LFXP217E6CTN144C

LatticeXP2™ Family Data Sheet DS1009 Version 01.6, August 2008 LatticeXP2 Family Data Sheet Introduction February 2008 Data Sheet DS1009 Features ■ flexiFLASH™ Architecture • • • • • • Instant-on Infinitely reconfigurable Single chip FlashBAK™ technology Serial TAG memory Design security ■ Flexible I/O Buffer • sysIO™ buffer supports: – LVCMOS 33/25/18/15/12; LVTTL – SSTL 33/25/18 class I, II – HSTL15 class I; HSTL18 class I, II – PCI – LVDS, Bus-LVDS, MLVDS, LVPECL, RSDS ■ Live Update Technology • TransFR™ technology • Secure updates with 128 bit AES encryption • Dual-boot with external SPI ■ Pre-engineered Source Synchronous Interfaces • DDR / DDR2 interfaces up to 200 MHz • 7:1 LVDS interfaces support display applications • XGMII ■ sysDSP™ Block • Three to eight blocks for high performance Multiply and Accumulate • 12 to 32 18x18 multipliers • Each block supports one 36x36 multiplier or four 18x18 or eight 9x9 multipliers ■ Density And Package Options • 5k to 40k LUT4s, 86 to 540 I/Os • csBGA, TQFP PQFP ftBGA and fpBGA packages , , • Density migration supported ■ Flexible Device Configuration • SPI (master and slave) Boot Flash Interface • Dual Boot Image supported • Soft Error Detect (SED) macro embedded ■ Embedded and Distributed Memory • Up to 885 Kbits sysMEM™ EBR • Up to 83 Kbits Distributed RAM ■ System Level Support • IEEE 1149.1 and IEEE 1532 Compliant • On-chip oscillator for initialization & general use • Devices operate with 1.2V power supply ■ sysCLOCK™ PLLs • Up to four analog PLLs per device • Clock multiply, divide and phase shifting Table 1-1. LatticeXP2 Family Selection Guide Device LUTs (K) Distributed RAM (KBits) EBR SRAM (KBits) EBR SRAM Blocks sysDSP Blocks 18 x 18 Multipliers VCC Voltage GPLL Max Available I/O Packages and I/O Combinations 132-Ball csBGA (8 x 8 mm) 144-Pin TQFP (20 x 20 mm) 208-Pin PQFP (28 x 28 mm) 256-Ball ftBGA (17 x17 mm) 484-Ball fpBGA (23 x 23 mm) 672-Ball fpBGA (27 x 27 mm) 86 100 146 172 86 100 146 201 XP2-5 5 10 166 9 3 12 1.2 2 172 XP2-8 8 18 221 12 4 16 1.2 2 201 XP2-17 17 35 276 15 5 20 1.2 4 358 XP2-30 29 56 387 21 7 28 1.2 4 472 XP2-40 40 83 885 48 8 32 1.2 4 540 146 201 358 201 363 472 363 540 © 2008 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. www.latticesemi.com 1-1 DS1009 Introduction_01.2 Lattice Semiconductor Introduction LatticeXP2 Family Data Sheet Introduction LatticeXP2 devices combine a Look-up Table (LUT) based FPGA fabric with non-volatile Flash cells in an architecture referred to as flexiFLASH. The flexiFLASH approach provides benefits including instant-on, infinite reconfigurability, on chip storage with FlashBAK embedded block memory and Serial TAG memory and design security. The parts also support Live Update technology with TransFR, 128-bit AES Encryption and Dual-boot technologies. The LatticeXP2 FPGA fabric was optimized for the new technology from the outset with high performance and low cost in mind. LatticeXP2 devices include LUT-based logic, distributed and embedded memory, Phase Locked Loops (PLLs), pre-engineered source synchronous I/O support and enhanced sysDSP blocks. The ispLEVER® design tool from Lattice allows large and complex designs to be efficiently implemented using the LatticeXP2 family of FPGA devices. Synthesis library support for LatticeXP2 is available for popular logic synthesis tools. The ispLEVER tool uses the synthesis tool output along with the constraints from its floor planning tools to place and route the design in the LatticeXP2 device. The ispLEVER tool extracts the timing from the routing and back-annotates it into the design for timing verification. Lattice provides many pre-designed Intellectual Property (IP) ispLeverCORE™ modules for the LatticeXP2 family. By using these IPs as standardized blocks, designers are free to concentrate on the unique aspects of their design, increasing their productivity. 1-2 LatticeXP2 Family Data Sheet Architecture August 2008 Data Sheet DS1009 Architecture Overview Each LatticeXP2 device contains an array of logic blocks surrounded by Programmable I/O Cells (PIC). Interspersed between the rows of logic blocks are rows of sysMEM™ Embedded Block RAM (EBR) and a row of sysDSP™ Digital Signal Processing blocks as shown in Figure 2-1. On the left and right sides of the Programmable Functional Unit (PFU) array, there are Non-volatile Memory Blocks. In configuration mode the nonvolatile memory is programmed via the IEEE 1149.1 TAP port or the sysCONFIG™ peripheral port. On power up, the configuration data is transferred from the Non-volatile Memory Blocks to the configuration SRAM. With this technology, expensive external configuration memory is not required, and designs are secured from unauthorized read-back. This transfer of data from non-volatile memory to configuration SRAM via wide busses happens in microseconds, providing an “instant-on” capability that allows easy interfacing in many applications. LatticeXP2 devices can also transfer data from the sysMEM EBR blocks to the Non-volatile Memory Blocks at user request. There are two kinds of logic blocks, the PFU and the PFU without RAM (PFF). The PFU contains the building blocks for logic, arithmetic, RAM and ROM functions. The PFF block contains building blocks for logic, arithmetic and ROM functions. Both PFU and PFF blocks are optimized for flexibility allowing complex designs to be implemented quickly and efficiently. Logic Blocks are arranged in a two-dimensional array. Only one type of block is used per row. LatticeXP2 devices contain one or more rows of sysMEM EBR blocks. sysMEM EBRs are large dedicated 18Kbit memory blocks. Each sysMEM block can be configured in a variety of depths and widths of RAM or ROM. In addition, LatticeXP2 devices contain up to two rows of DSP Blocks. Each DSP block has multipliers and adder/accumulators, which are the building blocks for complex signal processing capabilities. Each PIC block encompasses two PIOs (PIO pairs) with their respective sysIO buffers. The sysIO buffers of the LatticeXP2 devices are arranged into eight banks, allowing the implementation of a wide variety of I/O standards. In addition, a separate I/O bank is provided for programming interfaces. PIO pairs on the left and right edges of the device can be configured as LVDS transmit/receive pairs. The PIC logic also includes pre-engineered support to aid in the implementation of high speed source synchronous standards such as 7:1 LVDS interfaces, found in many display applications, and memory interfaces including DDR and DDR2. Other blocks provided include PLLs and configuration functions. The LatticeXP2 architecture provides up to four General Purpose PLLs (GPLL) per device. The GPLL blocks are located in the corners of the device. The configuration block that supports features such as configuration bit-stream de-encryption, transparent updates and dual boot support is located between banks two and three. Every device in the LatticeXP2 family supports a sysCONFIG port, muxed with bank seven I/Os, which supports serial device configuration. A JTAG port is provided between banks two and three. This family also provides an on-chip oscillator and Soft Error Detect (SED) capability. LatticeXP2 devices use 1.2V as their core voltage. © 2008 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. www.latticesemi.com 2-1 DS1009 Architecture_01.4 Lattice Semiconductor Figure 2-1. Simplified Block Diagram, LatticeXP2-17 Device (Top Level) Architecture LatticeXP2 Family Data Sheet sysIO Buffers, Pre-Engineered Source Synchronous Support On-chip Oscillator Programmable Function Units (PFUs) SPI Port sysMEM Block RAM JTAG Port DSP Blocks Flash sysCLOCK PLLs Flexible Routing PFU Blocks The core of the LatticeXP2 device is made up of logic blocks in two forms, PFUs and PFFs. PFUs can be programmed to perform logic, arithmetic, distributed RAM and distributed ROM functions. PFF blocks can be programmed to perform logic, arithmetic and ROM functions. Except where necessary, the remainder of this data sheet will use the term PFU to refer to both PFU and PFF blocks. Each PFU block consists of four interconnected slices, numbered Slice 0 through Slice 3, as shown in Figure 2-2. All the interconnections to and from PFU blocks are from routing. There are 50 inputs and 23 outputs associated with each PFU block. 2-2 Lattice Semiconductor Figure 2-2. PFU Diagram From Routing Architecture LatticeXP2 Family Data Sheet LUT4 & CARRY LUT4 & CARRY LUT4 & CARRY LUT4 & CARRY LUT4 & CARRY LUT4 & CARRY LUT4 LUT4 Slice 0 Slice 1 Slice 2 Slice 3 D D D D D D FF FF FF FF FF FF To Routing Slice Slice 0 through Slice 2 contain two 4-input combinatorial Look-Up Tables (LUT4), which feed two registers. Slice 3 contains two LUT4s and no registers. For PFUs, Slice 0 and Slice 2 can also be configured as distributed memory, a capability not available in PFF blocks. Table 2-1 shows the capability of the slices in both PFF and PFU blocks along with the operation modes they enable. In addition, each PFU contains logic that allows the LUTs to be combined to perform functions such as LUT5, LUT6, LUT7 and LUT8. There is control logic to perform set/reset functions (programmable as synchronous/asynchronous), clock select, chip-select and wider RAM/ROM functions. Figure 2-3 shows an overview of the internal logic of the slice. The registers in the slice can be configured as positive/negative edge triggered or level sensitive clocks. Table 2-1. Resources and Modes Available per Slice PFU BLock Slice Slice 0 Slice 1 Slice 2 Slice 3 Resources 2 LUT4s and 2 Registers 2 LUT4s Modes Logic, Ripple, ROM Logic, ROM Resources 2 LUT4s and 2 Registers 2 LUT4s PFF Block Modes Logic, Ripple, ROM Logic, Ripple, ROM Logic, Ripple, ROM Logic, ROM 2 LUT4s and 2 Registers Logic, Ripple, RAM, ROM 2 LUT4s and 2 Registers 2 LUT4s and 2 Registers Logic, Ripple, RAM, ROM 2 LUT4s and 2 Registers Slice 0 through Slice 2 have 14 input signals: 13 signals from routing and one from the carry-chain (from the adjacent slice or PFU). There are seven outputs: six to routing and one to carry-chain (to the adjacent PFU). Slice 3 has 13 input signals from routing and four signals to routing. Table 2-2 lists the signals associated with Slice 0 to Slice 2. 2-3 Lattice Semiconductor Figure 2-3. Slice Diagram FCO from Slice/PFU, FCI into Different Slice/PFU Architecture LatticeXP2 Family Data Sheet SLICE FXB FXA A1 B1 C1 D1 CO LUT4 & CARRY* CI OFX1 F/SUM D FF* To Routing LUT5 M ux F1 Q1 M1 M0 From Routing OFX0 A0 B0 C0 D0 CO LUT4 & CARRY* CI F0 F/SUM D FF* Q0 CE CLK LSR * Not in Slice 3 FCI into Slice/PFU, FCO from Different Slice/PFU For Slices 0 and 2, memory control signals are generated from Slice 1 as follows: WCK is CLK WRE is from LSR DI[3:2] for Slice 2 and DI[1:0] for Slice 0 data WAD [A:D] is a 4bit address from slice 1 LUT input Table 2-2. Slice Signal Descriptions Function Input Input Input Input Input Input Input Input Input Input Output Output Output Output Output Type Data signal Data signal Multi-purpose Multi-purpose Control signal Control signal Control signal Inter-PFU signal Inter-slice signal Inter-slice signal Data signals Data signals Data signals Data signals Inter-PFU signal Signal Names A0, B0, C0, D0 A1, B1, C1, D1 M0 M1 CE LSR CLK FCI FXA FXB F0, F1 Q0, Q1 OFX0 OFX1 FCO Inputs to LUT4 Inputs to LUT4 Multipurpose Input Multipurpose Input Clock Enable Local Set/Reset System Clock Fast Carry-In1 Intermediate signal to generate LUT6 and LUT7 Intermediate signal to generate LUT6 and LUT7 LUT4 output register bypass signals Register outputs Output of a LUT5 MUX Output of a LUT6, LUT7, LUT82 MUX depending on the slice Slice 2 of each PFU is the fast carry chain output1 Description 1. See Figure 2-3 for connection details. 2. Requires two PFUs. 2-4 Lattice Semiconductor Modes of Operation Architecture LatticeXP2 Family Data Sheet Each slice has up to four potential modes of operation: Logic, Ripple, RAM and ROM. Logic Mode In this mode, the LUTs in each slice are configured as LUT4s. A LUT4 has 16 possible input combinations. Fourinput logic functions are generated by programming the LUT4. Since there are two LUT4s per slice, a LUT5 can be constructed within one slice. Larger LUTs such as LUT6, LUT7 and LUT8, can be constructed by concatenating two or more slices. Note that a LUT8 requires more than four slices. Ripple Mode Ripple mode allows efficient implementation of small arithmetic functions. In ripple mode, the following functions can be implemented by each slice: • Addition 2-bit • Subtraction 2-bit • Add/Subtract 2-bit using dynamic control • Up counter 2-bit • Down counter 2-bit • Up/Down counter with async clear • Up/Down counter with preload (sync) • Ripple mode multiplier building block • Multiplier support • Comparator functions of A and B inputs – A greater-than-or-equal-to B – A not-equal-to B – A less-than-or-equal-to B Two carry signals, FCI and FCO, are generated per slice in this mode, allowing fast arithmetic functions to be constructed by concatenating slices. RAM Mode In this mode, a 16x4-bit distributed Single Port RAM (SPR) can be constructed using each LUT block in Slice 0 and Slice 2 as a 16x1-bit memory. Slice 1 is used to provide memory address and control signals. A 16x2-bit Pseudo Dual Port RAM (PDPR) memory is created by using one slice as the read-write port and the other companion slice as the read-only port. The Lattice design tools support the creation of a variety of different size memories. Where appropriate, the software will construct these using distributed memory primitives that represent the capabilities of the PFU. Table 2-3 shows the number of slices required to implement different distributed RAM primitives. For more information on using RAM in LatticeXP2 devices, please see TN1137, LatticeXP2 Memory Usage Guide. Table 2-3. Number of Slices Required For Implementing Distributed RAM SPR 16X4 Number of slices 3 Note: SPR = Single Port RAM, PDPR = Pseudo Dual Port RAM PDPR 16X4 3 ROM Mode ROM mode uses the LUT logic; hence, Slices 0 through 3 can be used in the ROM mode. Preloading is accomplished through the programming interface during PFU configuration. 2-5 Lattice Semiconductor Architecture LatticeXP2 Family Data Sheet Routing There are many resources provided in the LatticeXP2 devices to route signals individually or as busses with related control signals. The routing resources consist of switching circuitry, buffers and metal interconnect (routing) segments. The inter-PFU connections are made with x1 (spans two PFU), x2 (spans three PFU) or x6 (spans seven PFU) connections. The x1 and x2 connections provide fast and efficient connections in horizontal and vertical directions. The x2 and x6 resources are buffered to allow both short and long connections routing between PFUs. The LatticeXP2 family has an enhanced routing architecture to produce a compact design. The ispLEVER design tool takes the output of the synthesis tool and places and routes the design. Generally, the place and route tool is completely automatic, although an interactive routing editor is available to optimize the design. sysCLOCK Phase Locked Loops (PLL) The sysCLOCK PLLs provide the ability to synthesize clock frequencies. The LatticeXP2 family supports between two and four full featured General Purpose PLLs (GPLL). The architecture of the GPLL is shown in Figure 2-4. CLKI, the PLL reference frequency, is provided either from the pin or from routing; it feeds into the Input Clock Divider block. CLKFB, the feedback signal, is generated from CLKOP (the primary clock output) or from a user clock pin/logic. CLKFB feeds into the Feedback Divider and is used to multiply the reference frequency. Both the input path and feedback signals enter the Voltage Controlled Oscillator (VCO) block. The phase and frequency of the VCO are determined from the input path and feedback signals. A LOCK signal is generated by the VCO to indicate that the VCO is locked with the input clock signal. The output of the VCO feeds into the CLKOP Divider, a post-scalar divider. The duty cycle of the CLKOP Divider output can be fine tuned using the Duty Trim block, which creates the CLKOP signal. By allowing the VCO to operate at higher frequencies than CLKOP, the frequency range of the GPLL is expanded. The output of the CLKOP Divider is passed through the CLKOK Divider, a secondary clock divider, to generate lower frequencies for the CLKOK output. For applications that require even lower frequencies, the CLKOP signal is passed through a divideby-three divider to produce the CLKOK2 output. The CLKOK2 output is provided for applications that use source synchronous logic. The Phase/Duty Cycle/Duty Trim block is used to adjust the phase and duty cycle of the CLKOP Divider output to generate the CLKOS signal. The phase/duty cycle setting can be pre-programmed or dynamically adjusted. The clock outputs from the GPLL; CLKOP, CLKOK, CLKOK2 and CLKOS, are fed to the clock distribution network. For further information on the GPLL please see TN1126, LatticeXP2 sysCLOCK PLL Design and Usage Guide. 2-6 Lattice Semiconductor Figure 2-4. General Purpose PLL (GPLL) Diagram WRDEL DDUTY DPHASE Architecture LatticeXP2 Family Data Sheet 3 Phase/ Duty Cycle/ Duty Trim PFD CLKFB CLKFB Divider VCO/ LOOP FILTER CLKOP Divider Duty Trim CLKOK2 CLKOS CLKI CLKI Divider CLKOP CLKOK CLKOK Divider Lock Detect LOCK Internal Feedback RSTK RST Table 2-4 provides a description of the signals in the GPLL blocks. Table 2-4. GPLL Block Signal Descriptions Signal CLKI CLKFB RST RSTK DPHASE [3:0] DDDUTY [3:0] WRDEL CLKOS CLKOP CLKOK CLKOK2 LOCK I/O I I I I I I I O O O O O Clock input from external pin or routing PLL feedback input from CLKOP (PLL internal), from clock net (CLKOP) or from a user clock (PIN or logic) “1” to reset PLL counters, VCO, charge pumps and M-dividers “1” to reset K-divider DPA Phase Adjust input DPA Duty Cycle Select input DPA Fine Delay Adjust input PLL output clock to clock tree (phase shifted/duty cycle changed) PLL output clock to clock tree (no phase shift) PLL output to clock tree through secondary clock divider PLL output to clock tree (CLKOP divided by 3) “1” indicates PLL LOCK to CLKI Description Clock Dividers LatticeXP2 devices have two clock dividers, one on the left side and one on the right side of the device. These are intended to generate a slower-speed system clock from a high-speed edge clock. The block operates in a ÷2, ÷4 or ÷8 mode and maintains a known phase relationship between the divided down clock and the high-speed clock based on the release of its reset signal. The clock dividers can be fed from the CLKOP output from the GPLLs or from the Edge Clocks (ECLK). The clock divider outputs serve as primary clock sources and feed into the clock distribution network. The Reset (RST) control signal resets the input and forces all outputs to low. The RELEASE signal releases outputs to the input clock. For further information on clock dividers, please see TN1126, sysCLOCK PLL Design and Usage Guide. Figure 2-5 shows the clock divider connections. 2-7 Lattice Semiconductor Figure 2-5. Clock Divider Connections Architecture LatticeXP2 Family Data Sheet ECLK ÷1 CLKOP (GPLL) ÷2 CLKDIV ÷4 RST RELEASE ÷8 Clock Distribution Network LatticeXP2 devices have eight quadrant-based primary clocks and between six and eight flexible region-based secondary clocks/control signals. Two high performance edge clocks are available on each edge of the device to support high speed interfaces. The clock inputs are selected from external I/Os, the sysCLOCK PLLs, or routing. Clock inputs are fed throughout the chip via the primary, secondary and edge clock networks. Primary Clock Sources LatticeXP2 devices derive primary clocks from four sources: PLL outputs, CLKDIV outputs, dedicated clock inputs and routing. LatticeXP2 devices have two to four sysCLOCK PLLs, located in the four corners of the device. There are eight dedicated clock inputs, two on each side of the device. Figure 2-6 shows the primary clock sources. 2-8 Lattice Semiconductor Figure 2-6. Primary Clock Sources for XP2-17 Clock Input Clock Input From Routing Architecture LatticeXP2 Family Data Sheet PLL Input GPLL GPLL PLL Input CLK DIV CLK DIV Clock Input Primary Clock Sources to Eight Quadrant Clock Selection Clock Input Clock Input Clock Input PLL Input GPLL GPLL PLL Input From Routing Clock Input Clock Input Note: This diagram shows sources for the XP2-17 device. Smaller LatticeXP2 devices have two GPLLs. 2-9 Lattice Semiconductor Secondary Clock/Control Sources Architecture LatticeXP2 Family Data Sheet LatticeXP2 devices derive secondary clocks (SC0 through SC7) from eight dedicated clock input pads and the rest from routing. Figure 2-7 shows the secondary clock sources. Figure 2-7. Secondary Clock Sources Clock Input Clock Input From Routing From Routing From Routing From Routing From Routing From Routing From Routing From Routing Clock Input Clock Input Secondary Clock Sources Clock Input Clock Input From Routing From Routing From Routing From Routing From Routing From Routing Clock Input Clock Input From Routing From Routing 2-10 Lattice Semiconductor Edge Clock Sources Architecture LatticeXP2 Family Data Sheet Edge clock resources can be driven from a variety of sources at the same edge. Edge clock resources can be driven from adjacent edge clock PIOs, primary clock PIOs, PLLs and clock dividers as shown in Figure 2-8. Figure 2-8. Edge Clock Sources Clock Input From Routing Clock Input From Routing Sources for top edge clocks CLKOP CLKOP CLKOS GPLL PLL Input GPLL CLKOS PLL Input From Routing Clock Input Clock Input From Routing CLKOP CLKOP CLKOS GPLL From Routing Clock Input Clock Input From Routing Eight Edge Clocks (ECLK) Two Clocks per Edge PLL Input GPLL CLKOS PLL Input Sources for left edge clocks Sources for bottom edge clocks From Routing Clock Input Clock Input From Routing Sources for right edge clocks Note: This diagram shows sources for the XP2-17 device. Smaller LatticeXP2 devices have two GPLLs. 2-11 Lattice Semiconductor Primary Clock Routing Architecture LatticeXP2 Family Data Sheet The clock routing structure in LatticeXP2 devices consists of a network of eight primary clock lines (CLK0 through CLK7) per quadrant. The primary clocks of each quadrant are generated from muxes located in the center of the device. All the clock sources are connected to these muxes. Figure 2-9 shows the clock routing for one quadrant. Each quadrant mux is identical. If desired, any clock can be routed globally. Figure 2-9. Per Quadrant Primary Clock Selection Primary Clock Sources: PLLs + CLKDIVs + PIOs + Routing 30:1 30:1 30:1 30:1 30:1 30:1 29:1 29:1 29:1 29:1 DCS CLK0 CLK1 CLK2 CLK3 CLK4 CLK5 CLK6 DCS CLK7 8 Primary Clocks (CLK0 to CLK7) per Quadrant Dynamic Clock Select (DCS) The DCS is a smart multiplexer function available in the primary clock routing. It switches between two independent input clock sources without any glitches or runt pulses. This is achieved irrespective of when the select signal is toggled. There are two DCS blocks per quadrant; in total, eight DCS blocks per device. The inputs to the DCS block come from the center muxes. The output of the DCS is connected to primary clocks CLK6 and CLK7 (see Figure 29). Figure 2-10 shows the timing waveforms of the default DCS operating mode. The DCS block can be programmed to other modes. For more information on the DCS, please see TN1126, LatticeXP2 sysCLOCK PLL Design and Usage Guide. Figure 2-10. DCS Waveforms CLK0 CLK1 SEL DCSOUT Secondary Clock/Control Routing Secondary clocks in the LatticeXP2 devices are region-based resources. The benefit of region-based resources is the relatively low injection delay and skew within the region, as compared to primary clocks. EBR rows, DSP rows and a special vertical routing channel bound the secondary clock regions. This special vertical routing channel aligns with either the left edge of the center DSP block in the DSP row or the center of the DSP row. Figure 2-11 shows this special vertical routing channel and the eight secondary clock regions for the LatticeXP2-40. 2-12 Lattice Semiconductor Architecture LatticeXP2 Family Data Sheet LatticeXP2-30 and smaller devices have six secondary clock regions. All devices in the LatticeXP2 family have four secondary clocks (SC0 to SC3) which are distributed to every region. The secondary clock muxes are located in the center of the device. Figure 2-12 shows the mux structure of the secondary clock routing. Secondary clocks SC0 to SC3 are used for clock and control and SC4 to SC7 are used for high fan-out signals. Figure 2-11. Secondary Clock Regions XP2-40 I/O Bank 0 I/O Bank 1 Vertical Routing Channel Regional Boundary Secondary Clock Region 1 Secondary Clock Region 5 EBR Row Regional Boundary I/O Bank 2 I/O Bank 7 Secondary Clock Region 2 Secondary Clock Region 6 I/O Bank 6 Secondary Clock Region 3 Secondary Clock Region 7 EBR Row Regional Boundary I/O Bank 3 Secondary Clock Region 4 Secondary Clock Region 8 DSP Row Regional Boundary I/O Bank 5 I/O Bank 4 2-13 Lattice Semiconductor Figure 2-12. Secondary Clock Selection Architecture LatticeXP2 Family Data Sheet Secondary Clock Feedlines: 8 PIOs + 16 Routing 24:1 24:1 24:1 24:1 24:1 24:1 24:1 24:1 SC0 SC1 SC2 SC3 SC4 SC5 SC6 SC7 4 Secondary Clocks/CE/LSR (SC0 to SC3) per Region Clock/Control 4 High Fan-out Data Signals (SC4 to SC7) per Region High Fan-out Data Slice Clock Selection Figure 2-13 shows the clock selections and Figure 2-14 shows the control selections for Slice0 through Slice2. All the primary clocks and the four secondary clocks are routed to this clock selection mux. Other signals, via routing, can be used as clock inputs to the slices. Slice controls are generated from the secondary clocks or other signals connected via routing. If none of the signals are selected for both clock and control, then the default value of the mux output is 1. Slice 3 does not have any registers; therefore it does not have the clock or control muxes. Figure 2-13. Slice0 through Slice2 Clock Selection Primary Clock 8 Secondary Clock 4 Routing 12 Vcc 1 Clock to Slice 25:1 2-14 Lattice Semiconductor Figure 2-14. Slice0 through Slice2 Control Selection Architecture LatticeXP2 Family Data Sheet Secondary Clock 3 Slice Control Routing 12 Vcc 1 16:1 Edge Clock Routing LatticeXP2 devices have eight high-speed edge clocks that are intended for use with the PIOs in the implementation of high-speed interfaces. Each device has two edge clocks per edge. Figure 2-15 shows the selection muxes for these clocks. Figure 2-15. Edge Clock Mux Connections Top and Bottom Edge Clocks ECLK1/ ECLK2 (Both Muxes) Routing Clock Input Pad Input Pad GPLL Input Pad Left and Right Edge Clocks ECLK1 GPLL Output CLKOP Routing Input Pad GPLL Input Pad Left and Right Edge Clocks ECLK2 GPLL Output CLKOS Routing 2-15 Lattice Semiconductor Architecture LatticeXP2 Family Data Sheet sysMEM Memory LatticeXP2 devices contains a number of sysMEM Embedded Block RAM (EBR). The EBR consists of 18 Kbit RAM with dedicated input and output registers. sysMEM Memory Block The sysMEM block can implement single port, dual port or pseudo dual port memories. Each block can be used in a variety of depths and widths as shown in Table 2-5. FIFOs can be implemented in sysMEM EBR blocks by using support logic with PFUs. The EBR block supports an optional parity bit for each data byte to facilitate parity checking. EBR blocks provide byte-enable support for configurations with18-bit and 36-bit data widths. Table 2-5. sysMEM Block Configurations Memory Mode Configurations 16,384 x 1 8,192 x 2 4,096 x 4 2,048 x 9 1,024 x 18 512 x 36 16,384 x 1 8,192 x 2 4,096 x 4 2,048 x 9 1,024 x 18 16,384 x 1 8,192 x 2 4,096 x 4 2,048 x 9 1,024 x 18 512 x 36 Single Port True Dual Port Pseudo Dual Port Bus Size Matching All of the multi-port memory modes support different widths on each of the ports. The RAM bits are mapped LSB word 0 to MSB word 0, LSB word 1 to MSB word 1, and so on. Although the word size and number of words for each port varies, this mapping scheme applies to each port. FlashBAK EBR Content Storage All the EBR memory in the LatticeXP2 is shadowed by Flash memory. Optionally, initialization values for the memory blocks can be defined using the Lattice ispLEVER tools. The initialization values are loaded into the Flash memory during device programming and into the SRAM at power up or whenever the device is reconfigured. This feature is ideal for the storage of a variety of information such as look-up tables and microprocessor code. It is also possible to write the current contents of the EBR memory back to Flash memory. This capability is useful for the storage of data such as error codes and calibration information. For additional information on the FlashBAK capability see TN1137, LatticeXP2 Memory Usage Guide. 2-16 Lattice Semiconductor Figure 2-16. FlashBAK Technology Make Infinite Reads and Writes to EBR Architecture LatticeXP2 Family Data Sheet Write to Flash During Programming Flash JTAG / SPI Port FPGA Logic EBR Write From Flash to EBR During Configuration / Write From EBR to Flash on User Command Memory Cascading Larger and deeper blocks of RAMs can be created using EBR sysMEM Blocks. Typically, the Lattice design tools cascade memory transparently, based on specific design inputs. Single, Dual and Pseudo-Dual Port Modes In all the sysMEM RAM modes the input data and address for the ports are registered at the input of the memory array. The output data of the memory is optionally registered at the output. EBR memory supports two forms of write behavior for single port or dual port operation: 1. Normal – Data on the output appears only during a read cycle. During a write cycle, the data (at the current address) does not appear on the output. This mode is supported for all data widths. 2. Write Through – A copy of the input data appears at the output of the same port during a write cycle. This mode is supported for all data widths. Memory Core Reset The memory array in the EBR utilizes latches at the A and B output ports. These latches can be reset asynchronously or synchronously. RSTA and RSTB are local signals, which reset the output latches associated with Port A and Port B respectively. GSRN, the global reset signal, resets both ports. The output data latches and associated resets for both ports are as shown in Figure 2-17. Figure 2-17. Memory Core Reset Memory Core D SET Q Port A[17:0] LCLR Output Data Latches D SET Q Port B[17:0] LCLR RSTA RSTB GSRN Programmable Disable 2-17 Lattice Semiconductor Architecture LatticeXP2 Family Data Sheet For further information on the sysMEM EBR block, please see TN1137, LatticeXP2 Memory Usage Guide. EBR Asynchronous Reset EBR asynchronous reset or GSR (if used) can only be applied if all clock enables are low for a clock cycle before the reset is applied and released a clock cycle after the low-to-high transition of the reset signal, as shown in Figure 2-18. The GSR input to the EBR is always asynchronous. Figure 2-18. EBR Asynchronous Reset (Including GSR) Timing Diagram Reset Clock Clock Enable If all clock enables remain enabled, the EBR asynchronous reset or GSR may only be applied and released after the EBR read and write clock inputs are in a steady state condition for a minimum of 1/fMAX (EBR clock). The reset release must adhere to the EBR synchronous reset setup time before the next active read or write clock edge. If an EBR is pre-loaded during configuration, the GSR input must be disabled or the release of the GSR during device Wake Up must occur before the release of the device I/Os becoming active. These instructions apply to all EBR RAM and ROM implementations. Note that there are no reset restrictions if the EBR synchronous reset is used and the EBR GSR input is disabled. sysDSP™ Block The LatticeXP2 family provides a sysDSP block making it ideally suited for low cost, high performance Digital Signal Processing (DSP) applications. Typical functions used in these applications include Bit Correlators, Fast Fourier Transform (FFT) functions, Finite Impulse Response (FIR) Filter, Reed-Solomon Encoder/Decoder, Turbo Encoder/ Decoder and Convolutional Encoder/Decoder. These complex signal processing functions use similar building blocks such as multiply-adders and multiply-accumulators. sysDSP Block Approach Compare to General DSP Conventional general-purpose DSP chips typically contain one to four (Multiply and Accumulate) MAC units with fixed data-width multipliers; this leads to limited parallelism and limited throughput. Their throughput is increased by higher clock speeds. The LatticeXP2 family, on the other hand, has many DSP blocks that support different datawidths. This allows the designer to use highly parallel implementations of DSP functions. The designer can optimize the DSP performance vs. area by choosing appropriate levels of parallelism. Figure 2-19 compares the fully serial and the mixed parallel and serial implementations. 2-18 Lattice Semiconductor Figure 2-19. Comparison of General DSP and LatticeXP2 Approaches Architecture LatticeXP2 Family Data Sheet Operand A Operand A Operand B Operand B Operand A Operand B Operand A Operand B Single Multiplier x M loops x Multiplier 0 Multiplier 1 x (k adds) x + Output m/k loops Multiplier k Accumulator Function implemented in General purpose DSP m/k accumulate Function implemented in LatticeXP2 sysDSP Block Capabilities The sysDSP block in the LatticeXP2 family supports four functional elements in three 9, 18 and 36 data path widths. The user selects a function element for a DSP block and then selects the width and type (signed/unsigned) of its operands. The operands in the LatticeXP2 family sysDSP Blocks can be either signed or unsigned but not mixed within a function element. Similarly, the operand widths cannot be mixed within a block. DSP elements can be concatenated. The resources in each sysDSP block can be configured to support the following four elements: • MULT (Multiply) • MAC (Multiply, Accumulate) • MULTADDSUB (Multiply, Addition/Subtraction) • MULTADDSUBSUM (Multiply, Addition/Subtraction, Accumulate) The number of elements available in each block depends on the width selected from the three available options: x9, x18, and x36. A number of these elements are concatenated for highly parallel implementations of DSP functions. Table 2-6 shows the capabilities of the block. Table 2-6. Maximum Number of Elements in a Block Width of Multiply MULT MAC MULTADDSUB MULTADDSUBSUM x9 8 2 4 2 x18 4 2 2 1 x36 1 — — — Some options are available in four elements. The input register in all the elements can be directly loaded or can be loaded as shift register from previous operand registers. By selecting ‘dynamic operation’ the following operations are possible: 2-19 Lattice Semiconductor Architecture LatticeXP2 Family Data Sheet • In the ‘Signed/Unsigned’ options the operands can be switched between signed and unsigned on every cycle. • In the ‘Add/Sub’ option the Accumulator can be switched between addition and subtraction on every cycle. • The loading of operands can switch between parallel and serial operations. MULT sysDSP Element This multiplier element implements a multiply with no addition or accumulator nodes. The two operands, A and B, are multiplied and the result is available at the output. The user can enable the input/output and pipeline registers. Figure 2-20 shows the MULT sysDSP element. Figure 2-20. MULT sysDSP Element Shift Register B In Multiplicand m Shift Register A In m m Multiplier n n n Output Register Input Data Register A m Multiplier Input Data Register B m n n x Pipeline Register m+n (default) m+n Output Signed A Signed B Input Register Input Register To Multiplier To Multiplier CLK (CLK0,CLK1,CLK2,CLK3) CE (CE0,CE1,CE2,CE3) RST(RST0,RST1,RST2,RST3) Shift Register B Out Shift Register A Out 2-20 Lattice Semiconductor MAC sysDSP Element Architecture LatticeXP2 Family Data Sheet In this case, the two operands, A and B, are multiplied and the result is added with the previous accumulated value. This accumulated value is available at the output. The user can enable the input and pipeline registers but the output register is always enabled. The output register is used to store the accumulated value. The Accumulators in the DSP blocks in LatticeXP2 family can be initialized dynamically. A registered overflow signal is also available. The overflow conditions are provided later in this document. Figure 2-21 shows the MAC sysDSP element. Figure 2-21. MAC sysDSP Serial Register B in Multiplicand m Serial Register A in m Accumulator Preload n Input Data Register A m Multiplier Input Data Register B n n n Signed A Signed B Addn Accumsload Input Register Input Register Input Register Input Register Pipeline Register Pipeline Register Pipeline Register Pipeline Register Output Register m+n (default) Pipeline Register x Output Register Multiplier n n m m+n+16 (default) Output m+n+16 (default) To Accumulator To Accumulator To Accumulator Overflow signal CLK (CLK0,CLK1,CLK2,CLK3) To Accumulator CE (CE0,CE1,CE2,CE3) RST(RST0,RST1,RST2,RST3) SROB SROA 2-21 Lattice Semiconductor MULTADDSUB sysDSP Element Architecture LatticeXP2 Family Data Sheet In this case, the operands A0 and B0 are multiplied and the result is added/subtracted with the result of the multiplier operation of operands A1 and B1. The user can enable the input, output and pipeline registers. Figure 2-22 shows the MULTADDSUB sysDSP element. Figure 2-22. MULTADDSUB Shift Register B In Multiplicand A0 n n Input Data Register B n m m Input Data Register A m Multiplier Shift Register A In m CLK (CLK0,CLK1,CLK2,CLK3) CE (CE0,CE1,CE2,CE3) Multiplier B0 n RST (RST0,RST1,RST2,RST3) n m m m x Pipeline Register m+n (default) Add/Sub Multiplicand A1 Output Register Output m+n+1 (default) Multiplier B1 n n m+n+1 (default) m Multiplier m+n (default) Input Data Register A Input Data Register B n m Pipeline Pipe Register Reg Pipeline Pipe Register Reg Pipeline Pipe Register Reg x Pipeline Register Signed A Signed B Addn n Input Register Input Register Input Register To Add/Sub To Add/Sub To Add/Sub Shift Register B Out Shift Register A Out 2-22 Lattice Semiconductor MULTADDSUBSUM sysDSP Element Architecture LatticeXP2 Family Data Sheet In this case, the operands A0 and B0 are multiplied and the result is added/subtracted with the result of the multiplier operation of operands A1 and B1. Additionally the operands A2 and B2 are multiplied and the result is added/ subtracted with the result of the multiplier operation of operands A3 and B3. The result of both addition/subtraction are added in a summation block. The user can enable the input, output and pipeline registers. Figure 2-23 shows the MULTADDSUBSUM sysDSP element. Figure 2-23. MULTADDSUBSUM Shift Register B In Multiplicand A0 Multiplier B0 n n Input Data Register B n m m Input Data Register A m Multiplier Shift Register A In m CLK (CLK0,CLK1,CLK2,CLK3) CE (CE0,CE1,CE2,CE3) n m m m Input Data Register A n x Pipeline Register m+n (default) RST(RST0,RST1,RST2,RST3) Add/Sub0 Multiplicand A1 Multiplier B1 n m+n (default) Multiplier n n Input Data Register B n x Pipeline Register m+n+1 SUM Output Register Multiplicand A2 Multiplier B2 n n Input Data Register B m m m m+n+2 Output m+n+2 n Input Data Register A m Multiplier n m m m Input Data Register A m x Pipeline Register m+n (default) m+n+1 Add/Sub1 Multiplicand A3 Multiplier B3 n m+n (default) Multiplier n n Input Data Register B n m Input Register Input Register Input Register Input Register Pipeline Register Pipeline Register Pipeline Register Pipeline Register x Pipeline Register Signed A Signed B Addn0 Addn1 n To Add/Sub0, Add/Sub1 To Add/Sub0, Add/Sub1 To Add/Sub0 To Add/Sub1 Shift Register B Out Shift Register A Out Clock, Clock Enable and Reset Resources Global Clock, Clock Enable (CE) and Reset (RST) signals from routing are available to every DSP block. From four clock sources (CLK0, CLK1, CLK2, CLK3) one clock is selected for each input register, pipeline register and output 2-23 Lattice Semiconductor Architecture LatticeXP2 Family Data Sheet register. Similarly, CE and RST are selected from their four respective sources (CE0, CE1, CE2, CE3 and RST0, RST1, RST2, RST3) at each input register, pipeline register and output register. Signed and Unsigned with Different Widths The DSP block supports other widths, in addition to x9, x18 and x36 widths, of signed and unsigned multipliers. For unsigned operands, unused upper data bits should be filled to create a valid x9, x18 or x36 operand. For signed two’s complement operands, sign extension of the most significant bit should be performed until x9, x18 or x36 width is reached. Table 2-7 provides an example of this. Table 2-7. Sign Extension Example Number +5 -6 Unsigned 0101 N/A Unsigned 9-bit 000000101 N/A Unsigned 18-bit 000000000000000101 N/A Signed 0101 1010 Two’s Complement Signed 9 Bits 000000101 111111010 Two’s Complement Signed 18 Bits 000000000000000101 111111111111111010 OVERFLOW Flag from MAC The sysDSP block provides an overflow output to indicate that the accumulator has overflowed. “Roll-over” occurs and an overflow signal is indicated when any of the following is true: two unsigned numbers are added and the result is a smaller number than the accumulator, two positive numbers are added with a negative sum or two negative numbers are added with a positive sum. Note that when overflow occurs the overflow flag is present for only one cycle. By counting these overflow pulses in FPGA logic, larger accumulators can be constructed. The conditions for the overflow signal for signed and unsigned operands are listed in Figure 2-24. Figure 2-24. Accumulator Overflow/Underflow 011111100 011111101 011111110 011111111 100000000 100000001 100000010 252 253 254 255 256 257 258 000000011 000000010 000000001 000000000 111111111 111111110 111111101 3 2 1 0 511 510 509 Carry signal is generated for one cycle when this boundary is crossed Unsigned Operation Overflow signal is generated for one cycle when this boundary is crossed 011111100 011111101 011111110 011111111 100000000 100000001 100000010 252 253 254 255 -256 -255 -254 000000011 000000010 000000001 000000000 111111111 111111110 111111101 +3 +2 +1 0 -1 -2 -3 Signed Operation 2-24 Lattice Semiconductor IPexpress™ Architecture LatticeXP2 Family Data Sheet The user can access the sysDSP block via the ispLEVER IPexpress tool, which provides the option to configure each DSP module (or group of modules), or by direct HDL instantiation. In addition, Lattice has partnered with The MathWorks® to support instantiation in the Simulink® tool, a graphical simulation environment. Simulink works with ispLEVER to dramatically shorten the DSP design cycle in Lattice FPGAs. Optimized DSP Functions Lattice provides a library of optimized DSP IP functions. Some of the IP cores planned for the LatticeXP2 DSP include the Bit Correlator, FFT functions, FIR Filter, Reed-Solomon Encoder/Decoder, Turbo Encoder/Decoder and Convolutional Encoder/Decoder. Please contact Lattice to obtain the latest list of available DSP IP cores. Resources Available in the LatticeXP2 Family Table 2-8 shows the maximum number of multipliers for each member of the LatticeXP2 family. Table 2-9 shows the maximum available EBR RAM Blocks and Serial TAG Memory bits in each LatticeXP2 device. EBR blocks, together with Distributed RAM can be used to store variables locally for fast DSP operations. Table 2-8. Maximum Number of DSP Blocks in the LatticeXP2 Family Device XP2-5 XP2-8 XP2-17 XP2-30 XP2-40 DSP Block 3 4 5 7 8 9x9 Multiplier 24 32 40 56 64 18x18 Multiplier 12 16 20 28 32 36x36 Multiplier 3 4 5 7 8 Table 2-9. Embedded SRAM/TAG Memory in the LatticeXP2 Family Device XP2-5 XP2-8 XP2-17 XP2-30 XP2-40 EBR SRAM Block 9 12 15 21 48 Total EBR SRAM (Kbits) 166 221 276 387 885 TAG Memory (Bits) 632 768 2184 2640 3384 LatticeXP2 DSP Performance Table 2-10 lists the maximum performance in Millions of MAC (MMAC) operations per second for each member of the LatticeXP2 family. Table 2-10. DSP Performance Device XP2-5 XP2-8 XP2-17 XP2-30 XP2-40 DSP Block 3 4 5 7 8 DSP Performance MMAC 3,900 5,200 6,500 9,100 10,400 For further information on the sysDSP block, please see TN1140, LatticeXP2 sysDSP Usage Guide. 2-25 Lattice Semiconductor Architecture LatticeXP2 Family Data Sheet Programmable I/O Cells (PIC) Each PIC contains two PIOs connected to their respective sysIO buffers as shown in Figure 2-25. The PIO Block supplies the output data (DO) and the tri-state control signal (TO) to the sysIO buffer and receives input from the buffer. Table 2-11 provides the PIO signal list. Figure 2-25. PIC Diagram PIOA TD OPOS1 ONEG1 IOLT0 Tristate Register Block OPOS0 OPOS21 ONEG0 ONEG21 PADA “T” IOLD0 Output Register Block sysIO Buffer QNEG01 QNEG11 QPOS01 QPOS11 INCK2 INDD INFF IPOS0 IPOS1 CLK CE LSR GSRN ECLK1 ECLK2 DDRCLKPOL1 DQSXFER1 DQS DEL Control Muxes CLK1 CEO LSR GSR CLK0 CEI Input Register Block DI PADB “C” PIOB 1. Signals are available on left/right/bottom edges only. 2. Selected blocks. Two adjacent PIOs can be joined to provide a differential I/O pair (labeled as “T” and “C”) as shown in Figure 2-25. The PAD Labels “T” and “C” distinguish the two PIOs. Approximately 50% of the PIO pairs on the left and right edges of the device can be configured as true LVDS outputs. All I/O pairs can operate as inputs. 2-26 Lattice Semiconductor Table 2-11. PIO Signal List Name CE CLK ECLK1, ECLK2 LSR GSRN INCK2 DQS INDD INFF IPOS0, IPOS1 QPOS0 , QPOS1 1 1 Architecture LatticeXP2 Family Data Sheet Type Control from the core Control from the core Control from the core Control from the core Control from routing Input to the core Input to PIO Input to the core Input to the core Input to the core Input to the core Input to the core Output data from the core Tristate control from the core Control from the core Tristate control from the core Control from core Description Clock enables for input and output block flip-flops System clocks for input and output blocks Fast edge clocks Local Set/Reset Global Set/Reset (active low) Input to Primary Clock Network or PLL reference inputs DQS signal from logic (routing) to PIO Unregistered data input to core Registered input on positive edge of the clock (CLK0) Double data rate registered inputs to the core Gearbox pipelined inputs to the core Gearbox pipelined inputs to the core Output signals from the core for SDR and DDR operation Signals to Tristate Register block for DDR operation Dynamic input delay control bits Tristate signal from the core used in SDR operation Controls signal to the Output block QNEG01, QNEG11 OPOS0, ONEG0, OPOS2, ONEG2 OPOS1 ONEG1 DEL[3:0] TD DDRCLKPOL DQSXFER Control from clock polarity bus Controls the polarity of the clock (CLK0) that feed the DDR input block 1. Signals available on left/right/bottom only. 2. Selected I/O. PIO The PIO contains four blocks: an input register block, output register block, tristate register block and a control logic block. These blocks contain registers for operating in a variety of modes along with necessary clock and selection logic. Input Register Block The input register blocks for PIOs contain delay elements and registers that can be used to condition high-speed interface signals, such as DDR memory interfaces and source synchronous interfaces, before they are passed to the device core. Figure 2-26 shows the diagram of the input register block. Input signals are fed from the sysIO buffer to the input register block (as signal DI). If desired, the input signal can bypass the register and delay elements and be used directly as a combinatorial signal (INDD), a clock (INCK) and, in selected blocks, the input to the DQS delay block. If an input delay is desired, designers can select either a fixed delay or a dynamic delay DEL[3:0]. The delay, if selected, reduces input register hold time requirements when using a global clock. The input block allows three modes of operation. In the Single Data Rate (SDR) mode, the data is registered, by one of the registers in the SDR Sync register block, with the system clock. In DDR mode two registers are used to sample the data on the positive and negative edges of the DQS signal which creates two data streams, D0 and D2. D0 and D2 are synchronized with the system clock before entering the core. Further information on this topic can be found in the DDR Memory Support section of this data sheet. By combining input blocks of the complementary PIOs and sharing registers from output blocks, a gearbox function can be implemented, that takes a double data rate signal applied to PIOA and converts it as four data streams, IPOS0A, IPOS1A, IPOS0B and IPOS1B. Figure 2-26 shows the diagram using this gearbox function. For more information on this topic, please see TN1138, LatticeXP2 High Speed I/O Interface. 2-27 Lattice Semiconductor Architecture LatticeXP2 Family Data Sheet The signal DDRCLKPOL controls the polarity of the clock used in the synchronization registers. It ensures adequate timing when data is transferred from the DQS to system clock domain. For further discussion on this topic, see the DDR Memory section of this data sheet. Figure 2-26. Input Register Block DI (From sysIO Buffer) Fixed Delay Dynamic Delay 0 0 1 INCK2 To DQS Delay Block2 INDD DDR Registers SDR & Sync Registers Clock Transfer Registers IPOS0A D Q QPOS0A D0 D Q D Q 1 DEL [3:0] D-Type /LATCH D-Type1 D-Type From Routing D Q D1 D Q D2 D Q D Q IPOS1A QPOS1A Delayed DQS 0 1 D-Type D-Type D-Type /LATCH D-Type1 To Routing CLK0 (of PIO A) DDRCLKPOL CLKA True PIO (A) in LVDS I/O Pair Comp PIO (B) in LVDS I/O Pair DI (From sysIO Buffer) DDRSRC DDR Registers 0 1 INCK2 To DQS Delay Block2 INDD SDR & Sync Registers 0 1 Fixed Delay Dynamic Delay 0 Clock Transfer Registers D0 IPOS0B QPOS0B D Q 1 D Q DEL [3:0] D-Type D-Type /LATCH D Q D-Type1 From Routing Delayed DQS 0 1 IPOS1B D Q D1 0 D Q D2 1 D Q D Q QPOS1B D-Type D-Type D-Type /LATCH D-Type1 To Routing CLK0 (of PIO B) DDRCLKPOL CLKB 1. Shared with output register 2. Selected PIO. Gearbox Configuration Bit Note: Simplified version does not show CE and SET/RESET details Output Register Block The output register block provides the ability to register signals from the core of the device before they are passed to the sysIO buffers. The blocks on the PIOs on the left, right and bottom contain registers for SDR operation that are combined with an additional latch for DDR operation. Figure 2-27 shows the diagram of the Output Register Block for PIOs. In SDR mode, ONEG0 feeds one of the flip-flops that then feeds the output. The flip-flop can be configured as a Dtype or latch. In DDR mode, ONEG0 and OPOS0 are fed into registers on the positive edge of the clock. At the next clock cycle the registered OPOS0 is latched. A multiplexer running off the same clock cycle selects the correct register to feed the output (D0). By combining output blocks of the complementary PIOs and sharing some registers from input blocks, a gearbox function can be implemented, to take four data streams ONEG0A, ONEG1A, ONEG1B and ONEG1B. Figure 2-27 2-28 Lattice Semiconductor Architecture LatticeXP2 Family Data Sheet shows the diagram using this gearbox function. For more information on this topic, see TN1138, LatticeXP2 High Speed I/O Interface. Figure 2-27. Output and Tristate Block TD Tristate Logic ONEG1 D Q D-Type /LATCH 0 1 0 0 1 TO OPOS1 D Q D Q Latch 1 D-Type To sysIO Buffer From Routing 0 ONEG0 D Q 0 1 D-Type* 1 D Q D-Type /LATCH DDR Output Registers DO 0 0 1 OPOS0 Q D D-Type* D Latch Q 0 1 0 D 1 Q D Latch Q 1 D-Type CLKA ECLK1 ECLK2 CLK1 (CLKA) DQSXFER Clock Transfer Registers 0 1 0 1 Programmable Control Output Logic True PIO (A) in LVDS I/O Pair Comp PIO (B) in LVDS I/O Pair TD Tristate Logic ONEG1 Q D D-Type /LATCH 0 1 0 0 1 TO OPOS1 D Q D Q Latch 1 D-Type To sysIO Buffer From Routing ONEG0 D Q D-Type* Q D D-Type /LATCH DDR Output Registers 0 1 DO 0 OPOS0 D Q D Latch Q D Q D Latch Q 1 D-Type* D-Type CLKB ECLK1 ECLK2 CLK1 (CLKB) DQSXFER Clock Transfer Registers 0 1 0 1 Programmable Control Output Logic * Shared with input register Note: Simplified version does not show CE and SET/RESET details 2-29 Lattice Semiconductor Tristate Register Block Architecture LatticeXP2 Family Data Sheet The tristate register block provides the ability to register tri-state control signals from the core of the device before they are passed to the sysIO buffers. The block contains a register for SDR operation and an additional latch for DDR operation. Figure 2-27 shows the Tristate Register Block with the Output Block In SDR mode, ONEG1 feeds one of the flip-flops that then feeds the output. The flip-flop can be configured as Dtype or latch. In DDR mode, ONEG1 and OPOS1 are fed into registers on the positive edge of the clock. Then in the next clock the registered OPOS1 is latched. A multiplexer running off the same clock cycle selects the correct register for feeding to the output (D0). Control Logic Block The control logic block allows the selection and modification of control signals for use in the PIO block. A clock signal is selected from general purpose routing, ECLK1, ECLK2 or a DQS signal (from the programmable DQS pin) and is provided to the input register block. The clock can optionally be inverted. DDR Memory Support PICs have additional circuitry to allow implementation of high speed source synchronous and DDR memory interfaces. PICs have registered elements that support DDR memory interfaces. Interfaces on the left and right edges are designed for DDR memories that support 16 bits of data, whereas interfaces on the top and bottom are designed for memories that support 18 bits of data. One of every 16 PIOs on the left and right and one of every 18 PIOs on the top and bottom contain delay elements to facilitate the generation of DQS signals. The DQS signals feed the DQS buses which span the set of 16 or 18 PIOs. Figure 2-28 and Figure 2-29 show the DQS pin assignments in each set of PIOs. The exact DQS pins are shown in a dual function in the Logic Signal Connections table in this data sheet. Additional detail is provided in the Signal Descriptions table. The DQS signal from the bus is used to strobe the DDR data from the memory into input register blocks. For additional information on using DDR memory support please see TN1138, LatticeXP2 High Speed I/O Interface. 2-30 Lattice Semiconductor Figure 2-28. DQS Input Routing (Left and Right) PIO A PIO B PIO A PIO B PIO A PIO B PIO A PIO B PIO A DQS PIO B PIO A PIO B PIO A PIO B PIO A PIO B sysIO Buffer Delay Architecture LatticeXP2 Family Data Sheet PADA "T" LVDS Pair PADB "C" PADA "T" LVDS Pair PADB "C" PADA "T" LVDS Pair PADB "C" PADA "T" LVDS Pair PADB "C" Assigned DQS Pin PADA "T" LVDS Pair PADB "C" PADA "T" LVDS Pair PADB "C" PADA "T" LVDS Pair PADB "C" PADA "T" LVDS Pair PADB "C" Figure 2-29. DQS Input Routing (Top and Bottom) PIO A PIO B PIO A PIO B PIO A PIO B PIO A PIO B PIO A sysIO Buffer Delay PADA "T" LVDS Pair PADB "C" PADA "T" LVDS Pair PADB "C" PADA "T" LVDS Pair PADB "C" PADA "T" LVDS Pair PADB "C" Assigned DQS Pin DQS PIO B PIO A PIO B PIO A PIO B PIO A PIO B PIO A PIO B PADA "T" LVDS Pair PADB "C" PADA "T" LVDS Pair PADB "C" PADA "T" LVDS Pair PADB "C" PADA "T" LVDS Pair PADB "C" PADA "T" LVDS Pair PADB "C" 2-31 Lattice Semiconductor DLL Calibrated DQS Delay Block Architecture LatticeXP2 Family Data Sheet Source synchronous interfaces generally require the input clock to be adjusted in order to correctly capture data at the input register. For most interfaces a PLL is used for this adjustment. However, in DDR memories the clock, referred to as DQS, is not free-running, and this approach cannot be used. The DQS Delay block provides the required clock alignment for DDR memory interfaces. The DQS signal (selected PIOs only, as shown in Figure 2-30) feeds from the PAD through a DQS delay element to a dedicated DQS routing resource. The DQS signal also feeds polarity control logic which controls the polarity of the clock to the sync registers in the input register blocks. Figure 2-30 and Figure 2-31 show how the DQS transition signals are routed to the PIOs. The temperature, voltage and process variations of the DQS delay block are compensated by a set of 6-bit bus calibration signals from two dedicated DLLs (DDR_DLL) on opposite sides of the device. Each DLL compensates DQS delays in its half of the device as shown in Figure 2-30. The DLL loop is compensated for temperature, voltage and process variations by the system clock and feedback loop. Figure 2-30. Edge Clock, DLL Calibration and DQS Local Bus Distribution Spans 16 PIOs Left & Right Sides I/O Bank 0 I/O Bank 1 ECLK1 ECLK2 I/O Bank 2 I/O Bank 7 DQS Input DDR_DLL (Left) DDR_DLL (Right) Delayed DQS Polarity Control I/O Bank 3 DQSXFER DQS Delay Control Bus Spans 18 PIOs Top & Bottom Sides I/O Bank 6 I/O Bank 5 I/O Bank 4 2-32 Lattice Semiconductor Figure 2-31. DQS Local Bus CLK1 ECLK2 ECLK1 Polarity control Architecture LatticeXP2 Family Data Sheet DCNTL[6:0] DQSXFER DQS PIO DQSXFER Output Register Block Input Register Block GSR CEI DQS CLK1 DQS To DDR Reg. sysIO Buffer DDR Datain PAD To Sync Reg. DI PIO Polarity Control Logic DQS DQSDEL Calibration bus from DLL DCNTL[6:0] sysIO Buffer DQS Strobe PAD DI ECLK1 DQSXFER DQSXFERDEL* DCNTL[6:0] *DQSXFERDEL shifts ECLK1 by 90% and is not associated with a particular PIO. Polarity Control Logic In a typical DDR memory interface design, the phase relationship between the incoming delayed DQS strobe and the internal system clock (during the READ cycle) is unknown. The LatticeXP2 family contains dedicated circuits to transfer data between these domains. To prevent set-up and hold violations, at the domain transfer between DQS (delayed) and the system clock, a clock polarity selector is used. This changes the edge on which the data is registered in the synchronizing registers in the input register block and requires evaluation at the start of each READ cycle for the correct clock polarity. Prior to the READ operation in DDR memories, DQS is in tristate (pulled by termination). The DDR memory device drives DQS low at the start of the preamble state. A dedicated circuit detects this transition. This signal is used to control the polarity of the clock to the synchronizing registers. 2-33 Lattice Semiconductor DQSXFER Architecture LatticeXP2 Family Data Sheet LatticeXP2 devices provide a DQSXFER signal to the output buffer to assist it in data transfer to DDR memories that require DQS strobe be shifted 90o. This shifted DQS strobe is generated by the DQSDEL block. The DQSXFER signal runs the span of the data bus. sysIO Buffer Each I/O is associated with a flexible buffer referred to as a sysIO buffer. These buffers are arranged around the periphery of the device in groups referred to as banks. The sysIO buffers allow users to implement the wide variety of standards that are found in today’s systems including LVCMOS, SSTL, HSTL, LVDS and LVPECL. sysIO Buffer Banks LatticeXP2 devices have eight sysIO buffer banks for user I/Os arranged two per side. Each bank is capable of supporting multiple I/O standards. Each sysIO bank has its own I/O supply voltage (VCCIO). In addition, each bank has voltage references, VREF1 and VREF2, that allow it to be completely independent from the others. Figure 2-32 shows the eight banks and their associated supplies. In LatticeXP2 devices, single-ended output buffers and ratioed input buffers (LVTTL, LVCMOS and PCI) are powered using VCCIO. LVTTL, LVCMOS33, LVCMOS25 and LVCMOS12 can also be set as fixed threshold inputs independent of VCCIO. Each bank can support up to two separate VREF voltages, VREF1 and VREF2, that set the threshold for the referenced input buffers. Some dedicated I/O pins in a bank can be configured to be a reference voltage supply pin. Each I/O is individually configurable based on the bank’s supply and reference voltages. Figure 2-32. LatticeXP2 Banks TOP V CCIO0 V REF1(0) V REF1(1) V REF2(1) V CCIO1 Bank 0 V V REF2(0) GND GND V CCIO2 Bank 1 CCIO7 Bank 7 V REF1(7) V REF2(7) GND V REF1(2) V REF2(2) GND Bank 2 RIGHT LEFT V CCIO6 V CCIO3 Bank 6 V REF1(6) V REF2(6) GND V REF1(3) V REF2(3) GND Bank 3 Bank 5 Bank 4 V CCIO5 VREF1(5) V CCIO4 V REF1(4) V REF2(5) V REF2(4) GND BOTTOM 2-34 GND Lattice Semiconductor LatticeXP2 devices contain two types of sysIO buffer pairs. Architecture LatticeXP2 Family Data Sheet 1. Top and Bottom (Banks 0, 1, 4 and 5) sysIO Buffer Pairs (Single-Ended Outputs Only) The sysIO buffer pairs in the top banks of the device consist of two single-ended output drivers and two sets of single-ended input buffers (both ratioed and referenced). One of the referenced input buffers can also be configured as a differential input. The two pads in the pair are described as “true” and “comp”, where the true pad is associated with the positive side of the differential input buffer and the comp (complementary) pad is associated with the negative side of the differential input buffer. Only the I/Os on the top and bottom banks have programmable PCI clamps. 2. Left and Right (Banks 2, 3, 6 and 7) sysIO Buffer Pairs (50% Differential and 100% Single-Ended Outputs) The sysIO buffer pairs in the left and right banks of the device consist of two single-ended output drivers, two sets of single-ended input buffers (both ratioed and referenced) and one differential output driver. One of the referenced input buffers can also be configured as a differential input. The two pads in the pair are described as “true” and “comp”, where the true pad is associated with the positive side of the differential I/O, and the comp pad is associated with the negative side of the differential I/O. LVDS differential output drivers are available on 50% of the buffer pairs on the left and right banks. Typical sysIO I/O Behavior During Power-up The internal power-on-reset (POR) signal is deactivated when VCC and VCCAUX have reached satisfactory levels. After the POR signal is deactivated, the FPGA core logic becomes active. It is the user’s responsibility to ensure that all other VCCIO banks are active with valid input logic levels to properly control the output logic states of all the I/O banks that are critical to the application. For more information on controlling the output logic state with valid input logic levels during power-up in LatticeXP2 devices, please see TN1136, LatticeXP2 sysIO Usage Guide. The VCC and VCCAUX supply the power to the FPGA core fabric, whereas the VCCIO supplies power to the I/O buffers. In order to simplify system design while providing consistent and predictable I/O behavior, it is recommended that the I/O buffers be powered-up prior to the FPGA core fabric. VCCIO supplies should be powered-up before or together with the VCC and VCCAUX supplies. Supported sysIO Standards The LatticeXP2 sysIO buffer supports both single-ended and differential standards. Single-ended standards can be further subdivided into LVCMOS, LVTTL and other standards. The buffers support the LVTTL, LVCMOS 1.2V, 1.5V, 1.8V, 2.5V and 3.3V standards. In the LVCMOS and LVTTL modes, the buffer has individual configuration options for drive strength, bus maintenance (weak pull-up, weak pull-down, or a bus-keeper latch) and open drain. Other single-ended standards supported include SSTL and HSTL. Differential standards supported include LVDS, MLVDS, BLVDS, LVPECL, RSDS, differential SSTL and differential HSTL. Tables 2-13 and 2-14 show the I/O standards (together with their supply and reference voltages) supported by LatticeXP2 devices. For further information on utilizing the sysIO buffer to support a variety of standards please see TN1136, LatticeXP2 sysIO Usage Guide. 2-35 Lattice Semiconductor Table 2-12. Supported Input Standards Input Standard Single Ended Interfaces LVTTL LVCMOS33 LVCMOS25 LVCMOS18 LVCMOS15 LVCMOS12 PCI33 HSTL18 Class I, II HSTL15 Class I SSTL33 Class I, II SSTL25 Class I, II SSTL18 Class I, II Differential Interfaces Differential SSTL18 Class I, II Differential SSTL25 Class I, II Differential SSTL33 Class I, II Differential HSTL15 Class I Differential HSTL18 Class I, II LVDS, MLVDS, LVPECL, BLVDS, RSDS — — — — — — — — — — — — — 0.9 0.75 1.5 1.25 0.9 VREF (Nom.) Architecture LatticeXP2 Family Data Sheet VCCIO1 (Nom.) — — — 1.8 1.5 — — — — — — — — — — — — — 1. When not specified, VCCIO can be set anywhere in the valid operating range (page 3-1). 2-36 Lattice Semiconductor Table 2-13. Supported Output Standards Output Standard Single-ended Interfaces LVTTL LVCMOS33 LVCMOS25 LVCMOS18 LVCMOS15 LVCMOS12 LVCMOS33, Open Drain LVCMOS25, Open Drain LVCMOS18, Open Drain LVCMOS15, Open Drain LVCMOS12, Open Drain PCI33 HSTL18 Class I, II HSTL15 Class I SSTL33 Class I, II SSTL25 Class I, II SSTL18 Class I, II Differential Interfaces Differential SSTL33, Class I, II Differential SSTL25, Class I, II Differential SSTL18, Class I, II Differential HSTL18, Class I, II Differential HSTL15, Class I LVDS1, 2 MLVDS1 BLVDS1 LVPECL1 RSDS 1 Architecture LatticeXP2 Family Data Sheet Drive 4mA, 8mA, 12mA, 16mA, 20mA 4mA, 8mA, 12mA 16mA, 20mA 4mA, 8mA, 12mA, 16mA, 20mA 4mA, 8mA, 12mA, 16mA 4mA, 8mA 2mA, 6mA 4mA, 8mA, 12mA 16mA, 20mA 4mA, 8mA, 12mA 16mA, 20mA 4mA, 8mA, 12mA 16mA 4mA, 8mA 2mA, 6mA N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A 4mA, 8mA, 12mA, 16mA, 20mA VCCIO (Nom.) 3.3 3.3 2.5 1.8 1.5 1.2 — — — — — 3.3 1.8 1.5 3.3 2.5 1.8 3.3 2.5 1.8 1.8 1.5 2.5 2.5 2.5 3.3 2.5 3.3 LVCMOS33D1 1. Emulated with external resistors. For more detail, please see TN1138, LatticeXP2 High Speed I/O Interface. 2. On the left and right edges, LVDS outputs are supported with a dedicated differential output driver on 50% of the I/Os. This solution does not require external resistors at the driver. Hot Socketing LatticeXP2 devices have been carefully designed to ensure predictable behavior during power-up and powerdown. Power supplies can be sequenced in any order. During power-up and power-down sequences, the I/Os remain in tri-state until the power supply voltage is high enough to ensure reliable operation. In addition, leakage into I/O pins is controlled to within specified limits. This allows for easy integration with the rest of the system. These capabilities make the LatticeXP2 ideal for many multiple power supply and hot-swap applications. IEEE 1149.1-Compliant Boundary Scan Testability All LatticeXP2 devices have boundary scan cells that are accessed through an IEEE 1149.1 compliant Test Access Port (TAP). This allows functional testing of the circuit board, on which the device is mounted, through a serial scan path that can access all critical logic nodes. Internal registers are linked internally, allowing test data to be shifted in 2-37 Lattice Semiconductor Architecture LatticeXP2 Family Data Sheet and loaded directly onto test nodes, or test data to be captured and shifted out for verification. The test access port consists of dedicated I/Os: TDI, TDO, TCK and TMS. The test access port has its own supply voltage VCCJ and can operate with LVCMOS3.3, 2.5, 1.8, 1.5 and 1.2 standards. For more information, please see TN1141, LatticeXP2 sysCONFIG Usage Guide. flexiFLASH Device Configuration The LatticeXP2 devices combine Flash and SRAM on a single chip to provide users with flexibility in device programming and configuration. Figure 2-33 provides an overview of the arrangement of Flash and SRAM configuration cells within the device. The remainder of this section provides an overview of these capabilities. See TN1141, LatticeXP2 sysCONFIG Usage Guide, for a more detailed description. Figure 2-33. Overview of Flash and SRAM Configuration Cells Within LatticeXP2 Devices EBR Blocks Flash Memory Massively Parallel Data Transfer Instant-ON Flash for Single-Chip Solution SRAM Configuration Bits EBR Blocks FlashBAK for EBR Storage Decryption and Device Lock TAG Memory Device Lock for Design Security SPI and JTAG At power-up, or on user command, data is transferred from the on-chip Flash memory to the SRAM configuration cells that control the operation of the device. This is done with massively parallel buses enabling the parts to operate within microseconds of the power supplies reaching valid levels; this capability is referred to as Instant-On. The on-chip Flash enables a single-chip solution eliminating the need for external boot memory. This Flash can be programmed through either the JTAG or Slave SPI ports of the device. The SRAM configuration space can also be infinitely reconfigured through the JTAG and Master SPI ports. The JTAG port is IEEE 1149.1 and IEEE 1532 compliant. As described in the EBR section of the data sheet, the FlashBAK capability of the parts enables the contents of the EBR blocks to be written back into the Flash storage area without erasing or reprogramming other aspects of the device configuration. Serial TAG memory is also available to allow the storage of small amounts of data such as calibration coefficients and error codes. For applications where security is important, the lack of an external bitstream provides a solution that is inherently more secure than SRAM only FPGAs. This is further enhanced by device locking. The device can be in one of three modes: 2-38 Lattice Semiconductor 1. Unlocked Architecture LatticeXP2 Family Data Sheet 2. Key Locked – Presenting the key through the programming interface allows the device to be unlocked. 3. Permanently Locked – The device is permanently locked. To further complement the security of the device a One Time Programmable (OTP) mode is available. Once the device is set in this mode it is not possible to erase or re-program the Flash portion of the device. Serial TAG Memory LatticeXP2 devices offer 0.6 to 3.3kbits of Flash memory in the form of Serial TAG memory. The TAG memory is an area of the on-chip Flash that can be used for non-volatile storage including electronic ID codes, version codes, date stamps, asset IDs and calibration settings. A block diagram of the TAG memory is shown in Figure 2-34. The TAG memory is accessed in the same way as external SPI Flash and it can be read or programmed either through JTAG, an external Slave SPI Port, or directly from FPGA logic. To read the TAG memory, a start address is specified and the entire TAG memory contents are read sequentially in a first-in-first-out manner. The TAG memory is independent of the Flash used for device configuration and given its use for general-purpose storage functions is always accessible regardless of the device security settings. For more information, see TN1137, LatticeXP2 Memory Usage Guide, and TN1141, LatticeXP2 sysCONFIG Usage Guide. Figure 2-34. Serial TAG Memory Diagram External Slave SPI Port JTAG FPGA Logic TDI Data Shift Register TDO External Slave SPI Port JTAG FPGA Logic Sequential Address Counter Flash Flash Memory Array Live Update Technology Many applications require field updates of the FPGA. LatticeXP2 devices provide three features that enable this configuration to be done in a secure and failsafe manner while minimizing impact on system operation. 1. Decryption Support LatticeXP2 devices provide on-chip, non-volatile key storage to support decryption of a 128-bit AES encrypted bitstream, securing designs and deterring design piracy. 2. TransFR (Transparent Field Reconfiguration) TransFR I/O (TFR) is a unique Lattice technology that allows users to update their logic in the field without interrupting system operation using a single ispVM command. TransFR I/O allows I/O states to be frozen during device configuration. This allows the device to be field updated with a minimum of system disruption and downtime. For more information please see TN1143, LatticeXP2 TransFR I/O. 3. Dual Boot Image Support Dual boot images are supported for applications requiring reliable remote updates of configuration data for the system FPGA. After the system is running with a basic configuration, a new boot image can be downloaded remotely and stored in a separate location in the configuration storage device. Any time after the update the LatticeXP2 can be re-booted from this new configuration file. If there is a problem such as corrupt data during download or incorrect version number with this new boot image, the LatticeXP2 device can revert back to the 2-39 Lattice Semiconductor Architecture LatticeXP2 Family Data Sheet original backup configuration and try again. This all can be done without power cycling the system. For more information please see TN1144, LatticeXP2 Dual Boot Usage Guide. For more information on device configuration, please see TN1141, LatticeXP2 sysCONFIG Usage Guide. Soft Error Detect (SED) Support LatticeXP2 devices have dedicated logic to perform Cyclic Redundancy Code (CRC) checks. During configuration, the configuration data bitstream can be checked with the CRC logic block. In addition, LatticeXP2 devices can be programmed for checking soft errors in SRAM. The SED operation can run in the background during user mode (normal operation). In the event a soft error occurs, the device can be programmed to either reload from a known good boot image (from internal Flash or external SPI memory) or generate an error signal. For further information on SED support, please see TN1130, LatticeXP2 Soft Error Detection (SED) Usage Guide. On-Chip Oscillator Every LatticeXP2 device has an internal CMOS oscillator that is used to derive a Master Clock (CCLK) for configuration. The oscillator and CCLK run continuously and are available to user logic after configuration is complete. The available CCLK frequencies are listed in Table 2-14. When a different CCLK frequency is selected during the design process, the following sequence takes place: 1. Device powers up with the default CCLK frequency. 2. During configuration, users select a different CCLK frequency. 3. CCLK frequency changes to the selected frequency after clock configuration bits are received. This internal CMOS oscillator is available to the user by routing it as an input clock to the clock tree. For further information on the use of this oscillator for configuration or user mode, please see TN1141, LatticeXP2 sysCONFIG Usage Guide. Table 2-14. Selectable CCLKs and Oscillator Frequencies During Configuration and User Mode CCLK/Oscillator (MHz) 2.51 3.12 4.3 5.4 6.9 8.1 9.2 10 13 15 20 26 32 40 54 803 1633 1. Software default oscillator frequency. 2. Software default CCLK frequency. 3. Frequency not valid for CCLK. 2-40 Lattice Semiconductor Architecture LatticeXP2 Family Data Sheet Density Shifting The LatticeXP2 family is designed to ensure that different density devices in the same family and in the same package have the same pinout. Furthermore, the architecture ensures a high success rate when performing design migration from lower density devices to higher density devices. In many cases, it is also possible to shift a lower utilization design targeted for a high-density device to a lower density device. However, the exact details of the final resource utilization will impact the likely success in each case. 2-41 LatticeXP2 Family Data Sheet DC and Switching Characteristics August 2008 Data Sheet DS1009 Absolute Maximum Ratings1, 2, 3 Supply Voltage VCC . . . . . . . . . . . . . . . . . . . -0.5 to 1.32V Supply Voltage VCCAUX . . . . . . . . . . . . . . . . -0.5 to 3.75V Supply Voltage VCCJ . . . . . . . . . . . . . . . . . . -0.5 to 3.75V Supply Voltage VCCPLL4 . . . . . . . . . . . . . . . . -0.5 to 3.75V Output Supply Voltage VCCIO . . . . . . . . . . . -0.5 to 3.75V Input or I/O Tristate Voltage Applied5 . . . . . . -0.5 to 3.75V Storage Temperature (Ambient) . . . . . . . . . -65 to 150°C Junction Temperature Under Bias (Tj) . . . . . . . . . +125°C 1. Stress above those listed under the “Absolute Maximum Ratings” may cause permanent damage to the device. Functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. 2. Compliance with the Lattice Thermal Management document is required. 3. All voltages referenced to GND. 4. VCCPLL only available on csBGA, PQFP and TQFP packages. 5. Overshoot and undershoot of -2V to (VIHMAX + 2) volts is permitted for a duration of 400 MHz tOPJIT1 tSK tOPW tLOCK2 tIPJIT tFBKDLY tHI tLO TR / tF tRSTKW tRSTW Output Clock Period Jitter Input Clock to Output Clock Skew Output Clock Pulse Width PLL Lock-in Time Input Clock Period Jitter External Feedback Delay Input Clock High Time Input Clock Low Time Input Clock Rise/Fall Time Reset Signal Pulse Width (RSTK) Reset Signal Pulse Width (RST) 90% to 90% 10% to 10% 10% to 90% 100 MHz < fOUT < 400 MHz fOUT < 100 MHz N/M = integer At 90% or 10% 25 to 435MHz 10 to 25MHz — — — — 1 — — — — 0.5 0.5 — 10 500 1. Jitter sample is taken over 10,000 samples of the primary PLL output with clean reference clock. 2. Output clock is valid after tLOCK for PLL reset and dynamic delay adjustment. 3. Using LVDS output buffers. 4. Relative to CLKOP. Timing v. A 0.12 3-27 Lattice Semiconductor DC and Switching Characteristics LatticeXP2 Family Data Sheet LatticeXP2 sysCONFIG Port Timing Specifications Over Recommended Operating Conditions Parameter tICFG tVMC tPRGMRJ tPRGM tDINIT tDPPINIT tDPPDONE tIODISS tIOENSS tMWC tCFGX tCSSPI tCSCCLK tSOCDO tCSPID fMAXSPI tSUSPI tHSPI fMAXSPIS tRF tSTCO tSTOZ tSTSU tSTH tSTCKH tSTCKL tSTVO tSCS tSCSS tSCSH Description Minimum Vcc to INITN High Time from tICFG to valid Master CCLK PROGRAMN Pin Pulse Rejection PROGRAMN Low Time to Start Configuration PROGRAMN High to INITN High Delay Delay Time from PROGRAMN Low to INITN Low Delay Time from PROGRAMN Low to DONE Low User I/O Disable from PROGRAMN Low User I/O Enabled Time from CCLK Edge During Wake-up Sequence Additional Wake Master Clock Signals after DONE Pin High INITN High to CCLK Low INITN High to CSSPIN Low CCLK Low before CSSPIN Low CCLK Low to Output Valid CSSPIN[0:1] Low to First CCLK Edge Setup Time Max CCLK Frequency SOSPI Data Setup Time Before CCLK SOSPI Data Hold Time After CCLK Slave CCLK Frequency Rise and Fall Time Falling Edge of CCLK to SOSPI Active Falling Edge of CCLK to SOSPI Disable Data Setup Time (SISPI) Data Hold Time (SISPI) CCLK Clock Pulse Width, High CCLK Clock Pulse Width, Low Falling Edge of CCLK to Valid SOSPI Output CSSPISN High Time CSSPISN Setup Time CSSPISN Hold Time Min — — — 50 — — — — — 0 — — 0 — 2cyc — 7 10 — 50 — — 8 10 0.02 0.02 — 25 25 25 Max 50 2 12 — 1 50 50 35 25 — 1 2 — 15 600+6cyc 20 — — 25 — 20 20 — — 200 200 20 — — — Units ms µs ns ns ms ns ns ns ns cycles µs µs ns ns ns MHz ns ns MHz mV/ns ns ns ns ns µs µs ns ns ns ns sysCONFIG POR, Initialization and Wake Up sysCONFIG SPI Port (Master) sysCONFIG SPI Port (Slave) 3-28 Lattice Semiconductor DC and Switching Characteristics LatticeXP2 Family Data Sheet On-Chip Oscillator and Configuration Master Clock Characteristics Over Recommended Operating Conditions Parameter Master Clock Frequency Duty Cycle Timing v. A 0.12 Min. Selected value -30% 40 Max. Selected value +30% 60 Units MHz % Figure 3-9. Master SPI Configuration Waveforms Capture CR0 VCC PROGRAMN DONE INITN Capture CFGx CSSPIN 0 CCLK SISPI SOSPI Opcode Address Ignore Valid Bitstream 1 2 3 … 7 8 9 10 … 31 32 33 34 … 127 128 3-29 Lattice Semiconductor DC and Switching Characteristics LatticeXP2 Family Data Sheet Flash Download Time (from On-Chip Flash to SRAM) Over Recommended Operating Conditions Symbol Parameter XP2-5 PROGRAMN Low-toHigh. Transition to Done XP2-17 High. XP2-30 tREFRESH Power-up refresh when PROGRAMN is pulled up to VCC (VCC=VCC Min) XP2-40 XP2-5 XP2-8 XP2-17 XP2-30 XP2-40 XP2-8 Min. — — — — — — — — — — Typ. 1.8 1.9 1.7 2.0 2.0 1.8 1.9 1.7 2.0 2.0 Max. 2.1 2.3 2.0 2.1 2.3 2.1 2.3 2.0 2.1 2.3 Units ms ms ms ms ms ms ms ms ms ms Flash Program Time Over Recommended Operating Conditions Program Time Device XP2-5 XP2-8 XP2-17 XP2-30 XP2-40 1.2M 2.0M 3.6M 6.0M 8.0M Flash Density TAG Main Array TAG Main Array TAG Main Array TAG Main Array TAG Main Array Typ. 1.0 1.1 1.0 1.4 1.0 1.8 2.0 3.0 2.0 4.0 Units ms s ms s ms s ms s ms s Flash Erase Time Over Recommended Operating Conditions Erase Time Device XP2-5 XP2-8 XP2-17 XP2-30 XP2-40 1.2M 2.0M 3.6M 6.0M 8.0M Flash Density TAG Main Array TAG Main Array TAG Main Array TAG Main Array TAG Main Array Typ. 1.0 3.0 1.0 4.0 1.0 5.0 2.0 7.0 2.0 9.0 Units s s s s s s s s s s 3-30 Lattice Semiconductor DC and Switching Characteristics LatticeXP2 Family Data Sheet FlashBAK Time (from EBR to Flash) Over Recommended Operating Conditions Device XP2-5 XP2-8 XP2-17 XP2-30 XP2-40 EBR Density (Bits) 166K 221K 276K 387K 885K Time (Typ.) 1.5 1.5 1.5 2.0 3.0 Units s s s s s JTAG Port Timing Specifications Over Recommended Operating Conditions Symbol fMAX tBTCP tBTCPH tBTCPL tBTS tBTH tBTRF tBTCO tBTCODIS tBTCOEN tBTCRS tBTCRH tBUTCO tBTUODIS tBTUPOEN Timing v. A 0.12 Parameter TCK Clock Frequency TCK [BSCAN] clock pulse width TCK [BSCAN] clock pulse width high TCK [BSCAN] clock pulse width low TCK [BSCAN] setup time TCK [BSCAN] hold time TCK [BSCAN] rise/fall time TAP controller falling edge of clock to valid output TAP controller falling edge of clock to valid disable TAP controller falling edge of clock to valid enable BSCAN test capture register setup time BSCAN test capture register hold time BSCAN test update register, falling edge of clock to valid output BSCAN test update register, falling edge of clock to valid disable BSCAN test update register, falling edge of clock to valid enable Min. — 40 20 20 8 10 50 — — — 8 25 — — — Max. 25 — — — — — — 10 10 10 — — 25 25 25 Units MHz ns ns ns ns ns mV/ns ns ns ns ns ns ns ns ns 3-31 Lattice Semiconductor Figure 3-10. JTAG Port Timing Waveforms TMS DC and Switching Characteristics LatticeXP2 Family Data Sheet TDI tBTS tBTCPH TCK tBTCPL tBTH tBTCP tBTCOEN TDO Valid Data tBTCO Valid Data tBTCODIS tBTCRS Data to be captured from I/O tBTUPOEN Data to be driven out to I/O tBTCRH Data Captured tBUTCO Valid Data tBTUODIS Valid Data 3-32 Lattice Semiconductor DC and Switching Characteristics LatticeXP2 Family Data Sheet Switching Test Conditions Figure 3-11 shows the output test load that is used for AC testing. The specific values for resistance, capacitance, voltage, and other test conditions are shown in Table 3-6. Figure 3-11. Output Test Load, LVTTL and LVCMOS Standards VT R1 DUT R2 CL* Test Poi nt *CL Includes Test Fixture and Probe Capacitance Table 3-6. Test Fixture Required Components, Non-Terminated Interfaces Test Condition R1 R2 CL Timing Ref. LVCMOS 3.3 = 1.5V LVCMOS 2.5 = VCCIO/2 LVTTL and other LVCMOS settings (L -> H, H -> L) VT — — — — — — VCCIO — VCCIO ∞ ∞ 1MΩ ∞ 0pF LVCMOS 1.8 = VCCIO/2 LVCMOS 1.5 = VCCIO/2 LVCMOS 1.2 = VCCIO/2 LVCMOS 2.5 I/O (Z -> H) LVCMOS 2.5 I/O (Z -> L) LVCMOS 2.5 I/O (H -> Z) LVCMOS 2.5 I/O (L -> Z) 1MΩ VCCIO/2 VCCIO/2 VOH - 0.10 VOL + 0.10 ∞ 100 ∞ 100 ∞ Note: Output test conditions for all other interfaces are determined by the respective standards. 3-33 LatticeXP2 Family Data Sheet Pinout Information June 2008 Data Sheet DS1009 Signal Descriptions Signal Name General Purpose [Edge] indicates the edge of the device on which the pad is located. Valid edge designations are L (Left), B (Bottom), R (Right), T (Top). [Row/Column Number] indicates the PFU row or the column of the device on which the PIC exists. When Edge is T (Top) or B (Bottom), only need to specify Row Number. When Edge is L (Left) or R (Right), only need to specify Column Number. P[Edge] [Row/Column Number*]_[A/B] I/O [A/B] indicates the PIO within the PIC to which the pad is connected. Some of these user-programmable pins are shared with special function pins. These pins, when not used as special purpose pins, can be programmed as I/Os for user logic. During configuration the user-programmable I/Os are tri-stated with an internal pull-up resistor enabled. If any pin is not used (or not bonded to a package pin), it is also tri-stated with an internal pull-up resistor enabled after configuration. GSRN NC GND VCC VCCAUX VCCPLL VCCIOx VREF1_x, VREF2_x I — — — — — — — Global RESET signal (active low). Any I/O pin can be GSRN. No connect. Ground. Dedicated pins. Power supply pins for core logic. Dedicated pins. Auxiliary power supply pin. This dedicated pin powers all the differential and referenced input buffers. PLL supply pins. csBGA, PQFP and TQFP packages only. Dedicated power supply pins for I/O bank x. Reference supply pins for I/O bank x. Pre-determined pins in each bank are assigned as VREF inputs. When not used, they may be used as I/O pins. Power supply pin for PLL: LLC, LRC, URC, ULC, num = row from center. General Purpose PLL (GPLL) input pads: LLC, LRC, URC, ULC, num = row from center, T = true and C = complement, index A,B,C...at each side. Optional feedback GPLL input pads: LLC, LRC, URC, ULC, num = row from center, T = true and C = complement, index A,B,C...at each side. Primary Clock pads, T = true and C = complement, n per side, indexed by bank and 0,1,2,3 within bank. DQS input pads: T (Top), R (Right), B (Bottom), L (Left), DQS, num = ball function number. Any pad can be configured to be output. Test Mode Select input, used to control the 1149.1 state machine. Pull-up is enabled during configuration. Test Clock input pin, used to clock the 1149.1 state machine. No pull-up enabled. Test Data in pin. Used to load data into device using 1149.1 state machine. After power-up, this TAP port can be activated for configuration by sending appropriate command. (Note: once a configuration port is selected it is locked. Another configuration port cannot be selected until the power-up sequence). Pull-up is enabled during configuration. I/O Description PLL and Clock Functions (Used as user programmable I/O pins when not in use for PLL or clock pins) [LOC][num]_VCCPLL [LOC][num]_GPLL[T, C]_IN_A [LOC][num]_GPLL[T, C]_FB_A PCLK[T, C]_[n:0]_[3:0] [LOC]DQS[num] Test and Programming (Dedicated Pins) TMS TCK I I — I I I I TDI I © 2008 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. www.latticesemi.com 4-1 Pinout Information_01.5 Lattice Semiconductor Pinout Information LatticeXP2 Family Data Sheet Signal Descriptions (Cont.) Signal Name TDO VCCJ I/O O — Description Output pin. Test Data Out pin used to shift data out of a device using 1149.1. Power supply pin for JTAG Test Access Port. Mode pins used to specify configuration mode values latched on rising edge of INITN. During configuration, an internal pull-up is enabled. Open Drain pin. Indicates the FPGA is ready to be configured. During configuration, a pull-up is enabled. Initiates configuration sequence when asserted low. This pin always has an active pull-up. Open Drain pin. Indicates that the configuration sequence is complete, and the startup sequence is in progress. Configuration Clock for configuring an FPGA in sysCONFIG mode. Input data pin in slave SPI mode and Output data pin in Master SPI mode. Output data pin in slave SPI mode and Input data pin in Master SPI mode. Chip select for external SPI Flash memory in Master SPI mode. This pin has a weak internal pull-up. Chip select in Slave SPI mode. This pin has a weak internal pull-up. Test Output Enable tristates all I/O pins when driven low. This pin has a weak internal pull-up, but when not used an external pull-up to VCC is recommended. Configuration Pads (Used during sysCONFIG) CFG[1:0] INITN1 PROGRAMN DONE CCLK SISPI 2 2 I I/O I I/O I/O I/O I/O SOSPI CSSPIN 2 O I I CSSPISN TOE 1. If not actively driven, the internal pull-up may not be sufficient. An external pull-up resistor of 4.7k to 10k ohms is recommended. 2. When using the device in Master SPI mode, it must be mutually exclusive from JTAG operations (i.e. TCK tied to GND) or the JTAG TCK must be free-running when used in a system JTAG test environment. If Master SPI mode is used in conjunction with a JTAG download cable, the device power cycle is required after the cable is unplugged. 4-2 Lattice Semiconductor Pinout Information LatticeXP2 Family Data Sheet PICs and DDR Data (DQ) Pins Associated with the DDR Strobe (DQS) Pin PICs Associated with DQS Strobe PIO Within PIC A B A B A B A B A B A B A B A B A B A B A B A B A B A B A B A B A B DDR Strobe (DQS) and Data (DQ) Pins DQ DQ DQ DQ DQ DQ DQ DQ [Edge]DQSn DQ DQ DQ DQ DQ DQ DQ DQ DQ DQ DQ DQ DQ DQ DQ [Edge]DQSn DQ DQ DQ DQ DQ DQ DQ DQ DQ For Left and Right Edges of the Device P[Edge] [n-4] P[Edge] [n-3] P[Edge] [n-2] P[Edge] [n-1] P[Edge] [n] P[Edge] [n+1] P[Edge] [n+2] P[Edge] [n+3] For Top and Bottom Edges of the Device P[Edge] [n-4] P[Edge] [n-3] P[Edge] [n-2] P[Edge] [n-1] P[Edge] [n] P[Edge] [n+1] P[Edge] [n+2] P[Edge] [n+3] P[Edge] [n+4] Notes: 1. “n” is a row PIC number. 2. The DDR interface is designed for memories that support one DQS strobe up to 16 bits of data for the left and right edges and up to 18 bits of data for the top and bottom edges. In some packages, all the potential DDR data (DQ) pins may not be available. PIC numbering definitions are provided in the “Signal Names” column of the Signal Descriptions table. 4-3 Lattice Semiconductor Pinout Information LatticeXP2 Family Data Sheet Pin Information Summary XP2-5 Pin Type Single Ended User I/O Differential Pair User I/O Normal Highspeed TAP Configuration Muxed Dedicated Non Configuration Vcc Vccaux VCCPLL Bank0 Bank1 Bank2 VCCIO Bank3 Bank4 Bank5 Bank6 Bank7 GND, GND0-GND7 NC Bank0 Bank1 Bank2 Single Ended/ Differential I/O per Bank Bank3 Bank4 Bank5 Bank6 Bank7 Bank0 Bank1 Bank2 True LVDS Pairs Bank3 Bonding Out per Bank4 Bank Bank5 Bank6 Bank7 Bank0 Bank1 Bank2 DDR Banks Bank3 Bonding Out per 1 Bank4 I/O Bank Bank5 Bank6 Bank7 Muxed Dedicated XP2-8 XP2-17 XP2-30 XP2-40 132 144 208 256 132 144 208 256 208 256 484 256 484 672 484 672 csBGA TQFP PQFP ftBGA csBGA TQFP PQFP ftBGA PQFP ftBGA fpBGA ftBGA fpBGA fpBGA fpBGA fpBGA 86 35 8 5 9 1 5 1 6 4 2 2 1 2 1 1 2 1 2 15 18/9 4/2 16/8 4/2 8/4 14/7 6/3 16/8 0 0 3 1 0 0 1 3 1 0 1 0 0 1 0 1 100 39 11 5 9 1 5 1 4 4 2 2 1 2 1 1 2 1 2 15 146 57 16 5 9 1 7 1 9 4 2 2 2 2 2 2 2 2 2 20 4 172 66 20 5 9 1 7 1 6 4 2 2 2 2 2 2 2 2 20 31 86 35 8 5 9 1 7 1 6 4 2 2 1 2 1 1 2 1 2 15 18/9 4/2 16/8 4/2 8/4 14/7 6/3 16/8 0 0 3 1 0 0 1 3 1 0 1 0 0 1 0 1 100 39 11 5 9 1 7 1 4 4 2 2 1 2 1 1 2 1 2 15 146 57 16 5 9 1 9 1 9 4 2 2 2 2 2 2 2 2 2 22 2 201 77 23 5 9 1 9 1 6 4 2 2 2 2 2 2 2 2 20 2 146 57 16 5 9 1 11 1 9 4 4 2 2 2 2 2 2 2 2 22 201 77 23 5 9 1 11 1 6 4 2 2 2 2 2 2 2 2 20 2 358 135 44 5 9 1 21 1 16 8 4 4 4 4 4 4 4 4 56 7 52/26 36/18 46/23 44/22 36/18 52/26 46/23 46/23 0 0 11 11 0 0 11 11 3 2 2 2 2 3 2 2 201 77 23 5 9 1 7 1 6 4 2 2 2 2 2 2 2 2 20 2 28/14 22/11 26/13 24/12 26/13 24/12 27/13 24/12 0 0 6 6 0 0 6 5 1 1 1 1 1 1 1 1 363 137 44 5 9 1 11 1 16 8 4 4 4 4 4 4 4 4 56 2 52/26 36/18 46/23 46/23 38/19 53/26 46/23 46/23 0 0 11 11 0 0 11 11 2 2 3 3 2 2 3 3 472 180 56 5 9 1 13 1 20 8 4 4 4 4 4 4 4 4 64 69 70/35 54/27 56/28 56/28 54/27 70/35 56/28 56/28 0 0 14 14 0 0 14 14 4 3 3 3 3 4 3 3 363 137 44 5 9 1 11 1 16 8 4 4 4 4 4 4 4 4 56 2 52/26 36/18 46/23 46/23 38/19 53/26 46/23 46/23 0 0 11 11 0 0 11 11 2 2 3 3 2 2 3 3 540 204 66 5 9 1 13 1 20 8 4 4 4 4 4 4 4 4 64 1 70/35 70/35 64/32 66/33 70/35 70/35 66/33 64/32 0 0 16 17 0 0 17 16 4 4 4 4 4 4 4 4 20/10 20/10 26/13 6/3 18/9 4/2 8/4 18/9 8/4 18/9 0 0 4 1 0 0 2 4 1 0 1 0 0 1 0 1 18/9 18/9 16/8 18/9 18/9 22/11 20/10 18/9 20/10 20/10 28/14 20/10 28/14 6/3 18/9 4/2 8/4 18/9 8/4 18/9 0 0 4 1 0 0 2 4 1 0 1 0 0 1 0 1 18/9 18/9 16/8 18/9 22/11 26/13 24/12 26/13 18/9 18/9 16/8 18/9 22/11 26/13 24/12 26/13 20/10 24/12 18/9 18/9 0 0 4 4 0 0 4 4 1 1 1 1 1 1 1 1 22/11 22/11 0 0 5 5 0 0 5 5 1 1 1 1 1 1 1 1 20/10 24/12 20/10 24/12 18/9 18/9 0 0 4 4 0 0 4 4 1 1 1 1 1 1 1 1 27/13 24/12 0 0 6 6 0 0 6 5 1 1 1 1 1 1 1 1 18/9 18/9 0 0 4 4 0 0 4 4 1 1 1 1 1 1 1 1 27/13 24/12 0 0 6 6 0 0 6 5 1 1 1 1 1 1 1 1 4-4 Lattice Semiconductor Pinout Information LatticeXP2 Family Data Sheet Pin Information Summary (Cont.) XP2-5 Pin Type Bank0 Bank1 Bank2 PCI capable I/Os Bank3 Bonding Out per Bank4 Bank Bank5 Bank6 Bank7 XP2-8 XP2-17 XP2-30 XP2-40 132 144 208 256 132 144 208 256 208 256 484 256 484 672 484 672 csBGA TQFP PQFP ftBGA csBGA TQFP PQFP ftBGA PQFP ftBGA fpBGA ftBGA fpBGA fpBGA fpBGA fpBGA 18 4 0 0 8 14 0 0 20 6 0 0 8 18 0 0 20 18 0 0 18 20 0 0 26 18 0 0 18 24 0 0 18 4 0 0 8 14 0 0 20 6 0 0 8 18 0 0 20 18 0 0 18 20 0 0 28 22 0 0 26 24 0 0 20 18 0 0 18 20 0 0 28 22 0 0 26 24 0 0 52 36 0 0 36 52 0 0 28 22 0 0 26 24 0 0 52 36 0 0 38 53 0 0 70 54 0 0 54 70 0 0 52 36 0 0 38 53 0 0 70 70 0 0 70 70 0 0 1. Minimum requirement to implement a fully functional 8-bit wide DDR bus. Available DDR interface consists of at least 12 I/Os (1 DQS + 1 DQSB + 8 DQs + 1 DM + Bank VREF1). Logic Signal Connections Package pinout information can be found under “Data Sheets” on the LatticeXP2 product pages on the Lattice website at www.latticesemi.com/products/fpga/xp2 and in the Lattice ispLEVER software. Thermal Management Thermal management is recommended as part of any sound FPGA design methodology. To assess the thermal characteristics of a system, Lattice specifies a maximum allowable junction temperature in all device data sheets. Designers must complete a thermal analysis of their specific design to ensure that the device and package do not exceed the junction temperature limits. Refer to the Thermal Management document to find the device/package specific thermal values. For further information regarding Thermal Management, refer to the Thermal Management document located on the Lattice website at www.latticesemi.com. For Further Information • Technical Note TN1139 - Power Estimation and Management for LatticeXP2 Devices • Power Calculator tool included with Lattice’s ispLEVER design tool, or as a standalone download from www.latticesemi.com/software 4-5 LatticeXP2 Family Data Sheet Ordering Information August 2008 Data Sheet DS1009 Part Number Description LFXP2 – XX E – X XXXXX X Device Family XP2 Logic Capacity 5 = 5K LUTs 8 = 8K LUTs 17 = 17K LUTs 30 = 30K LUTs 40 = 40K LUTs Supply Voltage E = 1.2V Speed 5 = Slowest 6 7 = Fastest Grade C = Commercial I = Industrial Package M132 = 132-ball csBGA FT256 = 256-ball ftBGA F484 = 484-ball fpBGA F672 = 672-ball fpBGA MN132 = 132-ball Lead-Free csBGA TN144 = 144-pin Lead-Free TQFP QN208 = 208-pin Lead-Free PQFP FTN256 = 256-ball Lead-Free ftBGA FN484 = 484-ball Lead-Free fpBGA FN672 = 672-ball Lead-Free fpBGA Ordering Information The LatticeXP2 devices are marked with a single temperature grade, either Commercial or Industrial, as shown below. XP2 XP2 LFXP2-17E 7FT256C Datecode LFXP2-17E 6FT256I Datecode © 2008 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. www.latticesemi.com 5-1 Order Info_01.2 Lattice Semiconductor Lead-Free Packaging Commercial Part Number LFXP2-5E-5MN132C LFXP2-5E-6MN132C LFXP2-5E-7MN132C LFXP2-5E-5TN144C LFXP2-5E-6TN144C LFXP2-5E-7TN144C LFXP2-5E-5QN208C LFXP2-5E-6QN208C LFXP2-5E-7QN208C LFXP2-5E-5FTN256C LFXP2-5E-6FTN256C LFXP2-5E-7FTN256C Voltage 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V Grade -5 -6 -7 -5 -6 -7 -5 -6 -7 -5 -6 -7 Package Lead-Free csBGA Lead-Free csBGA Lead-Free csBGA Lead-Free TQFP Lead-Free TQFP Lead-Free TQFP Lead-Free PQFP Lead-Free PQFP Lead-Free PQFP Lead-Free ftBGA Lead-Free ftBGA Lead-Free ftBGA Ordering Information LatticeXP2 Family Data Sheet Pins 132 132 132 144 144 144 208 208 208 256 256 256 Temp. COM COM COM COM COM COM COM COM COM COM COM COM LUTs (k) 5 5 5 5 5 5 5 5 5 5 5 5 Part Number LFXP2-8E-5MN132C LFXP2-8E-6MN132C LFXP2-8E-7MN132C LFXP2-8E-5TN144C LFXP2-8E-6TN144C LFXP2-8E-7TN144C LFXP2-8E-5QN208C LFXP2-8E-6QN208C LFXP2-8E-7QN208C LFXP2-8E-5FTN256C LFXP2-8E-6FTN256C LFXP2-8E-7FTN256C Voltage 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V Grade -5 -6 -7 -5 -6 -7 -5 -6 -7 -5 -6 -7 Package Lead-Free csBGA Lead-Free csBGA Lead-Free csBGA Lead-Free TQFP Lead-Free TQFP Lead-Free TQFP Lead-Free PQFP Lead-Free PQFP Lead-Free PQFP Lead-Free ftBGA Lead-Free ftBGA Lead-Free ftBGA Pins 132 132 132 144 144 144 208 208 208 256 256 256 Temp. COM COM COM COM COM COM COM COM COM COM COM COM LUTs (k) 8 8 8 8 8 8 8 8 8 8 8 8 Part Number LFXP2-17E-5QN208C LFXP2-17E-6QN208C LFXP2-17E-7QN208C LFXP2-17E-5FTN256C LFXP2-17E-6FTN256C LFXP2-17E-7FTN256C LFXP2-17E-5FN484C LFXP2-17E-6FN484C LFXP2-17E-7FN484C Voltage 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V Grade -5 -6 -7 -5 -6 -7 -5 -6 -7 Package Lead-Free PQFP Lead-Free PQFP Lead-Free PQFP Lead-Free ftBGA Lead-Free ftBGA Lead-Free ftBGA Lead-Free fpBGA Lead-Free fpBGA Lead-Free fpBGA Pins 208 208 208 256 256 256 484 484 484 Temp. COM COM COM COM COM COM COM COM COM LUTs (k) 17 17 17 17 17 17 17 17 17 5-2 Lattice Semiconductor Ordering Information LatticeXP2 Family Data Sheet Part Number LFXP2-30E-5FTN256C LFXP2-30E-6FTN256C LFXP2-30E-7FTN256C LFXP2-30E-5FN484C LFXP2-30E-6FN484C LFXP2-30E-7FN484C LFXP2-30E-5FN672C LFXP2-30E-6FN672C LFXP2-30E-7FN672C Voltage 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V Grade -5 -6 -7 -5 -6 -7 -5 -6 -7 Package Lead-Free ftBGA Lead-Free ftBGA Lead-Free ftBGA Lead-Free fpBGA Lead-Free fpBGA Lead-Free fpBGA Lead-Free fpBGA Lead-Free fpBGA Lead-Free fpBGA Pins 256 256 256 484 484 484 672 672 672 Temp. COM COM COM COM COM COM COM COM COM LUTs (k) 30 30 30 30 30 30 30 30 30 Part Number LFXP2-40E-5FN484C LFXP2-40E-6FN484C LFXP2-40E-7FN484C LFXP2-40E-5FN672C LFXP2-40E-6FN672C LFXP2-40E-7FN672C Voltage 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V Grade -5 -6 -7 -5 -6 -7 Package Lead-Free fpBGA Lead-Free fpBGA Lead-Free fpBGA Lead-Free fpBGA Lead-Free fpBGA Lead-Free fpBGA Pins 484 484 484 672 672 672 Temp. COM COM COM COM COM COM LUTs (k) 40 40 40 40 40 40 Industrial Part Number LFXP2-5E-5MN132I LFXP2-5E-6MN132I LFXP2-5E-5TN144I LFXP2-5E-6TN144I LFXP2-5E-5QN208I LFXP2-5E-6QN208I LFXP2-5E-5FTN256I LFXP2-5E-6FTN256I Voltage 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V Grade -5 -6 -5 -6 -5 -6 -5 -6 Package Lead-Free csBGA Lead-Free csBGA Lead-Free TQFP Lead-Free TQFP Lead-Free PQFP Lead-Free PQFP Lead-Free ftBGA Lead-Free ftBGA Pins 132 132 144 144 208 208 256 256 Temp. IND IND IND IND IND IND IND IND LUTs (k) 5 5 5 5 5 5 5 5 Part Number LFXP2-8E-5MN132I LFXP2-8E-6MN132I LFXP2-8E-5TN144I LFXP2-8E-6TN144I LFXP2-8E-5QN208I LFXP2-8E-6QN208I LFXP2-8E-5FTN256I LFXP2-8E-6FTN256I Voltage 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V Grade -5 -6 -5 -6 -5 -6 -5 -6 Package Lead-Free csBGA Lead-Free csBGA Lead-Free TQFP Lead-Free TQFP Lead-Free PQFP Lead-Free PQFP Lead-Free ftBGA Lead-Free ftBGA Pins 132 132 144 144 208 208 256 256 Temp. IND IND IND IND IND IND IND IND LUTs (k) 8 8 8 8 8 8 8 8 5-3 Lattice Semiconductor Ordering Information LatticeXP2 Family Data Sheet Part Number LFXP2-17E-5QN208I LFXP2-17E-6QN208I LFXP2-17E-5FTN256I LFXP2-17E-6FTN256I LFXP2-17E-5FN484I LFXP2-17E-6FN484I Voltage 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V Grade -5 -6 -5 -6 -5 -6 Package Lead-Free PQFP Lead-Free PQFP Lead-Free ftBGA Lead-Free ftBGA Lead-Free fpBGA Lead-Free fpBGA Pins 208 208 256 256 484 484 Temp. IND IND IND IND IND IND LUTs (k) 17 17 17 17 17 17 Part Number LFXP2-30E-5FTN256I LFXP2-30E-6FTN256I LFXP2-30E-5FN484I LFXP2-30E-6FN484I LFXP2-30E-5FN672I LFXP2-30E-6FN672I Voltage 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V Grade -5 -6 -5 -6 -5 -6 Package Lead-Free ftBGA Lead-Free ftBGA Lead-Free fpBGA Lead-Free fpBGA Lead-Free fpBGA Lead-Free fpBGA Pins 256 256 484 484 672 672 Temp. IND IND IND IND IND IND LUTs (k) 30 30 30 30 30 30 Part Number LFXP2-40E-5FN484I LFXP2-40E-6FN484I LFXP2-40E-5FN672I LFXP2-40E-6FN672I Voltage 1.2V 1.2V 1.2V 1.2V Grade -5 -6 -5 -6 Package Lead-Free fpBGA Lead-Free fpBGA Lead-Free fpBGA Lead-Free fpBGA Pins 484 484 672 672 Temp. IND IND IND IND LUTs (k) 40 40 40 40 5-4 Lattice Semiconductor Conventional Packaging Commercial Part Number LFXP2-5E-5M132C LFXP2-5E-6M132C LFXP2-5E-7M132C LFXP2-5E-5FT256C LFXP2-5E-6FT256C LFXP2-5E-7FT256C Voltage 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V Grade -5 -6 -7 -5 -6 -7 Package csBGA csBGA csBGA ftBGA ftBGA ftBGA Ordering Information LatticeXP2 Family Data Sheet Pins 132 132 132 256 256 256 Temp. COM COM COM COM COM COM LUTs (k) 5 5 5 5 5 5 Part Number LFXP2-8E-5M132C LFXP2-8E-6M132C LFXP2-8E-7M132C LFXP2-8E-5FT256C LFXP2-8E-6FT256C LFXP2-8E-7FT256C Voltage 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V Grade -5 -6 -7 -5 -6 -7 Package csBGA csBGA csBGA ftBGA ftBGA ftBGA Pins 132 132 132 256 256 256 Temp. COM COM COM COM COM COM LUTs (k) 8 8 8 8 8 8 Part Number LFXP2-17E-5FT256C LFXP2-17E-6FT256C LFXP2-17E-7FT256C LFXP2-17E-5F484C LFXP2-17E-6F484C LFXP2-17E-7F484C Voltage 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V Grade -5 -6 -7 -5 -6 -7 Package ftBGA ftBGA ftBGA fpBGA fpBGA fpBGA Pins 256 256 256 484 484 484 Temp. COM COM COM COM COM COM LUTs (k) 17 17 17 17 17 17 Part Number LFXP2-30E-5FT256C LFXP2-30E-6FT256C LFXP2-30E-7FT256C LFXP2-30E-5F484C LFXP2-30E-6F484C LFXP2-30E-7F484C LFXP2-30E-5F672C LFXP2-30E-6F672C LFXP2-30E-7F672C Voltage 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V Grade -5 -6 -7 -5 -6 -7 -5 -6 -7 Package ftBGA ftBGA ftBGA fpBGA fpBGA fpBGA fpBGA fpBGA fpBGA Pins 256 256 256 484 484 484 672 672 672 Temp. COM COM COM COM COM COM COM COM COM LUTs (k) 30 30 30 30 30 30 30 30 30 5-5 Lattice Semiconductor Ordering Information LatticeXP2 Family Data Sheet Part Number LFXP2-40E-5F484C LFXP2-40E-6F484C LFXP2-40E-7F484C LFXP2-40E-5F672C LFXP2-40E-6F672C LFXP2-40E-7F672C Voltage 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V Grade -5 -6 -7 -5 -6 -7 Package fpBGA fpBGA fpBGA fpBGA fpBGA fpBGA Pins 484 484 484 672 672 672 Temp. COM COM COM COM COM COM LUTs (k) 40 40 40 40 40 40 Industrial Part Number LFXP2-5E-5M132I LFXP2-5E-6M132I LFXP2-5E-6FT256I Voltage 1.2V 1.2V 1.2V Grade -5 -6 -6 Package csBGA csBGA ftBGA Pins 132 132 256 Temp. IND IND IND LUTs (k) 5 5 5 Part Number LFXP2-8E-5M132I LFXP2-8E-6M132I LFXP2-5E-5FT256I LFXP2-8E-5FT256I LFXP2-8E-6FT256I Voltage 1.2V 1.2V 1.2V 1.2V 1.2V Grade -5 -6 -5 -5 -6 Package csBGA csBGA ftBGA ftBGA ftBGA Pins 132 132 256 256 256 Temp. IND IND IND IND IND LUTs (k) 8 8 5 8 8 Part Number LFXP2-17E-5FT256I LFXP2-17E-6FT256I LFXP2-17E-5F484I LFXP2-17E-6F484I Voltage 1.2V 1.2V 1.2V 1.2V Grade -5 -6 -5 -6 Package ftBGA ftBGA fpBGA fpBGA Pins 256 256 484 484 Temp. IND IND IND IND LUTs (k) 17 17 17 17 Part Number LFXP2-30E-5FT256I LFXP2-30E-6FT256I LFXP2-30E-5F484I LFXP2-30E-6F484I LFXP2-30E-5F672I LFXP2-30E-6F672I Voltage 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V Grade -5 -6 -5 -6 -5 -6 Package ftBGA ftBGA fpBGA fpBGA fpBGA fpBGA Pins 256 256 484 484 672 672 Temp. IND IND IND IND IND IND LUTs (k) 30 30 30 30 30 30 5-6 Lattice Semiconductor Ordering Information LatticeXP2 Family Data Sheet Part Number LFXP2-40E-5F484I LFXP2-40E-6F484I LFXP2-40E-5F672I LFXP2-40E-6F672I Voltage 1.2V 1.2V 1.2V 1.2V Grade -5 -6 -5 -6 Package fpBGA fpBGA fpBGA fpBGA Pins 484 484 672 672 Temp. IND IND IND IND LUTs (k) 40 40 40 40 5-7 LatticeXP2 Family Data Sheet Supplemental Information May 2007 Data Sheet DS1009 For Further Information A variety of technical notes for the LatticeXP2 FPGA family are available on the Lattice Semiconductor web site at www.latticesemi.com/products/fpga/xp2. • • • • • • • • • • • LatticeXP2 sysIO Usage Guide (TN1136) LatticeXP2 Memory Usage Guide (TN1137) LatticeXP2 High Speed I/O Interface (TN1138) LatticeXP2 sysCLOCK PLL Design and Usage Guide (TN1126) Power Estimation and Management for LatticeXP2 Devices (TN1139) LatticeXP2 sysDSP Usage Guide (TN1140) LatticeXP2 sysCONFIG Usage Guide (TN1141) LatticeXP2 Configuration Encryption and Security Usage Guide (TN1142) Minimizing System Interruption During Configuration Using TransFR Technology (TN1087) LatticeXP2 Dual Boot Usage Guide (TN1144) LatticeXP2 Soft Error Detection (SED) Usage Guide (TN1130) For further information on interface standards refer to the following web sites: • JEDEC Standards (LVTTL, LVCMOS, SSTL, HSTL): www.jedec.org • PCI: www.pcisig.com © 2007 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. www.latticesemi.com 6-1 Further Info_01.1 LatticeXP2 Family Data Sheet Revision History August 2008 Data Sheet DS1009 Revision History Date May 2007 September 2007 Version 01.1 01.2 Section — DC and Switching Characteristics Pinout Information February 2008 01.3 Architecture Initial release. Added JTAG Port Timing Waveforms diagram. Updated sysCLOCK PLL Timing table. Added Thermal Management text section. Added LVCMOS33D to Supported Output Standards table. Clarified: “This Flash can be programmed through either the JTAG or Slave SPI ports of the device. The SRAM configuration space can also be infinitely reconfigured through the JTAG and Master SPI ports.” Added External Slave SPI Port to Serial TAG Memory section. Updated Serial TAG Memory diagram. DC and Switching Characteristics Updated Flash Programming Specifications table. Added “8W” specification to Hot Socketing Specifications table. Updated Timing Tables Clarifications for IIH in DC Electrical Characteristics table. Added LVCMOS33D section Updated DOA and DOA (Regs) to EBR Timing diagrams. Removed Master Clock Frequency and Duty Cycle sections from the LatticeXP2 sysCONFIG Port Timing Specifications table. These are listed on the On-chip Oscillator and Configuration Master Clock Characteristics table. Changed CSSPIN to CSSPISN in description of tSCS, tSCSS, and tSCSH parameters. Removed tSOE parameter. Clarified On-chip Oscillator documentation Added Switching Test Conditions Pinout Information Added “True LVDS Pairs Bonding Out per Bank,” “DDR Banks Bonding Out per I/O Bank,” and “PCI capable I/Os Bonding Out per Bank” to Pin Information Summary in place of previous blank table “PCI and DDR Capabilities of the Device-Package Combinations” Removed pinout listing. This information is available on the LatticeXP2 product web pages Ordering Information April 2008 01.4 DC and Switching Characteristics Added XP2-17 “8W” and all other family OPNs. Updated Absolute Maximum Ratings footnotes. Updated Recommended Operating Conditions Table footnotes. Updated Supply Current (Standby) Table Updated Initialization Supply Current Table Updated Programming and Erase Flash Supply Current Table Updated Register to Register Performance Table Updated LatticeXP2 External Switching Characteristics Table Updated LatticeXP2 Internal Switching Characteristics Table Updated sysCLOCK PLL Timing Table Change Summary © 2008 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. www.latticesemi.com 7-1 Lattice Semiconductor Date April 2008 (cont.) Version 01.4 (cont.) Section Revision History LatticeXP2 Family Data Sheet Change Summary DC and Switching Updated Flash Download Time (From On-Chip Flash to SRAM) Table Characteristics (cont.) Updated Flash Program Time Table Updated Flash Erase Time Table Updated FlashBAK (from EBR to Flash) Table Updated Hot Socketing Specifications Table footnotes Pinout Information Updated Signal Descriptions Table Removed Read-Before-Write sysMEM EBR mode. Clarification of the operation of the secondary clock regions. DC and Switching Characteristics Pinout Information Removed Read-Before-Write sysMEM EBR mode. Updated DDR Banks Bonding Out per I/O Bank section of Pin Information Summary Table. Data sheet status changed from preliminary to final. Clarification of the operation of the secondary clock regions. Removed “8W” specification from Hot Socketing Specifications table. Removed "8W" footnote from DC Electrical Characteristics table. Updated Register-to-Register Performance table. Ordering Information Removed “8W” option from Part Number Description. Removed XP2-17 “8W” OPNs. June 2008 01.5 Architecture August 2008 01.6 — Architecture DC and Switching Characteristics 7-2