 122 121 I/O 113 I/O 112 I/O 111 I/O 110 I/O 109 I/O 108 I/O 107 I/O 106 I/O 105 VCC I/O 104 I/O 103 I/O 102 I/O 101 I/O 100 I/O 99 I/O 98 GND I/O 97 I/O 96 I/O 95 I/O 94 I/O 93 I/O 92 I/O 91 I/O 90 I/O 89 I/O 88 I/O 87 VCC I/O 86 I/O 85 I/O 84 I/O 83 I/O 82 GND I/O 81 I/O 80 I/O 79 I/O 78 ispLSI 3256A 160-Pin MQFP and 160-Pin PQFP Pinout Diagram ispLSI 3256A Top View 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 I/O 77 I/O 76 I/O 75 I/O 74 I/O 73 I/O 72 I/O 71 I/O 70 I/O 69 VCC I/O 68 I/O 67 I/O 66 GND I/O 65 I/O 64 TDO/SDO* Y2 Y3 Y4 GOE0 GOE1 TOE TRST I/O 63 I/O 62 I/O 61 I/O 60 I/O 59 VCC I/O 58 I/O 57 I/O 56 I/O 55 I/O 54 I/O 53 I/O 52 I/O 51 I/O 50 GND 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 I/O 14 I/O 15 I/O 16 I/O 17 GND I/O 18 I/O 19 I/O 20 I/O 21 I/O 22 VCC I/O 23 I/O 24 I/O 25 I/O 26 I/O 27 I/O 28 I/O 29 I/O 30 I/O 31 I/O 32 I/O 33 GND I/O 34 I/O 35 I/O 36 I/O 37 I/O 38 I/O 39 I/O 40 VCC I/O 41 I/O 42 I/O 43 I/O 44 I/O 45 I/O 46 I/O 47 I/O 48 I/O 49 GND I/O 114 I/O 115 I/O 116 I/O 117 I/O 118 I/O 119 I/O 120 I/O 121 GND I/O 122 VCC I/O 123 I/O 124 I/O 125 I/O 126 I/O 127 Y0 Y1 RESET *BSCAN/ispEN *TDI/SDI *TCK/SCLK *TMS/MODE I/O 0 I/O 1 GND I/O 2 I/O 3 I/O 4 VCC I/O 5 I/O 6 I/O 7 I/O 8 I/O 9 I/O 10 I/O 11 I/O 12 I/O 13 160-PQFP/3256A *Pins have dual function capability. 12 Specifications ispLSI 3256A Part Number Description ispLSI 3256A – XX X X Device Family X Grade Blank = Commercial I = Industrial Device Number Package M = MQFP Q = PQFP A D LL IS C DE O N VIC TI N ES U ED Speed 90 = 90 MHz fmax 70 = 77 MHz fmax 50 = 57 MHz fmax Power L = Low 0212/3256A Ordering Information COMMERCIAL FAMILY ispLSI fmax (MHz) tpd (ns) ORDERING NUMBER PACKAGE 90 12 ispLSI 3256A-90LM* 160-Pin MQFP 90 12 ispLSI 3256A-90LQ 160-Pin PQFP 77 15 ispLSI 3256A-70LM* 160-Pin MQFP 77 15 ispLSI 3256A-70LQ 160-Pin PQFP 57 20 ispLSI 3256A-50LM** 160-Pin MQFP INDUSTRIAL FAMILY ispLSI fmax (MHz) tpd (ns) ORDERING NUMBER Table 2-0041B/3256A PACKAGE 77 15 ispLSI 3256A-70LQI 160-Pin PQFP 57 20 ispLSI 3256A-50LMI** 160-Pin MQFP *Use ispLSI 3256A in PQFP package for all new designs. **Use ispLSI 3256A-70LQ/I for all new designs. Table 2-0041C/3256A 13