LX256EV-5FN484C

ispGDX2™ Device Datasheet June 2010 Select Devices Discontinued! Product Change Notifications (PCNs) #09-10 has been issued to discontinue select devices in this data sheet. The original datasheet pages have not been modified and do not reflect those changes. Please refer to the table below for reference PCN and current product status. Product Line LX64V LC64B LX64C LX128V LX128B LX128C LX256V LX256B Ordering Part Number LX64V-3F100C LX64V-3FN100C LX64V-5F100C LX64V-5FN100C LX64B-3F100C LX64B-3FN100C LX64B-5F100C LX64B-5FN100C LX64C-3F100C LX64C-3FN100C LX64C-5F100C LX64C-5FN100C LX128V-32F208C LX128V-32FN208C LX128V-5F208C LX128V-5FN208C LX128B-32F208C LX128B-32FN208C LX128B-5F208C LX128B-5FN208C LX128C-32F208C LX128C-32FN208C LX128C-5F208C LX128C-5FN208C LX256V-35F484C LX256V-35FN484C LX256V-5F484C LX256V-5FN484C LX256B-35F484C LX256B-35FN484C LX256B-5F484C LX256B-5FN484C Product Status Reference PCN Active / Orderable Discontinued PCN#09-10 Discontinued PCN#09-10 Active / Orderable Discontinued PCN#09-10 Discontinued PCN#09-10 Active / Orderable Discontinued PCN#09-10 5555 N.E. Moore Ct. z Hillsboro, Oregon 97124-6421 z Phone (503) 268-8000 z FAX (503) 268-8347 Internet: http://www.latticesemi.com Product Line LX256C LX64EV LX64EB LX64EC LX128EV LX128EB LX128EC LX256EV Ordering Part Number LX256C-35F484C LX256C-35FN484C LX256C-5F484C LX256C-5FN484C LX64EV-3F100C LX64EV-3FN100C LX64EV-5F100C LX64EV-5F100I LX64EV-5FN100C LX64EV-5FN100I LX64EB-3F100C LX64EB-3FN100C LX64EB-5F100C LX64EB-5F100I LX64EB-5FN100C LX64EB-5FN100I LX64EC-3F100C LX64EC-3FN100C LX64EC-5F100C LX64EC-5F100I LX64EC-5FN100C LX64EC-5FN100I LX128EV-32F208C LX128EV-32FN208C LX128EV-5F208C LX128EV-5F208I LX128EV-5FN208C LX128EV-5FN208I LX128EB-32F208C LX128EB-32FN208C LX128EB-5F208C LX128EB-5F208I LX128EB-5FN208C LX128EB-5FN208I LX128EC-32F208C LX128EC-32FN208C LX128EC-5F208C LX128EC-5F208I LX128EC-5FN208C LX128EC-5FN208I LX256EV-35F484C LX256EV-35FN484C LX256EV-5F484C LX256EV-5F484I LX256EV-5FN484C LX256EV-5FN484I Product Status Reference PCN Discontinued PCN#09-10 Active / Orderable Discontinued PCN#09-10 Discontinued PCN#09-10 Active / Orderable Discontinued PCN#09-10 Discontinued PCN#09-10 Active / Orderable 5555 N.E. Moore Ct. z Hillsboro, Oregon 97124-6421 z Phone (503) 268-8000 z FAX (503) 268-8347 Internet: http://www.latticesemi.com Product Line LX256EB LX256EC Ordering Part Number LX256EB-35F484C LX256EB-35FN484C LX256EB-5F484C LX256EB-5F484I LX256EB-5FN484C LX256EB-5FN484I LX256EC-35F484C LX256EC-35FN484C LX256EC-5F484C LX256EC-5F484I LX256EC-5FN484C LX256EC-5FN484I Product Status Reference PCN Discontinued PCN#09-10 Discontinued PCN#09-10 5555 N.E. Moore Ct. z Hillsboro, Oregon 97124-6421 z Phone (503) 268-8000 z FAX (503) 268-8347 Internet: http://www.latticesemi.com ispGDX2™ Family Includes High, Performance t os -C w Lo “E-Series” September 2005 Features High Performance Interfacing and Switching Data Sheet ■ Two Options Available • High-performance sysHSI (standard part number) • Low-cost, no sysHSI (“E-Series”) SE L D E IS C C T O D N E TI VI N C U E ED S ■ High Performance Bus Switching • High bandwidth – Up to 12.8 Gbps (SERDES) – Up to 38 Gbps (without SERDES) • Up to 16 (15x10) FIFOs for data buffering • High speed performance – fMAX = 360MHz – tPD = 3.0ns – tCO = 2.9ns – tS = 2.0ns • Built-in programmable control logic capability • I/O intensive: 64 to 256 I/Os • Expanded MUX capability up to 188:1 MUX ■ sysHSI Blocks Provide up to 16 High-speed Channels • • • • • Serializer/de-serializer (SERDES) included Clock Data Recovery (CDR) built in 800 Mbps per channel LVDS differential support 10B/12B support – Encoding / decoding – Bit alignment – Symbol alignment • 8B/10B support – Bit alignment – Symbol alignment • Source Synchronous support ■ sysCLOCK™ PLL • • • • Frequency synthesis and skew management Clock multiply and divide capability Clock shifting up to +/-2.35ns in 335ps steps Up to four PLLs ■ Flexible Programming and Testing • IEEE 1532 compliant In-System Programmability (ISP™) • Boundary scan test through IEEE 1149.1 interface • 3.3V, 2.5V or 1.8V power supplies • 5V tolerant I/O for LVCMOS 3.3 and LVTTL interfaces ■ sysIO™ Interfacing • LVCMOS 1.8, 2.5, 3.3 and LVTTL support for standard board interfaces • SSTL 2/3 Class I and II support • HSTL Class I, III and IV support • GTL+, PCI-X for bus interfaces • LVPECL, LVDS and Bus LVDS differential support • Hot socketing • Programmable drive strength Table 1. ispGDX2 Family Selection Guide ispGDX2-64/E ispGDX2-128/E ispGDX2-256/E I/Os 64 128 256 GDX Blocks 4 8 16 tPD 3.0ns 3.2ns 3.5ns tS 2.0ns 2.0ns 2.0ns 2.9ns 3.1ns 3.2ns 360MHz 330MHz 300MHz SERDES1, 2 3.2Gbps 6.4Gbps 12.8Gbps Without SERDES3 11Gbps 21Gbps 38Gbps tCO fMAX (Toggle) Max Bandwidth 2 sysHSI Channels 4 8 16 LVDS/Bus LVDS (Pairs) 32 64 128 PLLs Package 2 2 4 100-ball fpBGA 208-ball fpBGA 484-ball fpBGA 1. Max number of SERDES channels per device * 800Mbps 2. “E-Series” does not support sysHSI. 3. fMAX (Toggle) * maximum I/Os divided by 2. © 2005 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. www.latticesemi.com 1 gdx2fam_13 Lattice Semiconductor ispGDX2 Family Data Sheet Figure 1. ispGDX2 Block Diagram (256-I/O Device) sysIO Bank sysHSI Block SERDES SERDES SERDES SERDES sysHSI Block sysCLOCK PLL FIFO FIFO GDX Block GDX Block GDX Block GDX Block SERDES SERDES SERDES sysIO Bank SERDES sysIO Bank sysHSI Block sysIO Bank FIFO sysIO Bank FIFO SERDES sysHSI Block FIFO SERDES FIFO SERDES GDX Block SERDES GDX Block FIFO sysHSI Block GDX Block FIFO GDX Block GDX Block GDX Block FIFO GDX Block FIFO SERDES GDX Block FIFO GDX Block SERDES Global Routing Pool (GRP) FIFO GDX Block FIFO GDX Block FIFO SERDES sysIO Bank sysHSI Block FIFO GDX Block SERDES sysIO Bank sysCLOCK PLL FIFO sysHSI Block sysHSI Block SE L D E IS C C T O D N E TI VI N C U E ED S sysCLOCK PLL sysIO Bank sysCLOCK PLL ISP & Boundary Scan Test Port Introduction The ispGDX2™ family is Lattice’s second generation in-system programmable generic digital crosspoint switch for high speed bus switching and interface applications. The ispGDX2 family is available in two options. The standard device supports sysHSI capability for ultra fast serial communications while the lower-cost “E-series” supports the same high-performance FPGA fabric without the sysHSI Block. This family of switches combines a flexible switching architecture with advanced sysIO interfaces including high performance sysHSI Blocks, and sysCLOCK PLLs to meet the needs of the today’s high-speed systems. Through a muliplexer-intensive architecture, the ispGDX2 facilitates a variety of common switching functions. The availability of on-chip control logic further enhances the power of these devices. A high-performance solution, the family supports bandwidth up to 38Gbps. Every device in the family has a number of PLLs to provide the system designer with the ability to generate multiple clocks and manage clock skews in their systems. 2 Lattice Semiconductor ispGDX2 Family Data Sheet The sysIO interfaces provide system-level performance and integration. These I/Os support various modes of LVCMOS/LVTTL and support popular high-speed standard interfaces such as GTL+, PCI-X, HSTL, SSTL, LVDS and Bus-LVDS. The sysHSI Blocks further extend this capability by providing high speed serial data transfer capability. SE L D E IS C C T O D N E TI VI N C U E ED S Devices in the family can operate at 3.3V, 2.5V or 1.8V core voltages and can be programmed in-system via an IEEE 1149.1 interface that is compliant with the IEEE 1532 standard. Voltages required for the I/O buffers are independent of the core voltage supply. This further enhances the flexibility of this family in system designs. Typical applications for the ispGDX2 include multi-port multi-processor interfaces, wide data and address bus multiplexing, programmable control signal routing and programmable bus interfaces. Table 1 shows the members of the ispGDX2 family and their key features. Architecture The ispGDX2 devices consist of GDX Blocks interconnected by a Global Routing Pool (GRP). Signals interface with the external system via sysIO banks. In addition, each GDX Block is associated with a FIFO and a sysHSI Block to facilitate the transfer of data on- and off-chip. Figure 1 shows the ispGDX2 block diagram. Each GDX Block can be individually configured in one of four modes: • Basic (No FIFO or SERDES) • FIFO Only • SERDES Only • SERDES and FIFO Each sysIO bank has its own I/O power supply and reference voltage. Designers can use any output standard within a bank that is compatible with the power supply. Any input standard may be used, providing it is compatible with the reference voltage. The banks are independent. Global Routing Pool (GRP) The ispGDX2 architecture is organized into GDX Blocks, which are connected via a Global Routing Pool. The innovative GRP is optimized for routability, flexibility and speed. All the signals enter via the GDX Block. The block supplies these either directly or in registered form to the GRP. The GRP routes the signals to different blocks, and provides separate data and control routing. The data path is optimized to achieve faster speed and routing flexibility for nibble oriented signals. The control routing is optimized to provide high-speed bit oriented routing of control signals. There are some restrictions on the allocation of pins for optimal bus routing. These restrictions are considered by the software in the allocation of pins. GDX Block The blocks are organized in a “block” (nibble) manner, with each GDX Block providing data flow and control logic for 16 I/O buffers. The data flow is organized as four nibbles, each nibble containing four Multiplexer Register Blocks (MRBs). Data for the MRBs is provided from 64 lines from the GRP. Figure 2 illustrates the groups of signals going into and out of a GDX Block. Control signals for the MRBs are provided from the Control Array. The Control Array receives the 32 signals from the GRP and generates 16 control signals: eight MUX Select, four Clock/Clock Enable, two Set/Reset and two Output Enable. Each nibble is controlled via two MUX select signals. The remaining control signals go to all the MRBs. Besides the control signals from the Control Array, the following global signals are available to the MRBs in each GDX Block: four Clock/Clock Enable, one reset/preset, one power-on reset, two of four MUX select (two of two in 64 I/O), four Output Enable (two in 64 I/O) and Test Out Enable (TOE). 3 Lattice Semiconductor ispGDX2 Family Data Sheet MUX and Register Block (MRB) Every MRB Block has a 4:1 MUX (I/O MUX) and a set of three registers which are connected to the I/O buffers, FIFO and sysHSI Blocks. Multiple MRBs can be combined to form large multiplexers as described below. Figure 3 shows the structure of the MRB. SE L D E IS C C T O D N E TI VI N C U E ED S Each of the three registers in the MRB can be configured as edge-triggered D-type flip-flop or as a level sensitive latch. One register operates on the input data, the other output data and the last register synchronizes the output enable function. The input and output data signals can bypass each of their registers. The polarity of the data out and output enable signals can be selected. The Output and OE register share the same clock and clock enable signals. The Input register has a separate clock and clock enable. The initialization signals of each register can be independently configured as Set or Reset. These registers have programmable polarity control for Clock, Clock Enable and Set/Reset. The output enable register input can be set either by one of the two output enables generated locally from the Control Array or from one of the four (two in 64 I/O) Global OE enable pins. In addition to the local clock and clock enable signals, each MRB has access to Global Clock, Clock Enable, Reset and TOE nets. 4 Lattice Semiconductor ispGDX2 Family Data Sheet Figure 2. GDX Block GRP GDX Block 32 bits MUX Control Select sysIO Bank Control Array 8 SE L D E IS C C T O D N E TI VI N C U E ED S Nibble 0 8 OE 8 MUX and Register Block (MRB) 0 2 4 bits 8 IN OUT OE MUX and Register Block (MRB) 1 2 4 bits IN OUT 8 MUX and Register Block (MRB) 2 2 4 bits OE IN OUT 8 OE MUX and Register Block (MRB) 3 2 4 bits 8 IN OUT 2 Nibble 1 MRBs 4-7 OE IN OUT 2 Nibble 2 MRBs 8-11 OE IN OUT 2 Nibble 3 MRBs 12-15 OE IN OUT 16 bits 4 8 16 bits 4 8 16 bits 4 The output register of the MRB has a built-in bi-directional shift register capability. Each output register corresponding to MRB “n”, receives data output from its two adjacent MRBs, MRB (n-1) and MRB (n+1), to provide shift register capability. Like the output register, each input register of the MRB has built-in shift register capability. Each input register can receive data from its two adjacent MRB input registers, to provide bi-directional shift register capability. The chaining crosses GDX Block boundaries. The chain of input registers and the chain of output registers can be combined as one shift register via the GRP. 5 Lattice Semiconductor ispGDX2 Family Data Sheet The four data inputs to the 4:1 MUX come from the GRP. The output of this MUX connects to the output register. A fast feedback path from the MUX to the GRP allows wider MUXes to be built. Table 2 summarizes the various MUX sizes and delay levels. Table 2. MUX Size Versus Internal Delay MUX Sizes Levels of Internal GRP Delays One Level SE L D E IS C C T O D N E TI VI N C U E ED S 4:1 Up to 16:1 Two Levels Up to 64:1 Three Levels Up to 188:1 (with ispGDX2-256) Four Levels Figure 3. ispGDX2 Family MRB 4 2-4 OE MUX Select Global Signals Global Signals CK/CE MUX Select Control Array Signals GDX Control Array 2 4 2 D/L OE Q ClK OE Reg/Latch CK CE CE Set Reset OE CK/CE From GRP Set/Reset VCC from Out_Reg(n-1) from Out_Reg(n+1) D/L TOE Flags* (FIFO, SERDES or PLL) Q to Out_Reg(n-1) Out Reg/Latch ClK to Out_Reg(n+1) CE Set Reset VCC S/R Global Resetb To GRP Delay FIFO Out* from IN_Reg(n-1) from IN_Reg(n+1) D/L Q to IN_Reg(n-1) to IN_Reg(n+1) Input Reg/Latch ClK CK CE CE Set Reset S/R Global Resetb *Selected MRBs see Logic Signal Connection Table for details Control Array The control array generates control signals for the 16 MRBs within a GDX Block. The true and complement forms of 32 inputs from the GRP are available in the control array. The 20 NAND terms can use any or all of these inputs to form the control array outputs. Two AND terms are combined with a NOR term to form Set/Reset and OE signals. Figure 4 illustrates the control array. 6 Lattice Semiconductor ispGDX2 Family Data Sheet Figure 4. ispGDX2 Family Control Array 32 Inputs from Control GRP SE L D E IS C C T O D N E TI VI N C U E ED S Each connection is programmable. MUX Select to Nibble 0 MUX Select to Nibble 1 MUX Select to Nibble 2 MUX Select to Nibble 3 To MRB Clock/ Clock Enable On selected blocks, this signal can reset the M Divider of the PLL. To MRB Set/Reset To MRB Output Enable sysIO Banks The inputs and outputs of ispGDX2 devices are divided into eight sysIO banks, where each bank is capable of supporting different I/O standards. The number of I/Os per bank is 32, 16 and 8 for the 256-, 128- and 64-I/O devices respectively. Each sysIO bank has its own I/O supply voltage (VCCO) and reference voltage (VREF), allowing each bank complete independence from the other banks. Each I/O within a bank can be individually configured to any standard consistent with the VCCO and VREF settings. Figure 5 shows the I/O banks for the ispGDX2-256 device. The I/O of the ispGDX2 devices contain a programmable strength and slew rate tri-state output buffer, a programmable input buffer, a programmable pull-up resistor, a programmable pull-down resistor and a programmable buskeeper latch. These programmable capabilities allow the support of a wide range of I/O standards. 7 Lattice Semiconductor ispGDX2 Family Data Sheet Figure 5. ispGDX2-256 sysIO Banks SE L D E IS C C T O D N E TI VI N C U E ED S VCCO3 VREF3 GND VCCO4 VREF4 GND sysIO Bank 4 sysIO Bank 3 VCCO5 VREF5 VCCO2 sysIO Bank 5 sysIO Bank 2 VREF2 GND GND VCCO6 VCCO1 VREF6 sysIO Bank 6 sysIO Bank 1 GND VREF1 GND sysIO Bank 7 sysIO Bank 0 VCCO0 VREF0 GND VCCO7 VREF7 GND There are three classes of I/O interface standards implemented in the ispGDX2 devices. The first is the non-terminated, single-ended interface; it includes the 3.3V LVTTL standard along with the 1.8V, 2.5V and 3.3V LVCMOS interface standards. The slew rate and strength of these output buffers can be controlled individually. Additionally, PCI 3.3, PCI-X and AGP-1X are all subsets of this interface type. The second interface class implemented is the terminated, single-ended interface standard. This group of interfaces includes different versions of SSTL and HSTL interfaces along with CTT and GTL+. Use of these I/O interfaces requires an additional VREF signal. At the system level, a termination voltage, VTT, is also required. Typically, an output will be terminated to VTT at the receiving end of the transmission line it is driving. The final types of interfaces implemented are the differential standards LVPECL, LVDS and Bus LVDS. Table 3 shows the I/O standards supported by the ispGDX2 devices along with nominal VCCO, VREF and VTT. The ispGDX2 family also features 5V tolerant I/O. I/O banks with VCCO = 3.3V may have inputs driven to a maximum of 5.5V for easy interfacing with legacy systems. Up to 64 I/O pins per device may be driven by 5V inputs. 8 Lattice Semiconductor ispGDX2 Family Data Sheet Table 3. ispGDX2 Supported I/O Standards Nominal VCCO Nominal VREF Nominal VTT LVCMOS 3.3 3.3V — — LVCMOS 2.5 2.5V — — LVCMOS 1.8 1.8V — — LVTTL 3.3V — — PCI 3.3 3.3V — — PCI -X 3.3V — — AGP-1X 3.3V — — SSTL3 class I & II 3.3V 1.5V 1.5V SE L D E IS C C T O D N E TI VI N C U E ED S sysIO Standard SSTL2 class I & II 2.5V 1.25V 1.25V CTT 3.3 3.3V 1.5V 1.5V CTT 2.5 2.5V 1.25V 1.25V HSTL class I 1.5V 0.75V 0.75V HSTL class III 1.5V 0.9V 0.75V HSTL class IV 1.5V 0.9V 1.5V 1.8/2.5/3.3V 1.0V 1.5V 3.3V — — LVDS 2.5/3.3V — — Bus-LVDS 2.5/3.3V — — GTL+ LVPECL1, 2, 3 1. LVPECL drivers require three resistor pack (see Figure 17). 2. Depending on the driving LVPECL output specification, GDX2 LVPECL input driver may require terminating resistors. 3. For additional information on LVPECL refer to Lattice technical note number TN1000, sysIO Design and Usage Guidelines. The dedicated inputs support a subset of the sysIO standards indicated in Table 4. These inputs are associated with a bank consistent with their location. Table 4. I/O Standards Supported by Dedicated Inputs LVCMOS LVDS All other ASIC I/Os Global OE Pins Yes No Yes2 Global MUX Select Pins Yes No Yes2 Resetb Yes No Yes2 Global Clock/Clock Enables Yes Yes Yes2 ispJTAG™ Port Yes1 No No TOE Yes No No 1. LVCMOS as defined by the VCCJ pin voltage. 2. No PCI clamp. For more information on the sysIO capability, please refer to Lattice technical note number TN1000, sysIO Design and Usage Guidelines. sysCLOCK PLL The sysCLOCK PLL circuitry consists of Phase-Lock Loops (PLLs) along the various dividers and reset and feedback signals associated with the PLLs. This feature gives the user the ability to synthesize clock frequencies and generate multiple clock signals for routing within the device. Furthermore, it can generate clock signals that are deskewed either at the board level or the device level. Figure 6 shows the ispGDX2 PLL block diagram. Each PLL has a set of PLL_RST, PLL_FBK and PLL_LOCK signals. In order to facilitate the multiply and divide capabilities of the PLL, each PLL has associated dividers. The M divider is used to divide the clock signal, while the 9 Lattice Semiconductor ispGDX2 Family Data Sheet SE L D E IS C C T O D N E TI VI N C U E ED S N divider is used to multiply the clock signal. The K divider is used to provide a divided clock frequency of the adjacent PLL. This output can be routed to the global clock net. The V divider is used to provide lower frequency output clocks, while maintaining a stable, high frequency output from the PLL’s VCO circuit. The PLL also has a delay feature that allows the output clock to be advanced or delayed to improve set-up and clock-to-out times for better performance. For more information on the PLL, please refer to Lattice technical note number TN1003, sysCLOCK PLL Design and Usage Guidelines. Figure 6. sysCLOCK PLL PLL_LOCK CLK_OUT CLK_IN Input Clock (M) Divider 1 to 32 Programmable +Delay -------------------- Post-scalar (V) Divider PLL (n) Clock Net 1, 2, 4, 8, 16, 32 Programmable -Delay PLL_RST Clock (K) Divider 2, 4, 8, 16, 32 To Adjacent_PLL From Adjacent_PLL Feedback Divider (N) X 1 to 32 PLL_FBK There are four global clock networks routed to each MRB block. These global clocks, CLK0-3, can either be generated by the PLL circuits or supplied externally. External clock pins can be configured as single-ended or differential (LVDS) input. Figure 7 illustrates how the sysCLOCK PLL inputs and outputs can be routed to the I/O pins or general routing. Figure 10 shows the clock network for the ispGDX2-256 and Figure 8 shows the clock networks for ispGDX2-128 and ispGDX2-64. The Reset (0) pin from the Control Array of selected GDX Blocks can be programmed to reset the M Divider of the PLLs. This provides a means for generating the reset signal internally. Table 5 details which GDX Block provides reset to the PLLs. Table 5. Internal Reset Input of the PLL (M Divider) PLL0 PLL1 PLL2 PLL3 ispGDX2-256 GDX Block 5A GDX Block 7B GDX Block 1A GDX Block 3B ispGDX2-128 GDX Block 2A — GDX Block 0A — ispGDX2-64 GDX Block 0A — GDX Block 1B — 10 Lattice Semiconductor ispGDX2 Family Data Sheet Figure 7. I/O Pin Connection to the sysCLOCK PLL1 PLL_LOCK CLK_OUT SE L D E IS C C T O D N E TI VI N C U E ED S Output Reg/ Latch GCLK_IN Input Clock (M) Divider ÷ 1 to 32 Programmable + Delay -------------------- PLL (n) Programmable - Delay Post-scalar (V) Divider ÷ 1, 2, 4, 8, 16, 32 Clock (K) Divider ÷ 2, 4, 8, 16, 32 Clock Net To Adjacent_PLL Input Reg/ Latch From Adjacent_PLL Feedback Divider (N) x 1 to 32 GRP GDX Block PLL_FBK PLL_RST Resetb (0) Control Array (from selected blocks) GCLK_IN 1. Some pins are shared. See Logic Signal Connections Table for details. 11 Delay Lattice Semiconductor ispGDX2 Family Data Sheet Figure 8. ispGDX2-64 CLOCK Network sysIO Interface sysCLOCK Clock Net MRB Clock Net Reg/ Latch CLK0 K(0) + - PLL (0) SE L D E IS C C T O D N E TI VI N C U E ED S GCLK/CE0 VREF0 CLK_OUT0 GCLK/CE1 VREF1 + - CLK_OUT2 Clock Net Reg/ Latch Clock Net Reg/ Latch Clock Net Reg/ Latch CLK2 K(2) GCLK/CE2 VREF2 GCLK/CE3 VREF3 + - PLL (2) + - Figure 9. ispGDX2-128 CLOCK Network sysIO Interface sysCLOCK Clock Net MRB Clock Net Reg/ Latch Clock Net Reg/ Latch Clock Net Reg/ Latch Clock Net Reg/ Latch CLK0 K(0) GCLK/CE0 VREF0 + - PLL (0) CLK_OUT0 GCLK/CE1 VREF1 + - CLK_OUT2 CLK2 K(2) GCLK/CE2 VREF2 GCLK/CE3 VREF3 + - PLL (2) + - 12 Lattice Semiconductor ispGDX2 Family Data Sheet Figure 10. ispGDX2-256 CLOCK Network sysIO Interface sysCLOCK Clock Net MRB CLK0 SE L D E IS C C T O D N E TI VI N C U E ED S K(0) GCLK/CE0 VREF0 + - PLL (0) Clock Net Reg/ Latch Clock Net Reg/ Latch Clock Net Reg/ Latch Clock Net Reg/ Latch CLK_OUT0 CLK1 K(1) GCLK/CE1 VREF1 + - PLL (1) CLK_OUT1 CLK2 K(2) GCLK/CE2 VREF2 + - PLL (2) CLK_OUT2 CLK3 K(3) GCLK/CE3 VREF3 + - PLL (3) CLK_OUT3 13 Lattice Semiconductor ispGDX2 Family Data Sheet Operating Modes All the GDX Blocks in the ispGDX2 family can be programmed in four modes: Basic, FIFO only, SERDES only, and FIFO with SERDES mode. In basic mode, the SERDES and FIFO are disabled and the MUX output of the MRB connects to the output register. Inputs are connected to the GRP via the MRB. SE L D E IS C C T O D N E TI VI N C U E ED S Figure 11 shows the four different operating modes. Precise detail of the FIFO and SERDES connections is provided in their respective sections. Figure 11. Four Operating Modes of ispGDX2 Devices Basic Mode GRP FIFO Mode GRP SERDES Mode (FIFO in Flow-through Mode) GRP SERDES and FIFO Mode GRP GDX Block FIFO GDX Block FIFO SERDES SERDES FIFO* GDX Block SERDES FIFO GDX Block SERDES sysIO Bank sysIO Bank sysIO Bank sysIO Bank *FIFO held in RESET for SERDES-only mode. FIFO Operations Each GDX Block is associated with a 10-bit wide and 15-word deep (10x15) RAM. This RAM, combined with two address counters and two comparators, is used to implement a FIFO as a “circular queue”. The FIFO has separate clocks, the Read Clock (RCLK) and Write Clock (WCLK), for asynchronous operation. The FIFO has three additional control signals Write Enable, Read Enable and FIFO Reset. Three flags show the status of the FIFO: Empty, Full and Start Read. Each FIFO receives the global Power-on Reset and Reset signals. Figure 12 shows the connections to the FIFO. 14 Lattice Semiconductor ispGDX2 Family Data Sheet Figure 12. ispGDX2 FIFO Signals 10 10 Data Out (DOUT) Data In (DIN) Write Clock (WCLK) SE L D E IS C C T O D N E TI VI N C U E ED S Write Enable (WE) Read Clock (RCLK) Read Enable (RE) FIFO 10x15 Full (FULL) Empty (EMPTY) Global Reset (RESETb) Start Read (STRDb) Power-on Reset (PORb) FIFO Reset (FIFORSTb) Read Clock and Read Enable are the same as the Clock and Clock Enable signals of the input registers of the associated MRB. These registers are used to register the FIFO outputs, and in modes that utilize the FIFO are configured to use the same clock and clock enable signals. The Write Clock is selected from one of the GCLK/CE signals or the RECCLK (Recovered Clock) signal from the associated SERDES. The Write Enable is selected from one of the local MRB product term CLK/CE signals. All FIFO operations occur on the rising edge of the clock although clock polarity of these signals can be programmed. The flags from the FIFO, FULL, EMPTY and STRDb (Start Read) are each fed via a MUX in the MRB to an I/O buffer. The STRDb (half full) signal is used in conjunction with SERDES. STRDb is an active low signal, the signal is inactive (high) on FIFO RESET. After the FIFO reset when the FIFO contains data in five memory locations, at the following write clock transition the STRDb becomes active (low). Note, if the Read Clocks arrive before writing the sixth location, it may take longer than five write clocks before the STRDb becomes active. When the FIFO has data in the first six locations, at the next write clock transition the STRDb becomes inactive (high). Again, if the Read Clocks arrive before writing the seventh location, the STRDb may stay active for longer than one write clock period, even if the FIFO contains data in less than five locations. After this event, the STRDb stays inactive until the FIFO is RESET again. STRDb does not become active again even if less than six memory locations are occupied in the FIFO. It is the user’s responsibility to monitor the FULL and EMPTY signals to avoid data underflow/overflow and to take appropriate actions. Figure 13 shows how the FIFO is connected between the I/O banks and the GDX Blocks in FIFO mode. For more information on the FIFO, please refer to Lattice technical note number TN1020, sysHSI Usage Guidelines. 15 Lattice Semiconductor ispGDX2 Family Data Sheet Figure 13. Operation in FIFO Mode2 GDX Block 1 SERDES FIFO Pre-Assigned Pins SE L D E IS C C T O D N E TI VI N C U E ED S GRP Input Reg/ Latch Delay 10 10 DOUT DIN RCLK RXD Parallel Data Serial Data In (SIN) TXD Parallel Data Serial Data Out (SOUT) RE 10 Output Reg/ Latch PT-CLK/CE(0:3) WE GCLK/CE(0:3) RECCLK Input Reg/ Latch WCLK Input Reg/ Latch SYDT Output Reg/ Latch FULL EMPTY Output Reg/ Latch CDRRSTb FIFORSTb Notes: 1. For clarity, only a portion of the GDX Block is shown. 2. Some signals share pins. See Logic Signal Connections tables for details. 16 POR RESETb CAL Lattice Semiconductor ispGDX2 Family Data Sheet High Speed Serial Interface Block (sysHSI Block)1 The High Speed Serial Interface (sysHSI) allows high speed serial data transfer over a pair of LVDS I/O. The ispGDX2 devices have multiple sysHSI Blocks. SE L D E IS C C T O D N E TI VI N C U E ED S Each sysHSI Block has two SERDES blocks which contain two main sub-blocks, Transmitter (with a serializer) and Receiver (with a deserializer) including Clock/Data Recovery Circuit (CDR). Each SERDES can be used as a full duplex channel. The two SERDES in a given sysHSI Block share a common clock and must operate at the same nominal frequency. Figure 14 shows the sysHSI Block. Device features support two data coding modes: 10B/12B and 8B/10B (for use with other encoding schemes, see Lattice’s sysHSI application notes). The encoding and decoding of the 10B/12B standard are performed within the device in dedicated logic. For the 8B/10B standard, the symbol boundaries are aligned internally but the encoding and decoding are performed outside the device. Each SERDES block receives a single high speed serial data input stream (with embedded clock) from an input, and provide a low speed 10-bit wide data stream and a recovered clock to the device. For transmitting, the SERDES converts a 10-bit wide low-speed data stream to a single high-speed data stream with embedded clock for output. Additionally, multiple sysHSI Blocks can be grouped together to form a source synchronous interface of between 18 channels. Figure 15 shows the connections of the SERDES block with the FIFO, sysIO block and the MRB. Table 6 provides the descriptions of the SERDES. For more information on the SERDES/CDR, refer to Lattice technical note number TN1020, sysHSI Usage Guidelines. Table 6. SERDES Signal Descriptions Signal I/O Description CDRRSTb I Resets the CDR circuit of sysHSI block SYDT O Symbol alignment detect for sysHSI block CAL I RXD Internal Parallel data in for sysHSI block Initiates source synchronous calibration sequence TXD Internal Parallel data out for sysHSI block REFCLK Internal Reference clock received from the clock tree SIN I Serial data input for sysHSI block (LVDS input) SOUT O Serial data output for sysHSI block (LVDS output) SS_CLKIN I Clock input for source synchronous group SS_CLKOUT O Clock output for source synchronous group RECCLK Internal Recovered clock from encoded data by CDR of sysHSI block CSLOCK Internal Lock output of the PLL associated with sysHSI block 1. “E-Series” does not support sysHSI. 17 Lattice Semiconductor ispGDX2 Family Data Sheet Figure 14. sysHSI Block with SERDES and FIFO sysHSI Block Core Logic SERDES TXD Serializer 10 SE L D E IS C C T O D N E TI VI N C U E ED S SOUT RXD SIN De-serializer including CDR 10 FIFO RECCLK GDX Block CSLOCK SS_CLKOUT CSLOCK CSPLL SS_CLKIN GRP CAL Shared Source Synchronous pins drive multiple sysHSI blocks SERDES SOUT SIN Serializer De-serializer including CDR TXD 10 RXD 10 RECCLK REFCLK (0:3) Reference clocks from CLK (0:3) Note: Some pins are shared. See Logic Signal Connections table for details 18 FIFO GDX Block Lattice Semiconductor ispGDX2 Family Data Sheet Figure 15. Operation in SERDES Only Mode1, 2 GDX Block SERDES FIFO Pre-Assigned Pins SE L D E IS C C T O D N E TI VI N C U E ED S GRP Input Reg/ Latch 10 Delay DOUT DIN RCLK RXD Parallel Data Serial Data In (SIN) TXD Parallel Data Serial Data Out (SOUT) RE 10 Output Reg/ Latch PT-CLK/CE(0:3) WE GCLK/CE(0:3) RECCLK Input Reg/ Latch WCLK Input Reg/ Latch SYDT Output Reg/ Latch FULL EMPTY Output Reg/ Latch CDRRSTb FIFORSTb Notes: 1. Some pins shared. See Logic Signal Connections table for details. 2. For SERDES only mode programmable bit holds FIFO in reset. Input registers used for DOUT, and RECCLK configured as latches and held in pass through. POR RESETb 19 CAL Lattice Semiconductor ispGDX2 Family Data Sheet Figure 16. Operation in SERDES with FIFO Mode GDX Block SERDES FIFO Pre-Assigned Pins SE L D E IS C C T O D N E TI VI N C U E ED S GRP Input Reg/ Latch 10 Delay DOUT DIN RCLK RXD Parallel Data Serial Data In (SIN) TXD Parallel Data Serial Data Out (SOUT) RE 10 Output Reg/ Latch PT-CLK/CE(0:3) WE GCLK/CE(0:3) RECCLK Input Reg/ Latch WCLK Input Reg/ Latch SYDT Output Reg/ Latch FULL EMPTY Output Reg/ Latch CDRRSTb FIFORSTb POR RESETb 20 CAL Lattice Semiconductor ispGDX2 Family Data Sheet IEEE 1149.1-Compliant Boundary Scan Testability SE L D E IS C C T O D N E TI VI N C U E ED S All ispGDX2 devices have boundary scan cells and are compliant to the IEEE 1149.1 standard. This allows functional testing of the circuit board on which the device is mounted through a serial scan path that can access all critical logic notes. Internal registers are linked internally, allowing test data to be shifted in and loaded directly onto test nodes, or test node data to be captured and shifted out for verification. In addition, these devices can be linked into a board-level serial scan path for more board-level testing. The test access port has its own supply voltage that can operate with LVCMOS3.3, 2.5 and 1.8 standards. sysIO Quick Configuration To facilitate the most efficient board test, the physical nature of the I/O cells must be set before running any continuity tests. As these tests are fast, by nature, the overhead and time that is required for configuration of the I/Os' physical nature should be minimal so that board test time is minimized. The ispGDX2 family of devices allows this by offering the user the ability to quickly configure the physical nature of the sysIO cells. This quick configuration takes milliseconds to complete, whereas it takes seconds for the entire device to be programmed. Lattice's ispVM™ System programming software can either perform the quick configuration through the PC parallel port, or can generate the ATE or test vectors necessary for a third-party test system. IEEE 1532-Compliant In-System Programming In-system programming of devices provides a number of significant benefits including rapid prototyping, lower inventory levels, higher quality and the ability to make in-field modifications. All ispGDX2 devices provide In-System Programming (ISP) capability through their Boundary Scan Test Access Port. This capability has been implemented in a manner that ensures that the port remains compliant to the IEEE 1532 standard. By using IEEE 1532 as the communication interface through which ISP is achieved, designers get the benefit of a standard, well defined interface. The ispGDX2 devices can be programmed across the commercial temperature and voltage range. The PC-based Lattice software facilitates in-system programming of ispGDX2 devices. The software takes the JEDEC file output produced by the design implementation software, along with information about the scan chain, and creates a set of vectors used to drive the scan chain. The software can use these vectors to drive a scan chain via the parallel port of a PC. Alternatively, the software can output files in formats understood by common automated test equipment. This equipment can then be used to program ispGDX2 devices during the testing of a circuit board. Security Scheme A programmable security scheme is provided on the ispGDX2 devices as a deterrent to unauthorized copying of the array configuration patterns. Once programmed, this scheme prevents readback of the programmed pattern by a device programmer, securing proprietary designs from competitors. The security scheme also prevents programming and verification. The entire device must be erased in order to reset the security scheme. Hot Socketing The ispGDX2 devices are well suited for those applications that require hot socketing capability. Hot socketing a device requires that the device, when powered down, can tolerate active signals on the I/Os and inputs without being damaged. Additionally, it requires that the effects of the powered-down device be minimal on active signals. 21 Lattice Semiconductor ispGDX2 Family Data Sheet Absolute Maximum Ratings 1, 2, 3 ispGDX2C (1.8V) ispGDX2B/V (2.5/3.3V) Supply Voltage VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to 2.5V . . . . . . . . . . . . . . . . -0.5 to 5.5V PLL Supply Voltage VCCP . . . . . . . . . . . . . . . . . . . . -0.5 to 2.5V . . . . . . . . . . . . . . . . -0.5 to 5.5V SE L D E IS C C T O D N E TI VI N C U E ED S Output Supply Voltage VCCO . . . . . . . . . . . . . . . . . -0.5 to 4.5V . . . . . . . . . . . . . . . . -0.5 to 4.5V JTAG Supply Voltage (VCCJ) . . . . . . . . . . . . . . . . . -0.5 to 4.5V . . . . . . . . . . . . . . . . -0.5 to 4.5V Input or I/O Tristate Voltage Applied 4, 5 . . . . . . . . . -0.5 to 5.5V . . . . . . . . . . . . . . . . -0.5 to 5.5V Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . -65 to 150°C . . . . . . . . . . . . . . . -65 to 150°C Junction Temp. (TJ) with Power Applied . . . . . . . . -55 to 150°C . . . . . . . . . . . . . . . -55 to 150°C 1. Stress above those listed under the Absolute Maximum Ratings may cause permanent damage to the device. Functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied (while programming, following the programming specifications). 2. Compliance with the Lattice Thermal Management document is required. 3. All voltages referenced to GND. 4. Overshoot and undershoot of -2V to (VIH (MAX)+2) volts is permitted for a duration of 3.6V is allowed. Recommended Operating Conditions Symbol VCC Min. Max. Units Supply Voltage for 1.8V Devices1 Parameter 1.65 1.95 V Supply Voltage for 2.5V Devices 2.3 2.7 V Supply Voltage for 3.3V Devices 3 3.6 V Supply Voltage for PLL and sysHSI Blocks, 1.8V Devices 1.65 1.95 V Supply Voltage for PLL and sysHSI Blocks, 2.5V Devices 2.3 2.7 V 1 VCCP Supply Voltage for PLL and sysHSI Blocks, 3.3V Devices VCCJ 3 3.6 V Power Supply Voltage for JTAG Programming 1.8V Operation 1.65 1.95 V Power Supply Voltage for JTAG Programming 2.5V Operation 2.3 2.7 V Power Supply Voltage for JTAG Programming 3.3V Operation 3 3.6 V 0 90 -40 105 °C °C TJ (COM) Junction Commercial Operation TJ (IND) Junction Industrial Operation 1. sysHSI specification is valid for VCC and VCCP = 1.7V to 1.9V. Erase Reprogram Specifications Parameter Erase/Reprogram Cycle Min Max Units 1,000 — Cycles Note: Valid over commercial temperature range. Hot Socketing Specifications1, 2, 3 Symbol IDK 1. 2. 3. 4. 4 Parameter Input or Tristated I/O Leakage Current Condition 0 ≤ VIN ≤ 3.0V Min Typ Max Units — +/-50 +/-800 μA Insensitive to sequence of VCC and VCCO. However, assumes monotonic rise/fall rates for VCC and VCCO, provided (VIN - VCCO) ≤ 3.6V. LVTTL, LVCMOS only. 0 < VCC ≤ VCC (MAX), 0 < VCCO ≤ VCCO (MAX). IDK is additive to IPU, IPD or IBH. Device defaults to pull-up until fuse circuitry is active. 22 Lattice Semiconductor ispGDX2 Family Data Sheet DC Electrical Characteristics Over Recommended Operating Conditions Symbol IIL, IIH1 Parameter Input or I/O Low Leakage Min. Typ. Max. Units 0 ≤ VIN ≤ (VCCO - 0.2V) Condition — — 10 μA (VCCO - 0.2V) < VIN ≤ 3.6V — — 30 μA Input High Leakage Current 3.6V < VIN ≤ 5.5V and 3.0V ≤ VCCO ≤ 3.6V — — 3 mA IPU I/O Active Pull-up Current 0 ≤ VIN ≤ 0.7 VCCO -30 — -150 μA IPD I/O Active Pull-down Current VIL (MAX) ≤ VIN ≤ VIH (MAX) 30 — 150 μA IBHLS Bus Hold Low Sustaining Current VIN = VIL (MAX) 30 — — μA SE L D E IS C C T O D N E TI VI N C U E ED S IIH 3 IBHHS Bus Hold High Sustaining Current VIN = 0.7 VCCO -30 — — μA IBHLO Bus Hold Low Overdrive Current — — 150 μA IBHLH Bus Hold High Overdrive Current 0 ≤ VIN ≤ VIH (MAX) VBHT Bus Hold Trip Points C1 I/O Capacitance2 C2 Clock Capacitance2 C3 Global Input Capacitance2 0 ≤ VIN ≤ VIH (MAX) — — -150 μA VCCO * 0.35 — VCCO * 0.65 V VCCO = 3.3V, 2.5V, 1.8V — VCC = 1.8V, VIO = 0 to VIH (MAX) — VCCO = 3.3V, 2.5V, 1.8V — VCC = 1.8V, VIO = 0 to VIH (MAX) — VCCO = 3.3V, 2.5V, 1.8V — VCC = 1.8V, VIO = 0 to VIH (MAX) — — 8 — — 6 — — 6 — pf pf pf 1. Input or I/O leakage current is measured with the pin configured as an input or as an I/O with the output driver tri-stated. It is not measured with the output driver active. Bus maintenance circuits are disabled. 2. TA = 25°C, f = 1.0MHz. 3. 5V tolerant inputs and I/Os should be placed in banks where 3.0V ≤ VCCO ≤ 3.6V. The JTAG ports are not included for the 5V tolerant interface. Supply Current Over Recommended Operating Conditions (ispGDX2-256)4 Symbol Description Power Pins Core Logic Power Supply Current ICC1,2 VCC GPLL/sysHSI Logic Power Supply Current ICCP2 ICCO3 ICCJ 1. 2. 3. 4. GPLL/sysHSI CSPLL Power Supply Current Bank Power Supply Current JTAG Programming Current VCCP VCCO VCCJ Vcc (V) Min. Typ. Max. Units 3.3 — 59.6 — mA 2.5 — 58.7 — mA 1.8 — 60.0 — mA 3.3 — 118.7 — mA 2.5 — 118.7 — mA 1.8 — 117.5 — mA 3.3 — 14.7 — mA 2.5 — 14.7 — mA 1.8 — 17.4 — mA 3.3 — 35 — mA 2.5 — 35 — mA 1.8 — 25 — mA 3.3 — 1.5 — mA 2.5 — 1.0 — mA 1.8 — 800 — µA 64-input switching frequency at 20 MHz, with one GRP fanout. One GPLL with fVCO = 400 MHz and one sysHSI Block (two receivers and two transmitters) at 622 MHz data rate. All 8-bank reference circuit currents, all I/Os in tristate, inputs held at valid logic levels, and bus maintenance circuits disabled. TA = 25°C 23 Lattice Semiconductor ispGDX2 Family Data Sheet sysIO Recommended Operating Conditions VCCO (V)1 Standard Min. Typ. VREF (V) Max. Min. Typ. Max. 3.0 3.3 3.6 - - - 2.3 2.5 2.7 - - - LVCMOS 1.82 1.65 1.8 1.95 - - - LVTTL 3.0 3.3 3.6 - - - SE L D E IS C C T O D N E TI VI N C U E ED S LVCMOS 3.3 LVCMOS 2.5 PCI 3.3 3.0 3.3 3.6 - - - PCI-X 3.0 3.3 3.6 - - - AGP-1X 3.15 3.3 3.45 - - - SSTL 2 2.3 2.5 2.7 1.15 1.25 1.35 SSTL 3 3.0 3.3 3.6 1.3 1.5 1.7 CTT 3.3 3.0 3.3 3.6 1.35 1.5 1.65 CTT 2.5 2.3 2.5 2.7 1.35 1.5 1.65 HSTL Class I 1.4 1.5 1.6 0.68 0.75 0.9 HSTL Class III 1.4 1.5 1.6 - 0.9 - HSTL Class IV 1.4 1.5 1.6 - 0.9 - GTL+ 1.4 - 3.6 0.882 1.0 1.122 LVPECL 3.0 3.3 3.6 - - - LVDS 2.3 2.5/3.3 3.6 - - - BLVDS 2.3 2.5/3.3 3.6 - - - 1. Inputs are independent of VCCO setting. However, VCCO must be set within the valid operating range for one of the supported standards. 2. Software default setting. 24 Lattice Semiconductor ispGDX2 Family Data Sheet sysIO Single Ended DC Electrical Characteristics Over Recommended Operating Conditions Input/Output Standard Min (V) -0.3 VIH Max (V) 0.8 Min (V) 2.0 Max (V) 5.5 VOL Max (V) VOH Min (V) 0.4 2.4 IOL2 (mA) IOH2 (mA) 20, 16, 12, -20, -16, -12, 8, 5.33, 4 -8, -5.33, -4 SE L D E IS C C T O D N E TI VI N C U E ED S LVCMOS 3.3 VIL LVTTL -0.3 LVCMOS 2.5 1, 3 LVCMOS 1.8 -0.3 -0.3 0.8 0.7 0.68 2.0 1.7 1.07 5.5 3.6 3.6 0.2 VCCO - 0.2 0.1 -0.1 0.4 2.4 4 -4 0.2 VCCO - 0.2 0.1 -0.1 0.4 VCCO - 0.4 16, 12, 8, 5.33, 4 -16, -12, -8, -5.33, -4 0.2 VCCO - 0.2 0.1 -0.1 8 -8 0.4 VCCO - 0.4 0.4 VCCO -0.4 12, 5.33, 4 -12, -5.33, -4 LVCMOS 1.83 -0.3 0.68 1.07 3.6 0.2 VCCO - 0.2 0.1 -0.1 PCI 3.34 -0.3 1.08 1.5 3.6 0.1 VCCO 0.9 VCCO 1.5 -0.5 PCI -X5 -0.3 1.26 1.5 3.6 0.1 VCCO 0.9 VCCO 1.5 -0.5 AGP-1X4 -0.3 1.08 1.5 3.6 0.1 VCCO 0.9 VCCO 1.5 -0.5 SSTL3 class I -0.3 VREF - 0.2 VREF + 0.2 3.6 0.7 VCCO - 1.1 8 -8 SSTL3 class II -0.3 VREF - 0.2 VREF + 0.2 3.6 0.5 VCCO - 0.9 16 -16 SSTL2 class I -0.3 VREF - 0.18 VREF + 0.18 3.6 0.54 VCCO - 0.62 7.6 -7.6 SSTL2 class II -0.3 VREF - 0.18 VREF + 0.18 3.6 0.35 VCCO - 0.43 15.2 -15.2 CTT 3.3 -0.3 VREF - 0.2 VREF + 0.2 3.6 VREF - 0.4 VREF + 0.4 8 -8 CTT 2.5 -0.3 VREF - 0.3 VREF + 0.2 3.6 VREF - 0.4 VREF + 0.4 8 -8 HSTL class I -0.3 VREF - 0.1 VREF + 0.1 3.6 0.4 VCCO - 0.4 8 -8 HSTL class III -0.3 VREF - 0.2 VREF + 0.1 3.6 0.4 VCCO - 0.4 24 -8 HSTL class IV -0.3 VREF - 0.3 VREF + 0.1 3.6 0.4 VCCO - 0.4 48 -8 GTL+ -0.3 VREF - 0.2 VREF + 0.2 3.6 0.6 n/a 36 n/a 1. Software default setting. 2. The average DC current drawn by I/Os between adjacent bank GND connections, or between the last GND in an I/O bank and the end of the I/O bank, as shown in the logic signals connection table, shall not exceed n*8mA. Where n is the number of I/Os between bank GND connections or between the last GND in a bank and the end of a bank. 3. For 1.8V devices (ispGDX2C) these specifications are VIL = 0.35 VCC and VIH = 0.65VCC 4. For 1.8V power supply devices these specifications are VIL = 0.3 * VCC * 3.3/1.8, VIH = 0.5 * VCC * 3.3/1.8 5. For 1.8V power supply devices these specifications are VIL = 0.35 * VCC * 3.3/1.8 and VIH = 0.5 * VCC * 3.3/1.8 25 Lattice Semiconductor ispGDX2 Family Data Sheet sysIO Differential DC Electrical Characteristics Over Recommended Operating Conditions Parameter Symbol Parameter Description Test Conditions Min. Typ. Max. Units 0 — 2.4 V LVDS Input Voltage — VTHD Differential Input Threshold 0.2V ≤ VCM ≤ 1.8V IIN Input Current Power On VOH Output High Voltage for VOP or VOM VOL Output Low Voltage for VOP or VOM VOD Output Voltage Differential ΔVOD Change in VOD Between High and Low — SE L D E IS C C T O D N E TI VI N C U E ED S VINP VINM +/-100 — — mV — — +/-10 µA RT = 100Ω — 1.38 1.60 V RT = 100Ω 0.9 1.03 — V (VOP - VOM), RT = 100Ω 250 350 450 mV — — 50 mV VOS Output Voltage Offset (VOP - VOM)/2, RT = 100Ω 1.125 1.25 1.375 V ΔVOS Change in VOS Between H and L — — — 50 mV IOSD Output Short Circuit Current VOD = 0V. Driver Outputs Shorted. — — 24 mA VOH Output High Voltage for VOP or VOM RT = 27Ω — 1.4 1.80 V Bus LVDS1 VOL Output Low Voltage for VOP or VOM RT = 27Ω 0.95 1.1 — V VOD Output Voltage Differential |VOP - VOM|, RT = 27Ω 240 300 460 mV — — 27 mV |VOP - VOM| /2, RT = 27Ω 1.1 1.3 1.5 V — — 27 mV — 36 65 mA Max. Units ΔVOD Change in VOD Between H and L VOS Output Voltage Offset ΔVOS Change in VOS Between H and L IOSD Output Short Circuit Current VOD = 0. Driver Outputs Shorted. 1. VOP and VOM are the two outputs of the LVDS output buffer. 1 LVPECL DC Parameter Parameter Description Min. Max. Min. Min. Output Supply Voltage VIH Input Voltage High 1.49 2.72 1.49 2.72 1.49 2.72 V VIL Input Voltage Low 0.86 2.125 0.86 2.125 0.86 2.125 V VOH Output Voltage High 1.7 2.11 1.92 2.28 2.03 2.41 V VOL Output Voltage Low 0.96 1.27 1.06 1.43 1.25 1.57 V Differential Input voltage 0.3 VDIFF 2 3.0 Max. VCCO 3.3 3.6 0.3 0.3 V V 1. These values are valid at the output of the source termination pack as shown above with 100-ohm differential load only (see Figure 17). The VOH levels are 200mV below the standard LVPECL levels and are compatible with devices tolerant of the lower common mode ranges. 2. Valid for 0.2V ≤ VCM ≤ 1.8V. Figure 17. LVPECL Driver with Three Resistor Pack 1/4 of Bourns P/N CAT 16-PC4F12 A Zo RT=100 Rs RD ispGDX2 LVPECL Buffer Rs Zo 26 to LVPECL differential receiver Lattice Semiconductor ispGDX2 Family Data Sheet ispGDX2V/B/C, ispGDX2EV/EB/EC External Switching Characteristics Over Recommended Operating Conditions -3 Parameter Description -32 -35 -5 Min. Max. Min. Max. Min. Max. Min. — 3.0 — 3.2 — 3.5 — Max. Units Output Paths Data From Input Pin to Output Pin 5.0 tPD_SEL Data From Global Select Pin to Output Pin — 2.8 — 3.0 — 3.3 — 4.7 ns tCO Global Clock to Output — 2.9 — 3.1 — 3.2 — 5.4 ns tOPS Set-up Time Before Global Clock 2.0 — 2.0 — 2.0 — 3.0 — ns tOPH Hold Time After Global Clock 0.0 — 0.0 — 0.0 — 0.0 — ns tOPCES PT Clock Enable Setup Time Before Global Clock 3.0 — 3.0 — 4.1 — 6.9 — ns tOPCEH PT Clock Enable Hold Time After Global Clock 0.0 — 0.0 — 0.0 — 0.0 — ns tOPRSTO External Reset Pin to Output Delay — 5.3 — 6.0 — 6.0 — 10.0 ns tIPS Set-up Time Before Global Clock 0.5 — 0.5 — 0.5 — 0.9 — ns tIPSZ Set-up Time Before Global Clock (Zero Hold Time) 2.0 — 2.0 — 2.0 — 3.0 — ns tIPH Hold Time After Global Clock 1.0 — 1.0 — 1.0 — 1.7 — ns tIPHZ Hold Time After Global Clock (Zero Hold Time) 0.0 — 0.0 — 0.0 — 0.0 — ns tIPCES PT Clock Enable Setup Time Before Global Clock 3.1 — 3.1 — 3.1 — 5.1 — ns tIPCEH PT Clock Enable Hold Time After Global Clock 0.0 — 0.0 — 0.0 — 0.0 — ns tIPRSTO External Reset Pin to Output Delay — 5.6 — 6.5 — 7.5 — 12.5 ns SE L D E IS C C T O D N E TI VI N C U E ED S tPD ns Input Paths Output Enable Paths tOECO Global Clock to Output Enabled Pin — 4.2 — 4.5 — 5.5 — 9.1 ns tOES Output Enable Register Set-up Time Before Global Clock 1.6 — 1.6 — 2.0 — 3.4 — ns tOEH Hold Time After Global Clock 0.0 — 0.0 — 0.0 — 0.0 — ns tOECES PT Clock Enable Setup Time Before Global Clock 3.5 — 3.5 — 4.1 — 6.9 — ns tOECEH PT Clock Enable Hold Time After Global Clock 0.0 — 0.0 — 0.0 — 0.0 — ns tGOE/DIS Global OE Input to Output Enable/Disable — 3.5 — 3.8 — 4.5 — 7.5 ns tTOE/DIS Test OE Input to Output Enable/Disable — 5.2 — 5.5 — 6.2 — 10.3 ns tEN/DIS Input to Output Enable/Disable — 5.2 — 5.5 — 6.2 — 10.3 ns Clock and Reset Paths tRW Width of Reset Pulse 2.5 — 2.5 — 2.5 — 4.1 — ns tCW Clock Width 1.3 — 1.5 — 1.6 — 2.7 — ns tGW Clock Width 1.5 — 1.6 — 1.6 — 2.7 — ns fMAX (Ext) Clock Frequency with External Feedback 1/(tOPS + tCO) — 204 — 196 — 192 — 119 MHz fMAX (Tog, No PLL) Clock Frequency Maximum Toggle (No PLL) — 360 — 330 — 300 — 180 MHz 27 Lattice Semiconductor ispGDX2 Family Data Sheet ispGDX2V/B/C, ispGDX2EV/EB/EC External Switching Characteristics Over Recommended Operating Conditions -3 Parameter Description -35 -5 Min. Max. Min. Max. Min. Max. Min. — 360 — 330 — 300 — Max. Units 180 MHz SE L D E IS C C T O D N E TI VI N C U E ED S fMAX Clock Frequency Maximum Toggle (Tog, PLL) (With PLL) -32 Timing v.2.2 28 Lattice Semiconductor ispGDX2 Family Data Sheet Timing Model SE L D E IS C C T O D N E TI VI N C U E ED S The task of determining the timing through the ispGDX2 family is relatively simple. The timing model provided in Figure 18 shows the specific delay paths. Once the implementation of a given function is determined either conceptually or from the software report file, the delay path of the function can easily be determined from the timing model. The Lattice design tools report the timing delays based on the same timing model for a particular design. Note that the internal timing parameters are given for reference only, and are not tested. The external timing parameters are tested and guaranteed for every device. Figure 18. ispGDX2 Timing Model Diagram (I/O Cell) TOE/ GOE t TOE_IN t GOE_IN t IOI TOE path GOE path t PTOE from GRP to FIFO (WE) to sysHSI (REFCLK) GCLK/ GCLKEN t GCLK tCLK_IN tCLKEN_IN t IOI t PTCLKEN t OEBYPASS from GRP tPLL_DELAY tPLL_SEC_DELAY t PTCLK OE Reg. D to sysHSI/FIFO (Global Reset) GSR Q to FIFO (WCLK) CE t SR_IN t IOI from sysHSI (SOUT) S/R from GRP GSEL t PTSR t SEL_IN t IOI from GRP from Adjacent Cells (Output) tPTSEL t OPBYPASS Output Reg. t OPAC D t MUXPD t MUXSEL from GRP t HSISOUT from sysHSI/FIFO (Flags) t HSIFIFOFLAG from sysHSI (SSCLKOUT) t HSISSCLKOUT Output Delays t BUF t EN t DIS t IOO Q CE from Adjacent Cells (Input) IN t FIFODATAOUT from sysHSI (RECCLK, SYDT) t HSIOUT from PLL (PLL Output) t PLLOUT to sysHSI (TXD) S/R t IPAC from FIFO (DOUT) OUT to Adjacent Cells (Output) Input Reg. S/R CE t IN t IOI D Q t ROUTEGRP to GRP t INDIO tIPBYPASS to sysHSI/FIFO to Adjacent Cells (Input) (SIN, Control, DIN, I/O Reset, SSCLKIN) Italicized parameters are optional. Model Version 1.6.7 to FIFO (REN) to FIFO (RCLK) 29 Lattice Semiconductor ispGDX2 Family Data Sheet Figure 19. ispGDX2 Timing Model Diagram (with sysHSI and FIFO Receive Mode) to I/O Cell (RECCLK) sysHSI (RXD) SE L D E IS C C T O D N E TI VI N C U E ED S from I/O Cell (SIN) Serial Data In tHSISIN FIFO Data Out (RXD) tFIFODATAIN Data In Recovered Clock tFIFOWCLK Write CLK HSI Controls Data Out to I/O Cell (DOUT) HSI Flags from I/O Cell (Control) from I/O Cell (SSCLKIN) from I/O Cell (REFCLK) CAL tHSICTRLCAL CSLOCK to I/O Cell (Output Path Flag) SYDT to I/O Cell (SYDT and Output Path Flags) FIFO Flags FULL, EMPTY Source Synchronous Clock tHSISSCLKIN from I/O Cell (RCLK) tFIFORCLK Read Clock from I/O Cell (RE) tFIFOREN Read Enable Reference Clock tHSIREFCLK RESET RESET from I/O Cell (Global RESET) from I/O Cell (I/O RESET) tHSIFIFORST Figure 20. ispGDX2 Timing Model Diagram (with sysHSI Transmit Mode) sysHSI (TXD) from I/O Cell (TXD) from I/O Cell (REFCLK) Serial Data Out tHSITXDATA Data In tHSIREFCLK Reference Clock Source Synchronous Clock 30 to I/O Cell (SOUT) to I/O Cell (SSCLKOUT) to I/O Cell (Output Path Flags) Lattice Semiconductor ispGDX2 Family Data Sheet Figure 21. ispGDX2 Timing Model Diagram (in FIFO Only Mode) from I/O Cell (DIN) tFIFODATAIN Data In from I/O Cell (WCLK) tFIFOWCLK Write Clock FIFO to I/O Cell (DOUT) SE L D E IS C C T O D N E TI VI N C U E ED S Data Out from I/O Cell (WE) tFIFOWEN Write Enable FIFO Flags FULL, EMPTY from I/O Cell (RCLK) tFIFORCLK Read Clock from I/O Cell (RE) tFIFOREN Read Enable RESET from I/O Cell (Global RESET) from I/O Cell (I/O RESET) tHSIFIFORST 31 to I/O Cell (Output Path Flags) Lattice Semiconductor ispGDX2 Family Data Sheet Sample External Timing Calculations The following equations illustrate the task of determining the timing through the ispGDX2 family. These are only a sample of equations to calculate the timing through the ispGDX2. SE L D E IS C C T O D N E TI VI N C U E ED S Figure 18 shows the specific delay paths and the Internal Timing Parameters table provides the parameter values. Note that the internal timing parameters are given for reference only and are not tested. The external timing parameters are tested and guaranteed for every device. Data from global select pin to output pin: tPD_SEL = tSEL_IN + tMUXSEL + tOPBYPASS + tBUF Global clock to output: tCO = tCLK_IN + tGCLK + tOPCOi + tBUF Input register or latch set-up time before global clock: tIPS = tIN + tIPS - (tCLK + tGCLK) Input register or latch hold time after global clock: tIPH = (tCLK_IN + tGCLK) + tIPHi - tIN Data from product term select to output pin: tPD_PTSEL = tIN + tIPBYPASS + tROUTEGRP + tPTSEL + tMUXSEL + tOPBYPASS + tBUF Product term clock to output: tCO_PT = tIN + tIPBYPASS + tROUTEGRP + tPTCLK + tOPCOi + tBUF Input register or latch set-up time before product term clock: tIPS_PT = tIN + tIPSi_PT - (tIN + tIPBYPASS + tROUTEGRP + tPTCLK) Input register or latch hold time after product term clock: tIPH_PT = (tIN + tIPBYPASS + tROUTEGRP + tPTCLK) + tIPHi - tIN Global OE input to output enable/disable: tGOE/DIS = tGOE_IN + tOEBYPASS + tEN External reset pin to output delay: tOPRSTO = tSR_IN + tOPASROi + tBUF 32 Lattice Semiconductor ispGDX2 Family Data Sheet ispGDX2V/B/C, ispGDX2EV/EB/EC Internal Timing Parameters1 Over Recommended Operating Conditions -3 Parameter Description -32 -35 -5 Min. Max. Min. Max. Min. Max. Min. Max. Units Input/Output Delays Output Buffer Delay — 0.80 — 0.80 — 0.80 — 1.14 ns tCLK_IN Global Clock Input Delay — 1.00 — 1.00 — 1.00 — 1.67 ns tCLKEN_IN Global Clock Enable Input Delay — 1.80 — 1.80 — 1.80 — 3.00 ns tDIS Output Disable Delay — 1.80 — 1.80 — 2.50 — 4.17 ns tEN Output Enable Delay — 1.50 — 1.80 — 2.50 — 4.17 ns tGOE_IN Global Output Enable Path Delay — 2.00 — 2.00 — 2.00 — 3.33 ns tIN Input Pin Delay — 0.40 — 0.40 — 0.40 — 0.57 ns tSEL_IN Global MUX Select Input Delay — 1.60 — 1.60 — 1.60 — 2.29 ns tSR_IN Global Set/Reset Path Delay — 2.00 — 2.70 — 2.70 — 4.50 ns tTOE_IN Test Output Enable Path Delay — 3.70 — 3.70 — 3.70 — 6.17 ns SE L D E IS C C T O D N E TI VI N C U E ED S tBUF Shift Register and MUX Delays tIPAC Input Path Adjacent I/O Cell Delay (Shift Register) — 0.80 — 0.80 — 0.80 — 1.33 ns tOPAC Output Path Adjacent I/O Cell Delay (Shift Register) — 1.30 — 1.30 — 1.30 — 2.17 ns tMUXPD MUX Data Path Delay — 0.90 — 0.90 — 0.90 — 1.29 ns tMUXSEL MUX Select Path Delay — 0.40 — 0.40 — 0.40 — 0.57 ns AND Arrays and Routing Delays tFIFODATAOUT FIFO Output to I/O Block Delay — 0.00 — 0.00 — 0.00 — 0.00 ns tGCLK Clock Tree Delay — 0.40 — 0.40 — 0.40 — 0.67 ns tHSIFIFOFLAG HSI/FIFO Flag to I/O Block Delay — 0.00 — 0.00 — 0.00 — 0.00 ns tHSIOUT HSI Output to I/O Cell Block Delay — 0.00 — 0.00 — 0.00 — 0.00 ns tHSISSCLKOUT HSI Source Synchronous Clock to I/O Cell Block Delay — 0.00 — 0.00 — 0.00 — 0.00 ns tPLL_DELAY PLL Delay Increment — 0.33 — 0.33 — 0.33 — 0.33 ns tPTCLK Clock AND Array Delay — 2.20 — 2.20 — 2.20 — 3.67 ns tPTCLKEN Clock Enable AND Array Delay — 2.10 — 2.10 — 2.10 — 3.50 ns tPTOE OE AND Array Delay — 2.40 — 2.40 — 2.40 — 4.00 ns tPTSEL Select AND Array Delay — 1.70 — 1.70 — 1.70 — 2.83 ns tPTSR Set/Reset AND Array Delay — 1.40 — 1.40 — 2.70 — 4.50 ns tROUTEGRP Global Routing Pool Delay — 0.90 — 0.90 — 0.90 — 1.29 ns — 2.50 — 2.50 — 2.50 — 4.17 ns Register/Latch Delays, Output Paths tOPASROi Asynchronous Set/Reset to Output tOPASRRi Asynchronous Set/Reset Recovery — 2.50 — 2.50 — 2.50 — 4.17 ns tOPBYPASS Register/Latch Bypass Delay — 0.00 — 0.20 — 0.50 — 0.71 ns tOPCEHi Register Clock Enable Hold Time 1.30 — 1.30 — 1.30 — 2.17 — ns tOPCESi Register Clock Enable Setup Time (Global Clock Enable) 1.10 — 1.10 — 1.10 — 1.83 — ns tOPCESi_PT Register Clock Enable Setup Time (Product Term Clock Enable) 1.00 — 1.00 — 2.10 — 3.50 — ns tOPCOi Register Clock to Output Delay — 0.70 — 0.90 — 1.00 — 1.67 ns tOPHi Register Hold Time 0.80 — 0.80 — 0.80 — 1.33 — ns 33 Lattice Semiconductor ispGDX2 Family Data Sheet ispGDX2V/B/C, ispGDX2EV/EB/EC Internal Timing Parameters1 (Continued) Over Recommended Operating Conditions -3 Parameter Description -32 -35 -5 Min. Max. Min. Max. Min. Max. Min. — 1.00 — 1.00 — 1.00 — Max. Units 1.67 ns 0.80 — 0.80 — 0.80 — 1.33 — ns — 0.30 — 0.30 — 0.30 — 0.50 ns 1.20 — 1.20 — 1.20 — 2.00 — ns Latch Gate to Output Delay tOPLHi Latch Hold Time tOPLPDi Latch Propagation Delay (Transparent Mode) tOPLSi Latch Setup Time (Global Gate) tOPLSi_PT Latch Setup Time (Product Term Gate) 1.00 — 1.00 — 1.00 — 1.67 — ns tOPSi Register Setup Time (Global Clock) 1.20 — 1.20 — 1.20 — 2.00 — ns tOPSi_PT Register Setup Time (Product Term Clock) 1.00 — 1.00 — 1.00 — 1.67 — ns tOPSRPWi Asynchronous Set/Reset Pulse Width — 2.50 — 2.50 — 2.50 — 4.17 ns — 1.00 — 1.00 — 1.70 — 2.83 ns SE L D E IS C C T O D N E TI VI N C U E ED S tOPLGOi Register/Latch Delays, Input Paths tIPASROi Asynchronous Set/Reset to Output tIPASRRi Asynchronous Set/Reset Recovery — 2.50 — 2.50 — 2.50 — 4.17 ns tIPBYPASS Register/Latch Bypass Delay — 0.00 — 0.00 — 0.00 — 0.00 ns tIPCEHi Register Clock Enable Hold Time 1.30 — 1.30 — 1.30 — 2.17 — ns tIPCESi Register Clock Enable Setup Time (Global Clock Enable) 1.10 — 1.10 — 1.10 — 1.83 — ns tIPCESi_PT Register Clock Enable Setup Time (Product Term Clock Enable) 1.10 — 1.10 — 1.10 — 1.83 — ns tIPCOi Register Clock to Output Delay — 0.80 — 1.00 — 1.00 — 1.67 ns 0.00 — 0.00 — 0.00 — 0.00 — ns — 1.00 — 1.00 — 1.00 — 1.67 ns 0.00 — 0.00 — 0.00 — 0.00 — ns — 0.30 — 0.30 — 0.30 — 0.50 ns 1.50 — 1.50 — 1.50 — 2.50 — ns tIPHi Register Hold Time tIPLGOi Latch Gate to Output Delay tIPLHi Latch Hold Time tIPLPDi Latch Propagation Delay (Transparent Mode) tIPLSi Latch Setup Time (Global Term) tIPLSi_PT Latch Setup Time (Product Term Gate) 1.50 — 1.50 — 1.50 — 2.50 — ns tIPSi Register Setup Time (Global Clock) 1.50 — 1.50 — 1.50 — 2.50 — ns tIPSi_PT Register Setup Time (Product Term Clock) 1.50 — 1.50 — 1.50 — 2.50 — ns tIPSRPWi Asynchronous Set/Reset Pulse Width — 2.50 — 2.50 — 2.50 — 4.17 ns tOEASROi Asynchronous Set/Reset to Output — 2.50 — 2.50 — 2.50 — 4.17 ns tOEASRRi Asynchronous Set/Reset Recovery — 2.50 — 2.50 — 2.50 — 4.17 ns tOEBYPASS Register/Latch Bypass Delay — 0.00 — 0.00 — 0.00 — 0.00 ns tOECEHi Register Clock Enable Hold Time 1.30 — 1.30 — 0.80 — 1.33 — ns tOECESi Register Clock Enable Setup Time (Global Clock Enable) 1.20 — 1.20 — 1.20 — 2.00 — ns tOECESi_PT Register Clock Enable Setup Time (Product Term Clock Enable) 1.50 — 1.50 — 2.10 — 3.50 — ns tOECOi Register Clock to Output Delay — 1.30 — 1.30 — 1.60 — 2.67 ns 0.40 — 0.40 — 0.40 — 0.67 — ns — 1.60 — 1.60 — 1.60 — 2.67 ns 0.40 — 0.40 — 0.40 — 0.67 — ns — 0.30 — 0.30 — 0.30 — 0.50 ns OE Paths tOEHi Register Hold Time tOELGOi Latch Gate to Output Delay tOELHi Latch Hold Time tOELPDi Latch Propagation Delay (Transparent Mode) 34 Lattice Semiconductor ispGDX2 Family Data Sheet ispGDX2V/B/C, ispGDX2EV/EB/EC Internal Timing Parameters1 (Continued) Over Recommended Operating Conditions -3 Parameter Description -32 -35 -5 Min. Max. Min. Max. Min. Max. Min. 1.40 — 1.40 — 1.40 — 2.33 Max. Units Latch Setup Time (Global Gate) — ns tOELSi_PT Latch Setup Time (Product Term Gate) 1.00 — 1.00 — 1.00 — 1.67 — ns tOESi Register Setup Time (Global Clock) 1.00 — 1.00 — 1.40 — 2.33 — ns tOESi_PT Register Setup Time (Product Term Clock) 1.00 — 1.00 — 1.00 — 1.67 — ns tOESRPWi Asynchronous Set/Reset Pulse Width — 2.50 — 2.50 — 2.50 — 4.17 ns SE L D E IS C C T O D N E TI VI N C U E ED S tOELSi Timing v.2.2 1. Internal parameters are not tested and are for reference only. Refer to the timing model in this data sheet for details. 2. tPLL_DELAY is the unit of increment by which the clock signal can be incremented. The PLL can adjust the clock signal by up to t RANGE (as given in the sysCLOCK PLL Timing section) in either direction in steps of size tPLL_DELAY. 35 Lattice Semiconductor ispGDX2 Family Data Sheet ispGDX2V/B/C, ispGDX2EV/EB/EC Timing Adjusters -3 Parameter Description -32 -35 -5 Min. Max. Min. Max. Min. Max. Min. Max. Units Input Delay — 1.50 — 1.50 — 1.50 — 2.50 ns Secondary PLL Output Delay — 1.30 — 1.30 — 1.30 — 1.30 ns Slow Slew Using Slow Slew (LVTTL and LVCMOS Outputs Only) — 0.90 — 0.90 — 0.90 — 0.90 ns LVTTL_out Using 3.3V TTL Drive — 1.20 — 1.20 — 1.20 — 1.20 ns LVCMOS_18_4mA_out Using 1.8V CMOS Standard, 4mA Drive — 0.30 — 0.30 — 0.30 — 0.30 ns LVCMOS_18_5.33mA_out Using 1.8V CMOS Standard, 5.33mA Drive — 0.30 — 0.30 — 0.30 — 0.30 ns LVCMOS_18_8mA_out Using 1.8V CMOS Standard, 8mA Drive — 0.00 — 0.00 — 0.00 — 0.00 ns LVCMOS_18_12mA_out Using 1.8V CMOS Standard, 12mA Drive — 0.00 — 0.00 — 0.00 — 0.00 ns LVCMOS_25_4mA_out Using 2.5V CMOS Standard, 4mA Drive — 1.20 — 1.20 — 1.20 — 1.20 ns LVCMOS_25_5.33mA_out Using 2.5V CMOS Standard, 5.33mA Drive — 1.00 — 1.00 — 1.00 — 1.00 ns LVCMOS_25_8mA_out Using 2.5V CMOS Standard, 8mA Drive — 0.40 — 0.40 — 0.40 — 0.40 ns LVCMOS_25_12mA_out Using 2.5V CMOS Standard, 12mA Drive — 0.40 — 0.40 — 0.40 — 0.40 ns LVCMOS_25_16mA_out Using 2.5V CMOS Standard, 16mA Drive — 0.40 — 0.40 — 0.40 — 0.40 ns LVCMOS_33_4mA_out Using 3.3V CMOS Standard, 4mA Drive — 1.20 — 1.20 — 1.20 — 1.20 ns LVCMOS_33_5.33mA_out Using 3.3V CMOS Standard, 5.33mA Drive — 1.20 — 1.20 — 1.20 — 1.20 ns LVCMOS_33_8mA_out Using 3.3V CMOS Standard, 8mA Drive — 0.80 — 0.80 — 0.80 — 0.80 ns LVCMOS_33_12mA_out Using 3.3V CMOS Standard, 12mA Drive — 0.60 — 0.60 — 0.60 — 0.60 ns LVCMOS_33_16mA_out Using 3.3V CMOS Standard, 16mA Drive — 0.60 — 0.60 — 0.60 — 0.60 ns LVCMOS_33_20mA_out Using 3.3V CMOS Standard, 20mA Drive — 0.30 — 0.30 — 0.30 — 0.30 ns AGP_1X_out Using AGP 1x Standard — 0.60 — 0.60 — 0.60 — 0.60 ns BLVDS_out Using Bus Low Voltage Differential Signaling (BLVDS) — 1.00 — 1.00 — 1.00 — 1.00 ns CTT25_out Using CTT 2.5v — 0.30 — 0.30 — 0.30 — 0.30 ns CTT33_out Using CTT 3.3v — 0.20 — 0.20 — 0.20 — 0.20 ns GTL+_out Using GTL+ — 0.50 — 0.50 — 0.50 — 0.50 ns HSTL_I_out Using HSTL 2.5V, Class I — 0.50 — 0.50 — 0.50 — 0.50 ns HSTL_III_out Using HSTL 2.5V, Class III — 0.60 — 0.60 — 0.60 — 0.60 ns HSTL_IV_out Using HSTL 2.5V, Class IV — 0.60 — 0.60 — 0.60 — 0.60 ns Optional Adders SE L D E IS C C T O D N E TI VI N C U E ED S tINDIO tPLL_SEC_DELAY tIOO Output Adjusters 36 Lattice Semiconductor ispGDX2 Family Data Sheet ispGDX2V/B/C, ispGDX2EV/EB/EC Timing Adjusters (Continued) -3 Description -35 -5 Min. Max. Min. Max. Min. Max. Min. Max. Units LVPECL_out Using LVPECL Differential Signaling — 0.30 — 0.30 — 0.30 — 0.30 ns LVDS_out Using Low Voltage Differential Signaling (LVDS) — 0.80 — 0.80 — 0.80 — 0.80 ns PCI_out Using PCI Standard — 0.60 — 0.60 — 0.60 — 0.60 ns PCI_X_out Using PCI-X Standard — 0.60 — 0.60 — 0.60 — 0.60 ns SSTL2_I_out Using SSTL 2.5V, Class I — 0.30 — 0.30 — 0.30 — 0.30 ns SSTL2_II_out Using SSTL 2.5V, Class II — 0.50 — 0.50 — 0.50 — 0.50 ns SSTL3_I_out Using SSTL 3.3V, Class I — 0.20 — 0.20 — 0.20 — 0.20 ns SSTL3_II_out Using SSTL 3.3V, Class II — 0.40 — 0.40 — 0.40 — 0.40 ns LVTTL_in Using 3.3V TTL — 0.00 — 0.00 — 0.00 — 0.00 ns LVCMOS_18_in Using 1.8V CMOS — 0.00 — 0.00 — 0.00 — 0.00 ns LVCMOS_25_in Using 2.5V CMOS — 0.00 — 0.00 — 0.00 — 0.00 ns LVCMOS_33_in Using 3.3V CMOS — 0.00 — 0.00 — 0.00 — 0.00 ns AGP_1X_in Using AGP 1x — 1.00 — 1.00 — 1.00 — 1.00 ns BLVDS_in Using Bus Low Voltage Differential Signaling (BLVDS) — 0.50 — 0.50 — 0.50 — 0.50 ns CTT25_in Using CTT 2.5V — 1.00 — 1.00 — 1.00 — 1.00 ns CTT33_in Using CTT 3.3V — 1.00 — 1.00 — 1.00 — 1.00 ns GTL+_in Using GTL+ — 0.50 — 0.50 — 0.50 — 0.50 ns HSTL_I_in Using HSTL 2.5V, Class I — 0.50 — 0.50 — 0.50 — 0.50 ns HSTL_III_in Using HSTL 2.5V, Class III — 0.60 — 0.60 — 0.60 — 0.60 ns HSTL_IV_in Using HSTL 2.5V, Class IV — 0.60 — 0.60 — 0.60 — 0.60 ns LVPECL_in Using Differential Signaling (LVPECL) — 0.00 — 0.00 — 0.00 — 0.00 ns LVDS_in Using Low Voltage Differential Signaling (LVDS) — 0.50 — 0.50 — 0.50 — 0.50 ns PCI_in Using PCI — 1.00 — 1.00 — 1.00 — 1.00 ns PCI_X_in Using PCI-X — 1.00 — 1.00 — 1.00 — 1.00 ns SSTL2_I_in Using SSTL 2.5V, Class I — 0.50 — 0.50 — 0.50 — 0.50 ns SSTL2_II_in Using SSTL 2.5V, Class II — 0.50 — 0.50 — 0.50 — 0.50 ns SSTL3_I_in Using SSTL 3.3V, Class I — 0.60 — 0.60 — 0.60 — 0.60 ns SSTL3_II_in Using SSTL 3.3V, Class II — 0.60 — 0.60 — 0.60 — 0.60 SE L D E IS C C T O D N E TI VI N C U E ED S Parameter -32 tIOI Input Adjusters ns Timing v.2.2 37 Lattice Semiconductor ispGDX2 Family Data Sheet ispGDX2V/B/C, ispGDX2EV/EB/EC FIFO Internal Timing Parameter Description -3 -32 -35 -5 Min. Max. Min. Max. Min. Max. Min. Max. Units Routing Delays tFIFODATAIN FIFO Input Delay — 0.00 — 0.00 — 0.00 — 0.00 ns — 0.00 — 0.00 — 0.00 — 0.00 ns SE L D E IS C C T O D N E TI VI N C U E ED S tFIFODATAOUT FIFO Output to I/O Core Delay tFIFORCLK Read Clock Input Delay — 0.00 — 0.00 — 0.00 — 0.00 ns tFIFOREN Read Clock Enable Input Delay — 0.00 — 0.00 — 0.00 — 0.00 ns tFIFOWCLK Write Clock Input Delay — 0.00 — 0.00 — 0.00 — 0.00 ns tFIFOWEN Write Clock Enable Input Delay — 0.00 — 0.00 — 0.00 — 0.00 ns — 2.00 — 2.00 — 2.00 — 3.33 ns Core Delays tFIFOCLKSKEW Global Read Clock to Write Clock Skew tFIFOEMPTY Read Clock to Empty Flag Delay — 1.30 — 1.80 — 1.80 — 3.00 ns tFIFOFULL Write Clock to Full Flag Delay — 1.30 — 1.80 — 1.80 — 3.00 ns tFIFORCEH Read Clock Hold after Read Clock Enable Time — 0.00 — 0.00 — 0.00 — 0.00 ns tFIFORCES Read Clock Setup before Read Clock Enable Time — 1.50 — 1.50 — 1.50 — 2.50 ns tFIFORCLKO Read Clock to FIFO Out Delay — 0.50 — 0.50 — 0.50 — 0.83 ns tFIFORSTO Reset to Output Delay — 0.70 — 0.70 — 0.70 — 1.17 ns tFIFORSTPW Reset Pulse Width — 2.00 — 2.00 — 2.00 — 3.33 ns tFIFORSTR Reset Recovery Time — 1.20 — 1.50 — 2.00 — 3.33 ns tFIFOSTRD Write Clock to Start Read Flag Delay — 0.00 — 0.00 — 0.00 — 0.00 ns tFIFOTHRU Flow Through Delay — 0.00 — 0.00 — 0.00 — 0.00 ns tFIFOWCEH Write Clock hold after Write Clock Enable Time — 2.00 — 2.00 — 2.00 — 3.33 ns tFIFOWCES Write Clock Setup before Write Clock Enable Time — 0.00 — 0.00 — 0.00 — 0.00 ns tFIFOWCLKH Write Data Hold after Write Clock Time — 0.50 — 0.50 — 0.70 — 1.17 ns tFIFOWCLKS Write Data Setup before Write Clock Time — 1.00 — 1.00 — 1.00 — 1.67 ns Timing v.2.2 38 Lattice Semiconductor ispGDX2 Family Data Sheet sysHSI Block Timing Figure 22 provides a graphical representation of the SERDES receiver input requirements. It provides guidance on a number of input parameters, including signal amplitude and rise time limits, noise and jitter limits, and P and N input skew tolerance. SE L D E IS C C T O D N E TI VI N C U E ED S Figure 22. Receive Data Eye Diagram Template (Differential) Bit Time V THD 200 mV Differential +/- 100 mV Single Ended jt TH eo SIN jtTH jtTH : Optimum Threshold Crossing Jitter The data pattern eye opening at the receive end of a link is considered the ultimate measure of received signal quality. Almost all detrimental characteristics of a transmit signal and the interconnection link design result in eye closure. This combined with the eye-opening limitations of the line receiver can provide a good indication of a link’s ability to transfer error-free data. Signal jitter is of special interest to system designers. It is often the primary limiting characteristic of long digital links and of systems with high noise level environments. An interesting characteristic of the clock and data recovery (CDR) portion of the ispGDX2 SERDES receiver is its ability to filter incoming signal jitter that is below the clock recovery PLL bandwidth. For signals with high levels of low frequency jitter, the receiver can detect incoming data error free, with eye openings significantly less than that shown in Figure 22. sysHSI Block AC Specifications Operating Frequency Ranges Symbol fCLK Description Mode Reference Clock Frequency Test Condition Min. Max. Units SS:CAL 50 200 MHz 10B12B 33 67 MHz 8B10B fSIN2 fSOUT2 Serial Input Serial Out 40 80 MHz SS:CAL with eoSIN 400 8001 Mbps 10B12B with eoSIN 400 8001 Mbps 8B10B with eoSIN 400 8001 Mbps LVDS CL = 5 pF, RL = 100 Ohms, fCLK with no jitter 400 8001 Mbps 1. fSIN (8B/10B and 10B/12B) 800Mbps limit applicable only to the fastest speed grade. Limit is 700Mbps for the lower speed grade. 2. fSIN and fSOUT speeds are supported at VCC and VCCP at 1.7V to 1.9V for ispGDX2C devices. 39 Lattice Semiconductor ispGDX2 Family Data Sheet LOCKIN Time Symbol tSCLOCK Mode CDRPLL Lock-in Time Condition Max. Units 25 μS With SS mode sync pattern 1024 tRCP1 10B12B With 10B12B sync pattern 1024 tRCP 8B10B With 8B10B idle pattern All After input is stabilized SS Min. 960 tRCP SE L D E IS C C T O D N E TI VI N C U E ED S tCDRLOCK Description CSPLL Lock Time tSYNC SyncPat Length SS 1200 tRCP tCAL CAL Duration SS 1100 tRCP tSUSYNC SyncPat Set-up Time to CAL SS 50 tRCP tHDSYNC SyncPat Hold Time from CAL SS 50 tRCP 1. REFCLK clock period. REFCLK and SS_CLKIN Timing Symbol Description Mode tDREFCLK Frequency Deviation Between TX REFCLK and CDRX REFCLK on One Link 8B10B/ 10B12B tJPPREFCLK REFCLK, SS_CLKIN Peak-to-Peak Period Jitter All tPWREFCLK REFCLK, SS_CLKIN Pulse Width, (80% to 80% or 20% to 20%). All tRFREFCLK REFCLK, SS_CLKIN Rise/Fall Time (20% to 80% or 80% to 20%) All Condition Min. Max. Units -100 100 ppm 0.01 UIPP Random Jitter 1 2 ns ns Serializer Timing2 Symbol tJPPSOUT tJPP8B10B tRFSOUT Description SOUT Peak-to-Peak Output Data Jitter Mode All Condition Min. Max. Units fCLK with no jitter 0.25 UIPP SOUT Peak-to-Peak Random Jitter 8B10B 800 Mbps w/K28.7- 130 ps SOUT Peak-to-Peak Deterministic Jitter 8B10B 800 Mbps w/K28.5+ SOUT Output Data Rise/Fall Time (20%, 80%) LVDS BLVDS 160 ps 700 ps 900 ps SS/8B10B 2Bt1 + 2 2Bt1 +10 ns 10B12B 1Bt1 + 2 1Bt1 +10 ns 250 ps tCOSOUT REFCLK to SOUT Delay tSKTX Skew of SOUT with Respect to SS_CLKOUT SS tCKOSOUT SS_CLKOUT to bit0 of SOUT SS 2Bt1 - tSKTX 2Bt1 + tSKTX tHSITXDDATAS TXD Data Setup Time All Note 3 tHSITXDDATAH TXD Data Hold Time All Note 3 1.5 ns ns 1.0 ns 1. Bt: Bit Time Period. High Speed Serial Bit Time. 2. The SIN and SOUT jitter specifications listed above are under the condition that the clock tree that drives the REFCLK to sysHSI Block is in sysCLOCK PLL BYPASS mode. 3. Internal timing for reference only. 40 Lattice Semiconductor ispGDX2 Family Data Sheet Deserializer Timing Symbol Description Mode fDSIN SIN Frequency Deviation from REFCLK eoSIN SIN Eye Opening Tolerance Conditions 8B10B/ 10B12B All Notes 1, 2 Min. Max. Units -100 100 ppm 0.45 UIPP -12 Bit Error Rate All tHSIOUTVALIDPRE RXD, SYDT Valid Time Before RECCLK Falling Edge All Note 3 tRCP/2 - 0.7 ns tHSIOUTVALIDPOST RXD, SYDT Valid Time After RECCLK Falling Edge All Note 3 tRCP/2 - 0.7 ns tDSIN Bit 0 of SIN Delay to RXD Valid at RECCLK Falling edge All SE L D E IS C C T O D N E TI VI N C U E ED S 10 Bits ber 1.5 tRCP + 4.5Bt + 2 1. Eye opening based on jitter frequency of 100KHz. 2. Lower frequency operation assumes maximum eye closure of 800ps. 3. Internal timing for reference only. Lock-in Timing CDRX_SS LOCK-IN (DE-SKEW) TIMING SIN CAL MIN. 1200 SYNCPAT DATA (SERIAL) MIN. 1100 LS CYCLE tHDSYNC tSUSYNC SYDT RXD(0:7) SYNCPAT TRAINING SEQUENCE DATA (PARALLEL) SS MODE DATA TRANSFER CDR_10B12B LOCK-IN TIMING SIN 1024 SYNCPAT DATA (SERIAL) SYDT RXD(0:9) SYNCPAT 41 DATA (PARALLEL) 1.5 tRCP + 4.5Bt + 10 ns Lattice Semiconductor ispGDX2 Family Data Sheet Lock-in Timing (Continued) CDR_8B10B LOCK-IN TIMING SIN 240 Idle Pattern(960 TRCP) DATA (SERIAL) SYDT Idle Pattern DATA (PARALLEL) SE L D E IS C C T O D N E TI VI N C U E ED S RXD(0:9) SYDT Timing SYDT TIMING FOR CDRX_10B12B RECCLK SYDT RXD(0:9) Data0 Data1 Data2 Data3 Data4 SYNC PATTERN Parallel Data SYDT TIMING FOR CDRX_8B10B RECCLK SYDT RXD(0:9) K28.5 D21.4 D21.5 D21.5 K28.5 D21.4 D21.5 D21.5 IDLE PATTERN IDLE PATTERN 42 D0 D1 D2 Data Lattice Semiconductor ispGDX2 Family Data Sheet Serializer Timing 8B/10B SERIALIZER DELAY TIMING SYMBOL N TXD SYMBOL N+1 SE L D E IS C C T O D N E TI VI N C U E ED S tCOSOUT REFCLK SOUT b4 b5 b6 b7 b8 b9 b0 b1 b2 b3 b4 b5 b6 b7 b8 b9 b0 b1 b2 SYMBOL N SYMBOL N-1 SYMBOL N+1 10B/12B SERIALIZER DELAY TIMING SYMBOL N TXD SYMBOL N+1 t COSOUT REFCLK SOUT b4 b5 b6 b7 b8 b9 "0" "1" b0 b1 b2 b3 b4 b5 b6 b7 b8 b9 "0" "1" SYMBOL N SYMBOL N-1 SS Mode SERIALIZER DELAY TIMING SYMBOL N TXD SYMBOL N+1 t COSOUT REFCLK SS_CLKOUT t CKOSOUT SOUT b4 b5 b6 b7 t SKTX b0 b2 b1 b3 SYMBOL N SYMBOL N-1 INTERNAL TIMING FOR sysHSI BLOCK t PWREFCLK REFCLK tHSITXDDATAS tHSITXDDATAH TXD 43 b4 b5 b6 b7 b0 SYMBOL N+1 Lattice Semiconductor ispGDX2 Family Data Sheet Deserializer Timing 8B/10B DESERIALIZER DELAY TIMING SYMBOL N+1 SYMBOL N SIN SYMBOL N+2 b0 b1 b2 b3 b4 b5 b6 b7 b8 b9 b0 b1 b2 b3 b4 b5 b6 b7 b8 b9 b0 b1 b2 b3 b4 b5 TDSIN SE L D E IS C C T O D N E TI VI N C U E ED S RECCLK SYMBOL N SYMBOL N-1 RXD 10B/12B DESERIALIZER DELAY TIMING SYMBOL N SIN SYMBOL N+2 SYMBOL N+1 "1" b0 b1 b2 b3 b4 b5 b6 b7 b8 b9 "0" "1" b0 b1 b2 b3 b4 b5 b6 b7 b8 b9 "0" "1" b0 b1 b2 b3 b4 TTDSIN RECCLK RXD SYMBOL N-1 SYMBOL N-2 SYMBOL N CDRX_SS DESERIALIZER DELAY TIMING SYMBOL N SIN b0 b1 b2 b3 b4 SYMBOL N+2 SYMBOL N+1 b5 b6 b7 b0 b1 b2 b3 b4 b5 b6 b7 TDSIN RECCLK RXD SYMBOL N-2 SYMBOL N-1 INTERNAL TIMING FOR sysHSI BLOCK RECCLK t HSIOUTVALIDPRE t HSIOUTVALIDPOST SYDT, RXD 44 SYMBOL N b0 b1 b2 b3 b4 Lattice Semiconductor ispGDX2 Family Data Sheet sysCLOCK PLL Timing Over Recommended Operating Conditions Symbol Max Units Input clock, high time Parameter 80% to 80% Conditions 0.5 — ns tPWL Input clock, low time 20% to 20% 0.5 — ns tR, tF Input Clock, rise and fall time 20% to 80% — 3.0 ns SE L D E IS C C T O D N E TI VI N C U E ED S Min tPWH tINSTB Input clock stability, cycle to cycle (peak) — +/- 300 ps fMDIVIN M Divider input, frequency range 10 320 MHz fMDIVOUT M Divider output, frequency range 10 320 MHz fNDIVIN N Divider input, frequency range 10 320 MHz fNDIVOUT N Divider output, frequency range 10 320 MHz fVDIVIN V Divider input, frequency range 100 400 MHz fVDIVOUT V Divider output, frequency range 10 320 MHz tOUTDUTY Output clock, duty cycle 40 60 % Clean reference : 10 MHz ≤ fMDIVOUT ≤ 40 MHz or 100 MHz ≤ fVDIVIN ≤ 160 MHz — +/- 600 ps Clean reference1: 40 MHz ≤ fMDIVOUT ≤ 320 MHz and 160 MHz ≤ fVDIVIN ≤ 400 MHz — +/- 150 ps Clean reference1: 10 MHz ≤ fMDIVOUT ≤ 40 MHz or 100 MHz ≤ fVDIVIN ≤ 160 MHz — +/- 600 ps Clean reference1: 40 MHz ≤ fMDIVOUT ≤ 320 MHz and 160 MHz ≤ fVDIVIN ≤ 400 MHz — +/- 150 ps 1 Output clock, cycle to cycle jitter (peak) tJIT(CC) TJIT(PERIOD) 2 Output clock, period jitter (peak) tCLK_OUT_DLY Input clock to CLK_OUT delay Internal feedback — 3.4 ns tPHASE Input clock to external feedback delta External feedback — 500 ps tLOCK Time to acquire phase lock after input stable — 25 us tPLL_DELAY Delay increment (Lead/Lag) tRANGE Total output delay range (lead/lag) tPLL_RSTW Minimum reset pulse width Typical = +/- 250ps +/- 120 +/- 550 +/- 0.84 +/- 3.85 1.8 — ps ns ns 1. This condition assures that the output phase jitter will remain within specification. Jitter specification is based on optimized M, N and V settings determined by the ispLEVER software. 2. Accumulated jitter measured over 10,000 waveform samples 45 Lattice Semiconductor ispGDX2 Family Data Sheet Boundary Scan Timing Specifications Over Recommended Operating Conditions Parameter Description Min Max Units TCK [BSCAN] clock pulse width 40 — ns TCK [BSCAN] clock pulse width high 20 — ns SE L D E IS C C T O D N E TI VI N C U E ED S tBTCP tBTCPH tBTCPL TCK [BSCAN] clock pulse width low 20 — ns tBTS TCK [BSCAN] setup time 8 — ns tBTH TCK [BSCAN] hold time 10 — ns tBTRF TCK [BSCAN] rise/fall time 50 — mV/ns tBTCO TAP controller falling edge of clock to valid output — 10 ns tBTCODIS TAP controller falling edge of clock to valid disable — 10 ns tBTCOEN TAP controller falling edge of clock to valid enable — 10 ns tBTCRS BSCAN test capture register setup time 8 — ns tBTCRH BSCAN test capture register hold time 10 — ns tBUTCO BSCAN test update register, falling edge of clock to valid output — 25 ns tBTUODIS BSCAN test update register, falling edge of clock to valid disable — 25 ns tBTUPOEN BSCAN test update register, falling edge of clock to valid enable — 25 ns 46 Lattice Semiconductor ispGDX2 Family Data Sheet Power Consumption ICORE IHSI mA 100 IHSI_D IPLL_D 80 60 SE L D E IS C C T O D N E TI VI N C U E ED S mA 150 IPLL 90 80 70 60 50 40 30 20 10 0 mA 200 100 50 0 0 50 100 150 200 250 300 350 40 20 IHSI_A IPLL_A 0 0 200 400 600 800 1000 1200 0 200 Mbps MHz 400 MHz Power Estimation Coefficients – Core and PLL Device ispGDX2-256 IDC: KREF: KIN: KCORE: KPLLD: KPLLA: VCC IDC (mA) KREF KIN KCORE KPLLD KPLLA 3.3 10.0 3.25 0.0139 0.292 0.157 0.024 2.5 10.0 3.13 0.0139 0.292 0.157 0.024 1.8 4.0 3.00 0.0213 0.239 0.179 0.024 KTXD KTXSTBY KTXA Blank chip background current Reference voltage circuit current per bank I/O current per input per MHz Core current per MHz with GRP fanout of 1 PLL logic current per MHz per PLL PLL analog portion current per MHz per PLL Power Estimation Coefficients – sysHSI KRXD KRXSTBY KRXA Device VCC 3.3 0.027 1.3 0.0023 0.011 2.4 0.0018 ispGDX2-256 2.5 0.027 1.3 0.0023 0.011 2.4 0.0018 1.8 0.019 3.7 0.0040 0.011 1.2 0.0023 KRXD: KRXSTBY: KRXA: KTXD: KTXSTBY: KTXA: Receiver Logic current per Mbps Receiver Logic standby current Receiver Analog portion current per Mbps Transmitter Logic current per Mbps Transmitter Logic standby current Transmitter Analog portion current per Mbps 47 600 Lattice Semiconductor ispGDX2 Family Data Sheet Power Consumption (Continued) Power consumption in the ispGDX2 family is the sum of three components: ICC-TOTAL = ICORE + IPLL + IHSI (ICC-TOTAL combines current supplied via VCC pins and VCCP pins) SE L D E IS C C T O D N E TI VI N C U E ED S ICORE = IDC + IREF + IIN = Blank chip background current + KREF * Number of Banks with VREF active + (KIN * Number of inputs + KCORE) * Average Input Switching Frequency (MHz) IPLL = IPLL_D + IPLL_A = [KPLLD * FVCO * Number of PLLs used] + [KPLLA * FVCO * Number of PLLs used] = [(KPLLD + KPLLA) * FVCO] * Number of PLLs used = IRX + ITX IHSI = [(KRXD + KRXA) * FRX + IRXSTBY] * Number of Receiver Channels + [(KTXD + KTXA) * FTX + ITXSTBY] * Number of Transmitter Channels Where: FVCO: sysClock PLL VCO Frequency in MHz FRX: sysHSI Receiver Serial Data Rate FTX: sysHSI Transmitter Serial Data Rate IHSI can also be determined by calculating IHSI_D, the current supplied by the VCC pin, and IHSI_A, the current supplied by the VCCP0 and VCCP1. IHSI = IHSI_D + IHSI_A = [(KRXD * FRX + IRXSTBY)* Number of Receiver Channels + (KTXD * FTX + ITXSTBY) * Number of Transmitter Channels] +[(KRXA * FRX) * Number of Receiver Channels + (KTXA * FTX) * Number of Transmitter Channels] The ICCP is supplied through VCCP0 and VCCP1 pins for PLL and sysHSI analog portion. The equation for ICCP can be derived from the equations below. ICCP = IPLL_A + IHSI_A = [(KPLLA * FVCO) * Number of PLLs used] + [(KRXA * FRX) * Number of Receiver Channels + (KTXA * FTX) * Number of Transmitter Channels] Where: IPLL_A: PLL Analog Portion Current IHSI_A: HSI Analog Portion Current Note: For further information about the use of these coefficients, refer to Technical Note TN1034, Power Estimation in the ispGDX2 Family. ICC-TOTAL estimates are based on typical conditions. These values are for estimates only. Since the value of ICCTOTAL is sensitive to operating conditions and the program in the device, the actual current should be verified. 48 Lattice Semiconductor ispGDX2 Family Data Sheet Switching Test Conditions Figure 23 shows the output test load used for AC testing. Specific values for resistance, capacitance, voltage and other test conditions are shown in Table 7. Figure 23. Output Test Load, LVTTL and LVCMOS Standards (1.8V) SE L D E IS C C T O D N E TI VI N C U E ED S VCCO R1 Device Output Test Point R2 CL* *CL includes Test Fixture and Probe Capacitance. Table 7. Test Fixture Required Components Test Condition Default LVCMOS 1.8 I/O (L -> H, H -> L) LVCMOS I/O (L -> H, H -> L) R1 R2 CL 106 106 35pF — — 35pF Timing Ref. VCCO VCCO/2 1.8V LVCMOS3.3 = 1.5V LVCMOS3.3 = 3.0V LVCMOS2.5 = VCCO/2 LVCMOS2.5 = 2.3V LVCMOS1.8 = VCCO/2 LVCMOS1.8 = 1.65V Default LVCMOS 1.8 I/O (Z -> H) — 106 35pF VCCO/2 1.65V Default LVCMOS 1.8 I/O (Z -> L) 106 — 35pF VCCO/2 1.65V Default LVCMOS 1.8 I/O (H -> Z) — 106 5pF VOH - 0.15 1.65V Default LVCMOS 1.8 I/O (L -> Z) 106 — 5pF VOL + 0.15 1.65V Note: Output test conditions for all other interfaces are determined by the respective standards. 49 Lattice Semiconductor ispGDX2 Family Data Sheet Signal Descriptions1 Signal Names Description General Purpose Input/Output – General purpose I/O number y in I/O Bank X. GCLK/CE0, GCLK/CE1, GCLK/CE2, GCLK/CE3 Input – Global clock/clock enable inputs. SEL0, SEL1, SEL22, SEL32 Input – Global MUX select inputs. SE L D E IS C C T O D N E TI VI N C U E ED S BKx_IOy 2 2 GOE0, GOE1, GOE2 , GOE3 Input – Global output enable inputs. RESETb Input – Global RESET signal (active low). NC No connect. GND GND – Ground. VCC VCC – The power supply pins for core logic. VCCJ VCC – The power supply for the JTAG logic. VCCOx VCC – The power supply pins for I/O Bank X. VREFx Input – Defines the reference voltage for I/O Bank X. Testing and Programming TMS Input – Test Mode Select input, used to control the 1149.1 state machine. TCK Input – Test Clock Input pin, used to clock the 1149.1 state machine. TDI Input – Test Data In pin, used to load data into device using 1149.1 state machine. TDO Output – Test Data Out pin used to shift data out of device using 1149.1. TOE Input – Test Output Enable pin. TOE tristates all I/O pins when driven low. PLL Functions PLL_FBKz Input – Optional feedback input allows external feedback for PLL z. PLL_RSTz Input – Optional input resets the M divider in PLL z. CLK_OUTz Output – Optional clock output from PLL z (clock signal occupies the input path of this I/O pad). PLL_LOCKz Output – Optional lock output from PLL z (lock signal occupies the input path of this I/O pad). GNDP0, GNDP1 GND – Ground for PLLs. VCCP0, VCCP1 VCC – The power supply pins for PLLs. FIFO Functions FIFOy_DINw Input – DATA IN Bit w of FIFO y. FIFOy_DOUTw Internal Signal – DATA OUT Bit w of FIFO y FIFOy_FIFORSTb Input – Reset input for FIFO y (active low). FIFOy_FULL Output – FULL flag for FIFO y. FIFOy_EMPTY Output – EMPTY flag for FIFO y. FIFOy_STRDb Output – Start read (STRDb) flag for FIFO y. SERDES Functions HSImA_SINP, HSImB_SINP Input – Positive sense serial input for sysHSI BLOCK m channel A, B. HSImA_SINN, HSImB_SINN Input – Negative (minus) sense serial input for sysHSI BLOCK m channel A, B. HSImA_SOUTP, HSImB_SOUTP Output – Positive sense serial output for sysHSI BLOCK m channel A, B. HSImA_SOUTN, HSImB_SOUTN Output – Negative (minus) sense serial output for sysHSI BLOCK m channel A, B. HSImA_SYDT, HSImB_ SYDT Output – Symbol alignment detect for sysHSI BLOCK m channel A, B. HSImA_RECCLK, HSImB_RECCLK Internal Signal – Recovered clock for sysHSI BLOCK m channel A, B. HSImA_CDRRSTb, HSImB_CDRRSTb Input – Resets the CDR circuit of sysHSI BLOCK m channel A, B. HSIm_CSLOCK Output – LOCK output of the PLL associated with channel m. 50 Lattice Semiconductor ispGDX2 Family Data Sheet Signal Descriptions1 (Continued) Signal Names Description HSImA_TXDw, HSImB_ TXDw Internal Signal – Parallel data in bit w for sysHSI BLOCK m channel A, B. HSImA_RXDw, HSImB_ RXDw Internal Signal – Parallel data out bit w for sysHSI BLOCK m channel A, B. Source Synchronous Functions Input – Positive sense clock input for Source Synchronous group A, B. SS_SCLKIN0N, SS_SCLKIN1N Input – Negative (minus) sense clock input for Source Synchronous group A, B. SS_CLKOUT0N, SS_CLKOUT1P Output – Positive sense clock output for Source Synchronous group A, B. SS_CLKOUT0N, SS_CLKOUT1N Output – Negative (minus) sense clock output for Source Synchronous group A, B. CAL Input – Initiates source synchronous calibration sequence. SE L D E IS C C T O D N E TI VI N C U E ED S SS_SCLKIN0P, SS_SCLKIN1P 1. m, w, x, y and z are variables. 2. Not on ispGDX2-64 ispGDX2-64 Power Supply and NC Connections1 ispGDX2-64 (100-Ball fpBGA)2 Signal VCC A1, K10 VCCO0 J7 VCCO1 F10 VCCO2 E10 VCCO3 B7 VCCO4 B4 VCCO5 E1 VCCO6 F1 VCCO7 K4 VCCJ K1 VCCP0 G6 GNDP0 G5 GND A10, B9, C8, E6, E5, F6, F5, H3, J2 1. All grounds must be electrically connected at the board level. 2. Pin orientation A1 starts from the upper left corner of the top side view with alphabetical order ascending vertically and numerical order ascending horizontally. 51 Lattice Semiconductor ispGDX2 Family Data Sheet ispGDX2 Power Supply and NC Connections1 ispGDX2-128 (208-Ball fpBGA)3 Signal ispGDX2-256 (484-Ball fpBGA)3 B15, C14, R15, B2, C3, P3, R2, AA3, AA20, B3, B20, C2, C11, C12, C21, H9, H10, H11, H12, H13, H14, J8, J15, K8, K15, L8, L15, L20, M3, M8, M15, M20, N8, N15, P8, P15, R9, R10, R11, R12, R13, R14, Y2, Y11, Y12, Y21 VCCO0 N11, T12 AA14, AB20, Y17 VCCO1 L13, M16 P21, U20, Y22 VCCO2 E16, F13 C22, E20, J21 VCCO3 A12, D11 A20, B14, C17 VCCO4 A5, D6 A3, B9, C6 VCCO5 E1, F4 C1, F3, J2 VCCO6 L4, M1 P2, U3, Y1 VCCO7 N6, T5 AA9, AB3, Y6 VCCJ P14 L3 VCCP0 J1 K1 VCCP1 J16 N22 GNDP0 H1 J1 GNDP1 H16 K22 GND A16, D13, H15, J15, N13, T16, A1, B9, B8, D4, H2, J2, A2, A11, A12, A21, A1, A22, AA1, AA2, AA11, AA12, N4, R8, R9, T1, G7, G8, G9, G10, H7, H8, H9, H10, J7, AA21, AA22, AB1, AB2, AB11, AB12, AB21, AB22, B1, J8, J9, J10, K7, K8, K9, K10 B2, B11, B12, B21, B22, C3, C20, D4, D19, E5, E18, F6, F17, G7, G16, H8, H15, J9, J10, J11, J12, J13, J14, K9, K10, K11, K12, K13, K14, L1, L2, L7, L9, L10, L11, L12, L13, L14,L16, L21, L22, M1, M2, M7, M9, M10, M11, M12,M13, M14, M16, M21, M22, N9, N10, N11, N12, N13, N14, P9, P10, P11, P12, P13, P14, R8, R15, T7, T16, U6, U17, V5, V18, W4, W19,Y3, Y20 NC2 A11, B16 SE L D E IS C C T O D N E TI VI N C U E ED S VCC D8, D11, E6, E7, E8, E9, E12, E13, E14, E15, E16, F7, F16, G5, G6, G18, G19, H19, K4, K19, L19, M4, M19, N4, P4, P19, R4, R18, T4, T5, T17, T18, U5, U7, U16, V7, V8, V9, V10, V11, V12, V15, V16, V17, W14, Y18 1. All grounds must be electrically connected at the board level. 2. NC pins should not be connected to any active signals, VCC or GND. 3. Pin orientation A1 starts from the upper left corner of the top side view with alphabetical order ascending vertically and numerical order ascending horizontally. 52 Lattice Semiconductor ispGDX2 Family Data Sheet ispGDX2-64 Logic Signal Connections Signal Name sysIO LVDS Bank Pair/Polarity GDX Block MRB SERDES Mode I/O Pin1 SERDES Mode I/O Cell2 FIFO Mode I/O Cell/Pin3 100 fpBGA GOE0 - - - - - - - H6 BK0_IO0/PLL_LOCK0 0 0N 0A 0 - - FIFO0_FULL J6 BK0_IO1 0 0P 0A 1 HSI0A_CDRRSTb - FIFO0_FIFORSTb K6 SE L D E IS C C T O D N E TI VI N C U E ED S GND 0 - - - - - - GND BK0_IO2 0 BK0_IO3 0 1N 0A 2 HSI0A_SINN HSI0A_RECCLK - G7 1P 0A 3 HSI0A_SINP - - H7 GND 0 - - - - - - GND BK0_IO4/PLL_RST0 0 2N 0A 4 - HSI0A_RXD0/TXD0 FIFO0_DIN0/DOUT0 K7 BK0_IO5 0 2P 0A 5 - HSI0A_RXD1/TXD1 FIFO0_DIN1/DOUT1 K8 BK0_IO6 0 3N 0A 6 - HSI0A_RXD2/TXD2 FIFO0_DIN2/DOUT2 J8 BK0_IO7 0 3P 0A 7 Note 4 HSI0A_RXD3/TXD3 FIFO0_DIN3/DOUT3 K9 GND 0 - - - - - - GND TCK - - - - - - - J10 RESETb - - - - - - - J9 H10 5 BK1_IO0/PLL_FBK0 1 4P 0A 8 HSI0A_SYDT HSI0A_RXD4/TXD4 FIFO0_DIN4/DOUT4 BK1_IO1 1 4N 0A 9 - HSI0A_RXD5/TXD5 FIFO0_DIN5/DOUT5 H9 BK1_IO2 1 5P 0A 10 - HSI0A_RXD6/TXD6 FIFO0_DIN6/DOUT6 H8 BK1_IO3/VREF(0,1) 1 5N 0A 11 FIFO0_STRDb6 HSI0A_RXD7/TXD7 FIFO0_DIN7/DOUT7 G10 GND GND 1 - - - - - - BK1_IO4 1 6P 0A 12 HSI0A_SOUTP HSI0A_RXD8/TXD8 FIFO0_DIN8/DOUT8 G9 BK1_IO5 1 6N 0A 13 HSI0A_SOUTN HSI0A_RXD9/TXD9 FIFO0_DIN9/DOUT9 G8 GND 1 - - - GND 5 BK1_IO6 1 7P 0A 14 SS_CLKIN1P HSI0A_SYDT - F9 BK1_IO7 1 7N 0A 15 SS_CLKIN1N - FIFO0_ EMPTY F8 GCLK/CE2 - CLK2P - - - - - F7 GCLK/CE3 - CLK2N - - - - - E7 BK2_IO0 2 8N 0B 0 SS_CLKOUT0N - FIFO1_FULL E8 BK2_IO1 2 8P 0B 1 SS_CLKOUT0P - FIFO1_EMPTY E9 GND 2 - - - - - - GND BK2_IO2 2 9N 0B 2 HSI0B_SOUTN HSI0BA_SYDT5 - D8 BK2_IO3 2 9P 0B 3 HSI0B_SOUTP HSI0B_RXD0/TXD0 FIFO1_DIN0 D9 GND 2 - - - - - - GND BK2_IO4/VREF (2,3) 2 10N 0B 4 - HSI0B_RXD1/TXD1 FIFO1_DIN1/DOUT1 D10 BK2_IO5 2 10P 0B 5 - HSI0B_RXD2/TXD2 FIFO1_DIN2/DOUT2 C9 BK2_IO6 2 11N 0B 6 HSI0_CSLOCK HSI0B_RXD3/TXD3 FIFO1_DIN3/DOUT3 C10 BK2_IO7 2 11P 0B 7 Note 4 HSI0B_RXD4/TXD4 FIFO1_DIN4/DOUT4 B10 BK3_IO0 3 12P 0B 8 - HSI0B_RXD5/TXD5 FIFO1_DIN5/DOUT5 A9 BK3_IO1 3 12N 0B 9 HSI0B_SYDT5 HSI0B_RXD6/TXD6 FIFO1_DIN6/DOUT6 B8 BK3_IO2 3 13P 0B 10 HSI0B_RXD7/TXD7 FIFO1_DIN7/DOUT7 A8 BK3_IO3 3 13N 0B 11 - HSI0B_RXD8/TXD8 FIFO1_DIN8/DOUT8 A7 GND 3 - - - - - - GND BK3_IO4 3 14P 0B 12 HSI0B_SINP HSI0B_RXD9/TXD9 FIFO1_DIN9/DOUT9 C7 BK3_IO5 3 14N 0B 13 HSI0B_SINN HSI0B_RECCLK - D7 GND 3 - - - - - - GND BK3_IO6 3 15P 0B 14 FIFO1_STRDb6 - - B6 BK3_IO7/CLK_OUT0 3 15N 0B 15 HSI0B_CDRRSTb - FIFO1_FIFORSTb C6 53 Lattice Semiconductor ispGDX2 Family Data Sheet ispGDX2-64 Logic Signal Connections (Continued) Signal Name sysIO LVDS Bank Pair/Polarity GDX Block MRB SERDES Mode I/O Pin1 SERDES Mode I/O Cell2 FIFO Mode I/O Cell/Pin3 100 fpBGA - - - - - - - D6 - - - - - - - D5 BK4_IO0/CLK_OUT2 4 16N 1A7 0 HSI1A_CDRRSTb - FIFO2_FIFORSTb C5 1A7 1 FIFO2_STRDb6 - SE L D E IS C C T O D N E TI VI N C U E ED S SEL0 SEL1 BK4_IO1 4 16P - B5 GND GND 4 - - - - - - BK4_IO2 4 17N 1A7 2 HSI1A_SINN HSI1A_RECCLK - D4 BK4_IO3 4 17P 1A7 3 HSI1A_SINP HSI1A_RXD9/TXD9 FIFO2_DIN9/DOUT9 C4 GND 4 - - - GND 7 BK4_IO4 4 18N 1A 4 - HSI1A_RXD8/TXD8 FIFO2_DIN8/DOUT8 A6 BK4_IO5 4 18P 1A7 5 CAL HSI1A_RXD7/TXD7 FIFO2_DIN7/DOUT7 A5 BK4_IO6 4 19N 1A7 6 HSI1A_SYDT5 HSI1A_RXD6/TXD6 FIFO2_DIN6/DOUT6 A4 BK4_IO7 4 19P 1A7 7 - HSI1A_RXD5/TXD5 FIFO2_DIN5/DOUT5 A3 TMS - - - - - - B3 TDI - - - - - - - A2 GND - - - - - - - GND TDO - - - - - - - B1 TOE - - - - - - - B2 BK5_IO0 5 20P 1A7 8 Note 4 HSI1A_RXD4/TXD4 FIFO2_DIN4/DOUT4 C1 BK5_IO1 5 20N 1A7 9 HSI1_CSLOCK HSI1A_RXD3/TXD3 FIFO2_DIN3/DOUT3 C2 BK5_IO2 5 21P 1A7 10 - HSI1A_RXD2/TXD2 FIFO2_DIN2/DOUT2 C3 7 BK5_IO3/Vref(4,5) 5 21N 1A 11 - HSI1A_RXD1/TXD1 FIFO2_DIN1/DOUT1 D1 GND 5 - - - - - - GND BK5_IO4 5 22P 1A7 12 HSI1A_SOUTP HSI1A_RXD0/TXD0 FIFO2_DIN0/DOUT0 D3 BK5_IO5 5 22N 1A7 13 HSI1A_SOUTN HSI1A_SYDT5 - D2 GND GND 5 - - - - - BK5_IO6 5 23P 1A7 14 SS_CLKIN1P - FIFO2_EMPTY E2 BK5_IO7 5 23N 1A7 15 SS_CLKIN1N - FIFO2_FULL E3 GCLK/CE0 - CLK0P - - - - - E4 GCLK/CE1 - CLK0N - - - - - F4 BK6_IO0 6 24N 1B 0 SS_CLKOUT1N - FIFO3_EMPTY F3 BK6_IO1 6 24P 1B 1 SS_CLKOUT1P HSI1B_SYDT5 - F2 GND 6 - - - - - - GND BK6_IO2 6 25N 1B 2 HSI1B_SOUTN HSI1B_RXD9/TXD9 FIFO3_DIN9/DOUT9 G3 BK6_IO3 6 25P 1B 3 HSI1B_SOUTP HSI1B_RXD8/TXD8 FIFO3_DIN8/DOUT8 G2 GND 6 - - - - - - GND BK6_IO4/Vref(Bank6,7) 6 26N 1B 4 FIFO3_STRDb6 HSI1B_RXD7/TXD7 FIFO3_DIN7/DOUT7 G1 BK6_IO5 6 26P 1B 5 - HSI1B_RXD6/TXD6 FIFO3_DIN6/DOUT6 H1 BK6_IO6 6 27N 1B 6 - HSI1B_RXD5/TXD5 FIFO3_DIN5/DOUT5 H2 BK6_IO7/PLL_FBK2 6 27P 1B 7 HSI1B_SYDT5 HSI1B_RXD4/TXD4 FIFO3_DIN4/DOUT4 J1 BK7_IO0 7 28P 1B 8 Note 4 HSI1B_RXD3/TXD3 FIFO3_DIN3/DOUT3 J3 BK7_IO1 7 28N 1B 9 - HSI1B_RXD2/TXD2 FIFO3_DIN2/DOUT2 K2 BK7_IO2 7 29P 1B 10 - HSI1B_RXD1/TXD1 FIFO3_DIN1/DOUT1 J4 BK7_IO3/PLL_RST2 7 29N 1B 11 - HSI1B_RXD0/TXD0 FIFO3_DIN0/DOUT0 K3 GND 7 - - - - - - GND BK7_IO4 7 30P 1B 12 HSI1B_SINP - - G4 BK7_IO5 7 30N 1B 13 HSI1B_SINN HSI1B_RECCLK - H4 54 Lattice Semiconductor ispGDX2 Family Data Sheet ispGDX2-64 Logic Signal Connections (Continued) Signal Name sysIO LVDS Bank Pair/Polarity GDX Block MRB SERDES Mode I/O Pin1 SERDES Mode I/O Cell2 FIFO Mode I/O Cell/Pin3 100 fpBGA 7 - - - - - - GND 7 31P 1B 14 HSI1B_CDRRSTb - FIFO3_FIFORSTb K5 BK7_IO7/PLL_LOCK2 7 31N 1B 15 - - FIFO3_FULL SE L D E IS C C T O D N E TI VI N C U E ED S GND BK7_IO6 GOE1 7 - - - - - - J5 H5 1. The signals in this column route to/from the assigned pins of the associated I/O cell. 2. The signals in this column use the I/O cell. If a receiver signal is present in the I/O cell, the associated pin is available for output only. When transmit data (TXD) is present in the cell, the associated pin is available for input only. 3. The DOUT outputs are routed to GRP through the input register of the cell and the DIN inputs are routed direct from the associated pins in FIFO only mode. In SERDES with FIFO mode, the FULL and EMPTY flags are routed to the associated pins through the output MUX and the pins. 4. If the Source Synchronous Receiver is used in the HSI Block, this pin is unavailable for another use and must be left unconnected. 5. The SYDT signal has two routing options. If direct output through the dedicated pin is used, the I/O cell (the whole HSI Block) is not available for transmitter. The SYDT in the I/O Cell column is routed to the GRP through the input register of the cell and frees the I/O cell for transmitter. 6. FIFO_STRDb flag output is used in SERDES with FIFO Mode only. 7. sysHSI Source Synchronous Receive Mode is not available for channel 1A. 55 Lattice Semiconductor ispGDX2 Family Data Sheet ispGDX2-128 Logic Signal Connections Signal Name sysIO LVDS Bank Pair/Polarity GDX Block MRB SERDES Mode I/O Pin1 SERDES Mode I/O Cell2 FIFO Mode I/O Cell/Pin3 208 fpBGA - - - - - - P8 0 0N 0A 0 - - FIFO0A_FULL P9 BK0_IO1 0 0P 0A 1 - - - T10 SE L D E IS C C T O D N E TI VI N C U E ED S TOE BK0_IO0 BK0_IO2 / PLL_LOCK2 / PLL_RST2 0 1N BK0_IO3 0 GND 0 1P BK0_IO4 0 BK0_IO5 0 BK0_IO6 0 3N BK0_IO7 0 3P BK0_IO8 0 4N BK0_IO9 / PLL_FB2 0 4P BK0_IO10 0 5N BK0_IO11 0 5P 0A 2 - - - 5 R10 0A 3 - HSI0A_SYDT FIFO0A_ EMPTY T11 - - - - - GND 2N 0A 4 HSI0A_SINN HSI0A_RXD0/TXD0 FIFO0A_DIN0/DOUT0 P10 2P 0A 5 HSI0A_SINP HSI0A_RXD1/TXD1 FIFO0A_DIN1/DOUT1 N10 6 - HSI0A_RXD2/TXD2 FIFO0A_DIN2/DOUT2 R11 0A 7 - HSI0A_RXD3/TXD3 FIFO0A_DIN3/DOUT3 T13 0A 8 Note 4 HSI0A_RXD4/TXD4 FIFO0A_DIN4/DOUT4 P11 0A 9 - HSI0A_RXD5/TXD5 FIFO0A_DIN5/DOUT5 R12 0A 10 HSI0A_SOUTN HSI0A_RXD6/TXD6 FIFO0A_DIN6/DOUT6 P12 0A 11 HSI0A_SOUTP HSI0A_RXD7/TXD7 FIFO0A_DIN7/DOUT7 N12 GND GND 0 - - - - - BK0_IO12 0 6N 0A 12 - HSI0A_RXD8/TXD8 FIFO0A_DIN8/DOUT8 T14 BK0_IO13 0 6P 0A 13 HSI0A_SYDT5 HSI0A_RXD9/TXD9 FIFO0A_DIN9/DOUT9 R13 BK0_IO14 0 7N 0A 14 HSI0A_CDRRSTb HSI0A_RECCLK FIFO0A_FIFORSTb T15 P13 7P 6 BK0_IO15 / VREF0 0 0A 15 FIFO0A_STRDb - - GOE3 - - - - - - T9 TDO - - - - - - R16 GND 1 - - - - - GND FIFO0B_FULL N14 5 BK1_IO0 / VREF1 1 8P 0B 0 - HSI0B_SYDT BK1_IO1 1 8N 0B 1 - HSI0B_RXD0/TXD0 FIFO0B_DIN0/DOUT0 P15 BK1_IO2 1 9P 0B 2 Note 4 HSI0B_RXD1/TXD1 FIFO0B_DIN1/DOUT1 N15 BK1_IO3 1 9N 0B 3 - HSI0B_RXD2/TXD2 FIFO0B_DIN2/DOUT2 L14 BK1_IO4 1 10P 0B 4 HSI0B_SOUTP HSI0B_RXD3/TXD3 FIFO0B_DIN3/DOUT3 M14 BK1_IO5 1 10N 0B 5 HSI0B_SOUTN HSI0B_RXD4/TXD4 FIFO0B_DIN4/DOUT4 M13 BK1_IO6 1 11P 0B 6 HSI0_CSLOCK HSI0B_RXD5/TXD5 FIFO0B_DIN5/DOUT5 M15 BK1_IO7 1 11N 0B 7 HSI0B_SYDT5 HSI0B_RXD6/TXD6 FIFO0B_DIN6/DOUT6 L15 BK1_IO8 1 12P 0B 8 - HSI0B_RXD7/TXD7 FIFO0B_DIN7/DOUT7 P16 BK1_IO9 1 12N 0B 9 - HSI0B_RXD8/TXD8 FIFO0B_DIN8/DOUT8 N16 BK1_IO10 1 13P 0B 10 HSI0B_SINP HSI0B_RXD9/TXD9 FIFO0B_DIN9/DOUT9 K14 BK1_IO11 1 13N 0B 11 HSI0B_SINN HSI0B_RECCLK - K13 GND 1 - - - - - GND BK1_IO12 1 14P 0B 12 FIFO0B_STRDb6 - - K15 BK1_IO13 1 14N 0B 13 HSI0B_CDRRSTb - FIFO0B_FIFORSTb L16 BK1_IO14 1 15P 0B 14 SS_CLKIN1P - - J14 BK1_IO15 / CLK_OUT2 1 15N 0B 15 SS_CLKIN1N - FIFO0B_ EMPTY J13 GCLK/CE2 - - - - - - N8 SEL2 - - - - - - K16 SEL3 - - - - - - G16 GCLK/CE3 - - - - - - N9 BK2_IO0 2 16N 1A7 0 SS_CLKOUT1N - FIFO1A_FULL H13 BK2_IO1 2 16P 1A7 1 SS_CLKOUT1P - - H14 BK2_IO2 2 17N 1A7 2 - HSI1A_SYDT5 - G15 56 Lattice Semiconductor ispGDX2 Family Data Sheet ispGDX2-128 Logic Signal Connections (Continued) Signal Name sysIO LVDS Bank Pair/Polarity 2 GND 2 BK2_IO4 2 SERDES Mode I/O Pin1 SERDES Mode I/O Cell2 FIFO Mode I/O Cell/Pin3 208 fpBGA 1A7 3 - HSI1A_RXD0/TXD0 FIFO1A_DIN0/DOUT0 F16 - - - - - GND 1A7 4 HSI1A_SINN HSI1A_RXD1/TXD1 FIFO1A_DIN1/DOUT1 G13 18P 1A7 5 HSI1A_SINP HSI1A_RXD2/TXD2 FIFO1A_DIN2/DOUT2 G14 7 F14 17P 18N SE L D E IS C C T O D N E TI VI N C U E ED S BK2_IO3 GDX Block MRB BK2_IO5 2 BK2_IO6 2 19N 1A 6 HSI1_CSLOCK HSI1A_RXD3/TXD3 FIFO1A_DIN3/DOUT3 BK2_IO7 2 19P 1A7 7 Note 4 HSI1A_RXD4/TXD4 FIFO1A_DIN4/DOUT4 F15 BK2_IO8 2 20N 1A7 8 CAL HSI1A_RXD5/TXD5 FIFO1A_DIN5/DOUT5 D16 BK2_IO9 2 20P 1A7 9 - HSI1A_RXD6/TXD6 FIFO1A_DIN6/DOUT6 E15 7 E13 BK2_IO10 2 21N 1A 10 HSI1A_SOUTN HSI1A_RXD7/TXD7 FIFO1A_DIN7/DOUT7 BK2_IO11 2 21P 1A7 11 HSI1A_SOUTP HSI1A_RXD8/TXD8 FIFO1A_DIN8/DOUT8 E14 GND 2 - - - - - GND BK2_IO12 2 22N 1A7 12 HSI1A_SYDT5 HSI1A_RXD9/TXD9 FIFO1A_DIN9/DOUT9 C16 7 D15 BK2_IO13 2 22P 1A 13 HSI1A_CDRRSTb HSI1A_RECCLK FIFO1A_FIFORSTb BK2_IO14 2 23N 1A7 14 FIFO1A_STRDb6 - - C15 BK2_IO15 / VREF2 2 23P 1A7 15 - - FIFO1A_EMPTY D14 TCK - - - - - - R14 GOE2 - - - - - - A9 BK3_IO0 / VREF3 3 24P 1B 0 - HSI1B_RXD0/TXD0 FIFO1B_DIN0/DOUT0 C13 BK3_IO1 3 24N 1B 1 Note 4 HSI1B_RXD1/TXD1 FIFO1B_DIN1/DOUT1 B14 BK3_IO2 3 25P 1B 2 - HSI1B_RXD2/TXD2 FIFO1B_DIN2/DOUT2 A15 25N 1B 3 - HSI1B_RXD3/TXD3 FIFO1B_DIN3/DOUT3 B13 - - - - GND BK3_IO3 3 GND 3 BK3_IO4 3 26P 1B 4 HSI1B_SOUTP HSI1B_RXD4/TXD4 FIFO1B_DIN4/DOUT4 D12 BK3_IO5 3 26N 1B 5 HSI1B_SOUTN HSI1B_RXD5/TXD5 FIFO1B_DIN5/DOUT5 C12 BK3_IO6 3 27P 1B 6 - HSI1B_RXD6/TXD6 FIFO1B_DIN6/DOUT6 A14 - HSI1B_RXD7/TXD7 FIFO1B_DIN7/DOUT7 / FIFO1B_STRDb A13 BK3_IO7 3 BK3_IO8 3 28P 1B 8 - HSI1B_RXD8/TXD8 FIFO1B_DIN8/DOUT8 B12 BK3_IO9 3 28N 1B 9 HSI1B_SYDT5 HSI1B_RXD9/TXD9 FIFO1B_DIN9/DOUT9 C11 BK3_IO10 3 29P 1B 10 HSI1B_SINP HSI1B_RECCLK - D10 BK3_IO11 3 29N 1B 11 HSI1B_SINN - - C10 GND 3 - - - - - GND BK3_IO12 3 30P 1B 12 - HSI1B_SYDT5 FIFO1B_FULL B11 BK3_IO13 3 30N 1B 13 HSI1B_CDRRSTb - FIFO1B_FIFORSTb B10 BK3_IO14 3 31P 1B 14 - - - A10 BK3_IO15 3 31N 1B 15 - - FIFO1B_ EMPTY C9 RESET - - - - - - A7 BK4_IO0 4 32N 2A 0 - - FIFO2A_EMPTY C8 BK4_IO1 / PLL_LOCK0 / PLL_RST0 4 32P 2A 1 - - - B7 BK4_IO2 4 33N 2A 2 HSI2A_CDRRSTb - FIFO2A_FIFORSTb A6 BK4_IO3 4 33P 2A 3 - HSI2A_SYDT5 FIFO2A_FULL B6 GND 27N 1B 7 GND 4 - - - BK4_IO4 4 34N 2A 4 HSI2A_SINN - - C7 BK4_IO5 4 34P 2A 5 HSI2A_SINP HSI2A_RECCLK - D7 BK4_IO6 4 35N 2A 6 HSI2A_SYDT5 HSI2A_RXD9/TXD9 FIFO2A_DIN9/DOUT9 C6 BK4_IO7 4 35P 2A 7 - HSI2A_RXD8/TXD8 FIFO2A_DIN8/DOUT8 B5 57 Lattice Semiconductor ispGDX2 Family Data Sheet ispGDX2-128 Logic Signal Connections (Continued) Signal Name sysIO LVDS Bank Pair/Polarity GDX Block MRB SERDES Mode I/O Pin1 SERDES Mode I/O Cell2 FIFO Mode I/O Cell/Pin3 208 fpBGA 4 36N 2A 8 FIFO2A_STRDb6 HSI2A_RXD7/TXD7 FIFO2A_DIN7/DOUT7 A4 BK4_IO9 / PLL_FB0 4 36P 2A 9 - HSI2A_RXD6/TXD6 FIFO2A_DIN6/DOUT6 A3 BK4_IO10 4 37N 2A 10 HSI2A_SOUTN HSI2A_RXD5/TXD5 FIFO2A_DIN5/DOUT5 C5 SE L D E IS C C T O D N E TI VI N C U E ED S BK4_IO8 BK4_IO11 4 37P 2A 11 HSI2A_SOUTP HSI2A_RXD4/TXD4 FIFO2A_DIN4/DOUT4 D5 GND GND 4 - - - - BK4_IO12 4 38N 2A 12 - HSI2A_RXD3/TXD3 FIFO2A_DIN3/DOUT3 B4 BK4_IO13 4 38P 2A 13 - HSI2A_RXD2/TXD2 FIFO2A_DIN2/DOUT2 A2 BK4_IO14 4 39N 2A 14 Note 4 HSI2A_RXD1/TXD1 FIFO2A_DIN1/DOUT1 B3 BK4_IO15 / VREF4 4 39P 2A 15 - HSI2A_RXD0/TXD0 FIFO2A_DIN0/DOUT0 C4 GOE1 - - - - - A8 TMS - - - - - - R1 GND 5 - - - - - GND BK5_IO0 / VREF5 5 40P 2B 0 - - FIFO2B_EMPTY D3 BK5_IO1 5 40N 2B 1 FIFO2B_STRDb6 - - C2 BK5_IO2 5 41P 2B 2 HSI2B_CDRRSTb HSI2B_RECCLK FIFO2B_FIFORSTb D2 BK5_IO3 5 41N 2B 3 HSI2B_SYDT5 HSI2B_RXD9/TXD9 FIFO2B_DIN9/DOUT9 B1 BK5_IO4 5 42P 2B 4 HSI2B_SOUTP HSI2B_RXD8/TXD8 FIFO2B_DIN8/DOUT8 E3 BK5_IO5 5 42N 2B 5 HSI2B_SOUTN HSI2B_RXD7/TXD7 FIFO2B_DIN7/DOUT7 E4 BK5_IO6 5 43P 2B 6 - HSI2B_RXD6/TXD6 FIFO2B_DIN6/DOUT6 F3 BK5_IO7 5 43N 2B 7 - HSI2B_RXD5/TXD5 FIFO2B_DIN5/DOUT5 E2 BK5_IO8 5 44P 2B 8 Note 4 HSI2B_RXD4/TXD4 FIFO2B_DIN4/DOUT4 F2 BK5_IO9 5 44N 2B 9 HSI2_CSLOCK HSI2B_RXD3/TXD3 FIFO2B_DIN3/DOUT3 C1 BK5_IO10 5 45P 2B 10 HSI2B_SINP HSI2B_RXD2/TXD2 FIFO2B_DIN2/DOUT2 G3 BK5_IO11 5 45N 2B 11 HSI2B_SINN HSI2B_RXD1/TXD1 FIFO2B_DIN1/DOUT1 G4 GND GND 5 - - - - - BK5_IO12 5 46P 2B 12 - HSI2B_RXD0/TXD0 FIFO2B_DIN0/DOUT0 D1 BK5_IO13 5 46N 2B 13 - HSI2B_SYDT5 - G2 BK5_IO14 5 47P 2B 14 SS_CLKIN0P - - H4 BK5_IO15 / CLK_OUT0 5 47N 2B 15 SS_CLKIN0N - FIFO2B_FULL H3 GCLK/CE0 - CLK0P - - - - - D9 SEL0 - - - - - - F1 SEL1 - - - - - - G1 GCLK/CE1 - CLK0N - - - - - D8 BK6_IO0 6 48N 3A 0 SS_CLKOUT0N - FIFO3A_EMPTY J4 BK6_IO1 6 48P 3A 1 SS_CLKOUT0P - - J3 BK6_IO2 6 49N 3A 2 HSI3A_CDRRSTb - FIFO3A_FIFORSTb K1 BK6_IO3 6 49P 3A 3 FIFO3A_STRDb6 - - K2 GND 6 - - - - - GND BK6_IO4 6 50N 3A 4 HSI3A_SINN HSI3A_RECCLK - K4 BK6_IO5 6 50P 3A 5 HSI3A_SINP HSI3A_RXD9/TXD9 FIFO3A_DIN9/DOUT9 K3 BK6_IO6 6 51N 3A 6 - HSI3A_RXD8/TXD8 FIFO3A_DIN8/DOUT8 L1 BK6_IO7 6 51P 3A 7 - HSI3A_RXD7/TXD7 FIFO3A_DIN7/DOUT7 L2 BK6_IO8 6 52N 3A 8 HSI3A_SYDT5 HSI3A_RXD6/TXD6 FIFO3A_DIN6/DOUT6 N1 BK6_IO9 6 52P 3A 9 HSI3_CSLOCK HSI3A_RXD5/TXD5 FIFO3A_DIN5/DOUT5 M2 BK6_IO10 6 53N 3A 10 HSI3A_SOUTN HSI3A_RXD4/TXD4 FIFO3A_DIN4/DOUT4 M4 BK6_IO11 6 53P 3A 11 HSI3A_SOUTP HSI3A_RXD3/TXD3 FIFO3A_DIN3/DOUT3 M3 58 Lattice Semiconductor ispGDX2 Family Data Sheet ispGDX2-128 Logic Signal Connections (Continued) Signal Name sysIO LVDS Bank Pair/Polarity GDX Block MRB SERDES Mode I/O Pin1 SERDES Mode I/O Cell2 FIFO Mode I/O Cell/Pin3 208 fpBGA GND 6 - - - - - BK6_IO12 6 54N 3A 12 - HSI3A_RXD2/TXD2 FIFO3A_DIN2/DOUT2 L3 BK6_IO13 6 54P 3A 13 Note 4 HSI3A_RXD1/TXD1 FIFO3A_DIN1/DOUT1 N2 SE L D E IS C C T O D N E TI VI N C U E ED S GND BK6_IO14 6 55N 55P 3A 14 - HSI3A_RXD0/TXD0 5 FIFO3A_DIN0/DOUT0 P1 BK6_IO15 / VREF6 6 3A 15 - HSI3A_SYDT FIFO3A_ FULL P2 TDI - - - - - - N3 GOE0 - - - - - - T8 GND 7 - - - - - GND BK7_IO0 / VREF7 7 56P 3B 0 FIFO3B_STRDb6 - - T2 BK7_IO1 7 56N 3B 1 HSI3B_CDRRSTb HSI3B_RECCLK FIFO3B_FIFORSTb R3 BK7_IO2 7 57P 3B 2 HSI3B_SYDT5 HSI3B_RXD9/TXD9 FIFO3B_DIN9/DOUT9 P4 BK7_IO3 7 57N 3B 3 - HSI3B_RXD8/TXD8 FIFO3B_DIN8/DOUT8 T3 BK7_IO4 7 58P 3B 4 HSI3B_SOUTP HSI3B_RXD7/TXD7 FIFO3B_DIN7/DOUT7 N5 BK7_IO5 7 58N 3B 5 HSI3B_SOUTN HSI3B_RXD6/TXD6 FIFO3B_DIN6/DOUT6 P5 BK7_IO6 7 59P 3B 6 - HSI3B_RXD5/TXD5 FIFO3B_DIN5/DOUT5 R4 BK7_IO7 7 59N 3B 7 Note 4 HSI3B_RXD4/TXD4 FIFO3B_DIN4/DOUT4 T4 BK7_IO8 7 60P 3B 8 - HSI3B_RXD3/TXD3 FIFO3B_DIN3/DOUT3 R5 BK7_IO9 7 60N 3B 9 - HSI3B_RXD2/TXD2 FIFO3B_DIN2/DOUT2 P6 BK7_IO10 7 61P 3B 10 HSI3B_SINP HSI3B_RXD1/TXD1 FIFO3B_DIN1/DOUT1 N7 BK7_IO11 7 61N 3B 11 HSI3B_SINN HSI3B_RXD0/TXD0 FIFO3B_DIN0/DOUT0 P7 GND 7 - - - - - GND BK7_IO12 7 62P 3B 12 - HSI3B_SYDT5 FIFO3B_ EMPTY R6 BK7_IO13 7 62N 3B 13 - - - T6 BK7_IO14 7 63P 3B 14 - - - R7 BK7_IO15 7 63N 3B 15 - - FIFO3B_FULL T7 1. The signals in this column route to/from the assigned pins of the associated I/O cell. 2. The signals in this column use the I/O cell. If a receiver signal is present in the I/O cell, the associated pin is available for output only. When transmit data (TXD) is present in the cell, the associated pin is available for input only. 3. The DOUT outputs are routed to GRP through the input register of the cell and the DIN inputs are routed direct from the associated pins in FIFO only mode. In SERDES with FIFO mode, the FULL and EMPTY flags are routed to the associated pins through the output MUX and the pins. 4. If the Source Synchronous Receiver is used in the HSI Block, this pin is unavailable for another use and must be left unconnected. 5. The SYDT signal has two routing options. If direct output through the dedicated pin is used, the I/O cell (the whole HSI Block) is not available for transmitter. The SYDT in the I/O Cell column is routed to the GRP through the input register of the cell and frees the I/O cell for transmitter. 6. FIFO_STRDb flag output is used in SERDES with FIFO Mode only. 7. sysHSI Source Synchronous Receive Mode is not available for channel 1A. 59 Lattice Semiconductor ispGDX2 Family Data Sheet ispGDX2-256 Logic Signal Connections Signal Name sysIO Bank LVDS GDX Pair/Polarity Block MRB SERDES Mode I/O Pin1 SERDES Mode I/O Cell2 FIFO Mode I/O Cell/Pin3 484 fpBGA 0 0N 0A 0 - - FIFO0A_FULL AB13 BK0_IO1 0 0P 0A 1 - - - AA13 BK0_IO2/ PLL_LOCK2 0 1N 0A 2 - - - V13 BK0_IO3 0 1P 0A 3 - - FIFO0A_ EMPTY V14 GND 0 - - - - SYDT_HSI0A5 - GND BK0_IO4 0 2N 0A 4 HSI0A_SINN HSI0A_RXD0/TXD0 FIFO0A_DIN0/DOUT0 U12 BK0_IO5 0 2P 0A 5 HSI0A_SINP HSI0A_RXD1/TXD1 FIFO0A_DIN1/DOUT1 U13 BK0_IO6 0 3N 6 - HSI0A_RXD2/TXD2 FIFO0A_DIN2/DOUT2 W12 BK0_IO7 0 3P 0A 7 - HSI0A_RXD3/TXD3 FIFO0A_DIN3/DOUT3 Y13 BK0_IO8 0 4N 0A 8 Note 4 HSI0A_RXD4/TXD4 FIFO0A_DIN4/DOUT4 W13 BK0_IO9/ PLL_FB2 0 4P 0A 9 - HSI0A_RXD5/TXD5 FIFO0A_DIN5/DOUT5 Y14 BK0_IO10 0 5N 0A 10 HSI0A_SOUTN HSI0A_RXD6/TXD6 FIFO0A_DIN6/DOUT6 T12 BK0_IO11 0 5P 0A 11 HSI0A_SOUTP HSI0A_RXD7/TXD7 FIFO0A_DIN7/DOUT7 T13 GND 0 - - - - - - GND SE L D E IS C C T O D N E TI VI N C U E ED S BK0_IO0 BK0_IO12 0 6N 0A 12 - HSI0A_RXD8/TXD8 FIFO0A_DIN8/DOUT8 AB14 BK0_IO13 0 6P 0A 13 HSI0A_SYDT5 HSI0A_RXD9/TXD9 FIFO0A_DIN9/DOUT9 AB15 BK0_IO14 0 7N 0A 14 HSI0A_CDRRSTb HSI0A_RECCLK FIFO0A_FIFORSTb Y15 BK0_IO15 0 7P 0A 15 FIFO0A_STRDb6 - - W15 BK0_IO16 0 8N 1A 0 - - FIFO1A_FULL AA15 BK0_IO17/ PLL_RST2 0 8P 1A 1 - - - AA16 5 BK0_IO18 0 9N 1A 2 - HSI1A_SYDT BK0_IO19 0 9P 1A 3 - HSI1A_RXD0/TXD0 - Y16 FIFO1A_DIN0/DOUT0 W16 GND 0 - - - - - - GND BK0_IO20 0 10N 1A 4 HSI1A_SOUTN HSI1A_RXD1/TXD1 FIFO1A_DIN1/DOUT1 U14 BK0_IO21/ VREF0 0 10P 1A 5 HSI1A_SOUTP HSI1A_RXD2/TXD2 FIFO1A_DIN2/DOUT2 U15 BK0_IO22 0 11N 1A 6 - HSI1A_RXD3/TXD3 FIFO1A_DIN3/DOUT3 AB16 BK0_IO23 0 11P 1A 7 Note 4 HSI1A_RXD4/TXD4 FIFO1A_DIN4/DOUT4 AB17 BK0_IO24 0 12N 1A 8 - HSI1A_RXD5/TXD5 FIFO1A_DIN5/DOUT5 AA17 BK0_IO25 0 12P 1A 9 - HSI1A_RXD6/TXD6 FIFO1A_DIN6/DOUT6 W17 BK0_IO26 0 13N 1A 10 HSI1A_SINN HSI1A_RXD7/TXD7 FIFO1A_DIN7/DOUT7 T14 BK0_IO27 0 13P 1A 11 HSI1A_SINP HSI1A_RXD8/TXD8 FIFO1A_DIN8/DOUT8 T15 BK0_IO28 0 14N 1A 12 HSI1A_SYDT5 HSI1A_RXD9/TXD9 FIFO1A_DIN9/DOUT9 AA18 BK0_IO29 0 14P 1A 13 HSI1A_CDRRSTb5 HSI1A_RECCLK FIFO1A_FIFORSTb AB18 BK0_IO30 0 15N 1A 14 FIFO1A_STRDb6 - - W18 BK0_IO31 0 15P 1A 15 - - FIFO1A_EMPTY Y19 GND 0 - - - - - - GND GOE3 - - - - - - - AA19 TDO - - - - - - - AB19 GND 1 - - - - - - GND BK1_IO0 1 16P 0B 0 - - FIFO0B_ FULL W21 BK1_IO1 1 16N 0B 1 - HSI0B_SYDT5 - W20 BK1_IO2 1 17P 0B 2 - HSI0B_RXD0/TXD0 FIFO0B_DIN0/DOUT0 V22 BK1_IO3 1 17N 0B 3 Note 4 HSI0B_RXD1/TXD1 FIFO0B_DIN1/DOUT1 W22 BK1_IO4 1 18P 0B 4 HSI0B_SINP HSI0B_RXD2/TXD2 FIFO0B_DIN2/DOUT2 P16 60 Lattice Semiconductor ispGDX2 Family Data Sheet ispGDX2-256 Logic Signal Connections (Continued) Signal Name sysIO Bank LVDS GDX Pair/Polarity Block MRB SERDES Mode I/O Pin1 SERDES Mode I/O Cell2 FIFO Mode I/O Cell/Pin3 484 fpBGA 1 18N 0B 5 HSI0B_SINN HSI0B_RXD3/TXD3 FIFO0B_DIN3/DOUT3 P17 BK1_IO6 1 19P 0B 6 HSI0_CSLOCK HSI0B_RXD4/TXD4 FIFO0B_DIN4/DOUT4 U18 BK1_IO7 1 19N 0B 7 - HSI0B_RXD5/TXD5 FIFO0B_DIN5/DOUT5 V19 SE L D E IS C C T O D N E TI VI N C U E ED S BK1_IO5 BK1_IO8 1 20P 0B 8 - 5 HSI0B_RXD6/TXD6 FIFO0B_DIN6/DOUT6 V20 HSI0B_RXD7/TXD7 FIFO0B_DIN7/DOUT7 V21 R16 BK1_IO9 1 20N 0B 9 HSI0B_SYDT BK1_IO10/ VREF1 1 21P 0B 10 HSI0B_SOUTP HSI0B_RXD8/TXD8 FIFO0B_DIN8/DOUT8 BK1_IO11 1 21N 0B 11 HSI0B_SOUTN HSI0B_RXD9/TXD9 FIFO0B_DIN9/DOUT9 R17 GND 1 - - - - - - GND BK1_IO12 1 22P 0B 12 HSI0B_CDRRSTb HSI0B_RECCLK FIFO0B_FIFORSTb U19 BK1_IO13 1 22N 0B 13 FIFO0B_STRDb6 - - T19 BK1_IO14 1 23P 0B 14 - - - U21 BK1_IO15 1 23N 0B 15 - - FIFO0B_EMPTY U22 FIFO1B_FULL R19 5 BK1_IO16 1 24P 1B 0 - HSI1B_SYDT BK1_IO17 1 24N 1B 1 - HSI1B_RXD0/TXD0 FIFO1B_DIN0/DOUT0 T20 BK1_IO18 1 25P 1B 2 Note 4 HSI1B_RXD1/TXD1 FIFO1B_DIN1/DOUT1 T21 BK1_IO19 1 25N 1B 3 - HSI1B_RXD2/TXD2 FIFO1B_DIN2/DOUT2 T22 GND GND 1 - - - - - - BK1_IO20 1 26P 1B 4 HSI1B_SOUTP HSI1B_RXD3/TXD3 FIFO1B_DIN3/DOUT3 N16 BK1_IO21 1 26N 1B 5 HSI1B_SOUTN HSI1B_RXD4/TXD4 FIFO1B_DIN4/DOUT4 N17 BK1_IO22 1 27P 1B 6 HSI1_CSLOCK HSI1B_RXD5/TXD5 FIFO1B_DIN5/DOUT5 R20 5 BK1_IO23 1 27N 1B 7 HSI1B_SYDT BK1_IO24 1 28P 1B 8 - HSI1B_RXD6/TXD6 FIFO1B_DIN6/DOUT6 R21 HSI1B_RXD7/TXD7 FIFO1B_DIN7/DOUT7 N19 BK1_IO25 1 28N 1B 9 - HSI1B_RXD8/TXD8 FIFO1B_DIN8/DOUT8 P20 BK1_IO26 1 29P 1B 10 HSI1B_SINP HSI1B_RXD9/TXD9 FIFO1B_DIN9/DOUT9 P18 BK1_IO27 1 29N 1B 11 HSI1B_SINN HSI1B_RECCLK - N18 GND 1 - - - - - GND BK1_IO28 1 30P 1B 12 FIFO1B_STRDb6 - - R22 BK1_IO29 1 30N 1B 13 HSI1B_CDRRSTb - FIFO1B_FIFORSTb P22 BK1_IO30 1 31P 1B 14 SS_CLKIN1P - - M18 BK1_IO31/ CLK_OUT2 1 31N 1B 15 SS_CLKIN1N - FIFO1B_EMPTY M17 GCLK/CE2 - CLK2P - - - - - N20 SEL2 - - - - - - - N21 SEL3 - - - - - - - K21 GCLK/CE3 - CLK2N - - - - - K20 BK2_IO0/ CLK_OUT3 2 32N 3A7 0 SS_CLKOUT1N - FIFO3A_FULL K17 BK2_IO1 2 32P 3A7 1 SS_CLKOUT1P - - K18 7 2 - HSI3A_SYDT 3 - HSI3A_RXD0/TXD0 BK2_IO2 2 33N 3A BK2_IO3 2 33P 3A7 - - - 34N 3A7 4 HSI3A_SINN 7 GND 2 BK2_IO4 2 5 - L17 FIFO3A_DIN0/DOUT0 L18 - - GND HSI3A_RXD1/TXD1 FIFO3A_DIN1/DOUT1 J17 BK2_IO5 2 34P 3A 5 HSI3A_SINP HSI3A_RXD2/TXD2 FIFO3A_DIN2/DOUT2 J18 BK2_IO6 2 35N 3A7 6 HSI3_CSLOCK HSI3A_RXD3/TXD3 FIFO3A_DIN3/DOUT3 J22 BK2_IO7 2 35P 3A7 7 Note 4 HSI3A_RXD4/TXD4 FIFO3A_DIN4/DOUT4 J20 BK2_IO8 2 36N 3A7 8 CAL HSI3A_RXD5/TXD5 FIFO3A_DIN5/DOUT5 H22 BK2_IO9 2 36P 3A7 9 - HSI3A_RXD6/TXD6 FIFO3A_DIN6/DOUT6 H21 61 Lattice Semiconductor ispGDX2 Family Data Sheet ispGDX2-256 Logic Signal Connections (Continued) Signal Name sysIO Bank LVDS GDX Pair/Polarity Block MRB SERDES Mode I/O Pin1 SERDES Mode I/O Cell2 FIFO Mode I/O Cell/Pin3 484 fpBGA K16 BK2_IO10 2 37N 3A7 10 HSI3A_SOUTN HSI3A_RXD7/TXD7 FIFO3A_DIN7/DOUT7 BK2_IO11 2 37P 3A7 11 HSI3A_SOUTP HSI3A_RXD8/TXD8 FIFO3A_DIN8/DOUT8 J16 GND 2 - - - - - - GND 38N 3A7 12 HSI3A_SYDT5 HSI3A_RXD9/TXD9 FIFO3A_DIN9/DOUT9 7 SE L D E IS C C T O D N E TI VI N C U E ED S BK2_IO12 2 J19 BK2_IO13 2 38P 3A 13 HSI3A_CDRRSTb HSI3A_RECCLK FIFO3A_FIFORSTb H20 BK2_IO14 2 39N 3A7 14 FIFO3A_STRDb6 - - G21 BK2_IO15 2 39P 3A7 15 - - FIFO3A_EMPTY G20 BK2_IO16 2 40N 2A 0 - - FIFO2A_FULL G22 BK2_IO17 2 40P 2A 1 - HSI2A_SYDT5 - F22 BK2_IO18 2 41N 2A 2 - HSI2A_RXD0/TXD0 FIFO2A_DIN0/DOUT0 F20 BK2_IO19 2 41P 2A 3 Note 4 HSI2A_RXD1/TXD1 FIFO2A_DIN1/DOUT1 F21 GND 2 - - - - - - GND BK2_IO20/ PLL_FB3 2 42N 2A 4 HSI2A_SOUTN HSI2A_RXD2/TXD2 FIFO2A_DIN2/DOUT2 H18 BK2_IO21/ VREF2 2 42P 2A 5 HSI2A_SOUTP HSI2A_RXD3/TXD3 FIFO2A_DIN3/DOUT3 G17 BK2_IO22 2 43N 2A 6 HSI2_CSLOCK HSI2A_RXD4/TXD4 FIFO2A_DIN4/DOUT4 E21 BK2_IO23 2 43P 2A 7 - HSI2A_RXD5/TXD5 FIFO2A_DIN5/DOUT5 F19 BK2_IO24 2 44N 2A 8 - HSI2A_RXD6/TXD6 FIFO2A_DIN6/DOUT6 E22 BK2_IO25 2 44P 2A 9 HSI2A_SYDT5 HSI2A_RXD7/TXD7 FIFO2A_DIN7/DOUT7 D22 BK2_IO26 2 45N 2A 10 HSI2A_SINN HSI2A_RXD8/TXD8 FIFO2A_DIN8/DOUT8 H17 BK2_IO27 2 45P 2A 11 HSI2A_SINP HSI2A_RXD9/TXD9 FIFO2A_DIN9/DOUT9 H16 BK2_IO28 2 46N 2A 12 HSI2A_CDRRSTb HSI2A_RECCLK FIFO2A_FIFORSTb E19 BK2_IO29 2 46P 2A 13 FIFO2A_STRDb6 - - F18 BK2_IO30 2 47N 2A 14 - - - D20 BK2_IO31 2 47P 2A 15 - - FIFO2A_EMPTY D21 GND 2 - - - - - - GND TCK - - - - - - - B19 GOE2 - - - - - - - C19 BK3_IO0 3 48P 3B 0 - HSI3B_SYDT5 FIFO3B_FULL E17 BK3_IO1 3 48N 3B 1 - HSI3B_RXD0/TXD0 FIFO3B_DIN0/DOUT0 D18 BK3_IO2 3 49P 3B 2 Note 4 HSI3B_RXD1/TXD1 FIFO3B_DIN1/DOUT1 A19 BK3_IO3 3 49N 3B 3 - HSI3B_RXD2/TXD2 FIFO3B_DIN2/DOUT2 A18 GND 3 - - - - - - GND BK3_IO4 3 50P 3B 4 HSI3B_SINP HSI3B_RXD3/TXD3 FIFO3B_DIN3/DOUT3 G15 BK3_IO5 3 50N 3B 5 HSI3B_SINN HSI3B_RXD4/TXD4 FIFO3B_DIN4/DOUT4 G14 BK3_IO6 3 51P 3B 6 - HSI3B_RXD5/TXD5 FIFO3B_DIN5/DOUT5 D17 BK3_IO7 3 51N 3B 7 HSI3B_SYDT5 HSI3B_RXD6/TXD6 FIFO3B_DIN6/DOUT6 D16 BK3_IO8 3 52P 3B 8 - HSI3B_RXD7/TXD7 FIFO3B_DIN7/DOUT7 C18 BK3_IO9 3 52N 3B 9 - HSI3B_RXD8/TXD8 FIFO3B_DIN8/DOUT8 B18 BK3_IO10/ VREF3 3 53P 3B 10 HSI3B_SOUTP HSI3B_RXD9/TXD9 FIFO3B_DIN9/DOUT9 F15 BK3_IO11 3 53N 3B 11 HSI3B_SOUTN HSI3B_RECCLK - F14 GND GND 3 - - - - - - BK3_IO12 3 54P 3B 12 FIFO3B_STRDb6 - - B17 BK3_IO13 3 54N 3B 13 HSI3B_CDRRSTb HSI3B_RECCLK FIFO3B_FIFORSTb A17 BK3_IO14/ PLL_RST3 3 55P 3B 14 - - - A16 62 Lattice Semiconductor ispGDX2 Family Data Sheet ispGDX2-256 Logic Signal Connections (Continued) Signal Name sysIO Bank LVDS GDX Pair/Polarity Block MRB SERDES Mode I/O Pin1 SERDES Mode I/O Cell2 FIFO Mode I/O Cell/Pin3 484 fpBGA 3 55N 3B 15 - - FIFO3B_EMPTY C16 BK3_IO16 3 56P 2B 0 - HSI2B_RXD0/TXD0 FIFO2B_DIN0/DOUT0 D15 BK3_IO17 3 56N 2B 1 Note 4 HSI2B_RXD1/TXD1 FIFO2B_DIN1/DOUT1 D14 SE L D E IS C C T O D N E TI VI N C U E ED S BK3_IO15 BK3_IO18 3 57P 2B 2 - HSI2B_RXD2/TXD2 FIFO2B_DIN2/DOUT2 B16 BK3_IO19 3 57N 2B 3 - HSI2B_RXD3/TXD3 FIFO2B_DIN3/DOUT3 C15 GND 3 - - - - - - GND BK3_IO20 3 58P 2B 4 HSI2B_SOUTP HSI2B_RXD4/TXD4 FIFO2B_DIN4/DOUT4 G13 BK3_IO21 3 58N 2B 5 HSI2B_SOUTN HSI2B_RXD5/TXD5 FIFO2B_DIN5/DOUT5 G12 B15 BK3_IO22 3 59P 2B 6 - HSI2B_RXD6/TXD6 FIFO2B_DIN6/DOUT6 BK3_IO23 3 59N 2B 7 FIFO2B_STRDb6 HSI2B_RXD7/TXD7 FIFO2B_DIN7 /DOUT7 A15 BK3_IO24 3 60P 2B 8 - HSI2B_RXD8/TXD8 FIFO2B_DIN8/DOUT8 C14 BK3_IO25 3 60N 2B 9 HSI2B_SYDT5 HSI2B_RXD9/TXD9 FIFO2B_DIN9/DOUT9 A14 BK3_IO26 3 61P 2B 10 HSI2B_SINP HSI2B_RECCLK - F13 BK3_IO27 3 61N 2B 11 HSI2B_SINN - - F12 GND 3 - - - - - - GND BK3_IO28 3 62P 2B 12 - HSI2B_SYDT5 FIFO2B_FULL D13 BK3_IO29 3 62N 2B 13 HSI2B_CDRRSTb - FIFO2B_FIFORSTb C13 BK3_IO30/ PLL_LOCK3 3 63P 2B 14 - - - B13 BK3_IO31 3 63N 2B 15 - - FIFO2B_ EMPTY A13 RESETb - - - - - - D12 BK4_IO0 4 64N 4A 0 - - FIFO4A_EMPTY A10 BK4_IO1/ PLL_LOCK0 4 64P 4A 1 - - - B10 BK4_IO2 4 65N 4A 2 HSI4A_CDRRSTb - FIFO4A_FIFORSTb E11 BK4_IO3 4 65P 4A 3 - HSI4A_SYDT5 FIFO4A_FULL E10 GND GND 4 - - - BK4_IO4 4 66N 4A 4 HSI4A_SINN - - F11 BK4_IO5 4 66P 4A 5 HSI4A_SINP HSI4A_RECCLK - F10 BK4_IO6 4 67N 4A 6 HSI4A_SYDT5 HSI4A_RXD9/TXD9 FIFO4A_DIN9/DOUT9 C10 BK4_IO7 4 67P 4A 7 - HSI4A_RXD8/TXD8 FIFO4A_DIN8/DOUT8 C9 BK4_IO8 4 68N 4A 8 FIFO4A_STRDb6 HSI4A_RXD7/TXD7 FIFO4A_DIN7 /DOUT7 D10 BK4_IO9/ PLL_FB0 4 68P 4A 9 - HSI4A_RXD6/TXD6 FIFO4A_DIN6/DOUT6 D9 BK4_IO10 4 69N 4A 10 HSI4A_SOUTN HSI4A_RXD5/TXD5 FIFO4A_DIN5/DOUT5 G11 BK4_IO11 4 69P 4A 11 HSI4A_SOUTP HSI4A_RXD4/TXD4 FIFO4A_DIN4/DOUT4 G10 GND 4 - - - - GND BK4_IO12 4 70N 4A 12 - HSI4A_RXD3/TXD3 FIFO4A_DIN3/DOUT3 A9 BK4_IO13 4 70P 4A 13 - HSI4A_RXD2/TXD2 FIFO4A_DIN2/DOUT2 C8 BK4_IO14 4 71N 4A 14 Note 4 HSI4A_RXD1/TXD1 FIFO4A_DIN1/DOUT1 B8 BK4_IO15 4 71P 4A 15 - HSI4A_RXD0/TXD0 FIFO4A_DIN0/DOUT0 A8 BK4_IO16 4 72N 5A 0 - - FIFO5A_EMPTY B7 BK4_IO17/ PLL_RST0 4 72P 5A 1 - - - C7 BK4_IO18 4 73N 5A 2 HSI5A_CDRRSTb - FIFO5A_FIFORSTb A7 BK4_IO19 4 73P 5A 3 FIFO5A_STRDb6 - - B6 GND 4 - - - - - - GND BK4_IO20 4 74N 5A 4 HSI5A_SOUTN HSI5A_RECCLK - F9 63 Lattice Semiconductor ispGDX2 Family Data Sheet ispGDX2-256 Logic Signal Connections (Continued) Signal Name sysIO Bank LVDS GDX Pair/Polarity Block MRB SERDES Mode I/O Pin1 SERDES Mode I/O Cell2 FIFO Mode I/O Cell/Pin3 484 fpBGA 4 74P 5A 5 HSI5A_SOUTP HSI5A_RXD9/TXD9 FIFO5A_DIN9/DOUT9 F8 BK4_IO22 4 75N 5A 6 - HSI5A_RXD8/TXD8 FIFO5A_DIN8/DOUT8 D7 BK4_IO23 4 75P 5A 7 - HSI5A_RXD7/TXD7 FIFO5A_DIN7/DOUT7 D6 BK4_IO24 4 76N 5A 8 HSI5A_SYDT5 HSI5A_RXD6/TXD6 FIFO5A_DIN6/DOUT6 A6 SE L D E IS C C T O D N E TI VI N C U E ED S BK4_IO21/ VREF4 BK4_IO25 4 76P 5A 9 - HSI5A_RXD5/TXD5 FIFO5A_DIN5/DOUT5 A5 BK4_IO26 4 77N 5A 10 HSI5A_SINN HSI5A_RXD4/TXD4 FIFO5A_DIN4/DOUT4 G9 BK4_IO27 4 77P 5A 11 HSI5A_SINP HSI5A_RXD3/TXD3 FIFO5A_DIN3/DOUT3 G8 BK4_IO28 4 78N 5A 12 - HSI5A_RXD2/TXD2 FIFO5A_DIN2/DOUT2 C5 BK4_IO29 4 78P 5A 13 Note 4 HSI5A_RXD1/TXD1 FIFO5A_DIN1/DOUT1 B5 BK4_IO30 4 79N 5A 14 - HSI5A_RXD0/TXD0 FIFO5A_DIN0/DOUT0 D5 BK4_IO31 4 79P 5A 15 - HSI5A_SYDT5 FIFO5A_FULL C4 GND 4 - - - - - GND GOE1 - - - - - B4 TMS - - - - - - A4 GND 5 - - - - - GND BK5_IO0 5 80P 4B 0 - - FIFO4B_EMPTY D2 BK5_IO1 5 80N 4B 1 - - - D3 BK5_IO2 5 81P 4B 2 FIFO4B_STRDb6 - - F5 BK5_IO3 5 81N 4B 3 HSI4B_CDRRSTb HSI4B_RECCLK FIFO4B_FIFORSTb E4 BK5_IO4 5 82P 4B 4 HSI4B_SINP HSI4B_RXD9/TXD9 FIFO4B_DIN9/DOUT9 J7 BK5_IO5 5 82N 4B 5 HSI4B_SINN HSI4B_RXD8/TXD8 FIFO4B_DIN8/DOUT8 J6 BK5_IO6 5 83P 4B 6 HSI4B_SYDT5 HSI4B_RXD7/TXD7 FIFO4B_DIN7/DOUT7 D1 BK5_IO7 5 83N 4B 7 - HSI4B_RXD6/TXD6 FIFO4B_DIN6/DOUT6 E1 BK5_IO8 5 84P 4B 8 - HSI4B_RXD5/TXD5 FIFO4B_DIN5/DOUT5 F4 BK5_IO9 5 84N 4B 9 HSI4_CSLOCK HSI4_RXD4/TXD4 FIFO4B_DIN4/DOUT4 E3 BK5_IO10/ VREF5 5 85P 4B 10 HSI4B_SOUTP HSI4B_RXD3/TXD3 FIFO4B_DIN3/DOUT3 H7 BK5_IO11 5 85N 4B 11 HSI4B_SOUTN HSI4B_RXD2/TXD2 FIFO4B_DIN2/DOUT2 H6 GND 5 - - - - - - GND BK5_IO12 5 86P 4B 12 Note 4 HSI4B_RXD1/TXD1 FIFO4B_DIN1/DOUT1 E2 BK5_IO13 5 86N 4B 13 - HSI4B_RXD0/TXD0 FIFO4B_DIN0/DOUT0 F2 BK5_IO14 5 87P 4B 14 - HSI4B_SYDT5 - G4 BK5_IO15 5 87N 4B 15 - - FIFO4B_FULL H5 BK5_IO16 5 88P 5B 0 - - FIFO5B_EMPTY F1 BK5_IO17 5 88N 5B 1 FIFO5B_STRDb6 - - G1 BK5_IO18 5 89P 5B 2 HSI5B_CDRRSTb HSI5B_RECCLK FIFO5B_FIFORSTb G3 BK5_IO19 5 89N 5B 3 HSI5B_SYDT5 HSI5B_RXD9/TXD9 FIFO5B_DIN9/DOUT9 G2 GND GND 5 - - - - - - BK5_IO20 5 90P 5B 4 HSI5B_SOUTP HSI5B_RXD8/TXD8 FIFO5B_DIN8/DOUT8 K7 BK5_IO21 5 90N 5B 5 HSI5B_SOUTN HSI5B_RXD7/TXD7 FIFO5B_DIN7/DOUT7 K6 BK5_IO22 5 91P 5B 6 - HSI5B_RXD6/TXD6 FIFO5B_DIN6/DOUT6 H4 BK5_IO23 5 91N 5B 7 - HSI5B_RXD5/TXD5 FIFO5B_DIN5/DOUT5 H3 BK5_IO24 5 92P 5B 8 Note 4 HSI5B_RXD4/TXD4 FIFO5B_DIN4/DOUT4 H1 BK5_IO25 5 92N 5B 9 HSI5_CSLOCK HSI5B_RXD3/TXD3 FIFO5B_DIN3/DOUT3 H2 BK5_IO26 5 93P 5B 10 HSI5B_SINP HSI5B_RXD2/TXD2 FIFO5B_DIN2/DOUT2 J5 BK5_IO27 5 93N 5B 11 HSI5B_SINN HSI5B_RXD1/TXD1 FIFO5B_DIN1/DOUT1 K5 64 Lattice Semiconductor ispGDX2 Family Data Sheet ispGDX2-256 Logic Signal Connections (Continued) Signal Name sysIO Bank LVDS GDX Pair/Polarity Block MRB SERDES Mode I/O Pin1 SERDES Mode I/O Cell2 FIFO Mode I/O Cell/Pin3 484 fpBGA GND 5 - - - - - - GND BK5_IO28 5 94P 5B 12 - HSI5B_RXD0/TXD0 FIFO5B_DIN0/DOUT0 J4 BK5_IO29 5 94N 5B 13 - HSI5B_SYDT5 - SE L D E IS C C T O D N E TI VI N C U E ED S J3 BK5_IO30 5 95P 5B 14 SS_CLKIN0P - - L6 BK5_IO31/ CLK_OUT0 5 95N 5B 15 SS_CLKIN0N - FIFO5B_FULL L5 GCLK/CE0 - CLK0P - - - - - L4 SEL0 - - - - - - - K3 SEL1 - - - - - - - K2 GCLK/CE1 - CLK0N - - - - - N1 BK6_IO0/ CLK_OUT1 6 96N 7A 0 SS_CLKOUT0N - FIFO7A_EMPTY N6 BK6_IO1 6 96P 7A 1 SS_CLKOUT0P - - N5 BK6_IO2 6 97N 7A 2 HSI7A_CDRRST - FIFO7A_FIFORSTb M5 BK6_IO3 6 97P 7A 3 FIFO7A_STRDb6 - - M6 GND 6 - - - - - - GND BK6_IO4 6 98N 7A 4 HSI7A_SINN HSI7A_RECCLK - P6 BK6_IO5 6 98P 7A 5 HSI7A_SINP HSI7A_RXD9/TXD9 FIFO7A_DIN9/DOUT9 P5 BK6_IO6 6 99N 7A 6 - HSI7A_RXD8/TXD8 FIFO7A_DIN8/DOUT8 N3 BK6_IO7 6 99P 7A 7 - HSI7A_RXD7/TXD7 FIFO7A_DIN7/DOUT7 N2 BK6_IO8 6 100N 7A 8 HSI7A_SYDT5 HSI7A_RXD6/TXD6 FIFO7A_DIN6/DOUT6 P3 BK6_IO9 6 100P 7A 9 HSI7_CSLOCK HSI7A_RXD5/TXD5 FIFO7A_DIN5/DOUT5 P1 BK6_IO10 6 101N 7A 10 HSI7A_SOUTN HSI7A_RXD4/TXD4 FIFO7A_DIN4/DOUT4 N7 BK6_IO11 6 101P 7A 11 HSI7A_SOUTP HSI7A_RXD3/TXD3 FIFO7A_DIN3/DOUT3 P7 GND 6 - - - - - - GND BK6_IO12 6 102N 7A 12 - HSI7A_RXD2/TXD2 FIFO7A_DIN2/DOUT2 R3 BK6_IO13 6 102P 7A 13 Note 4 HSI7A_RXD1/TXD1 FIFO7A_DIN1/DOUT1 R2 BK6_IO14 6 103N 7A 14 - HSI7A_RXD0/TXD0 FIFO7A_DIN0/DOUT0 R1 BK6_IO15 6 103P 7A 15 - HSI7A_SYDT5 FIFO7A_ FULL T1 BK6_IO16 6 104N 6A 0 - - FIFO6A_EMPTY T2 BK6_IO17 6 104P 6A 1 - - - T3 BK6_IO18 6 105N 6A 2 FIFO6A_STRDb6 - - U1 BK6_IO19 6 105P 6A 3 HSI6A_CDRRSTb HSI6_RECCLK FIFO6A_FIFORSTb U2 GND 6 - - - - - - GND BK6_IO20/ PLL_FB1 6 106N 6A 4 HSI6A_SOUTN HSI6A_RXD9/TXD9 FIFO6A_DIN9/DOUT9 R5 BK6_IO21/ VREF6 6 106P 6A 5 HSI6A_SOUTP HSI6A_RXD8/TXD8 FIFO6A_DIN8/DOUT8 T6 HSI6A_RXD7/TXD7 FIFO6A_DIN7/DOUT7 U4 HSI6A_RXD6/TXD6 FIFO6A_DIN6/DOUT6 V4 5 BK6_IO22 6 107N 6A 6 HSI6A_SYDT BK6_IO23 6 107P 6A 7 - BK6_IO24 6 108N 6A 8 - HSI6A_RXD5/TXD5 FIFO6A_DIN5/DOUT5 V3 BK6_IO25 6 108P 6A 9 HSI6_CSLOCK HSI6A_RXD4/TXD4 FIFO6A_DIN4/DOUT4 V2 BK6_IO26 6 109N 6A 10 HSI6A_SINN HSI6A_RXD3/TXD3 FIFO6A_DIN3/DOUT3 R6 BK6_IO27 6 109P 6A 11 HSI6A_SINP HSI6A_RXD2/TXD2 FIFO6A_DIN2/DOUT2 R7 BK6_IO28 6 110N 6A 12 Note 4 HSI6A_RXD1/TXD1 FIFO6A_DIN1/DOUT1 W1 BK6_IO29 6 110P 6A 13 - HSI6A_RXD0/TXD0 FIFO6A_DIN0/DOUT0 V1 BK6_IO30 6 111N 6A 14 - HSI6A_SYDT5 - W2 BK6_IO31 6 111P 6A 15 - - FIFO6A_ FULL W3 65 Lattice Semiconductor ispGDX2 Family Data Sheet ispGDX2-256 Logic Signal Connections (Continued) Signal Name sysIO Bank LVDS GDX Pair/Polarity Block MRB SERDES Mode I/O Pin1 SERDES Mode I/O Cell2 FIFO Mode I/O Cell/Pin3 484 fpBGA GND 6 - - - - - - GND TDI - - - - - - - AA4 GOE0 - - - - - - - Y4 SE L D E IS C C T O D N E TI VI N C U E ED S GND 7 - - - - - - GND BK7_IO0 7 112P 7B 0 - - FIFO7B_ EMPTY AB4 BK7_IO1 7 112N 7B 1 FIFO7B_STRDb6 - - AB5 BK7_IO2 7 113P 7B 2 HSI7B_CDRRSTb HSI7B_RECCLK FIFO7B_FIFORSTb V6 BK7_IO3 7 113N 7B 3 HSI7B_SYDT5 HSI7B_RXD9/TXD9 FIFO7B_DIN9/DOUT9 W5 BK7_IO4 7 114P 7B 4 HSI7B_SINP HSI7B_RXD8/TXD8 FIFO7B_DIN8/DOUT8 T8 BK7_IO5 7 114N 7B 5 HSI7B_SINN HSI7B_RXD7/TXD7 FIFO7B_DIN7/DOUT7 T9 BK7_IO6 7 115P 7B 6 - HSI7B_RXD6/TXD6 FIFO7B_DIN6/DOUT6 W6 BK7_IO7 7 115N 7B 7 - HSI7B_RXD5/TXD5 FIFO7B_DIN5/DOUT5 Y5 BK7_IO8 7 116P 7B 8 Note 4 HSI7B_RXD4/TXD4 FIFO7B_DIN4/DOUT4 AA5 BK7_IO9 7 116N 7B 9 - HSI7B_RXD3/TXD3 FIFO7B_DIN3/DOUT3 AA6 BK7_IO10/ VREF7 7 117P 7B 10 HSI7B_SOUTP HSI7B_RXD2/TXD2 FIFO7B_DIN2/DOUT2 U8 BK7_IO11 7 117N 7B 11 HSI7B_SOUTN HSI7B_RXD1/TXD1 FIFO7B_DIN1/DOUT1 U9 GND 7 - - - - - - GND BK7_IO12 7 118P 7B 12 - HSI7B_RXD0/TXD0 FIFO7B_DIN0/DOUT0 W7 BK7_IO13 7 118N 7B 13 - HSI7B_SYDT5 - W8 BK7_IO14/ PLL_RST1 7 119P 7B 14 - - - AB6 AB7 BK7_IO15 7 119N 7B 15 - - FIFO7B_FULL BK7_IO16 7 120P 6B 0 FIFO6B_STRDb6 - - Y7 BK7_IO17 7 120N 6B 1 HSI6B_CDRRSTb HSI6B_RECCLK FIFO6B_FIFORSTb AA7 BK7_IO18 7 121P 6B 2 HSI6B_SYDT5 HSI6B_RXD9/TXD9 FIFO6B_DIN9/DOUT9 W9 BK7_IO19 7 121N 6B 3 - HSI6B_RXD8/TXD8 FIFO6B_DIN8/DOUT8 Y8 GND 7 - - - - - - GND BK7_IO20 7 122P 6B 4 HSI6B_SOUTP HSI6B_RXD7/TXD7 FIFO6B_DIN7/DOUT7 T10 BK7_IO21 7 122N 6B 5 HSI6B_SOUTN HSI6B_RXD6/TXD6 FIFO6B_DIN6/DOUT6 T11 BK7_IO22 7 123P 6B 6 - HSI6B_RXD5/TXD5 FIFO6B_DIN5/DOUT5 AA8 BK7_IO23 7 123N 6B 7 - HSI6B_RXD4/TXD4 FIFO6B_DIN4/DOUT4 AB8 BK7_IO24 7 124P 6B 8 Note 4 HSI6B_RXD3/TXD3 FIFO6B_DIN3/DOUT3 W10 BK7_IO25 7 124N 6B 9 - HSI6B_RXD2/TXD2 FIFO6B_DIN2/DOUT2 Y9 BK7_IO26 7 125P 6B 10 HSI6B_SINP HSI6B_RXD1/TXD1 FIFO6B_DIN1/DOUT1 U10 BK7_IO27 7 125N 6B 11 HSI6B_SINN HSI6B_RXD0/TXD0 FIFO6B_DIN0/DOUT0 U11 GND 7 - - - - - - GND BK7_IO28 7 126P 6B 12 - HSI6B_SYDT5 FIFO6B_ EMPTY W11 BK7_IO29/ PLL_LOCK1 7 126N 6B 13 - - - Y10 BK7_IO30 7 127P 6B 14 - - - AA10 BK7_IO31 7 127N 6B 15 - - FIFO6B_FULL AB9 66 Lattice Semiconductor ispGDX2 Family Data Sheet ispGDX2-256 Logic Signal Connections (Continued) Signal Name TOE sysIO Bank - LVDS GDX Pair/Polarity Block MRB - - - SERDES Mode I/O Pin1 SERDES Mode I/O Cell2 FIFO Mode I/O Cell/Pin3 484 fpBGA - - - AB10 SE L D E IS C C T O D N E TI VI N C U E ED S 1. The signals in this column route to/from the assigned pins of the associated I/O cell. 2. The signals in this column use the I/O cell. If a receiver signal is present in the I/O cell, the associated pin is available for output only. When transmit data (TXD) is present in the cell, the associated pin is available for input only. 3. The DOUT outputs are routed to GRP through the input register of the cell and the DIN inputs are routed direct from the associated pins in FIFO only mode. In SERDES with FIFO mode, the FULL and EMPTY flags are routed to the associated pins through the output MUX and the pins. 4. If the Source Synchronous Receiver is used in the HSI Block, this pin is unavailable for another use and must be left unconnected. 5. The SYDT signal has two routing options. If direct output through the dedicated pin is used, the I/O cell (the whole HSI Block) is not available for transmitter. The SYDT in the I/O Cell column is routed to the GRP through the input register of the cell and frees the I/O cell for transmitter. 6. FIFO_STRDb flag output is used in SERDES with FIFO Mode only. 7. sysHSI Source Synchronous Receive Mode is not available for channel 3A. 67 Lattice Semiconductor ispGDX2 Family Data Sheet Part Number Description LX XXX X X – XX FXXX X Device Family LX Grade C = Commercial I = Industrial Package F100 = 100-Ball fpBGA FN100 = Lead-Free 100-Ball fpBGA F208 = 208-Ball fpBGA FN208 = Lead-Free 208-Ball fpBGA F484 = 484-Ball fpBGA FN484 = Lead-Free 484-Ball fpBGA Speed 3 = 3.0ns 32 = 3.2ns 35 = 3.5ns 5 = 5.0ns SE L D E IS C C T O D N E TI VI N C U E ED S Device Number 64 = 64 I/Os 128 = 128 I/Os 256 = 256 I/Os sysHSI Support Blank = Supports sysHSI E = No sysHSI support Power Supply Voltage V = 3.3V B = 2.5V C = 1.8V Ordering Information Conventional Packaging Commercial Family LX64V LX128V LX256V LX64B LX128B LX256B LX64C LX128C LX256C Part Number LX64V-3F100C I/Os Voltage tPD Package Pins Grade 64 3.3 3 fpBGA 100 C LX64V-5F100C 64 3.3 5 fpBGA 100 C LX128V-32F208C 128 3.3 3.2 fpBGA 208 C LX128V-5F208C 128 3.3 5 fpBGA 208 C LX256V-35F484C 256 3.3 3.5 fpBGA 484 C LX256V-5F484C 256 3.3 5 fpBGA 484 C LX64B-3F100C 64 2.5 3 fpBGA 100 C LX64B-5F100C 64 2.5 5 fpBGA 100 C LX128B-32F208C 128 2.5 3.2 fpBGA 208 C LX128B-5F208C 128 2.5 5 fpBGA 208 C LX256B-35F484C 256 2.5 3.5 fpBGA 484 C LX256B-5F484C 256 2.5 5 fpBGA 484 C LX64C-3F100C 64 1.8 3 fpBGA 100 C LX64C-5F100C 64 1.8 5 fpBGA 100 C LX128C-32F208C 128 1.8 3.2 fpBGA 208 C LX128C-5F208C 128 1.8 5 fpBGA 208 C LX256C-35F484C 256 1.8 3.5 fpBGA 484 C LX256C-5F484C 256 1.8 5 fpBGA 484 C 68 Lattice Semiconductor ispGDX2 Family Data Sheet “E-Series” Commercial Family LX64EV I/Os Voltage tPD Package Pins Grade 64 3.3 3 fpBGA 100 C LX64EV-5F100C 64 3.3 5 fpBGA 100 C LX128EV-32F208C 128 3.3 3.2 fpBGA 208 C LX128EV-5F208C 128 3.3 5 fpBGA 208 C LX256EV-35F484C 256 3.3 3.5 fpBGA 484 C LX256EV-5F484C 256 3.3 5 fpBGA 484 C LX64EB-3F100C 64 2.5 3 fpBGA 100 C SE L D E IS C C T O D N E TI VI N C U E ED S LX128EV Part Number LX64EV-3F100C LX256EV LX64EB LX128EB LX256EB LX64EC LX128EC LX64EB-5F100C 64 2.5 5 fpBGA 100 C LX128EB-32F208C 128 2.5 3.2 fpBGA 208 C LX128EB-5F208C 128 2.5 5 fpBGA 208 C LX256EB-35F484C 256 2.5 3.5 fpBGA 484 C LX256EB-5F484C 256 2.5 5 fpBGA 484 C LX64EC-3F100C 64 1.8 3 fpBGA 100 C LX64EC-5F100C 64 1.8 5 fpBGA 100 C LX128EC-32F208C 128 1.8 3.2 fpBGA 208 C LX128EC-5F208C 128 1.8 5 fpBGA 208 C “E-Series” Industrial Family I/Os Voltage tPD Package Pins Grade LX64EV-5F100I 64 3.3 5 fpBGA 100 I LX64EB LX64EB-5F100I 64 2.5 5 fpBGA 100 I LX64EC LX64EC-5F100I 64 1.8 5 fpBGA 100 I LX128EV LX128EV-5F208I 128 3.3 5 fpBGA 208 I LX128EB LX128EB-5F208I 128 2.5 5 fpBGA 208 I LX128EC LX128EC-5F208I 128 1.8 5 fpBGA 208 I LX256EV LX256EV-5F484I 256 3.3 5 fpBGA 484 I LX256EB LX256EB-5F484I 256 2.5 5 fpBGA 484 I LX256EC LX256EC-5F484I 256 1.8 5 fpBGA 484 I LX64EV Part Number 69 Lattice Semiconductor ispGDX2 Family Data Sheet Lead-Free Packaging Commercial Family I/Os Voltage tPD Package Pins Grade LX64V-3FN100C 64 3.3 3.0 Lead-free fpBGA 100 C LX64V-5FN100C 64 3.3 5.0 Lead-free fpBGA 100 C LX64B-3FN100C 64 2.5 3.0 Lead-free fpBGA 100 C LX64B-5FN100C 64 2.5 5.0 Lead-free fpBGA 100 C LX64C-3FN100C 64 1.8 3.0 Lead-free fpBGA 100 C LX64C-5FN100C 64 1.8 5.0 Lead-free fpBGA 100 C LX128V-32FN208C 128 3.3 3.2 Lead-free fpBGA 208 C LX128V-5FN208C 128 3.3 5.0 Lead-free fpBGA 208 C LX128B-32FN208C 128 2.5 3.2 Lead-free fpBGA 208 C LX128B-5FN208C 128 2.5 5.0 Lead-free fpBGA 208 C LX128C-32FN208C 128 1.8 3.2 Lead-free fpBGA 208 C LX128C-5FN208C 128 1.8 5.0 Lead-free fpBGA 208 C LX256V-35FN484C 256 3.3 3.5 Lead-free fpBGA 484 C LX256V-5FN484C 256 3.3 5.0 Lead-free fpBGA 484 C LX256B-35FN484C 256 2.5 3.5 Lead-free fpBGA 484 C LX256B-5FN484C 256 2.5 5.0 Lead-free fpBGA 484 C LX256C-35FN484C 256 1.8 3.5 Lead-free fpBGA 484 C LX256C-5FN484C 256 1.8 5.0 Lead-free fpBGA 484 C SE L D E IS C C T O D N E TI VI N C U E ED S LX64V Part Number LX64B LX64C LX128V LX128B LX128C LX256V LX256B LX256C “E-Series” Commercial Family LX64EV LX64EB LX64EC LX128EV LX128EB LX128EC LX256EV LX256EB LX256EC Part Number I/Os Voltage tPD Package Pins Grade LX64EV-3FN100C 64 3.3 3.0 Lead-free fpBGA 100 C LX64EV-5FN100C 64 3.3 5.0 Lead-free fpBGA 100 C LX64EB-3FN100C 64 2.5 3.0 Lead-free fpBGA 100 C LX64EB-5FN100C 64 2.5 5.0 Lead-free fpBGA 100 C LX64EC-3FN100C 64 1.8 3.0 Lead-free fpBGA 100 C LX64EC-5FN100C 64 1.8 5.0 Lead-free fpBGA 100 C LX128EV-32FN208C 128 3.3 3.2 Lead-free fpBGA 208 C LX128EV-5FN208C 128 3.3 5.0 Lead-free fpBGA 208 C LX128EB-32FN208C 128 2.5 3.2 Lead-free fpBGA 208 C LX128EB-5FN208C 128 2.5 5.0 Lead-free fpBGA 208 C LX128EC-32FN208C 128 1.8 3.2 Lead-free fpBGA 208 C LX128EC-5FN208C 128 1.8 5.0 Lead-free fpBGA 208 C LX256EV-35FN484C 256 3.3 3.5 Lead-free fpBGA 484 C LX256EV-5FN484C 256 3.3 5.0 Lead-free fpBGA 484 C LX256EB-35FN484C 256 2.5 3.5 Lead-free fpBGA 484 C LX256EB-5FN484C 256 2.5 5.0 Lead-free fpBGA 484 C LX256EC-35FN484C 256 1.8 3.5 Lead-free fpBGA 484 C LX256EC-5FN484C 256 1.8 5.0 Lead-free fpBGA 484 C 70 Lattice Semiconductor ispGDX2 Family Data Sheet “E-Series” Industrial Family Part Number I/Os Voltage tPD Package Pins Grade LX64EV-5FN100I 64 3.3 5.0 Lead-free fpBGA 100 I LX64EB LX64EB-5FN100I 64 2.5 5.0 Lead-free fpBGA 100 I LX64EC LX64EC-5FN100I 64 1.8 5.0 Lead-free fpBGA 100 I LX128EV LX128EV-5FN208I 128 3.3 5.0 Lead-free fpBGA 208 I LX128EB LX128EB-5FN208I 128 2.5 5.0 Lead-free fpBGA 208 I LX128EC LX128EC-5FN208I 128 1.8 5.0 Lead-free fpBGA 208 I LX256EV LX256EV-5FN484I 256 3.3 5.0 Lead-free fpBGA 484 I LX256EB LX256EB-5FN484I 256 2.5 5.0 Lead-free fpBGA 484 I LX256EC LX256EC-5FN484I 256 1.8 5.0 Lead-free fpBGA 484 I SE L D E IS C C T O D N E TI VI N C U E ED S LX64EV 71 Lattice Semiconductor ispGDX2 Family Data Sheet For Further Information In addition to this data sheet, the following Lattice technical notes may be helpful when designing with the ispGDX2 Family: sysIO Design and Usage Guidelines (TN1000) sysCLOCK PLL Design and Usage Guidelines (TN1003) sysHSI Usage Guide (TN1020) Power Estimation in ispGDX2 Devices (TN1021) SE L D E IS C C T O D N E TI VI N C U E ED S • • • • 72