LA274W-EG-W55R14

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LED ARRAY Sealed to IP67 Pb Lead-Free Parts LA274W/EG-W55R14 DATA SHEET DOC. NO : QW0905-L A274W/EG-W55R14 REV. DATE : : B 15 - Mar. - 2007 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA274W/EG-W55R14 Page 1/5 Package Dimensions 8.4 20.6 IF +Vcc Vcc=24Volts RL RL=1000ohms ±5% G E 155±5.0 VF IF= Vcc-VF RL 1 23 GREEN 1.ANODE GREEN 2.COMMON CATHODE 3.ANODE ORANGE RED ORANGE 123 LEG3393/F243-PF 5.0 5.9 7.6 8.6 10.5±0.5 G 5.0±0.5 1.5 MAX E 1 1.0±0.3 1.0±0.3 2.54TYP 2.54TYP 23 1.ANODE GREEN 2.COMMON CATHODE 3.ANODE ORANGE 1 2 3 Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA274W/EG-W55R14 Absolute Maximum Ratings at Ta=25 ℃ Page 2/5 Rating Parameter Symbol G Forward Voltage Reverse Voltaget @5V Operating Temperature Storage Temperature DC Vr Topr Tstg 24 24 -40 ~ +85 -40 ~ +100 E 24 24 V V UNIT ℃ ℃ Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO MATERIAL COLOR Peak Spectral wave halfwidth length Δλ nm λPnm Forward current (mA) @24V Luminous intensity (mcd) @24V Reverse Viewing angle Current 2θ 1/2 (μA) VR= 24 V (deg) Emitted GaAsP/GaP Orange L A274W/EG-W55R14 Lens 635 Water Clear 565 45 30 Min. Max. Min. Typ. 20.4 23.5 20.4 23.5 45 60 75 100 100 100 40 40 GaP Green Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA274W/EG-W55R14 Page 3/5 Typical Electro-Optical Characteristics Curve E CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 1000 Forward Current(mA) 100 Relative Intensity Normalize @20mA 1.0 2.0 3.0 4.0 5.0 2.5 2.0 1.5 1.0 0.5 0.0 1.0 10 100 1000 10 1.0 0.1 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature Forward Current(mA) Fig.4 Relative Intensity vs. Temperature 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 100 Relative Intensity@20mA Normalize @25 ℃ Forward Voltage@20mA Normalize @25 ℃ 1.2 Ambient Temperature( ℃) Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA 1.0 0.5 0.0 550 600 650 700 750 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA274W/EG-W55R14 Page 4/5 Typical Electro-Optical Characteristics Curve G CHIP Fig.1 Forward current vs. Forward Voltage 1000 Fig.2 Relative Intensity vs. Forward Current 3.5 Forward Current(mA) 100 Relative Intensity Normalize @20mA 3.0 2.5 2.0 1.5 1.0 0.5 0.0 10 1.0 0.1 1.0 2.0 3.0 4.0 5.0 1.0 10 100 1000 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature Forward Current(mA) Fig.4 Relative Intensity vs. Temperature 3.0 Forward Voltage@20mA Normalize @25 ℃ Relative Intensity@20mA Normalize @25 ℃ 1.2 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 100 Ambient Temperature( ℃) Ambient Temperature( ℃) Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA 1.0 0.5 0.0 500 550 600 650 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA274W/EG-W55R14 Page 5/5 Reliability Test: Test Item Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Description This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Reference Standard MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Operating Life Test High Temperature Storage Test 1.Ta=105 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95 % 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. MIL-STD-202:103B JIS C 7021: B-11 Thermal Shock Test 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2