L9UG22840

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only TAPE AND BOX TYPE LED LAMPS L9UG22840/S8/TBS-X DATA SHEET DOC. NO : REV. DATE : : QW0905-L9UG22840/S8/TBS-X A 19 - Sep.- 2005 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. L9UG22840/S8/TBS-X Page 1/5 Package Dimensions P2 ΔH H2 H1 L W0 W2 W1 W3 D P1 F P T L9UG22840/S8 4.0 3.8 6.3 9.6±0.5 1.5MAX 25.0MIN □0.5 TYP 1.0MIN 2.54TYP +Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. L9UG22840/S8/TBS-X Page 2/5 Absolute Maximum Ratings at Ta=25 ℃ Absolute Maximum Ratings Parameter Symbol 9UG Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Electrostatic Discharge Operating Temperature Storage Temperature Soldering Temperature IF IFP PD Ir ESD Topr Tstg Tsol 30 60 75 10 2000 -40 ~ +85 -40 ~ +100 Max 260 ℃ for 5 sec Max (2mm from body) mA mA mW UNIT μA V ℃ ℃ Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO MATERIAL Emitted COLOR Forward Dominant Spectral voltage wave halfwidth @20mA(V) length △λ nm λDnm Luminous intensity @20mA(mcd) Viewing angle 2 θ 1/2 (deg) Lens Min. Max. Min. Typ. Horizontal Axis 80° Vertical Axis 120° L9UG22840/S8/TBS-X AlGaInP Green Green Diffused 574 20 1.7 2.6 50 90 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ± 15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. L9UG22840/S8/TBS-X •Dimension Symbol Information SPECIFICATIONS SYMBOL ITEMS OPTION SYMBOL CODE ------------------- Page 3/5 Minimum mm inch 0.15 0.09 ------- Maximum mm 4.2 3.0 2.0 18.5 22.5 26.5 23.5 20.9 25.0 25.5 20.0 19.4 22.0 21.5 19.0 36 11 inch 0.17 0.12 0.08 0.73 0.89 1.04 0.93 0.82 0.98 1.0 0.79 0.76 0.87 0.85 0.75 1.42 0.43 0.51 0.23 0.3 0.06 0.38 0.61 0.16 0.75 Tape Feed Hole Diameter Component Lead Pitch Front-To-Rear Deflection D F △H 3.8 2.3 ------- TBS-1 TBS-2 TBS-3 TBS-5 TBS-6 Feed Hole To Bottom Of Component TBS-7 TBS-8 TBS-9 TBS-10 TBS-11 TBS-12 TBS-13 Feed Hole To Overall Component Height Lead Length After Component Height Feed Hole Pitch Lead Location Center Of Component Location Overall Taped Package Thickness Feed Hole Location Adhesive Tape Width Adhesive Tape Position Tape Width ------------------------------------------------------------- 17.5 21.5 25.5 22.5 19.9 H1 24.0 24.5 19.0 18.4 21.0 20.5 18.0 H2 L P P1 P2 T W0 W1 W2 W3 12.4 4.4 5.1 ------------- 0.69 0.85 1.0 0.89 0.78 0.94 0.96 0.75 0.72 0.83 0.81 0.71 ------- W0 0.49 0.17 0.2 ------- 13 5.8 7.7 1.42 9.75 15.5 4.0 19 8.5 14.5 0 17.5 0.33 0.57 0 0.69 REMARK:TBS=Tape And Box Straight Leads • Dimensions Symbol Information Specification • Package Dimensions maxmum mm 340 275 60 inch 13.4 10.8 2.4 Description Overall Length Overall Width Overall Thickness Symbol minimum mm inch 13.0 10.4 1.97 L W H 330 265 50 Quantity/Box 2500PCS LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. L9UG22840/S8/TBS-X Page 4/5 Typical Electro-Optical Characteristics Curve 9UG CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 1000 3.0 Forward Current(mA) 100 Relative Intensity Normalize @20mA 1.0 2.5 2.0 1.5 1.0 0.5 0 10 1.0 0.1 2.0 3.0 4.0 5.0 1.0 10 100 1000 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature Forward Current(mA) Fig.4 Relative Intensity vs. Temperature Relative Intensity @20mA Normalize @25℃ -40 -20 0 20 40 60 80 100 Forward Voltage@20mA Normaliz @25℃ 1.2 3.0 2.5 2.0 1.5 1.0 0.5 0 -40 -20 0 20 40 60 80 100 1.1 1.0 0.9 0.8 Ambient Temperature( ℃) Ambient Temperature( ℃) Fig.5 Relative Intensity vs. Wavelength Relative Intensity @20mA 1.0 0.5 0 500 550 600 650 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. L9UG22840/S8/TBS-X Page 5/5 Reliability Test: Test Item Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Description This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. Reference Standard MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Operating Life Test High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 High Temperature High Humidity Test 1.Ta=65 ℃±5 ℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hous. MIL-STD-202:103B JIS C 7021: B-11 Thermal Shock Test 1.Ta=105 ℃±5℃ &-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2