SII9437CNUC

SiI9437/SiI9438 ARC/Enhanced ARC Receiver and Transmitter Data Brief SiI-DB-02013-B October 2017 SiI9437/SiI9438 ARC/Enhanced ARC Receiver and Transmitter Data Brief Copyright Notice Copyright © 2016-2017 Lattice Semiconductor Corporation. All rights reserved. The contents of these materials contain proprietary and confidential information (including trade secrets, copyright, and other Intellectual Property interests) of Lattice Semiconductor Corporation and/or its affiliates. All rights are reserved. You are permitted to use this document and any information contained therein expressly and only for bona fide non-commercial evaluation of products and/or services from Lattice Semiconductor Corporation or its affiliates; and only in connection with your bona fide consideration of purchase or license of products or services from Lattice Semiconductor Corporation or its affiliates, and only in accordance with the terms and conditions stipulated. 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NO PERSON IS AUTHORIZED TO MAKE ANY OTHER WARRANTY OR REPRESENTATION CONCERNING THE PERFORMANCE OF THE INFORMATION, PRODUCTS, KNOW-HOW, DESIGNS OR SERVICES OTHER THAN AS PROVIDED IN THESE TERMS AND CONDITIONS. 2 © 2016-2017 Lattice Semiconductor All rights reserved. SiI-DB-02013-B SiI9437/SiI9438 ARC/Enhanced ARC Receiver and Transmitter Data Brief 1.2. Audio Interfaces 1. General Description The SiI9437/SiI9438 ARC/Enhanced ARC receiver/transmitter from Lattice Semiconductor adds higher bandwidth Enhanced Audio Return Channel (eARC) capability to HDMI®-based designs. The SiI9437/SiI9438 ARC/Enhanced ARC receiver/transmitter support audio bit rates up to 98 Mb/s (36.8 Mb/s payload). Manufacturers of televisions, audio/video receivers, and sound bars can use these devices to implement eARC with up to 8channels of 24-bit, 192 kHz audio. This new high bit rate, low jitter audio interface transmits over standard HDMI with Ethernet cable using the available differential twisted pair of pins 14 and 19. The devices are backward-compatible with HDMI 1.4 Audio Return Channel, for connectivity with legacy ARC devices. Implementing eARC into consumer electronics products helps to ensure greater interoperability and forward-compatibility without compromise. This is especially important as new devices with Dynamic HDR, Variable Refresh, and other HDMI 2.1 features come to market. The SiI9437/SiI9438 include support for the eARC Common Mode Data Channel, used for Discovery, Capabiity Detection, Heartbeat, and Lipsync features of eARC. The SiI9437/SiI9438 design enables integration in conjunction with existing HDMI transmitters and receivers, and operates independently of the HDMI frequency, mode, and encoding format. No HDMI 2.1 or HDMI 2.0 dependency exists; the devices can be integrated with HDMI transmitter/receivers using any version of HDMI.   SiI9438 Transmitter:  Four-lane I2S inputs  IEC60958 (S/PDIF) input  HDMI eARC (differential signal) transmitter  HDMI Legacy ARC (Single Mode) output compatibility SiI9437 Receiver:  Four-lane I2S outputs  IEC60958 (S/PDIF) output  HDMI eARC (differential signal) receiver  HDMI Legacy ARC (single mode or Common mode) input compatibility 1.3. Audio Support          Dolby® Digital Dolby Digital PlusTM Dolby® TrueHD DTSTM DTS-HD DTS HD Master AudioTM Dolby AtmosTM DTS:XTM PCM audio, up to 8 channels, 24-bit, 192 kHz 1.4. Programming Interface Local I2C bus 1.5. Packaging  32-pin, 4 mm × 4 mm, 0.4 mm pitch QFN package with an exposed pad (ePad) Figure 1.1 on the next page shows a typical systems diagram of SiI9437/SiI9438 ARC/Enhanced ARC receiver/transmitter 1.1. Applications     3 Televisions (SiI9438 Transmitter) AVRs (SiI9437 Receiver) Home Theater-in-a-Box (SiI9437 Receiver) Soundbars (SiI9437 Receiver) © 2016-2017 Lattice Semiconductor All rights reserved. CONFIDENTIAL SiI-DB-02013-B SiI9437/SiI9438 ARC/Enhanced ARC Receiver and Transmitter Data Brief HDMI Video HDMI SINK HDMI Source AVR HPD AUDIO OUT SiI9437 AUDIO IN Differential eARC TV SiI9438 UTIL Audio Data Common Mode Communication Figure 1.1. Typical System Diagram 4 © 2016-2017 Lattice Semiconductor All rights reserved. CONFIDENTIAL SiI-DB-02013-B SiI9437/SiI9438 ARC/Enhanced ARC Receiver and Transmitter Data Brief 2. Pin Diagram Figure 2.1 shows the pin assignments of the SiI9437/SiI9438 device. The package is a 4 mm × 4 mm 32-pin QFN with an ePad. For best performance, the ePad should be soldered to a pad on the PC board that is electrically connected to ground, but it is not required to make an electrical ground connection since the package also has GND pins. GPIO RSVD/HPD 1.2V 3.3V Diff_Audio Diff_Audio GND 1.2V 32 31 30 29 28 27 26 25 Pin names are generalized by type for this document. The list below the diagram describes the purpose of each type. RSVD 1 24 CTRL_SIG_I CI2CA/GPIO 2 23 CTRL_SIG_O GPIO 3 22 I2C_BUS GPIO 4 21 I2C_BUS 20 1.2V SiI9437/SiI9438 (Top View) GPIO 5 1.2V 6 19 GND GND 7 18 AUDIO_CTRL_IO AUDIO_CTRL_IO 8 17 AUDIO_IF_IO GPIO − General Purpose Input/Output AUDIO_CTRL_IO − Audio Control Input/Output AUDIO_IF_IO − Audio Interfacel Input/Output CTRL_SIG_I − Control Input CTRL_SIG_O − Control Output 15 16 AUDIO_IF_IO 3.3V ePad (GND) I2C_BUS − I2C Bus, 5 V Tolerant HPD − Hot Plug Detect RSVD − Reserved GND − Ground Figure 2.1. Pin Diagram SiI-DB-02013-B © 2016-2017 Lattice Semiconductor All rights reserved. 5 SiI9437/SiI9438 ARC/Enhanced ARC Receiver and Transmitter Data Brief 3. Package Information 3.1. ePad Requirements The SiI9437/SiI9438 receiver/transmitter is packaged in a 32-pin, 4 mm × 4 mm QFN package with an exposed pad (ePad) that is 2.7 mm × 2.7 mm (±0.1 mm). Soldering the ePad to the ground plane of the PCB is recommended for improved grounding and thermal transfer but is not required for typical applications. Figure 3.1 on the next page shows the package dimensions of the SiI9437/SiI9438 receiver/transmitter. 6 © 2016-2017 Lattice Semiconductor All rights reserved. CONFIDENTIAL SiI-DB-02013-B SiI9437/SiI9438 ARC/Enhanced ARC Receiver and Transmitter Data Brief 3.2. Package Dimensions These drawings are not to scale. // D A bbb C ccc C C SEATING PLANE B 32 M 1 E PIN 1 CORNER A1 (A3) aaa C M A2 Top View A eee J 32 25 24 C A B M PIN 1 I.D. 1 e/2 K e eee M C A B 8 17 16 32X L 9 Bottom View View M – M EXPOSED DIE ATTACH PAD 32X b ddd M C A B JEDEC Package Code- MO-220 Item A Description Total Thickness Min 0.80 Typ 0.85 Max 0.90 Item J A1 A2 A3 Stand Off Mold Thickness L/F Thickness 0 — 0.035 0.65 0.203 REF 0.05 0.67 K L aaa D E Body Size b e Lead Width Lead Pitch 4 BSC 4 BSC 0.15 0.2 0.4 BSC 0.25 Description Exposed Pad Size Lead Length Package Edge Tolerance Min 2.6 Typ 2.7 Max 2.8 2.6 0.25 2.7 0.3 0.1 2.8 0.35 bbb ccc Mold Flatness Coplanarity 0.1 0.08 ddd eee Lead Offset Exposed Pad Offset 0.1 0.1 Note: All dimensions are in millimeter. Figure 3.1. Package Diagram SiI-DB-02013-B © 2016-2017 Lattice Semiconductor All rights reserved. 7 SiI9437/SiI9438 ARC/Enhanced ARC Receiver and Transmitter Data Brief 3.3. Marking Specification The marking diagram for SiI9437 is shown in Figure 3.2. This drawing is not to scale. Pin 1 ID 9437CNUC DATECODE Figure 3.2. SiI9437 Marking Diagram The marking diagram for SiI9438 is shown in Figure 3.3. This drawing is not to scale. Pin 1 ID 9438CNUC DATECODE Figure 3.3. SiI9438 Marking Diagram 3.4. Ordering Information Production Part Numbers: 8 Device Part Number SiI9437 Enhanced ARC Receiver SiI9437CNUC SiI9438 Enhanced ARC Transmitter SiI9438CNUC © 2016-2017 Lattice Semiconductor All rights reserved. CONFIDENTIAL SiI-DB-02013-B 7th Floor, 111 SW 5th Avenue Portland, OR 97204, USA T 503.268.8000 www.latticesemi.com