LDD435-62-XX-PF

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DUAL DIGIT LED DISPLAY (0.39 lnch) Pb Lead-Free Parts LDD435/62-XX-PF DATA SHEET DOC. NO : REV. DATE : : QW0905-LDD435/62-XX-PF A 16 - Feb. - 2009 發行 立碁電子 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDD435/62-XX-PF Page 1/8 Package Dimensions 23.8 (0.93") PIN18 PIN10 6.5 (0.256") 11.0 (0.39") DIG.1 DIG.2 18.8 (0.74") 15.24 (0.6") PIN1 PIN9 ψ1.5 (0.059") LDD435/62-XX-PF LIGITEK ψTYP0.45 2.54*8=20.32 4.8±0.5 PIN NO.1 Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDD435/62-XX-PF Page 2/8 Internal Circuit Diagram LDD4352-XX-PF 14 DIG.1 A BCDEFG DP A DIG.2 BCDEFG DP 13 16 15 3 2 1 18 17 4 11 10 8 6 5 12 7 9 LDD4362-XX-PF 14 DIG.1 A BCDEFG DP A DIG.2 BCDEFG DP 13 16 15 3 2 1 18 17 4 11 10 8 6 5 12 7 9 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDD435/62-XX-PF Page 3/8 Electrical Connection PIN NO. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 LDD4352-XX-PF Anode DIG1 Anode DIG1 Anode DIG1 Anode DIG1 Anode DIG2 Anode DIG2 Anode DIG2 Anode DIG2 Anode DIG2 Anode DIG2 Anode DIG2 Anode DIG2 E D C DP E D G C DP B A F PIN NO. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 LDD4362-XX-PF Cathode DIG1 Cathode DIG1 Cathode DIG1 Cathode DIG1 Cathode DIG2 Cathode DIG2 Cathode DIG2 Cathode DIG2 Cathode DIG2 Cathode DIG2 Cathode DIG2 Cathode DIG2 E D C DP E D G C DP B A F Common Cathode Dig.2 Common Cathode Dig.1 Anode DIG1 Anode DIG1 Anode DIG1 Anode DIG1 B A G F Common Anode Dig.2 Common Anode Dig.1 Cathode DIG1 Cathode DIG1 Cathode DIG1 Cathode DIG1 B A G F LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDD435/62-XX-PF Page 4/8 Absolute Maximum Ratings at Ta=25 ℃ Ratings UNIT G Forward Current Per Chip Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) Power Dissipation Per Chip Reverse Current Per Any Chip Operating Temperature Storage Temperature IF IFP 30 120 mA mA Parameter Symbol PD Ir Topr Tstg 100 10 -25 ~ +85 -25 ~ +85 mW μA ℃ ℃ Part Selection And Application Information(Ratings at 25℃) common cathode or anode Common Cathode GaP LDD4362-XX-PF CHIP PART NO Material LDD4352-XX-PF Emitted λP (nm) Electrical △λ (nm) Min. Vf(v) Typ. Max. Iv(mcd) Min. Typ. IV-M Green 565 Common Anode 30 1.7 2.1 2.6 1.75 3.05 2:1 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDD435/62-XX-PF Page 5/8 Test Condition For Each Parameter Parameter Forward Voltage Per Chip Luminous Intensity Per Chip Peak Emission Wavelength Symbol Vf Iv λP Unit volt mcd nm nm Test Condition If=20mA If=10mA If=20mA If=20mA Vr=5V Spectral Line Half-Width Reverse Current Any Chip Luminous Intensity Matching Ratio △λ Ir IV-M μA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDD435/62-XX-PF Page 6/8 Typical Electro-Optical Characteristics Curve G CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.5 1000 Forward Current(mA) 100 Relative Intensity Normalize @20mA 1.0 2.0 3.0 4.0 5.0 3.0 2.5 2.0 1.5 1.0 0.5 0.0 1.0 10 100 1000 10 1.0 0.1 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature Forward Current(mA) Fig.4 Relative Intensity vs. Temperature 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 100 Relative Intensity@20mA Normalize @25 ℃ Forward Voltage@20mA Normalize @25 ℃ 1.2 Ambient Temperature( ℃) Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength Fig.6 Directive Radiation Relative Intensity@20mA 1.0 0.5 0.0 500 550 600 650 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. DD435/62-XX-PF Page 4/5 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350° C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to case) 2.Wave Soldering Profile Dip Soldering Preheat: 120° C Max Preheat time: 60seconds Max Ramp-up 2° C/sec(max) Ramp-Down:-5° C/sec(max) Solder Bath:260° C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to case) Temp(°C) 260°C3sec Max 260° 5° /sec max 120° 2° /sec max Preheat 25° 0° 0 50 100 150 Time(sec) 60 Seconds Max Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDD435/62-XX-PF Page 8/8 Reliability Test: Test Item Test Condition 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) Description This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. Reference Standard MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Operating Life Test High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 High Temperature High Humidity Test 1.Ta=65 ℃±5 ℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. MIL-STD-202:103B JIS C 7021: B-11 Thermal Shock Test 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. This test intended to see soldering well performed or not. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5 ℃ 2.Dwell time= 10 ±1sec. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5 ℃ 2.Dwell time=5 ±1sec MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2